Thermal management integrated module, thermal management system, and vehicle

CN224898485UActive Publication Date: 2026-10-27MIND ELECTRONICS APPLIANCE CO LTD
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Patent Information

Application Number
CN202522410610.5
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-11-13
Publication Date
2026-10-27
Estimated Expiration
2035-11-13

AI Technical Summary

Technical Problem

[0005]本申请实施例提出一种热管理集成模块、热管理系统及车辆,旨在改善车辆机舱的空间利用率偏低、热管理模块布置成本偏高的问题

Benefits of technology

[0007]本申请实施例的热管理集成模块,将加热器、压缩机以及控制组件进行了集成式设计。压缩机与加热器沿轴向拼接,控制组件内置在压缩机壳和加热器壳合围成的电气舱内,相较于相关技术中的各部件独立安装、独立线束、独立控制模块的方式而言,省去了多余的线束、控制模块的布置需求,从而既有利于减少安装空间,提高空间利用率,还有利于降低成本,优化成本控制。同时,还有利于减少装配工序,提高装配效率。

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Abstract

The application provides a thermal management integrated module, a thermal management system and a vehicle, and relates to the technical field of vehicle thermal management. The thermal management integrated module comprises: a compressor, which comprises a compressor shell; a heater, which is arranged on one side of the compressor in the axial direction of the compressor, and comprises a heater shell, the heater shell is formed with a heat exchange cavity and a containing groove which are isolated from each other, and the containing groove and the compressor shell jointly form an electrical cabin; and a control assembly, which is arranged in the electrical cabin and is electrically connected with the compressor and the heater respectively, the control assembly comprises a first circuit board and a second circuit board which are arranged in layers and are spaced apart, the working voltage of the first circuit board is less than the working voltage of the second circuit board, and the second circuit board is used for driving the compressor and the heater. In this way, the space utilization rate can be improved, the cost can be reduced, and the cost control can be optimized.
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Description

Technical Field

[0001] This application relates to the field of vehicle thermal management technology, and in particular to a thermal management integrated module, a thermal management system, and a vehicle. Background Technology

[0002] The core of new energy electric vehicles lies in the three-electric system consisting of batteries, electric drive, and electric control, all of which rely on thermal management systems for cooling and heating.

[0003] A current mainstream thermal management solution involves compressing the refrigerant with a compressor to achieve refrigerant circulation, thereby providing cooling and heating effects. Simultaneously, electric heaters are used for auxiliary heating to maintain cabin temperature and heat the battery pack. Furthermore, both the electric heaters and the compressor require their own control units to coordinate and manage their operation.

[0004] In related technologies, a design with separate layouts for the electric heater and compressor is widely adopted, with each located in different positions within the vehicle. However, this layout requires separate wiring harnesses and control modules for each, which not only puts pressure on cost control but also occupies a large installation space, reducing the space utilization rate of the vehicle's engine compartment. Utility Model Content

[0005] This application proposes a thermal management integrated module, a thermal management system, and a vehicle, aiming to improve the problems of low space utilization in the vehicle's engine compartment and high cost of arranging thermal management modules.

[0006] The specific technical solution is as follows: In a first aspect, embodiments of this application propose a thermal management integrated module, comprising: a compressor, the compressor including a compressor housing; a heater disposed on one side of the compressor along its axial direction, the heater including a heater housing, the heater housing forming a heat exchange cavity and a receiving groove that are isolated from each other, the receiving groove and the compressor housing enclosing an electrical compartment; and a control component disposed within the electrical compartment and electrically connected to the compressor and the heater respectively, the control component including a first circuit board and a second circuit board disposed at intervals and layers, the operating voltage of the first circuit board being less than the operating voltage of the second circuit board, the second circuit board being used to drive the compressor and the heater.

[0007] The thermal management integrated module of this application integrates the heater, compressor, and control components. The compressor and heater are axially connected, and the control components are built into the electrical compartment formed by the compressor housing and heater housing. Compared with the independent installation, wiring harness, and control module of each component in related technologies, this eliminates the need for redundant wiring harnesses and control module layout. This not only reduces installation space and improves space utilization but also helps to reduce costs and optimize cost control. Furthermore, it helps to reduce assembly steps and improve assembly efficiency.

