Automatic bending measurement folding board equipment

Abstract

The utility model relates to a kind of automatic bending measurement folding board equipment, it includes a platform, platform has a measurement part, a conveying part and a folding board part;A measuring device, it is set in measurement part;A board moving device, it is set in platform;A conveying roller set, it includes multiple conveying wheels and is set in conveying part;A pressing roller set, it includes multiple upper rollers and multiple lower rollers, and each upper roller can be moved relative to each lower roller, and pressing roller set is set in folding board part;A folding board roller set, it includes an upper pressing wheel and a lower pressing wheel, and upper pressing wheel and lower pressing wheel can be moved relative to platform synchronously, and folding board roller set is set in folding board part;A distance sensor, it is movably set in platform;By this whole operation process is closed-loop control, through automatic process, plus bending point can be through fast retest and can be through folding board roller set repeated flattening operation, to improve yield and capacity.

Description

Technical Field

[0001] This utility model relates to a bending plate device for the semiconductor industry, and more particularly to an automatic bending and warping measurement bending plate device. Background Technology

[0002] With the increasing demand for semiconductor packaging and high-end electronic products, the manufacturing processes of printed circuit boards (PCBs) and semiconductor substrates are gradually moving towards multilayer, thicker boards, and more precise circuitry. However, in the manufacturing of these high-end boards, uneven stress distribution within the board material often occurs due to inhomogeneous material properties, interlayer lamination processes, or subsequent plating steps, leading to board warping. Thick boards or substrates with asymmetrical structures are particularly prone to accumulating stress differences in localized areas, causing uneven deformation during cooling or subsequent processing, resulting in an inability to maintain the overall flatness of the board.

[0003] This type of warpage has a particularly severe impact on high-end PCB or substrate manufacturing processes. Firstly, warped components cannot be properly secured to the equipment platform in later processes (such as exposure, drilling, electroplating, or assembly), easily leading to misalignment or failure to be mounted, thus reducing overall process yield. Secondly, warpage makes it difficult for robotic arms or vacuum suction devices to handle components stably, hindering the operation of automated production lines and reducing throughput and process consistency.

[0004] In existing technologies, common methods for addressing board warpage include high-temperature hot-pressing leveling or temporary correction using a simple pressing process. While these methods can improve warpage to some extent, they still have several drawbacks. First, high-temperature hot-pressing leveling requires additional hot-pressing equipment and heating energy, increasing process costs and time. Furthermore, high-temperature treatment may generate secondary stress on some resin materials or fine circuitry, thus affecting product reliability. Second, simple pressing methods often only provide localized repairs and cannot effectively eliminate the root cause of overall warpage; the treated board may warp again in subsequent processes.

[0005] Furthermore, current leveling operations largely rely on manual measurement of warpage points followed by correction using bending plates or pressure. This method not only requires experienced personnel for judgment and has a slow work cycle, but also suffers from inconsistent product quality and unstable yield due to significant variations in human operation. For mass automated production, this manual-dependent approach clearly cannot meet the demands for high throughput and high consistency.

[0006] In summary, existing technologies for addressing warpage issues in high-end PCBs or carrier boards, whether using high-temperature hot pressing or simple pressing methods, suffer from drawbacks such as time consumption, high cost, reliance on manual labor, and unstable yield rates. Therefore, improvements are necessary to address these issues. Utility Model Content

[0007] In view of the shortcomings and deficiencies of the existing technology, this utility model provides an automatic warping measurement and bending plate device, which achieves the purpose of automated process, improved accuracy and yield through automated measurement, fixing and bending plate mechanism.

[0008] To achieve the aforementioned creative objectives, the technical means employed in this utility model is to design an automatic bending and warping measurement device for a folding plate, which includes:

[0009] A platform having a measuring section, a conveying section and a folding plate section, wherein the conveying section is located between the measuring section and the folding plate section;

[0010] A measuring device is disposed in the measuring section;

[0011] A plate-moving device is mounted on the platform;

[0012] A set of conveyor rollers, comprising multiple conveyor rollers and disposed in the conveying section;

[0013] A pressing roller assembly includes multiple upper rollers and multiple lower rollers, each of the upper rollers being located above each of the lower rollers and each of the upper rollers being movable relative to each of the lower rollers. The pressing roller assembly is disposed in the folding plate portion and adjacent to the conveying roller assembly.

