A power module potting device

Abstract

The utility model discloses a kind of power module potting device, including mould body, adjusting cavity is structured on mould body, the top of adjusting cavity and one side are open, two adjusting plates are slidably connected in adjusting cavity, fixed mechanism is also provided on mould body, the base plate of power module can be driven to be pressed on two adjusting plates by fixed mechanism, so that the base plate of power module, two adjusting plates and the inner wall of adjusting cavity form glue-filling space between them. The distance between the two adjusting plates can be changed by driving two adjusting plates to slide, then the base plate of power module is pressed on two adjusting plates by fixed mechanism, so that the glue-filling space of required size is formed between two adjusting plates, the inner wall of adjusting cavity and the base plate of power module. Compared with prior art, the glue-filling space of the utility model can be adjusted according to the size of power module, with higher applicability.

Description

Technical Field

[0001] This utility model relates to the field of power module manufacturing technology, and in particular, to a power module potting device. Background Technology

[0002] Traditional power supply potting is a crucial process that involves injecting liquid protective material into the power module's casing and allowing it to solidify, thereby providing comprehensive protection for the internal electronic components. It effectively enhances the module's insulation, moisture resistance, dust resistance, and shock resistance, and efficiently conducts heat generated by the components to the casing, significantly improving heat dissipation performance. Excellent potting quality ensures stable and reliable operation of the power supply in harsh environments such as high temperatures and vibrations, and is a vital guarantee for achieving long lifespan and high reliability in high-power-density power modules.

[0003] Currently, Chinese patent CN210351912U discloses a power module potting device, including a mold body and a pressure plate. The top and sides of the mold body are open, forming a cavity. The pressure plate can press the substrate of the power module, fixing the functional components on the power module within the cavity. Subsequently, potting compound can be poured into the top of the cavity to achieve a pre-potting and then cover-sealing process for the power module. This process facilitates the separation of the cover and the compound, thus simplifying subsequent maintenance operations.

[0004] However, the cavity used for potting is fixed, which means that the potting device can only be used for potting power modules of a single size, resulting in low applicability. Utility Model Content

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide a power module potting device.

[0006] The objective of this utility model is achieved through the following technical solution: A power module potting apparatus includes a mold body with an adjustment cavity. The top and a side opening of the adjustment cavity are provided. Two adjustment plates are slidably connected inside the adjustment cavity. The mold body is also provided with a fixing mechanism, which can drive the base plate of the power module to be pressed against the two adjustment plates, thereby forming a potting space between the base plate of the power module, the two adjustment plates, and the inner wall of the adjustment cavity.

[0007] Preferably, the mold body is provided with a lead screw adjustment mechanism, and the adjustment plate is disposed on the transfer end of the lead screw adjustment mechanism.

[0008] Preferably, each of the adjustment plates is provided with a corresponding lead screw adjustment mechanism.

[0009] Preferably, the lead screw of the lead screw adjustment mechanism has two spiral grooves with opposite directions of rotation, and the two adjustment plates are respectively adapted to the two spiral grooves.

[0010] Preferably, the bottom surface of the adjustment cavity is provided with a slot for inserting the base plate of the power module, and the fixing mechanism includes a pressure bar detachably connected to the mold body, and the pressure bar is arranged across the side opening of the adjustment cavity along the length direction.

[0011] Preferably, the middle part of the pressure bar is provided with a clamping block for abutting against the base plate of the power module.

[0012] Preferably, the bottom surface of the adjustment cavity is provided with a slot for inserting the base plate of the power module, and the fixing mechanism includes two card seats that are slidably connected in the adjustment cavity, and the slots are provided on the opposite side walls of the two card seats.

[0013] Preferably, the card holder is fixed in position relative to the adjustment cavity by means of bolt fastening.

[0014] Preferably, the bottom surface of the adjustment cavity is provided with a slot for inserting the base plate of the power module, and the fixing mechanism includes a buckle set on the top of the mold body, which can be fastened to a support column extending away from the glue-filling space on the base plate of the power module.

