A connecting piece, a bridge arm structure, a half-bridge unit, a power module and a vehicle

Abstract

The application discloses a connecting piece, a bridge arm structure, a half-bridge unit, a power module and a vehicle. The connecting piece comprises a first connecting part, a second connecting part and a third connecting part. The second connecting part is connected with the first connecting part along a first direction. An end of the second connecting part away from the first connecting part is provided with a plurality of welding parts. The plurality of welding parts are arranged at intervals along a second direction. Each welding part is adapted to be welded with a chip. The third connecting part is arranged on a side of the second connecting part away from the first connecting part. The third connecting part is fixedly connected with each welding part. The first direction intersects with the second direction. In this way, the third connecting part connects the plurality of welding parts together, so that the third connecting part can serve as a low-impedance common current path of the plurality of electric cores and can level the potentials of the plurality of electric cores, so that each electric core is under the same electric potential. Meanwhile, since the third connecting part serves as the common current path, the current flowing through the third connecting part can be balanced, so as to ensure the uniformity of the current flowing through each electric core.

Description

Technical Field

[0001] This application belongs to the field of vehicle technology, specifically relating to a connector, a bridge arm structure, a half-bridge unit, a power module, and a vehicle. Background Technology

[0002] With the increasing development of new energy vehicles, power modules are widely used in the field of new energy vehicle technology. Currently, power modules have become an important component in motor controllers, inverters, and new energy charging piles in new energy vehicles.

[0003] In related technologies, power modules typically contain multiple chips, each connected to an external circuit via metal wires. However, due to the limited cross-sectional area of ​​the metal wires, even with multiple wires connected in parallel, it is difficult to distribute the current evenly, resulting in poor uniformity of the current flowing through each cell. Utility Model Content

[0004] This application aims to provide a connector, bridge arm structure, half-bridge unit, power module, and vehicle that can solve the problem in the related technology that multiple chips inside the power module are connected to the external circuit through metal wires. However, due to the limited cross-sectional area of ​​the metal wires, even if multiple wires are connected in parallel, it is difficult to distribute the current evenly, resulting in poor uniformity of the current flowing through each cell.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows: In a first aspect, embodiments of this application provide a connector, including: a first connecting portion adapted to be welded to a substrate; A second connecting portion is connected to the first connecting portion along a first direction. The second connecting portion has a plurality of welding portions at one end away from the first connecting portion. The plurality of welding portions are arranged at intervals along a second direction. Each welding portion is adapted to be welded to one of the chips. The third connecting part is located on the side of the second connecting part away from the first connecting part, and the third connecting part is fixedly connected to each of the welding parts, wherein the first direction intersects the second direction.

[0006] Optionally, the chip has a second electrode and two first electrodes, with the second electrode disposed between the two first electrodes along the second direction; each of the welding portions includes two welding pins, which are spaced apart along the second direction, and each welding pin is welded to one of the first electrodes and fixedly connected to the third connection portion; Each of the welding portions is further provided with a clearance groove, which is disposed between the two welding pins along the second direction, and the clearance groove is used to accommodate the second electrode.

[0007] Optionally, the first connecting portion is provided with a receiving groove, which extends through the first connecting portion along a third direction, and the first direction, the second direction, and the third direction intersect each other.

[0008] Optionally, there are two of each of the second connecting portions and the third connecting portions. The two second connecting portions are spaced apart on both sides of the first connecting portion along the first direction, and each third connecting portion is fixedly connected to the corresponding welding portion.

[0009] Optionally, the two second connecting portions are arranged symmetrically with respect to the second direction.

[0010] Secondly, embodiments of this application propose a bridge arm structure, including: a plurality of chips, a substrate, and a connector as described in any of the above claims, wherein the plurality of chips are disposed between the substrate and the connector, each chip is welded to a welding portion, and the first connecting portion is welded to the substrate.

[0011] Optionally, the substrate includes an insulating portion, a first metal portion, and a second metal portion, wherein the first metal portion and the second metal portion are disposed on the side of the insulating portion facing the chip, and the second metal portion is spaced apart on the side of the first metal portion along the first direction; The first metal part is welded to the first connecting part, and a plurality of chips are spaced apart on the second metal part along the second direction, with each chip electrically connected to the second metal part.

[0012] Thirdly, embodiments of this application propose a half-bridge unit, including: a connector as described in any of the preceding claims; or a bridge arm structure as described in any of the preceding claims.