[0014] A folding plate roller assembly includes an upper pressure roller and a lower pressure roller. The upper pressure roller is located above the lower pressure roller, and the upper pressure roller and the lower pressure roller can move synchronously relative to the platform. The folding plate roller assembly is disposed on the folding plate section.

[0015] A distance sensor is movably mounted on the platform.

[0016] Furthermore, in the aforementioned automatic bending and warping measurement folding plate device, the upper pressure roller and the lower pressure roller are connected by a connector to make them equidistant and can move synchronously back and forth or up and down.

[0017] Furthermore, in the aforementioned automatic bending and warping measurement folding plate equipment, the conveying section is further provided with a clapping mechanism, which is used to center and position the plate.

[0018] Furthermore, in the aforementioned automatic bending and warping measurement folding plate device, the plate-tapping mechanism comprises multiple tapping rods, and each tapping rod is located on both sides of the plate.

[0019] Furthermore, the aforementioned automatic warping measurement and bending plate equipment includes a 3D measuring device that detects the warping position and height of the plate. Because the measuring device can scan the entire plate and is combined with a plate moving device and conveyor roller assembly, it can perform multi-angle bending and full-plate correction for comprehensive leveling operations.

[0020] Furthermore, in the aforementioned automatic bending and warping measurement plate bending equipment, the plate moving device is a robotic arm.

[0021] Furthermore, the automatic bending and warping measurement folding plate equipment further includes a control device disposed on the platform. The platform further includes an upper plate portion and a lower plate portion. The upper plate portion is provided with an upper plate device, and the lower plate portion is provided with a lower plate device. The control device is electrically connected to the measurement device, the plate moving device, the conveying roller group, the pressing roller group, the folding plate roller group, the distance sensor, the upper plate device, and the lower plate device.

[0022] Furthermore, in the aforementioned automatic bending and warping measurement plate bending equipment, the upper plate device and the lower plate device are robotic arms. Since both the upper and lower plates are handled by automated upper and lower plate devices, full automation can be achieved to improve overall process efficiency.

[0023] The advantages of this invention are that, by using a closed-loop control for the entire operation process, the warping points can be quickly retested and the leveling operation can be repeated, thereby improving yield and production capacity; the measurement device and the folding roller assembly can be connected to the control device for operation, and the next PCB board can be prepared for measurement simultaneously during the folding process, improving production efficiency; the folding roller assembly and the pressing roller assembly work together, which is more accurate and stable than the existing technology that uses a single press for leveling. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the device of this utility model.

[0025] Figure 2 This is a side view of the front of the folding plate of this utility model.

[0026] Figure 3 This is a side view of the folded plate of this utility model.

[0027] Figure 4 This is a flowchart of the equipment production process for this utility model.

[0028] Figure 5 This is a schematic diagram of the clapping mechanism of the conveyor roller assembly of this utility model.

[0029] Figure 6 This is a schematic diagram of the rotating plate of the plate moving device of this utility model.

[0030] Figure 7 This is a schematic diagram of a device according to another embodiment of the present invention. Detailed Implementation

[0031] The following, in conjunction with the accompanying drawings and preferred embodiments of the present invention, further illustrates the technical means employed by the present invention to achieve its intended creative purpose.

[0032] Please see Figure 1 As shown, the automatic bending and warping measurement folding plate device of this utility model includes a platform 10, a measuring device 20, a plate moving device 30, a conveying roller group 40, a pressing roller group 50, a folding plate roller group 60, and a distance sensor 70.

[0033] Platform 10 has a measuring section 11, a conveying section 12 and a folding plate section 13. The conveying section 12 is located between the measuring section 11 and the folding plate section 13. In this embodiment, the measuring section 11 is located in the front position and the folding plate section 13 is located in the rear position.

[0034] The measuring device 20 is disposed on the measuring unit 11. In this embodiment, the measuring device 20 is a 3D measuring device, which has the function of detecting the warping position and height of the entire PCB board 80, but is not limited thereto, and the user can make changes according to the needs.

[0035] Please see Figure 1 and Figure 6 As shown, the board moving device 30 is disposed on the platform 10. In this embodiment, the board moving device 30 is a robotic arm, which is disposed on one side of the measurement section 11 and the conveying section 12 to move the PCB board 80 located in the measurement section 11 to the conveying section 12. However, it is not limited to this and the form of the board moving device 30 can be changed according to the user's needs.