[0008] In some embodiments, the second circuit board is located on the side of the first circuit board near the heat exchange chamber, the first circuit board is fixedly connected to the compressor housing, and the second circuit board is fixedly connected to the heater housing.

[0009] This design has several advantages. First, it improves the heat dissipation of the second circuit board, thus extending its lifespan. Second, it allows for a layered design between the two circuit boards, which also improves the assembly accuracy and efficiency of the first and second circuit boards, mitigating the problem of insufficient high and low voltage electrical clearances caused by spacing deviations.

[0010] In some embodiments, the second circuit board includes a circuit board body and a plurality of power devices disposed on the circuit board body, wherein the plurality of power devices are used to be electrically connected to the compressor and / or the heater; The receiving groove is provided with a boss, and the upper surface of the boss is spaced apart from the circuit board body. The power device is disposed on the boss.

[0011] This helps reduce the heat transferred from power devices to the circuit board body, thereby improving the lifespan and reliability of the circuit board body and other electronic components on it. Furthermore, it also helps improve the reliability and stability of power devices under conditions of vibration and shock.

[0012] In some embodiments, the heater further includes an electric heating element and a conductive adapter plate; The conductive adapter plate is disposed in the electrical compartment and located between the second circuit board and the bottom of the receiving groove. The electric heating tube is disposed in the heat exchange cavity. The conductive adapter plate is electrically connected to the second circuit board and the electric heating tube. The conductive adapter plate is used to block the heat transfer between the electric heating tube and the second circuit board.

[0013] The above design achieves several advantages. First, it reduces the heat transferred from the heating element to the second circuit board, mitigating the problem of functional failure caused by the high temperature of the heating element and thus improving the lifespan and reliability of the second circuit board. Second, it increases the conductive area, enhancing current carrying capacity and improving heating efficiency and safety. Third, it also improves the space utilization and structural compactness of the electrical compartment.

[0014] In some embodiments, the conductive adapter plate includes a conductive element and an insulating element sleeved outside the conductive element, wherein the insulating element is spaced apart from the second circuit board and fixed within the receiving groove; The conductive element electrically connects the second circuit board and the heating element.

[0015] The above design firstly reduces the probability of high-pressure leaks, breakdowns, and short circuits, thus improving the safety and reliability of the electrical compartment. Secondly, it improves current transmission efficiency and reduces electrical losses during heating. Furthermore, it enhances the structural stability of components within the electrical compartment, improving their resistance to impacts and vibrations.

[0016] In some embodiments, the thermal management integrated module further includes a first connector and a second connector, both of which are connected to the compressor housing. The first connector is electrically connected to the first circuit board, and the second connector is electrically connected to the second circuit board.

[0017] First, it allows for the separation of high and low voltage ports, improving electrical safety and interference resistance. Second, it facilitates further integration, reduces costs, and increases space utilization and assembly efficiency.

[0018] In some embodiments, the heater housing includes a first housing and a second housing connected to each other, the first housing and the compressor housing enclosing the electrical compartment, and the first housing and the second housing enclosing the heat exchange cavity; A first seal is provided between the first housing and the second housing, and a second seal is provided between the first housing and the compressor housing.

[0019] By designing the first and second seals, the sealing performance of the heat exchange chamber and the electrical compartment is improved, reducing the probability of coolant leakage into the electrical compartment and thus enhancing the operational safety of the control components. Furthermore, the separate heater housing design also improves the ease of manufacturing and yield rate of the heater housing.

[0020] In some embodiments, the heater further includes an electric heating element disposed within the heat exchange chamber, the electric heating element being electrically connected to the second circuit board, wherein: The heat exchange cavity is provided with a tortuous flow channel, and the electric heating tube is located in the flow channel.

[0021] This configuration allows the heating element to directly contact the coolant for heating, which reduces heat loss and increases the contact area between the heating element and the coolant, thereby improving heat exchange efficiency and heating speed.

[0022] In some embodiments, there are multiple heating elements, which are stacked and spaced apart.