[0013] Fourthly, embodiments of this application propose a power module, including: a bridge arm structure as described in any of the preceding claims; or a half-bridge unit as described above.

[0014] Fifthly, embodiments of this application propose a vehicle comprising: a half-bridge unit as described above; or a power module as described above.

[0015] In the embodiments of this application, a connector is used to electrically connect multiple battery cells. The connector includes a first connecting portion, a second connecting portion, and a third connecting portion. The second connecting portion is connected to the first connecting portion along a first direction. The end of the second connecting portion opposite to the first connecting portion is provided with multiple welding portions, which are spaced apart along a second direction. Each welding portion is suitable for welding to a chip. The third connecting portion is located on the side of the second connecting portion opposite to the first connecting portion and is fixedly connected to each welding portion. The first direction intersects the second direction. In this way, multiple welding portions are connected together through the third connecting portion, so that the third connecting portion can serve as a low-impedance common current path for multiple battery cells and can level the potential of multiple battery cells, so that each battery cell is under the same potential. At the same time, since the third connecting portion serves as a common current path, it can balance the current flowing through it to ensure the uniformity of the current flowing through each battery cell. It can also improve the structural strength of the multiple welding portions and improve the reliability of the connection.

[0016] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0017] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of the connector from one perspective according to an embodiment of this application; Figure 2 This is a structural schematic diagram of the connector according to an embodiment of this application from another perspective; Figure 3 This is a schematic diagram of the bridge arm structure according to an embodiment of this application; Figure 4 This is a partial exploded view of the bridge arm structure according to an embodiment of this application; Figure 5 This is a schematic diagram of the chip structure according to an embodiment of this application.

[0018] Figure label: 1: Connector; 11: First connecting part; 111: Receiving groove; 12: Second connecting part; 121: Welding part; 1211: Welding pin; 1212: Clearance groove; 13: Third connecting part; 2: Chip; 21: First electrode; 22: Second electrode; 3: Substrate; 31: Insulating part; 32: First metal part; 33: Second metal part; X: First direction; Y: Second direction; Z: Third direction. Detailed Implementation

[0019] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0020] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "multiple" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0021] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0022] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0023] Before explaining the connectors, bridge arm structures, half-bridge units, power modules, and vehicles provided in the embodiments of this application, the application scenarios of the connectors, bridge arm structures, half-bridge units, power modules, and vehicles provided in the embodiments of this application will be specifically described: With the increasing development of new energy vehicles, power modules are widely used in the field of new energy vehicle technology. Currently, power modules have become the core components for realizing power conversion in motor controllers, inverters, and new energy charging piles in new energy vehicles.

[0024] In related technologies, power modules typically contain multiple chips, each connected to an external circuit via metal wires. Generally, wire bonding technology is used for interconnection, employing multiple thin metal wires (such as aluminum or copper wires) to ultrasonically bond the chip electrodes to the substrate. While this technology is low-cost and mature, with technological advancements, power modules need to handle increasingly larger currents, operate at higher temperatures, and have smaller footprints. Traditional wire bonding technology has gradually revealed many problems, becoming a bottleneck limiting module performance.

[0025] The main problems with wire bonding technology lie in its thin conductors, high parasitic parameters, poor heat dissipation, and insufficient reliability. First, the limited cross-sectional area of ​​thin metal wires makes it difficult to evenly distribute current evenly, even with multiple wires connected in parallel, easily leading to localized overcurrent and overheating, and in severe cases, burnout. Second, the curved shape of the wires introduces significant parasitic inductance, generating voltage spikes and energy losses at high frequencies, limiting module efficiency. Simultaneously, the small contact area at the solder joint between the metal wire and the chip / substrate makes heat dissipation difficult. Prolonged high-temperature operation accelerates oxidation and fatigue cracking at the solder interface, and the mechanical stress caused by thermal expansion and contraction easily leads to desoldering or breakage. Furthermore, the complex soldering process of wire bonding, requiring individual operation and making yield control difficult, increases production costs and occupies vertical space due to the need for wire curvature, hindering module miniaturization design. These combined problems make traditional wire bonding interconnects unable to meet the demands of next-generation power modules requiring high power density and high reliability.