[0036] Please see Figures 1 to 3 , Figure 5 As shown, the conveyor roller assembly 40 includes multiple conveyor rollers 41 and is disposed in the conveying section 12. In this embodiment, each conveyor roller 41 is a roller in the form of a drum and is arranged in the front-to-back direction. Furthermore, a clapping mechanism 42 is further provided in the conveying section 12. The clapping mechanism 42 includes multiple clapping rods (not shown in the figure) and is located on both sides of the PCB board 80. It can be aligned and centered according to the size of the PCB board 80, but is not limited thereto. The form of the conveyor roller assembly 40 can be changed according to the user's needs.

[0037] The pressing roller assembly 50 includes multiple upper rollers 51 and multiple lower rollers 52. Each upper roller 51 is located above each lower roller 52, and each upper roller 51 can move up and down relative to each lower roller 52. The upper rollers 51 achieve the function of moving up and down by connecting to a lifting mechanism (not shown in the figure). The lifting mechanism is a standard component of the prior art, and its detailed structure will not be described in detail. This enables the upper rollers 51 and lower rollers 52 to clamp the PCB board 80. The pressing roller assembly 50 is disposed in the folding plate section 13 and adjacent to the conveying roller assembly 40, but is not limited thereto. The form of the pressing roller assembly 50 can be changed according to the user's needs.

[0038] The folding roller assembly 60 includes an upper pressure roller 61 and a lower pressure roller 62. The upper pressure roller 61 is located above the lower pressure roller 62, and the upper pressure roller 61 and the lower pressure roller 62 can move synchronously relative to the platform 10. The folding roller assembly 60 is disposed on the folding plate part 13. In this embodiment, the upper pressure roller 61 and the lower pressure roller 62 are connected by a connector 63 to make them equidistant, and can move synchronously back and forth or up and down. The movement function is achieved by connecting a moving module (not shown in the figure). The moving module is movably disposed on the platform 10. The moving module is a standard component of the prior art, and its detailed structure will not be described in detail, but it is not limited thereto. The form of the folding roller assembly 60 can be changed according to the user's needs.

[0039] The distance sensor 70 is movably mounted on the platform 10. Specifically, the distance sensor 70 and the folding roller assembly 60 are both mounted on the same movable module, but this is not a limitation. The distance sensor 70 is a standard component of the prior art, and its detailed structure will not be described in detail.

[0040] When using this utility model, please refer to [link / reference]. Figures 1 to 6As shown, the example of flattening a PCB board 80 is used, but it is not limited to this. It can also be used for flattening thick boards such as high-end multilayer boards (HDI), carrier boards, BT boards, and autonomous driving control boards, as well as for flattening OLED and Mini LED backplanes, or any sheet material that requires warpage correction. A PCB board 80 is manually placed on the measuring section 11 of the platform 10. The measuring device 20 detects the warpage position and height of the entire PCB board 80. The operator starts the bending operation through a control device 90. The control device 90 is set on the platform 10. The operation control device 90 starts the board moving device 30 to move the PCB board 80 to the conveying section 12. The conveying wheels 41 located in the conveying section 12 can lift the PCB board 80. After being centered and positioned by the plate-pressing mechanism 42, it is lowered. The board moving device 30 rotates the PCB board 80 to the bending direction for positioning. The PCB board 80 is transferred to the bending section 13 via the conveyor roller assembly 40. After being positioned, it is pressed down by the upper roller 51 of the pressing roller assembly 50. The upper roller 51 and the lower roller 52 have a fixed anti-slip function to clamp and fix the PCB board 80 to prevent displacement. The distance sensor 70 is electrically connected to the control device 90 and is used to measure the position of the front end of the PCB board 80. The horizontal distance is set as 0 point. The bending direction can be easily measured by the change of positive and negative values. The upper pressure roller 61 and the lower pressure roller 62 of the bending roller assembly 60 work with the distance sensor 70 to perform reverse pressure bending and flattening. When the measured value returns to 0 point, the bending and flattening operation is completed.

[0041] In the aforementioned process, since the overall operation is controlled in a closed loop, the bending point can be quickly retested and the leveling operation can be repeated, thereby improving yield and production capacity.

[0042] During the aforementioned process, the measuring device 20 and the folding roller assembly 60 can be connected to the control device 90 for operation. During the folding process, the next PCB board 80 can be prepared for measurement simultaneously, thereby improving production efficiency.