[0023] Therefore, firstly, multiple heating elements can be controlled independently and operated in staggered shifts, which improves the flexibility and convenience of heating power adjustment. Secondly, it allows the heating elements to fully contact the coolant, improving heating uniformity and preventing localized overheating. Thirdly, it helps to further improve heating efficiency and heating speed. In addition, the multiple heating elements can form a redundant design, which also helps to improve the reliability of the thermal management integrated module.

[0024] In some embodiments, the heater housing is provided with an inlet pipe and an outlet pipe that communicate with the heat exchange chamber, and the inlet pipe and the outlet pipe are integrally formed with the heater housing.

[0025] This setup not only reduces the cost of manufacturing inlet and outlet water pipes, but also lowers the probability of leakage due to interface sealing issues, thereby improving the reliability of the thermal management integrated module.

[0026] Secondly, embodiments of this application propose a thermal management system, including the thermal management integrated module described in the first aspect.

[0027] Thirdly, embodiments of this application propose a vehicle including the thermal management integrated module described in the first aspect. Attached Figure Description

[0028] Figure 1 A schematic diagram of the structure of the thermal management integrated module provided in the embodiments of this application; Figure 2 A cross-sectional structural schematic diagram of the thermal management integrated module provided in an embodiment of this application; Figure 3 A partial structural schematic diagram of the thermal management integrated module provided in an embodiment of this application; Figure 4 This is another partial structural diagram of the thermal management integrated module provided in an embodiment of this application; Figure 5 for Figure 4 The diagram shown is a breakdown of the structure. Figure 6 This is a schematic diagram of the structure of the second housing provided in an embodiment of this application.

[0029] The annotations in the attached figures are explained as follows: 10. Thermal management integrated module; 100. Compressor; 110. Compressor housing; 111. Refrigerant inlet; 112. Refrigerant outlet; 200. Heater; 201. Heat exchange chamber; 202. Receiving tank; 2021. Boss; 203. Electrical compartment; 210. Heater housing; 211. First housing; 212. Second housing; 2121. Flow channel; 213. Water inlet pipe; 214. Water outlet pipe; 220. Heating element; 230. Conductive adapter plate; 231. Conductive component; 232. Insulating component. 300. Control component; 310. First circuit board; 320. Second circuit board; 321. Circuit board body; 322. Power device; 400. First connector; 500. Second connector; 610. First seal; 620. Second seal. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0031] In the description of this application, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, they are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the accompanying drawings are only for illustrative purposes and should not be construed as limiting this application. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0033] In the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0034] like Figure 1 , Figure 2 and Figure 3 As shown, in a first aspect, embodiments of this application propose a thermal management integrated module 10. The thermal management integrated module 10 includes a compressor 100, a heater 200, and a control component 300. The compressor 100 includes a compressor housing 110. The heater 200 is disposed on one side of the compressor 100 along its axial direction. The heater 200 includes a heater housing 210, which forms a heat exchange chamber 201 and a receiving groove 202 that are isolated from each other. The receiving groove 202 and the compressor housing 110 enclose an electrical compartment 203. The control component 300 is disposed in the electrical compartment 203 and is electrically connected to the compressor 100 and the heater 200 respectively. The control component 300 includes a first circuit board 310 and a second circuit board 320 that are spaced apart and layered. The operating voltage of the first circuit board 310 is lower than the operating voltage of the second circuit board 320. The second circuit board 320 is used to drive the compressor 100 and the heater 200.

[0035] The thermal management integrated module 10 of this application embodiment includes a compressor 100, a heater 200, and a control component 300. The compressor 100 is the power source driving the refrigerant, used to compress the low-temperature, low-pressure gaseous refrigerant into a high-temperature, high-pressure gaseous refrigerant, providing power for the refrigerant's circulation and phase change (heat absorption / release) in the system. The refrigerant circulates in the system according to a predetermined route, realizing heat transfer, thereby fulfilling cooling or heating needs.