[0026] Therefore, embodiments of this application provide a connector, a bridge arm structure, a half-bridge unit, a power module, and a vehicle. The connector, bridge arm structure, half-bridge unit, power module, and vehicle provided in this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0027] like Figure 1 and Figure 2 As shown, according to some embodiments of this application, the connector 1 is used to electrically connect multiple chips 2. The connector 1 includes: a first connecting portion 11, a second connecting portion 12, and a third connecting portion 13. The first connecting portion 11 is adapted to be soldered to a substrate 3. The second connecting portion 12 is connected to the first connecting portion 11 along a first direction X. The end of the second connecting portion 12 away from the first connecting portion 11 is provided with multiple soldering portions 121. The multiple soldering portions 121 are arranged at intervals along a second direction Y. Each soldering portion 121 is adapted to be soldered to a chip 2. The third connecting portion 13 is provided on the side of the second connecting portion 12 away from the first connecting portion 11. The third connecting portion 13 is fixedly connected to each soldering portion 121. The first direction X intersects the second direction Y.

[0028] In this embodiment, multiple welding portions 121 are connected together by a third connecting portion 13, thereby enabling the third connecting portion 13 to serve as a low-impedance common current path for multiple chips 2 and to level the potential of multiple chips 2, so that each chip 2 is under the same voltage; at the same time, since the third connecting portion 13 serves as a common current path, the current flowing through it can be balanced to ensure the uniformity of the current flowing through each chip 2; and the structural strength of the multiple welding portions 121 can be improved, thereby enhancing the reliability of the connection.

[0029] It should be noted that the first direction X specifically refers to the length direction of the connector 1, or it can also be the length direction of the bridge arm structure; the second direction Y specifically refers to the width direction of the connector 1, or it can also be the width direction of the bridge arm structure; and the third direction Z specifically refers to the height direction of the connector 1, or it can also be the height direction of the bridge arm structure. The first direction X, the second direction Y, and the third direction Z intersect each other; preferably, the first direction X, the second direction Y, and the third direction Z are perpendicular to each other, and this will not be elaborated further.

[0030] Understandably, the first direction X, the second direction Y, and the third direction Z are mutually perpendicular. Specifically, this can be "perpendicular" in the strict sense, meaning that the angle between any two of the first direction X, the second direction Y, and the third direction Z is 90°; or it can be "approximately perpendicular," specifically meaning that the angle between any two of the first direction X, the second direction Y, and the third direction Z includes a certain error. Considering the measurement and the error associated with the measurement of a specific quantity (i.e., the limitations of the measurement system), this error is within the acceptable deviation range for a specific value as determined by a person skilled in the art. For example, the angle between any two of the first direction X, the second direction Y, and the third direction Z is 90° ± 5°.

[0031] In specific applications, the first connection part 11 is suitable for welding to the substrate 3, thereby realizing the connection between the substrate 3 and the chip 2 through the first connection part 11, which facilitates the flow of current. It can be understood that the first connection part 11 is welded to the substrate 3, specifically by using silver paste or silver film with silver sintering process, or by directly welding together with solder paste or solder pads.

[0032] It should be noted that the second connecting part 12 has a plurality of welding parts 121 at the end opposite to the first connecting part 11. The number of welding parts 121 matches the number of chips 2, that is, one welding part 121 corresponds to one chip 2. Each welding part 121 is welded to the corresponding chip 2, thereby realizing the electrical connection between the chip 2 and the connector 1.

[0033] Understandably, the number of chips 2 can be any number, such as 3, 4, 5, or 6. The number of chips 2 is equal to the number of soldering parts 121. Those skilled in the art can set this number according to actual needs, and this application does not impose any restrictions on it.

[0034] Specifically, the third connection part 13 is located on the side of the second connection part 12 away from the first connection part 11, and the third connection part 13 is fixedly connected to each welding part 121 to connect all welding parts 121 together, so that each welding part 121 and the third connection part 13 form an equipotential body, thereby leveling the potential of the chip 2 electrically connected to each welding part 121, thus eliminating the inconsistency of the reference potential of multiple chips 2 and ensuring the consistency of the voltage of each chip 2; at the same time, the third connection part 13 provides a low-impedance common current path for each chip 2. After the current is collected in this path, it will be naturally redistributed, reducing the impact of small differences in the parameters of individual chips 2 on the total current distribution; this can balance the parasitic inductance of the branch corresponding to each chip 2, thereby ensuring that the chips 2 are simultaneously turned on or off, fundamentally solving the problem of dynamic current imbalance and the resulting voltage spikes.

