A copper-clad plate structure for improving electrical performance of PCB

Abstract

The utility model discloses a copper -clad plate structure of improvement PCB electric performance, specifically related to copper -clad plate technical field, include: copper -clad plate body, the copper -clad plate body has rectangle long side and rectangle short side, the copper -clad plate body includes upper layer copper foil, dielectric layer and lower layer copper foil, and the dielectric layer is located between upper layer copper foil and lower layer copper foil, the dielectric layer includes resin and the glass fiber cloth that is completely infiltrated and is wrapped by resin, the glass fiber cloth includes each other perpendicular warp and weft, and the included angle alpha of warp in glass fiber cloth and the rectangle long side of copper -clad plate body is 5 DEG <= alpha <= 7 DEG. The utility model discloses through adopting the glass fiber cloth of twill, and the included angle alpha of warp of glass fiber cloth and the rectangle long side of copper -clad plate body is 5 DEG <= alpha <= 7 DEG, avoids the glass fiber of copper -clad plate body parallel to PCB signal line, makes PCB graph not to have to rotate when the later processing production, thereby avoids producing the large -area copper -clad plate finished product corner waste material.

Description

Technical Field

[0001] This utility model relates to the field of copper clad laminate technology, and specifically to a copper clad laminate structure for improving the electrical performance of PCBs. Background Technology

[0002] Copper clad laminate (CCL) is the main raw material for PCBs. A typical CCL consists of three main parts: copper foil, glass fiber, and resin. The cost of these three components is approximately 40% for copper foil, 30% for glass fiber, and 30% for resin. The role of glass fiber is to enhance the toughness of the CCL. The horizontal glass fiber bundles are called weft yarns, and the vertical glass fiber bundles are called warp yarns. The two are distributed vertically.

[0003] However, in traditional copper-clad laminates (CCLs), the direction of the glass fiber bundles is often parallel to the PCB signal lines, which can easily lead to CAF (Convection-Avoidance-Resistance) effects and impedance unevenness. The most common solution is to rotate the PCB pattern by 5-7° during the PCB design phase to avoid parallel alignment between the glass fiber and the circuitry, thereby increasing the CAF resistance of the CCL and improving impedance uniformity by increasing the consistency of the dielectric constant Dk. However, PCBs are processed by cutting them into rectangular shapes, and rotating the PCB pattern generates a large area of ​​scrap material at the edges of the finished CCL, reducing the utilization rate of the CCL by approximately 17% and increasing costs by about 17%. Utility Model Content

[0004] The purpose of this invention is to provide a copper-clad laminate structure that improves the electrical performance of PCBs, thereby solving the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a copper-clad laminate structure for improving the electrical performance of a PCB, comprising: A copper-clad laminate body, the copper-clad laminate body having a rectangular long side and a rectangular short side, the copper-clad laminate body including an upper copper foil, a dielectric layer and a lower copper foil, the dielectric layer being located between the upper copper foil and the lower copper foil; The dielectric layer includes resin and a glass fiber cloth completely impregnated and wrapped by the resin. The glass fiber cloth includes warp and weft yarns that are perpendicular to each other. The angle α between the warp yarns in the glass fiber cloth and the long rectangular side of the copper clad laminate body is 5°≤α≤7°.

[0006] Furthermore, the fiberglass cloth is a twill fiberglass cloth that is directly woven, which eliminates the need for a rotation and positioning step and reduces material waste.

[0007] Furthermore, both the outer surfaces of the upper and lower copper foils are provided with an anti-rust layer, which can be a zinc plating layer, a nickel plating layer, or an organic passivation film coating layer, to block the copper foil from contacting oxygen, sulfur, and water vapor in the air, and to inhibit oxidation discoloration and sulfidation blackening.

[0008] Furthermore, both the upper and lower copper foils are ultra-low profile copper foils.

[0009] Furthermore, coupling agent layers are provided between the upper copper foil and the dielectric layer, and between the lower copper foil and the dielectric layer. The coupling agent layers are silane coupling agents, which makes the coupling agent layer more effective.

[0010] The technical effects and advantages provided by this utility model in the above technical solution are as follows: By using twill fiberglass cloth, the angle α between the warp yarns of the fiberglass cloth and the long rectangular side of the copper clad laminate body is 5°≤α≤7°. This avoids the fiberglass of the copper clad laminate body being parallel to the PCB signal lines, so that the PCB pattern does not need to be rotated during subsequent processing. This avoids the generation of large areas of waste material at the edges of the finished copper clad laminate. Under the premise of maintaining almost no change in material cost, the impedance uniformity, CAF resistance, and signal integrity of the PCB are significantly improved. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this utility model. For those skilled in the art, other drawings can be obtained based on these drawings.