[0036] The compressor housing 110 serves as the protective base for the compressor 100, housing its components. These components enable the recovery, compression, and discharge of refrigerant. The compressor housing 110 is equipped with a refrigerant inlet 111 and a refrigerant outlet 112. The refrigerant inlet 111 recovers refrigerant, and the refrigerant outlet 112 discharges compressed refrigerant. Optionally, the refrigerant inlet 111 and refrigerant outlet 112 are connected to the refrigerant piping of the air conditioning system. The refrigerant can then be delivered through these piping to the power battery pack for cooling, maintaining the battery at its optimal operating temperature to improve its lifespan and driving range.

[0037] The heater 200 is a heating element that generates heat based on the Joule heating effect by passing an electric current through a resistive material. The heater 200 can heat the coolant and transfer the heat to the cabin and / or the battery pack via the air conditioning system.

[0038] The heater housing 210 serves as the protective base for the heater 200, housing its components and guiding coolant flow. The housing 202 of the heater housing 210, together with the compressor housing 110, forms the electrical compartment 203. The electrical compartment 203 houses the control components 300, preventing them from being directly exposed to dust, moisture, vibration, and other complex environments. Electromagnetic shielding is achieved through the metallic materials of the heater housing 210 and the compressor housing 110. The heat exchange chamber 201 of the heater housing 210 is the chamber where heat exchange occurs between the heating element of the heater 200 and the coolant. When the heating element of the heater 200 is energized, it generates heat. As the coolant flows through the heat exchange chamber 201, it absorbs the heat from the heating element, becoming a high-temperature coolant, which is then transported through pipelines to the battery pack or cabin for heating.

[0039] Alternatively, the heater housing 210 and the compressor housing 110 can be made of the same material to reduce gaps caused by differences in materials, coefficients of thermal expansion, etc. For example, both can be die-cast from aluminum alloy, which also has the advantages of low density, high strength, and good thermal conductivity.

[0040] The control component 300 is responsible for coordinating the operating states of the compressor and heater to achieve on-demand cooling or heating. The control component 300 includes a first circuit board 310 and a second circuit board 320. The first circuit board 310 is a low-voltage control circuit board, typically operating at 12V or 24V. The first circuit board 310 receives and processes heating or cooling request signals from the external vehicle controller, converts the request signals into control signals, and transmits the control signals to the second circuit board 320, enabling the second circuit board 320 to execute the heating or cooling request. Simultaneously, the first circuit board 310 can also feed back the status of the compressor 100 and heater 200 to the controller.

[0041] The second circuit board 320 is a high-voltage drive board, matched with the high-voltage platform of the vehicle, and its operating voltage is typically 400V, 800V, etc. The second circuit board 320 is used to receive heating or cooling request signals from the first circuit board 310 and execute heating or cooling actions to realize heating and cooling functions.

[0042] The thermal management integrated module 10 of this application embodiment integrates the heater 200, compressor 100, and control component 300. The compressor 100 and heater 200 are axially connected, and the control component 300 is housed within the electrical compartment 203 formed by the compressor housing 110 and heater housing 210. Compared to the independent installation, wiring harness, and control module methods in related technologies, this eliminates the need for redundant wiring harnesses and control module layouts. This not only reduces installation space and improves space utilization but also lowers costs and optimizes cost control. Furthermore, it reduces assembly steps and improves assembly efficiency.

[0043] Secondly, the heat exchange chamber 201 of the heater housing 210 is isolated from the receiving tank 202, which can prevent coolant from seeping into the electrical compartment 203, reduce the probability of high-pressure short circuit caused by coolant leakage, and reduce the failure rate.

[0044] Furthermore, since the second circuit board 320 operates at a higher voltage, it carries a larger operating voltage and current during operation, thus generating significant heat. In related technologies, high-voltage and low-voltage modules coexist on the same circuit board, requiring high-voltage isolation measures, which increases cost and affects heat dissipation. This application addresses this by separating the first circuit board 310 (low voltage) and the second circuit board 320 (high voltage) into distinct layers. This approach reduces heat transfer from the second circuit board 320 to the first circuit board 310, extending the lifespan of both circuit boards and electronic components. Moreover, eliminating the need for high-low voltage isolation measures further reduces the probability of insulation failure between the high and low voltage circuit boards, lowers costs, and improves their reliability and safety.

[0045] Furthermore, the coordinated control of the compressor 100 and heater 200 by the control component 300 eliminates the need for communication and coordination between the two controllers, which also helps to improve the response rate and thus improve thermal management efficiency.

