A high-grade T paperboard multi-layer composite high-strength bonding gluing device

Abstract

The utility model discloses a high -grade T paperboard multilayer composite high -strength bonding is with gluing device, it includes conveying device, and the one side of conveying device top is equipped with the first fixed frame, and the side wall rotation is connected with the compression assembly of first fixed frame, and the other side of conveying device top is equipped with the second fixed frame, and the side wall of second fixed frame inner chamber is equipped with the gluing assembly, this kind of high -grade T paperboard multilayer composite high -strength bonding is with gluing device, through opening motor drives the rotation of rotation plate to make the convex plate rotation drive nub rotates around the center of rotation disc, thereby make the rotation disc rotation drive eccentric rotation of convex axle, in turn make guide ring drive connecting rod move down, the T paperboard of vacuum chuck adsorption is conveniently moved down and is pressed tightly another T paperboard of gluing completion, and the close adhesion is pasted, and the finished product quality is effectively improved, and the intermittent rotation of rotation disc makes the intermittent movement of vacuum chuck, and it is convenient to complete multilayer composite paperboard bonding, second, through the gluing assembly makes the stable adhesion of glue, and it is convenient to make gluing more uniform.

Description

Technical Field

[0001] This utility model relates to the field of paperboard processing technology, specifically to a gluing device for high-strength bonding of multi-layer composites of high-grade T-paperboard. Background Technology

[0002] T-board is a high-end packaging product that falls between kraft linerboard and high-strength corrugated board. Its quality and performance indicators are higher than those of high-strength corrugated board but slightly lower than those of kraft linerboard. It can completely replace kraft linerboard for packaging high-end products. When bonding multi-layer composite T-board, a gluing device is required to apply glue evenly.

[0003] The prior art patent document CN216100929U provides a high-strength multi-layer composite corrugated cardboard bonding device, including a conveying mechanism and a receiving mechanism. The conveying mechanism includes side plates and a roller, with the roller rotatably connected between the two side plates. A liquid storage box is provided at the bottom of the roller, and the two sides of the liquid storage box are fixedly connected to the two side plates. Multiple rollers are rotatably connected to the middle of the two side plates, and the receiving mechanism is placed on one side of the roller. This invention solves the problem of inconsistent glue application caused by manual glue application by having the corrugated cardboard adhere to its bottom surface after passing over the roller and then directly covering the top surface of the bottom corrugated cardboard after descending. The distance between the two limiting frames is adjustable, and the cooperation of the tightening knob and the tightening block can fix the limiting frames. After passing over the roller, the corrugated cardboard directly covers the receiving plate, solving the problem of time-consuming and labor-intensive manual fixing of the corrugated cardboard.

[0004] Although the device has many beneficial effects, the following problems still exist: During the use of the device, the cardboard layers after gluing are not tightly bonded and the adhesion is not strong enough, which affects the quality of the finished product; secondly, the adhesion of the glue to the cardboard is not stable enough during the use of the device, and it is easy to fall due to gravity, resulting in uneven gluing. Therefore, we propose a gluing device for high-strength bonding of multi-layer composites of high-grade T-cardboard. Utility Model Content

[0005] The purpose of this section is to outline some aspects of the embodiments of this utility model and to briefly introduce some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be used to limit the scope of this utility model.

[0006] 1. Technical problems to be solved: To address the issues of insufficient tightness and weak adhesion of cardboard layers after gluing, which affect the quality of the finished product, and the unstable adhesion of the glue to the cardboard, which can easily lead to uneven glue application due to falling due to gravity, this utility model is proposed.

[0007] Therefore, the purpose of this utility model is to provide a high-strength adhesive coating device for multi-layer composite bonding of high-grade T-board, which makes the coated board more tightly bonded and more firmly glued, effectively improving the quality of the finished product, making the adhesive more stable on the board, and making the coating more uniform.

[0008] 2. Technical Solution: To solve the above-mentioned technical problems, according to one aspect of the present invention, the present invention provides the following technical solution: A high-strength adhesive coating device for multi-layer composite bonding of high-grade T-paperboard includes a conveying device. A first fixed frame is located on one side of the top of the conveying device. A pressing assembly is rotatably connected to the side wall of the first fixed frame. The pressing assembly includes a turntable with protrusions at the top and bottom of its side wall. A motor is located on the side wall of the first fixed frame. A rotating plate is located on the outer circumference of the motor's output end, and a protruding plate is located on the outer circumference of the rotating plate. A protruding shaft is located on the top of the other side wall of the turntable. A guide ring is slidably connected to the outer circumference of the protruding shaft. A connecting rod is located at the bottom of the guide ring, and a vacuum suction cup is located at the bottom of the connecting rod. A second fixed frame is located on the other side of the top of the conveying device. A glue storage cavity is opened inside the top of the second fixed frame. An adhesive coating assembly is located on the side wall of the inner cavity of the second fixed frame. The motor is electrically connected to an external power source, and the vacuum suction cup is connected to an external vacuum pump via an air pipe. The dimensions of the protruding shaft match the inner cavity dimensions of the guide ring to prevent the guide ring from loosening and affecting use.