[0015] Preferably, at least two buckles are provided along the length direction.

[0016] The beneficial effects of this invention are as follows: The distance between the two adjusting plates can be changed by sliding them, and then the power module substrate is pressed firmly onto the two adjusting plates by a fixing mechanism. This creates a potting space of the required size between the two adjusting plates, the inner wall of the adjusting cavity, and the power module substrate. Compared with the prior art, the potting space of this invention can be adjusted according to the size of the power module, thus having higher applicability. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of an embodiment; Figure 2 This is a schematic diagram of the spiral groove structure; Figure 3 This is a structural diagram of the card holder and the buckle.

[0018] Reference numerals: 1. Mold body; 2. Adjustment cavity; 3. Adjustment plate; 4. Fixing mechanism; 5. Glue filling space; 6. Screw adjustment mechanism; 7. Spiral groove; 8. Slot; 9. Pressure strip; 10. Pressure block; 11. Card seat; 12. Buckle; 13. Base plate; 14. Support column. Detailed Implementation

[0019] The technical solution of this utility model will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0020] like Figures 1 to 3 As shown, a power module potting apparatus includes a mold body 1, which, similar to existing designs, has an adjustment cavity 2 with an opening at the top and a side. The difference lies in that two adjustment plates 3 are preferably slidably fitted within the adjustment cavity 2, and a fixing mechanism 4 is also provided on the mold body 1. The fixing mechanism 4 can press the power module substrate 13 onto the two adjustment plates 3, thereby forming a potting space 5 between the power module substrate 13, the two adjustment plates 3, and the inner wall of the adjustment cavity 2. For example, the two adjustment plates 3 can be slid to a desired distance according to the size of the power module, ultimately forming a potting space 5 of the required size.

[0021] In some embodiments, a lead screw adjustment mechanism 6 is provided on the mold body 1, and an adjustment plate 3 is provided on the transfer end of the lead screw adjustment mechanism 6. The lead screw adjustment mechanism 6 is prior art, and its specific structure and transmission principle will not be described in detail. In short, after the nut of the lead screw adjustment mechanism 6 rotates, its transfer end (lead screw) will drive the adjustment plate 3 to move.

[0022] For example, two lead screw adjustment mechanisms 6 can be symmetrically arranged on the mold body 1, and two adjustment plates 3 are respectively arranged on the transfer ends of the two lead screw adjustment mechanisms 6. In this way, the dispensing space 5 can be adjusted to any position in the length direction of the mold body 1.

[0023] In other examples, only one lead screw adjustment mechanism 6 is provided, and its lead screw has two helical grooves 7 with opposite directions of rotation. Two adjusting plates 3 are respectively fitted onto the two helical grooves 7. Thus, by rotating the lead screw, the two adjusting plates 3 can be driven to move closer or further apart, thereby adjusting the distance between them. In this example, it is more convenient to operate the adjusting plates 3 to change the distance, but the position of the resulting glue-filling space 5 is relatively fixed.

[0024] In some embodiments, the bottom surface of the adjustment cavity 2 is provided with a slot 8 for inserting the base plate 13 of the power module, and the fixing mechanism 4 includes a pressure strip 9 detachably connected to the mold body 1. For example, threaded holes are provided on both sides of the mold body 1, and the two ends of the pressure block are respectively pressed into the threaded holes by fasteners such as bolts, so that the pressure block spans across the side opening of the adjustment cavity 2 along the length direction. At this time, the base plate 13 of the power module is pressed between the pressure plate and the adjustment plate 3.

[0025] For example, a clamping block 10 for abutting the substrate 13 of the power module is also provided in the middle of the clamping strip 9. The clamping block 10 is preferably made of rubber, so as to increase the clamping force on the substrate 13 of the power module while not easily causing squeezing damage to the substrate 13.