[0043] In the aforementioned process, since the measuring device 20 can perform full-plate scanning, and is combined with the plate moving device 30 and the conveying roller group 40, it can perform multi-angle bending and full-plate correction all-round leveling operations.

[0044] In the aforementioned process, since the folding roller group 60 and the pressing roller group 50 work together, the leveling process is more precise and stable compared to the existing technology that uses a single press for leveling.

[0045] Please see Figure 7As shown, this is another embodiment of the present invention, in which the platform 10, measuring device 20, plate moving device 30, conveying roller group 40, pressing roller group 50, folding plate roller group 60, and distance sensor 70 are all the same as in the aforementioned embodiment. The main difference is that this embodiment is a fully automated mechanism, employing automated plate loading and unloading operations. Specifically, on the left and right sides of the manual operation control device 90, above the platform 10, there is an upper plate section 14 and a lower plate section 15, respectively. The upper plate section 14 is equipped with an upper plate device. 141. The lower plate portion 15 is provided with a lower plate device 151. The upper plate device 141 and the lower plate device 151 are robotic arms, but are not limited thereto. When performing automated operations, the upper plate device 141 will automatically move the PCB board 80 from the upper plate portion 14 to the measurement portion 11 for measurement. When it is confirmed to be a bent board, the bending operation of the aforementioned embodiment is performed. This part is the same as the aforementioned embodiment and will not be described again. When it is confirmed to be a flat board, the PCB board 80 is moved to the lower plate portion 15 by the lower plate device 151.

[0046] In the aforementioned process, since both the upper and lower plates are automated by the upper plate device 141 and the lower plate device 151, full automation can be achieved to improve the overall process efficiency.

[0047] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any way. Although the present utility model has been disclosed above with reference to a preferred embodiment, it is not intended to limit the present utility model. Anyone skilled in the art can make some modifications or alterations to the above-disclosed technical content as equivalent embodiments without departing from the scope of the present utility model. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model without departing from the scope of the present utility model shall still fall within the scope of the present utility model.

Claims

1. An automatic bending and warping measurement device for folding plates, characterized in that, Include: A platform having a measuring section, a conveying section and a folding plate section, wherein the conveying section is located between the measuring section and the folding plate section; A measuring device is disposed in the measuring section; A plate-moving device is mounted on the platform; A set of conveyor rollers, comprising multiple conveyor rollers and disposed in the conveying section; A pressing roller assembly includes multiple upper rollers and multiple lower rollers, each of the upper rollers being located above each of the lower rollers and each of the upper rollers being movable relative to each of the lower rollers. The pressing roller assembly is disposed in the folding plate portion and adjacent to the conveying roller assembly. A folding plate roller assembly includes an upper pressure roller and a lower pressure roller. The upper pressure roller is located above the lower pressure roller, and the upper pressure roller and the lower pressure roller can move synchronously relative to the platform. The folding plate roller assembly is disposed on the folding plate section. A distance sensor is movably mounted on the platform.

2. The automatic warping measurement folding plate equipment as described in claim 1, characterized in that, The upper pressure roller and the lower pressure roller are connected by a connector to make them equidistant and can move synchronously back and forth or up and down.

3. The automatic warping measurement folding plate equipment as described in claim 1, characterized in that, The conveying section is further provided with a clapping mechanism, which is used to center and position the plate.

4. The automatic warping measurement folding plate equipment as described in claim 3, characterized in that, The clapping mechanism includes multiple clapping rods, and each clapping rod is located on both sides of the plate.

5. The automatic bending and warping measurement folding plate equipment as described in claim 1, characterized in that, The measuring device is a 3D measuring instrument, which has the function of detecting the warping position and height of the board material.

6. The automatic warping measurement folding plate device as described in claim 1, characterized in that, The plate-moving device is a robotic arm.

7. The automatic warp measuring plate device as described in any one of claims 1 to 6, characterized in that, It further includes a control device disposed on the platform, the platform further including an upper plate portion and a lower plate portion, the upper plate portion being provided with an upper plate device, the lower plate portion being provided with a lower plate device, and the control device being electrically connected to the measuring device, the plate moving device, the conveying roller group, the pressing roller group, the folding plate roller group, the distance sensor, the upper plate device, and the lower plate device.

8. The automatic warping measurement folding plate device as described in claim 7, characterized in that, The upper plate device and the lower plate device are robotic arms.

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