[0009] In a preferred embodiment of this utility model, a high-strength adhesive applicator for multi-layer composite bonding of high-grade T-paperboard is provided. The adhesive applicator assembly includes two grooves formed on the side walls of the inner cavity of a second fixed frame. Each groove has a spring at its top and a slider at its bottom. A connecting shaft is provided on the side wall of each slider, and an adhesive roller is rotatably connected to the outer circumference of the connecting shaft. A receiving groove is formed at the top of each groove, and a baffle is slidably connected to the side wall of the receiving groove at the top of the slider. Multiple adhesive outlets are provided at the top of the inner cavity of the second fixed frame. The baffle moves within the receiving groove to prevent gaps from forming that would allow adhesive to flow into the springs.

[0010] In a preferred embodiment of the high-strength adhesive coating device for multi-layer composite bonding of high-grade T-paperboard according to this utility model, the position of the center of the rotating plate is offset from the position of the center of the turntable, and the position of the convex plate matches the position of the convex block.

[0011] As a preferred embodiment of the high-strength adhesive coating device for multi-layer composite bonding of high-grade T-paperboard according to this utility model, the first fixing frame sidewall is provided with a limiting sleeve that is slidably connected to the connecting rod, and the size and position of the limiting sleeve match the size and position of the connecting rod.

[0012] In a preferred embodiment of the high-strength adhesive coating device for multi-layer composite bonding of high-grade T-paperboard according to this utility model, the size of the slider matches the size of the groove, and the size of the receiving groove matches the size of the baffle.

[0013] As a preferred embodiment of the high-strength adhesive coating device for multi-layer composite bonding of high-grade T-paperboard according to this utility model, each of the multiple adhesive dispensing heads is provided with an electromagnetic valve on its inner circumference, and the adhesive storage cavity is provided with heating plates on both sides of its sidewalls. The heating plates are electrically connected to an external power source.

[0014] In a preferred embodiment of this utility model, a high-strength adhesive coating device for multi-layer composite bonding of high-grade T-paperboard is provided, wherein the bottom of the conveying device is provided with multiple support columns, and each of the support columns is provided with a pad. The pad facilitates anti-slip and prevents the conveying device from sliding and affecting the adhesive coating.

[0015] 3. Beneficial effects: Compared with the prior art, the beneficial effects of this utility model are: This high-strength adhesive coating device for multi-layer composite bonding of high-grade T-boards works by starting an external vacuum pump to allow a vacuum suction cup to pick up the high-grade T-boards. Turning on a motor drives a rotating plate, which in turn rotates a convex plate, causing a protrusion to rotate around the center of the turntable. This rotation of the turntable causes the convex shaft to rotate eccentrically, which in turn causes a guide ring to move a connecting rod downwards. This facilitates the vacuum suction cup to move the high-grade T-board downwards and press it against another T-board that has already been coated, resulting in a tighter and stronger bond, effectively improving the quality of the finished product. When the convex plate rotates to the other side, it disengages from the protrusion, and the turntable stops rotating. The rotating plate then contacts the other protrusion and continues to drive the turntable to rotate, allowing the vacuum suction cup to move intermittently and facilitating the high-strength bonding of multi-layer composite paperboards. This high-strength adhesive applicator for multi-layer composite bonding of high-grade T-board uses the rebound force of a spring to drive a slider downwards, thereby causing the connecting shaft to drive the adhesive roller to always press downwards against the high-grade T-board. This allows it to adapt to board of different thicknesses. Adhesive flows out through the glue outlet onto the surface of the adhesive roller, which presses firmly against the board surface to ensure stable adhesion and prevent glue from falling off. By activating the conveyor, the high-grade T-board is transported, which in turn drives the adhesive roller to rotate, making the adhesive application more uniform. A baffle prevents glue from clogging the spring. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the present utility model will be described in detail below with reference to the accompanying drawings and detailed embodiments. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them: Figure 1This is a schematic diagram of the overall structure of a high-strength adhesive coating device for multi-layer composite bonding of high-grade T-paperboard according to the present invention. Figure 2 This is a schematic diagram of the pressing component structure of a high-strength adhesive coating device for multi-layer composite bonding of high-grade T-paperboard according to this utility model. Figure 3 This is a schematic diagram showing the disassembled structure of the pressing component of a high-strength adhesive coating device for multi-layer composite bonding of high-grade T-paperboard according to this utility model. Figure 4 This is a schematic diagram of the first fixing frame structure of a high-strength adhesive coating device for multi-layer composite bonding of high-grade T-paperboard according to the present invention. Figure 5 This is a cross-sectional schematic diagram of the adhesive coating component structure of an adhesive coating device for high-strength bonding of multi-layer composites of high-grade T-paperboard according to this utility model.