[0046] like Figure 2 and Figure 3 As shown, in some embodiments, the second circuit board 320 is located on the side of the first circuit board 310 near the heat exchange chamber 201. The first circuit board 310 is fixedly connected to the compressor housing 110, and the second circuit board 320 is fixedly connected to the heater housing 210.

[0047] This configuration offers several advantages. First, since the second circuit board 320 generates a significant amount of heat, placing it near the heat exchange chamber 201 and connecting it to the heater housing 210 allows the coolant in the heat exchange chamber 201 to absorb heat from the second circuit board 320 through the heater housing 210. This improves the heat dissipation of the second circuit board 320 and extends its service life. Second, the first circuit board 310 is fixedly connected to the compressor housing 110, and the second circuit board 320 is fixedly connected to the heater housing 210. This allows for the initial assembly of the two circuit boards onto the compressor housing 110 and heater housing 210, followed by a splicing assembly. This ensures both circuit board installation and fixation while maintaining a layered spacing design between them. This improves the assembly accuracy and efficiency of the first circuit board 310 and second circuit board 320, mitigating the problem of insufficient high and low voltage electrical clearances caused by spacing deviations.

[0048] like Figures 2 to 4 As shown, in some embodiments, the second circuit board 320 includes a circuit board body 321 and a plurality of power devices 322 disposed on the circuit board body 321. The plurality of power devices 322 are used for electrical connection with the compressor 100 and / or the heater 200. For example, some of the power devices 322 are electrically connected to the compressor 100, and the remaining power devices 322 are electrically connected to the heater 200; or, all of the power devices 322 are electrically connected to the compressor 100; or, all of the power devices 322 are electrically connected to the heater 200. A boss 2021 is provided in the receiving groove 202, and the upper surface of the boss 2021 is spaced apart from the circuit board body 321. The power devices 322 are disposed on the boss 2021.

[0049] This embodiment presents a specific structure for the second circuit board 320. The circuit board body 321 serves as the base of the second circuit board 320 and is used to arrange the drive circuitry. The power device 322 can be a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), IGBT (Insulated Gate Bipolar Transistor), etc., used to drive the heater 200 and compressor 100 to achieve the corresponding heating or cooling functions. After receiving the control signal from the first circuit board 310, the second circuit board 320 performs relevant controls on the power device 322, such as switching on / off and switching frequency control, to achieve precise control of the power of the compressor 100 and the heater 200. The power device 322 is the main heat-generating element.

[0050] In this embodiment, the power device 322 is mounted on the boss 2021 within the receiving groove 202, and the boss 2021 is spaced apart from the circuit board body 321. Therefore, the heat generated by the power device 322 can be diffused through the boss 2021 to the heater housing 210, achieving heat dissipation. This helps reduce the heat transferred from the power device 322 to the circuit board body 321, thereby improving the service life and reliability of the circuit board body 321 and other electronic components on it. Furthermore, vibrations during vehicle operation and compressor 100 operation will not cause significant displacement of the power device 322, further improving its reliability and stability under vibration and impact conditions.

[0051] like Figures 2 to 5 As shown, in some embodiments, the heater 200 further includes an electric heating element 220 and a conductive adapter plate 230. The conductive adapter plate 230 is disposed in the electrical compartment 203 and located between the bottom of the second circuit board 320 and the receiving groove 202. The electric heating element 220 is disposed in the heat exchange chamber 201. The conductive adapter plate 230 is electrically connected to the second circuit board 320 and the electric heating element 220. The conductive adapter plate 230 is used to block the heat transfer between the electric heating element 220 and the second circuit board 320.

[0052] The electric heating tube 220 is the core heating element of the heater 200. After being powered on, the electric heating tube 220 directly heats the coolant in the heat exchange chamber 201. The heated high-temperature coolant is then transported to the battery pack or cabin space through pipelines for use.