[0012] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the dielectric layer of this utility model; Figure 3 This is a top sectional view of the present invention; Figure 4 A schematic diagram showing the placement of PCB patterns on the copper-clad laminate. Figure 5 This is a cross-sectional view of a standard copper-clad laminate. Figure 6 This is a schematic diagram showing the rotation and placement of a PCB pattern on a standard copper-clad board.

[0013] Explanation of reference numerals in the attached figures: 10. Copper-clad laminate body; 11. Upper copper foil; 12. Dielectric layer; 13. Lower copper foil; 14. Resin; 15. Fiberglass cloth. Detailed Implementation

[0014] To enable those skilled in the art to better understand the technical solution of this utility model, the present utility model will be further described in detail below with reference to the accompanying drawings.

[0015] like Figures 5 to 6 As shown ( Figure 6(The slanted black outline in the middle represents the rotated PCB pattern). To improve the CAF effect and impedance unevenness, the conventional method is to rotate the PCB pattern by 5-7° during the PCB circuit design to avoid the fiberglass being parallel to the circuit pattern. However, this will generate a large area of ​​scrap material from the edges of the finished copper-clad board.

[0016] This utility model provides, for example Figures 1 to 4 The copper-clad laminate structure shown here, which improves the electrical performance of a PCB, includes: The copper clad laminate body 10 has a rectangular long side and a rectangular short side. The copper clad laminate body 10 includes an upper copper foil 11, a dielectric layer 12 and a lower copper foil 13. The dielectric layer 12 is located between the upper copper foil 11 and the lower copper foil 13. The dielectric layer 12 includes resin 14 and glass fiber cloth 15 completely impregnated and wrapped by resin 14. The glass fiber cloth 15 includes warp and weft yarns that are perpendicular to each other. The angle α between the warp yarns in the glass fiber cloth 15 and the long rectangular side of the copper clad laminate body 10 is 5°≤α≤7°.

[0017] Fiberglass cloth 15 is a twill fiberglass cloth that is directly woven, eliminating the need for a rotation and positioning step and reducing material waste.

[0018] Both the outer surfaces of the upper copper foil 11 and the lower copper foil 13 are provided with an anti-rust layer. The anti-rust layer can be a zinc plating layer, a nickel plating layer, or an organic passivation film coating layer, which blocks the copper foil from contacting oxygen, sulfur, and water vapor in the air, and inhibits oxidation discoloration and sulfidation blackening.

[0019] Both the upper copper foil 11 and the lower copper foil 13 are ultra-low profile copper foils.

[0020] A coupling agent layer is provided between the upper copper foil 11 and the dielectric layer 12, and between the lower copper foil 13 and the dielectric layer 12. The coupling agent layer is a silane coupling agent, which makes...

[0021] In this invention, by using a twill-woven fiberglass cloth 15, the angle α between the warp of the fiberglass cloth 15 and the long rectangular side of the copper clad laminate body 10 is 5°≤α≤7°, thus preventing the fiberglass of the copper clad laminate body 10 from being parallel to the PCB signal lines. This eliminates the need to rotate the PCB pattern during subsequent processing, thereby avoiding the generation of large areas of scrap at the edges of the finished copper clad laminate. Under the premise of maintaining almost no change in material cost, the impedance uniformity, CAF resistance, and signal integrity of the PCB are significantly improved.

[0022] The foregoing description only illustrates certain exemplary embodiments of the present invention. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the above drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. A copper-clad laminate structure for improving the electrical performance of a PCB, characterized in that, include: The copper clad laminate body (10) has a rectangular long side and a rectangular short side. The copper clad laminate body (10) includes an upper copper foil (11), a dielectric layer (12) and a lower copper foil (13). The dielectric layer (12) is located between the upper copper foil (11) and the lower copper foil (13). The dielectric layer (12) includes resin (14) and glass fiber cloth (15) completely impregnated and wrapped by resin (14). The glass fiber cloth (15) includes warp and weft yarns that are perpendicular to each other. The angle α between the warp yarns in the glass fiber cloth (15) and the long rectangular side of the copper clad laminate body (10) is 5°≤α≤7°.

2. The copper-clad laminate structure for improving PCB electrical performance according to claim 1, characterized in that: The glass fiber cloth (15) is a twill glass fiber cloth that is directly woven.

3. The copper-clad laminate structure for improving PCB electrical performance according to claim 1, characterized in that: The outer surfaces of both the upper copper foil (11) and the lower copper foil (13) are provided with an anti-rust layer.

4. The copper-clad laminate structure for improving PCB electrical performance according to claim 1, characterized in that: Both the upper copper foil (11) and the lower copper foil (13) are ultra-low profile copper foils.

5. The copper-clad laminate structure for improving PCB electrical performance according to claim 1, characterized in that: A coupling agent layer is provided between the upper copper foil (11) and the dielectric layer (12) and between the lower copper foil (13) and the dielectric layer (12), and the coupling agent layer is a silane coupling agent.

Images