[0017] The following are the labeling instructions in the diagram: 1. Conveying device; 2. First fixed frame; 3. Pressing assembly; 4. Second fixed frame; 5. Glue storage chamber; 6. Glue application assembly; 7. Support column; 8. Pad; 301. Turntable; 302. Protrusion; 303. Motor; 304. Rotating plate; 305. Protruding plate; 306. Protruding shaft; 307. Guide ring; 308. Connecting rod; 309. Vacuum suction cup; 310. Limiting sleeve; 601. Slide groove; 602. Spring; 603. Slider; 604. Connecting shaft; 605. Glue application roller; 606. Receiving groove; 607. Baffle; 608. Glue outlet; 609. Solenoid valve; 610. Heating plate. Detailed Implementation

[0018] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0019] This utility model is described in detail with reference to the schematic diagrams. When describing the embodiments of this utility model, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not adhering to the usual scale. Furthermore, the schematic diagrams are merely examples and should not be construed as limiting the scope of protection of this utility model. In actual manufacturing, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0020] The orientation or positional relationship indicated in the terminology is based on the orientation or positional relationship shown in the accompanying drawings and is only for the convenience of describing the present invention and simplifying the description. It is not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0021] The term "connection method" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0022] The embodiments of this utility model will now be described in further detail with reference to the accompanying drawings.

[0023] This utility model provides an overall structural schematic diagram of an embodiment of a high-strength adhesive coating device for multi-layer composite bonding of high-grade T-paperboard, including: Please see Figures 1-5 This embodiment discloses a high-strength adhesive coating device for multi-layer composite bonding of high-grade T-paperboard. It includes a conveying device 1, a first fixed frame 2 fixed to one side of the top of the conveying device 1, and a pressing assembly 3 rotatably connected to the side wall of the first fixed frame 2. The pressing assembly 3 includes a turntable 301, with protrusions 302 welded to the top and bottom of the side wall of the turntable 301. A motor 303 is fixed to the side wall of the first fixed frame 2, and a rotating plate 304 is fixed to the outer circumference of the output end of the motor 303. A protrusion 3 is welded to the outer circumference of the rotating plate 304. 05. A convex shaft 306 is welded to the top of the other side wall of the turntable 301. A guide ring 307 is slidably connected to the outer circumference of the convex shaft 306. A connecting rod 308 is fixed to the bottom of the guide ring 307. A vacuum suction cup 309 is fixed to the bottom of the connecting rod 308. A second fixed frame 4 is fixed to the other side of the top of the conveying device 1. A glue storage cavity 5 is opened inside the top of the second fixed frame 4. A glue application assembly 6 is slidably connected to the inner side wall of the second fixed frame 4. The motor 303 is electrically connected to an external power source. The vacuum suction cup 309... The system is connected to an external vacuum pump via an air pipe. Activating the external vacuum pump causes the vacuum suction cup 309 to adsorb high-grade T-board. Turning on the motor 303 drives the rotating plate 304 to rotate, causing the convex plate 305 to rotate and the protrusion 302 to rotate around the center of the turntable 301. This rotation of the turntable 301 causes the convex shaft 306 to rotate eccentrically, which in turn causes the guide ring 307 to move the connecting rod 308 downwards. This facilitates the vacuum suction cup 309 to move the high-grade T-board downwards and press it against the other T-board conveyed by the conveying device 1 after gluing, resulting in a tighter and stronger bond, effectively improving the quality of the finished product. When the convex plate 305 rotates to the other side, it disengages from the protrusion 302, and the turntable 301 stops rotating. The convex plate 305 continues to rotate, contacting the other protrusion 302, thus driving the turntable 301 to rotate. This allows the vacuum suction cup 309 to move intermittently, facilitating high-strength bonding of multi-layer composite cardboard. The conveying device 1 is existing technology; please refer directly to patent number CN221051562U for details.