[0053] The conductive adapter plate 230 is used to realize the electrical connection between the second circuit board 320 and the heating element 220, and at the same time, it can also block the heat transfer between the heating element 220 and the second circuit board 320. The conductive adapter plate 230 is located between the second circuit board 320 and the bottom of the receiving groove 202, which is close to the connection pin of the heating element 220 and can form a physical barrier between the heating element 220 and the second circuit board 320, while adapting to the layout requirements of the compact space of the electrical compartment 203.

[0054] Through the above design, this embodiment achieves several advantages. First, the high temperature of the heating element 220 during operation is blocked by the conductive adapter plate 230, thereby reducing the heat transferred from the heating element 220 to the second circuit board 320. This mitigates the problem of functional failure of the second circuit board 320 caused by the high temperature of the heating element 220, and improves the service life and reliability of the second circuit board 320. Second, the conductive adapter plate 230 electrically connects the second circuit board 320 and the heating element 220. Compared to directly soldering the pins of the heating element 220 to the second circuit board 320, this increases the conductive area and improves the current carrying capacity, thus enhancing heating efficiency and safety. Furthermore, it also improves the space utilization and structural compactness within the electrical compartment 203.

[0055] like Figure 2 and Figure 4 As shown, in some embodiments, the conductive adapter plate 230 includes a conductive element 231 and an insulating element 232 sleeved on the outside of the conductive element 231. The insulating element 232 is spaced apart from the second circuit board 320 and fixed in the receiving groove 202. The conductive element 231 is electrically connected to the second circuit board 320 and the heating tube 220.

[0056] This embodiment presents one specific structure of the conductive adapter plate 230. The conductive element 231 provides electrical connection and may include a plate-shaped main body and multiple pins located at the edge of the plate-shaped main body. The pins are connected to the second circuit board 320 and the heating element 220, respectively. The insulating element 232 may be made of a high-strength insulating material, which covers the outside of the plate-shaped main body of the conductive element 231 and at least partially covers the pins of the conductive element 231. The main functions of the insulating element 232 include: first, isolating the conductive element 231 from external conductors such as the second circuit board 320 and the heater housing 210 to prevent high-voltage leakage, breakdown, etc.; second, fixing the conductive adapter plate 230 and providing rigid support for the conductive element 231 to ensure stable connection with the second circuit board 320 and the heating element 220; and third, maintaining a distance from the second circuit board 320 to achieve physical isolation and reduce the heat transferred from the heating element 220 to the second circuit board 320.

[0057] The above design firstly reduces the probability of high-pressure leaks, breakdowns, and short circuits, thus improving the safety and reliability of the electrical compartment 203. Secondly, it improves current transmission efficiency and reduces electrical losses during heating. Furthermore, it enhances the structural stability of components within the electrical compartment 203, improving their resistance to impacts and vibrations.

[0058] like Figure 1 and Figure 3 As shown, in some embodiments, the thermal management integrated module 10 further includes a first connector 400 and a second connector 500, both of which are connected to the compressor housing 110. The first connector 400 is electrically connected to the first circuit board 310, and the second connector 500 is electrically connected to the second circuit board 320.

[0059] The first connector 400 is a low-voltage control signal transmission interface used to interact with the vehicle's low-voltage system. Its main functions include: receiving control commands from the vehicle controller and battery management system; uploading monitoring signals collected by the first circuit board, such as compressor speed and heater power, to the vehicle; providing low-voltage power to the first circuit board 310, etc.

[0060] The second connector 500 is a high-voltage power current transmission port used for electrical connection with the vehicle's high-voltage system. Its main functions include: receiving high-voltage electricity from the vehicle's battery pack to provide operating power for the compressor 100 and heater 200; transmitting the high-voltage current regulated by the second circuit board 320 to the compressor 100 and heater 200, etc.

[0061] By providing a first connector 400 and a second connector 500 on the compressor housing 110, firstly, a separate design for the high and low pressure ports can be achieved, improving electrical safety and anti-interference capabilities. Secondly, it facilitates further improvement in integration, reduces costs, and increases space utilization and assembly efficiency.

[0062] like Figure 2 , Figure 5 As shown, in some embodiments, the heater housing 210 includes a first housing 211 and a second housing 212 connected to each other. The first housing 211 and the compressor housing 110 enclose an electrical compartment 203. The first housing 211 and the second housing 212 enclose a heat exchange chamber 201. A first seal 610 is provided between the first housing 211 and the second housing 212. A second seal 620 is provided between the first housing 211 and the compressor housing 110.