[0026] Alternatively, the fixing mechanism 4 may include a retainer 11 slidably connected within the adjustment cavity 2, with slots 8 provided on the opposite sidewalls of the two retainers 11. For example, after inserting the bottom of the power module substrate 13 into the slots 8 on the adjustment cavity 2, sliding the two retainers 11 will drive the two sides of the power module to be inserted into the slots 8 of the two retainers 11 respectively, thereby fixing the relative position of the power module.

[0027] In a preferred embodiment, the retainer 11 can be fixed in position relative to the adjusting cavity 2 by means of bolt fastening. Alternatively, the retainer 11 can also be slidable and its relative position fixed by means of the lead screw adjusting mechanism 6.

[0028] In some embodiments, the fixing mechanism 4 may include a buckle 12 disposed on the top of the mold body 1. After the slot 8 on the adjustment cavity 2 is inserted into the bottom of the power module substrate 13, the buckle 12 can be operated to fasten to the support post 14 extending away from the potting space 5 on the side of the power module substrate 13. The tension of the buckle 12 drives the power module substrate 13 to press against the two adjustment plates 3. Preferably, two buckles 12 may be provided along the length of the mold body 1, but more may be added to provide a better fastening effect.

[0029] The above description is merely a preferred embodiment of this utility model. It should be understood that this utility model is not limited to the forms disclosed herein and should not be construed as excluding other embodiments. It can be used in various other combinations, modifications, and environments, and can be altered within the scope of the concept described herein through the above teachings or related technologies or knowledge. Modifications and variations made by those skilled in the art that do not depart from the spirit and scope of this utility model should be protected within the scope of the appended claims.

Claims

1. A power module potting device, comprising a mold body (1), wherein an adjustment cavity (2) is constructed on the mold body (1), and the adjustment cavity (2) has an opening at the top and a side, characterized in that: Two adjustment plates (3) are slidably connected inside the adjustment cavity (2). A fixing mechanism (4) is also provided on the mold body (1). The fixing mechanism (4) can drive the base plate of the power module to press against the two adjustment plates (3), thereby forming a potting space (5) between the base plate of the power module, the two adjustment plates (3) and the inner wall of the adjustment cavity (2).

2. The power module potting device according to claim 1, characterized in that: The mold body (1) is provided with a lead screw adjustment mechanism (6), and the adjustment plate (3) is provided on the transfer end of the lead screw adjustment mechanism (6).

3. The power module potting device according to claim 2, characterized in that: Each of the aforementioned adjustment plates (3) is provided with a corresponding lead screw adjustment mechanism (6).

4. The power module potting device according to claim 2, characterized in that: The lead screw of the lead screw adjustment mechanism (6) has two spiral grooves (7) with opposite directions of rotation, and the two adjustment plates (3) are respectively adapted to the two spiral grooves (7).

5. The power module potting device according to claim 1, characterized in that: The bottom surface of the adjustment cavity (2) is provided with a slot (8) for inserting the base plate of the power module. The fixing mechanism (4) includes a pressure strip (9) detachably connected to the mold body (1), and the pressure strip (9) spans the side opening of the adjustment cavity (2) along the length direction.

6. The power module potting apparatus according to claim 5, characterized in that: The middle part of the pressure strip (9) is provided with a clamping block (10) for abutting against the base plate of the power module.

7. The power module potting device according to claim 1, characterized in that: The bottom surface of the adjustment cavity (2) is provided with a slot (8) for inserting the base plate of the power module. The fixing mechanism (4) includes two card seats (11) slidably connected in the adjustment cavity (2). The slot (8) is provided on the opposite side wall of the two card seats (11).

8. The power module potting apparatus according to claim 7, characterized in that: The card holder (11) is fixed in position relative to the adjustment cavity (2) by means of bolt fastening.

9. The power module potting device according to claim 1, characterized in that: The bottom surface of the adjustment cavity (2) is provided with a slot (8) for inserting the base plate of the power module. The fixing mechanism (4) includes a buckle (12) set on the top of the mold body (1). The buckle (12) can be fastened to a support column extending away from the potting space (5) on the base plate of the power module.

10. The power module potting apparatus according to claim 9, characterized in that: The buckle (12) has at least two along its length.

Images