[0024] It is worth noting that, in order to facilitate uniform glue application on the cardboard surface, the glue application assembly 6 specifically includes two sliding grooves 601 formed on the side walls of the inner cavity of the second fixed frame 4. A spring 602 is fixedly mounted on the top of each of the two sliding grooves 601, and a slider 603 is fixedly mounted on the bottom of each of the two springs 602. A connecting shaft 604 is fixedly mounted on the side wall of the slider 603, and a glue application roller 605 is rotatably connected to the outer circumference of the connecting shaft 604. A receiving groove 606 is formed on the top of the sliding groove 601, and a baffle 607 located on the top of the slider 603 is slidably connected to the side wall of the receiving groove 606. The top of the inner cavity of the second fixed frame 4... The unit is equipped with multiple glue outlets 608. The spring 602's rebound force drives the slider 603 to move downward, thereby causing the connecting shaft 604 to drive the glue coating roller 605 to always press downward against the high-grade T-board, which is convenient for adapting to cardboard of different thicknesses. Glue flows out through the glue outlets 608 to the surface of the glue coating roller 605. The glue coating roller 605 presses tightly against the surface of the cardboard, which is convenient for the glue to adhere stably and prevents the glue from falling. The high-grade T-board is conveyed by the start of the conveyor device 1, which drives the glue coating roller 605 to rotate, which makes the glue application more uniform. The baffle 607 prevents the glue from clogging the spring 602.

[0025] Next, in order to facilitate the intermittent rotation of turntable 301, specifically, the position of the center of the rotating plate 304 is offset from the position of the center of turntable 301, and the position of the convex plate 305 is matched with the position of the convex block 302. By rotating plate 304 with its center offset from the position of the center of turntable 301, it is easier to make the convex plate 305 drive turntable 301 to rotate intermittently.

[0026] Meanwhile, in order to prevent the high-grade T-board from tilting and affecting the gluing, specifically, the side wall of the first fixing frame 2 is provided with a limiting sleeve 310 that is slidably connected to the connecting rod 308. The size and position of the limiting sleeve 310 match the size and position of the connecting rod 308. By using the limiting sleeve 310 that matches the size and position of the connecting rod 308, it is easy to limit the movement of the connecting rod 308 and prevent the high-grade T-board adsorbed by the vacuum suction cup 309 from tilting due to the tilting of the connecting rod 308.

[0027] Furthermore, in order to prevent the glue application roller 605 from shaking and causing uneven glue application, specifically, the size of the slider 603 matches the size of the chute 601, and the size of the receiving groove 606 matches the size of the baffle 607. By using the slider 603, which matches the size of the chute 601, it is easier to make the slider 603 move more smoothly and avoid the glue application roller 605 shaking and affecting the glue application.

[0028] It is worth noting that, in order to prevent the glue from solidifying, specifically, each of the multiple glue dispensing heads 608 is equipped with a solenoid valve 609 on its inner circumference, and a heating plate 610 is fixed on both sides of the glue storage chamber 5. The heating plate 610 is electrically connected to an external power source. The amount of glue dispensed can be easily controlled by the solenoid valve 609, and the glue inside the glue storage chamber 5 is heated by the heating plate 610 through conductivity, so as to prevent the glue from solidifying and affecting its use.

[0029] Finally, to prevent the conveyor device 1 from shaking, specifically, multiple support columns 7 are fixed at the bottom of the conveyor device 1, and each support column 7 has a pad 8 fixed at its bottom. The support columns 7 support the conveyor device 1, and the pad 8 makes the high-grade T-board multi-layer composite high-strength bonding adhesive device more stable.

[0030] In addition, the circuits, electronic components, and modules involved in this utility model are all existing technologies, which can be fully implemented by those skilled in the art, and need not be elaborated upon. Furthermore, the scope of protection of this utility model does not involve improvements to the internal structure and methods. The device or equipment models mentioned in this article may be as follows: Motor 303: Y90S-2.