[0063] The heater housing 210 has a split structure. The first housing 211 and the compressor housing 110 enclose the electrical compartment 203, and together with the second housing 212, they enclose the heat exchange chamber 201, achieving physical isolation between the electrical components and the heat exchange components. The first seal 610 and the second seal 620 can be sealing rings, sealing gaskets, sealing felt, etc., and can be flexibly designed according to the actual situation.

[0064] By designing the first seal 610 and the second seal 620, the sealing performance of the heat exchange chamber 201 and the electrical compartment 203 is improved, reducing the probability of coolant leakage into the electrical compartment 203, thereby improving the operational safety of the control assembly 300. Furthermore, by providing a split heater housing 210, the ease of manufacturing and yield rate of the heater housing 210 are also improved.

[0065] like Figure 5 and Figure 6 As shown, in some embodiments, the heat exchange cavity 201 is provided with a tortuous flow channel 2121. Specifically, the second housing 212 is provided with the flow channel 2121, and the first housing 211 and the flow channel 2121 form the heat exchange cavity 201. The electric heating tube 220 is provided in the flow channel 2121.

[0066] The flow channel 2121 is an internal channel integrally die-cast from the second shell 212, and has a tortuous extension shape, such as S-shaped, U-shaped, or spiral-shaped. The heating element 220 is located inside the flow channel 2121, that is, the heating element 220 is also in a tortuous extension shape. This arrangement allows the heating element 220 to directly contact the coolant for heating, which reduces heat loss and increases the contact area between the heating element 220 and the coolant, thereby improving heat exchange efficiency and heating speed.

[0067] like Figure 5 and Figure 6 As shown, in some embodiments, there are multiple heating elements 220, which are stacked and spaced apart. For example, there may be two heating elements 220, which can be stacked at intervals along the depth direction of the flow channel 2121; or, they can be stacked at intervals along the width direction of the flow channel. Therefore, firstly, the multiple heating elements 220 can be independently controlled and operated in staggered shifts, thereby improving the flexibility and convenience of heating power adjustment. Secondly, it allows the heating elements 220 to fully contact the coolant, improving heating uniformity and avoiding localized overheating. Furthermore, it helps to further improve heating efficiency and heating speed. In addition, the multiple heating elements 220 can form a redundant design, which also helps to improve the reliability of the thermal management integrated module 10.

[0068] like Figures 1 to 6 As shown, in some embodiments, the heater housing 210 is provided with an inlet pipe 213 and an outlet pipe 214 that communicate with the heat exchange chamber 201. The inlet pipe 213 and the outlet pipe 214 are integrally formed with the heater housing 210. For example, the inlet pipe 213 and the outlet pipe 214 can be integrally formed with the second housing 212 by die casting.

[0069] This configuration not only helps reduce the cost of manufacturing inlet and outlet water pipes, but also reduces the probability of leakage due to interface sealing problems, thereby improving the reliability of the thermal management integrated module 10.

[0070] Secondly, embodiments of this application propose a thermal management system, including the thermal management integrated module 10 described in the first aspect.

[0071] The thermal management system of this application uses the thermal management integrated module 10 described in the first aspect, which not only reduces installation space and improves space utilization, but also reduces costs and optimizes cost control. Simultaneously, it helps reduce assembly steps and improve assembly efficiency. Secondly, it helps reduce the probability of high-voltage short circuits caused by coolant leakage, thus reducing the failure rate. Furthermore, by layering and spacing the first circuit board 310 (low voltage) and the second circuit board 320 (high voltage), this application helps reduce the heat transferred from the second circuit board 320 to the first circuit board 310, extending the service life of both circuit boards and electronic components. On the other hand, it eliminates the need for high-low voltage isolation measures, which also helps reduce the probability of insulation failure between the high and low voltage circuit boards while reducing costs and improving their reliability and safety. In addition, it helps improve the response rate, thereby improving thermal management efficiency.

[0072] Thirdly, embodiments of this application propose a vehicle including the thermal management integrated module 10 described in the first aspect.