[0035] It should be noted that the first connecting part 11, the second connecting part 12, and the third connecting part 13 are specifically made of conductive materials, such as aluminum, copper, etc.; preferably, the first connecting part 11, the second connecting part 12, and the third connecting part 13 are all made of copper, which makes the resistance lower and the heat dissipation better; of course, the materials of the first connecting part 11, the second connecting part 12, and the third connecting part 13 can be the same or different, and those skilled in the art can set them according to actual needs, and this application does not limit them in this regard.

[0036] Understandably, the first connecting part 11, the second connecting part 12 and the third connecting part 13 can be integrally formed parts, thereby improving the overall structural strength of the connecting part 1; or they can be separate forming parts, which are processed separately and then welded together, making them easier to process and improving processing efficiency.

[0037] like Figure 1 , Figure 2 and Figure 5 As shown, in some embodiments of this application, chip 2 has a second electrode 22 and two first electrodes 21. Along the second direction Y, the second electrode 22 is disposed between the two first electrodes 21. Each welding part 121 includes two welding pins 1211, which are spaced apart along the second direction Y. Each welding pin 1211 is welded to one of the first electrodes 21 and is fixedly connected to the third connecting part 13. Each welding part 121 is also provided with a relief groove 1212, which is disposed between the two welding pins 1211 along the second direction Y. The relief groove 1212 is used to accommodate the second electrode 22.

[0038] In this embodiment of the application, each welding pin 1211 is welded to a first electrode 21, and the clearance groove 1212 provided in each welding part 121 between two welding pins 1211 can accommodate the second electrode 22. In this way, while ensuring a reliable connection between the welding pin 1211 and the first electrode 21 of the chip 2, the welding part 121 can be prevented from squeezing the second electrode 22, thereby reducing the possibility of the second electrode 22 cracking due to mechanical stress (squeezing) and causing functional damage to the chip 2.

[0039] In specific applications, chip 2 can be any one of the following: MOSFET, transistor, field-effect transistor, thyristor, IGBT (Insulated Gate Bipolar Transistor). Those skilled in the art can configure it according to actual needs.

[0040] Understandably, such as Figure 5 As shown, chip 2 has a second electrode 22 and two first electrodes 21. Specifically, taking chip 2 as an IGBT as an example, chip 2 has a first electrode 21, a second electrode 22 and a third electrode (not shown in the figure); wherein, the first electrode 21 is the source, and the current flows in from the source; the second electrode 22 is the gate, which is used for voltage control. The opening and closing of the conductive channel between the source and the drain, as well as the magnitude of the current, are controlled by the voltage applied between the gate and the source; the third electrode is the drain, which is electrically connected to the load and the high potential end of the power supply, and the current flows out from the drain.

[0041] Specifically, each solder pin 1211 is soldered to a first electrode 21, and the clearance groove 1212 between two adjacent solder pins 1211 can accommodate a second electrode 22. The second electrode 22 is the gate. In practical applications, the gate has a gate finger structure, also known as a multi-finger gate. Specifically, the gate is presented as multiple thin, parallel-arranged fingers to reduce gate resistance; however, the gate finger structure protrudes from the surface of the chip 2 (e.g., Figure 5 As shown, the clearance groove 1212 is set to accommodate the second electrode 22, reducing the possibility that the welding pin 1211 may squeeze the second electrode 22 when the welding part 121 is welded to the chip 2, thereby improving the safety and service life of the chip 2.

[0042] It should be noted that the number of welding pins 1211 in each welding section 121 is the same as the number of first electrodes 21 on the chip 2, and each welding pin 1211 is welded to the corresponding first electrode 21; the number of clearance grooves 1212 in each welding section 121 is the same as the number of second electrodes 22.

[0043] Understandably, in actual use, the dimension of the clearance groove 1212 in the second direction Y is greater than the dimension of the second electrode 22 in the second direction Y, that is, the width of the clearance groove 1212 is greater than the width of the second electrode 22. Therefore, the groove wall of the clearance groove 1212 will not contact the second electrode 22 during installation, thereby reducing the probability of short circuit.

[0044] like Figure 1 and Figure 2 As shown, in some embodiments of this application, the first connecting part 11 is provided with a receiving groove 111, which passes through the first connecting part 11 along the third direction Z, and the first direction X, the second direction Y and the third direction Z intersect each other.