[0031] Combination Figures 1-5 The specific usage process of the high-strength adhesive coating device for multi-layer composite bonding of high-grade T-paperboard in this embodiment is as follows: 1: When this device is needed for high-strength bonding of multi-layer composite high-grade T-board, start the external vacuum pump to make the vacuum suction cup 309 adsorb the high-grade T-board, start the motor 303 to make the rotating plate 304 rotate and drive the convex plate 305 to rotate, so that the convex block 302 rotates around the center of the turntable 301 and drives the turntable 301 to rotate, so that the convex shaft 306 rotates eccentrically and drives the guide ring 307 to move downward, and then the connecting rod 308 drives the T-board adsorbed by the vacuum suction cup 309 to move downward and press the other T-board conveyed by the conveying device 1 after the glue has been applied. The turntable 301 rotates intermittently and the vacuum suction cup 309 moves intermittently to complete the bonding of multi-layer paperboard. 2: The rebound force of spring 602 drives slider 603 to move downward, so that connecting shaft 604 drives glue roller 605 to always press downward against high-grade T-board. Glue flows out of glue head 608 to the surface of glue roller 605. Glue roller 605 presses tightly against the surface of board. Start conveyor device 1 to drive high-grade T-board to be conveyed and drive glue roller 605 to rotate and apply glue evenly.

[0032] Although the present invention has been described above with reference to embodiments, various modifications can be made and components can be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the features in the embodiments disclosed in this invention can be combined with each other in any way. The lack of an exhaustive description of these combinations in this specification is merely for the sake of brevity and resource conservation. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A gluing device for high-strength bonding of multi-layer composites of high-grade T-paperboard, characterized in that, The device includes a conveying device (1), on one side of the top of the conveying device (1) is provided a first fixed frame (2), and a pressing assembly (3) is rotatably connected to the side wall of the first fixed frame (2). The pressing assembly (3) includes a turntable (301), and protrusions (302) are provided at the top and bottom of the side wall of the turntable (301). A motor (303) is provided on the side wall of the first fixed frame (2), and a rotating plate (304) is provided on the outer circumference of the output end of the motor (303). A protruding plate (305) is provided on the outer circumference of the rotating plate (304). A protruding shaft is provided on the top of the other side wall of the turntable (301). (306), a guide ring (307) is slidably connected to the outer circumference of the convex shaft (306), a connecting rod (308) is provided at the bottom of the guide ring (307), a vacuum suction cup (309) is provided at the bottom of the connecting rod (308), a second fixing frame (4) is provided on the other side of the top of the conveying device (1), a glue storage cavity (5) is opened inside the top of the second fixing frame (4), a glue application assembly (6) is provided on the inner side wall of the second fixing frame (4), the motor (303) is electrically connected to an external power source, and the vacuum suction cup (309) is connected to an external vacuum pump through an air pipe.

2. The gluing device for high-strength bonding of multi-layer composite high-grade T-paperboard according to claim 1, characterized in that, The adhesive application assembly (6) includes two slide grooves (601) opened on both sides of the inner cavity of the second fixed frame (4). The top of each slide groove (601) is provided with a spring (602), and the bottom of each spring (602) is provided with a slider (603). The side wall of the slider (603) is provided with a connecting shaft (604). The outer circumference of the connecting shaft (604) is rotatably connected to an adhesive application roller (605). The top of the slide groove (601) is provided with a receiving groove (606). The side wall of the receiving groove (606) is slidably connected to a baffle (607) located on the top of the slider (603). The top of the inner cavity of the second fixed frame (4) is provided with multiple adhesive outlets (608).

3. The gluing device for high-strength bonding of multi-layer composite high-grade T-paperboard according to claim 2, characterized in that, The center of the rotating plate (304) is offset from the center of the turntable (301), and the position of the protruding plate (305) matches the position of the protrusion (302).

4. The gluing device for high-strength bonding of multi-layer composite high-grade T-paperboard according to claim 3, characterized in that, The first fixing frame (2) has a limiting sleeve (310) on its side wall that is slidably connected to the connecting rod (308). The size and position of the limiting sleeve (310) match the size and position of the connecting rod (308).

5. The gluing device for high-strength bonding of multi-layer composite high-grade T-paperboard according to claim 4, characterized in that, The size of the slider (603) matches the size of the groove (601), and the size of the receiving groove (606) matches the size of the baffle (607).

6. The gluing device for high-strength bonding of multi-layer composite high-grade T-paperboard according to claim 5, characterized in that, Each of the dispensing heads (608) is provided with a solenoid valve (609) on its inner circumference, and each of the two side walls of the glue storage cavity (5) is provided with a heating plate (610), which is electrically connected to an external power source.

7. The gluing device for high-strength bonding of multi-layer composite high-grade T-paperboard according to claim 6, characterized in that, The bottom of the conveying device (1) is provided with multiple support columns (7), and the bottom of each of the multiple support columns (7) is provided with a pad (8).

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