[0073] The vehicle described in this application uses the thermal management integrated module 10 as described in the first aspect, which not only reduces installation space and improves space utilization, but also reduces costs and optimizes cost control. Simultaneously, it helps reduce assembly steps and improve assembly efficiency. Secondly, it helps reduce the probability of high-voltage short circuits caused by coolant leakage, thus reducing the failure rate. Furthermore, by layering and spacing the first circuit board 310 (low voltage) and the second circuit board 320 (high voltage), this application helps reduce the heat transferred from the second circuit board 320 to the first circuit board 310, extending the service life of both circuit boards and electronic components. On the other hand, it eliminates the need for high-low voltage isolation measures, further reducing the probability of insulation failure between the high and low voltage circuit boards while lowering costs and improving their reliability and safety. In addition, it helps improve the response rate, thereby improving thermal management efficiency.

[0074] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A thermal management integrated module, characterized in that, include: The compressor, including the compressor housing; A heater is located on one side of the compressor along its axial direction. The heater includes a heater housing, which forms a heat exchange chamber and a receiving groove that are isolated from each other. The receiving groove and the compressor housing together form an electrical compartment. and A control assembly is located in the electrical compartment and is electrically connected to the compressor and the heater respectively. The control assembly includes a first circuit board and a second circuit board arranged in a layered manner. The operating voltage of the first circuit board is lower than that of the second circuit board. The second circuit board is used to drive the compressor and the heater.

2. The thermal management integrated module according to claim 1, characterized in that, The second circuit board is located on the side of the first circuit board near the heat exchange chamber. The first circuit board is fixedly connected to the compressor housing, and the second circuit board is fixedly connected to the heater housing.

3. The thermal management integrated module according to claim 1, characterized in that, The second circuit board includes a circuit board body and a plurality of power devices disposed on the circuit board body, wherein the plurality of power devices are used to electrically connect to the compressor and / or the heater; The receiving groove is provided with a boss, and the upper surface of the boss is spaced apart from the circuit board body. The power device is disposed on the boss.

4. The thermal management integrated module according to claim 1, characterized in that, The heater also includes an electric heating element and a conductive adapter plate; The conductive adapter plate is disposed in the electrical compartment and located between the second circuit board and the bottom of the receiving groove. The electric heating tube is disposed in the heat exchange cavity. The conductive adapter plate is electrically connected to the second circuit board and the electric heating tube. The conductive adapter plate is used to block the heat transfer between the electric heating tube and the second circuit board.

5. The thermal management integrated module according to claim 4, characterized in that, The conductive adapter plate includes a conductive component and an insulating component sleeved on the outside of the conductive component. The insulating component is spaced apart from the second circuit board and fixed in the receiving groove. The conductive element electrically connects the second circuit board and the heating element.

6. The thermal management integrated module according to claim 1, characterized in that, The thermal management integrated module further includes a first connector and a second connector, both of which are connected to the compressor housing. The first connector is electrically connected to the first circuit board, and the second connector is electrically connected to the second circuit board.

7. The thermal management integrated module according to claim 1, characterized in that, The heater housing includes a first housing and a second housing connected to each other. The first housing and the compressor housing enclose the electrical compartment, and the first housing and the second housing together form the heat exchange cavity. A first seal is provided between the first housing and the second housing, and a second seal is provided between the first housing and the compressor housing.

8. The thermal management integrated module according to claim 1, characterized in that, The heater further includes an electric heating element disposed within the heat exchange chamber, the electric heating element being electrically connected to the second circuit board, wherein: The heat exchange chamber is provided with a tortuous flow channel, and the electric heating tube is disposed in the flow channel; And / or, there are multiple heating elements, and the multiple heating elements are stacked and spaced apart; And / or, the heater shell is provided with an inlet pipe and an outlet pipe that communicate with the heat exchange chamber, and the inlet pipe and the outlet pipe are integrally formed with the heater shell.

9. A thermal management system, characterized in that, Includes the thermal management integrated module as described in any one of claims 1-8.

10. A vehicle, characterized in that, Includes the thermal management integrated module as described in any one of claims 1-8.