[0045] In this embodiment of the application, by providing a receiving groove 111 in the first connecting part 11, the stress in the first connecting part 11 during the processing can be released, and the filler material can be filled into the receiving groove 111 in the subsequent processing to encapsulate and fix the connector 1 and the chip 2 as a whole.

[0046] In a specific application, the receiving groove 111 passes through the first connecting part 11 in the third direction Z, so that during the molding process, the filler can be filled to the bottom of the connector 1 through the receiving groove 111, so that the first connecting part 11 is further fixed by the filler and forms an overall molding fixation; specifically, the filler can be any one or more of silicone gel, epoxy resin, organosilicon elastomer, etc., and those skilled in the art can set it according to actual needs.

[0047] Understandably, when the first connecting part 11 is machined, different areas inside the material will "pull" each other. By setting the receiving groove 111, a "space for stress to expand and contract freely" can be provided, reducing the accumulation of stress in the first connecting part 11, reducing local stress concentration, and thus improving the stability of the size and structural shape of the first connecting part 11.

[0048] like Figure 1 and Figure 2 As shown, in some embodiments of this application, two receiving grooves 111 are provided, and the two receiving grooves 111 are spaced apart along the first direction X. Each receiving groove 111 is close to the junction of the first connecting part 11 and the second connecting part 12; thereby further reducing the internal stress accumulation of the first connecting part 11 and improving the stability of the first connecting part 11.

[0049] It should be noted that, as Figure 1As shown, in order to ensure the welding reliability of the first connecting part 11 to the substrate 3 and the welding reliability of the welding pin 1211 to the first electrode 21 of the chip 2, the first connecting part 11 and the second connecting part 12 are bent and extended in the first direction X, so as to ensure the reliable connection of the two welding parts and reduce the possibility of short circuit between other parts and the substrate 3. This makes the stress concentration in the first connecting part 11 (which is plate-shaped) more, and the two receiving grooves 111 can improve the stress release efficiency.

[0050] like Figure 1 and Figure 2 As shown, in some embodiments of this application, there are two second connecting portions 12 and two third connecting portions 13. The two second connecting portions 12 are spaced apart on both sides of the first connecting portion 11 along the first direction X, and each third connecting portion 13 is fixedly connected to the corresponding welding portion 121.

[0051] In this embodiment of the application, by distributing two second connecting portions 12 at intervals along the first direction X on both sides of the first connecting portion 11, the number of chips 2 that the connector 1 can connect can be increased, thereby increasing the current capacity. At the same time, it is convenient to optimize the heat distribution of multiple chips 2 and improve the heat dissipation effect of the chips 2.

[0052] In a specific application, two second connecting parts 12 are spaced apart on both sides of the first connecting part 11 along the first direction X. The welding part 121 of each second connecting part 12 can be welded to the corresponding chip 2. For example, each second connecting part 12 can be connected to 3 chips 2, so the connector 1 can be connected to a total of 6 chips 2 at the same time. Of course, the number of welding parts 121 on the second connecting parts 12 on both sides can be the same or different. For example, the second connecting part 12 on one side has 3 welding parts 121, that is, it is welded to 3 chips 2; the second connecting part 12 on the other side has 4 welding parts 121, that is, it is welded to 4 chips 2, so that it can be connected to a total of 7 chips 2.

[0053] It should be noted that each third connection part 13 is fixedly connected to the welding part 121 of the corresponding second connection part 12, so that each third connection part 13 can flatten the potential of the multiple chips 2 connected to the corresponding second connection part 12 and ensure the uniformity of the current flowing through each chip 2.

[0054] like Figure 1 and Figure 2 As shown, in some embodiments of this application, the two second connecting portions 12 are symmetrically arranged with respect to the second direction Y.

[0055] In this embodiment, by symmetrically arranging the two second connection portions 12 with respect to the second direction Y, the current flow path from each chip 2 connected to the two second connection portions 12 to the first connection portion 11 can be made approximately equal, thereby making the response time of each chip 2 connected to the connector 1 approximately the same, thus improving the response speed of the entire module.

[0056] In specific applications, the two second connecting parts 12 are symmetrically arranged with respect to the second direction Y. Specifically, the two second connecting parts 12 are axially symmetrical with respect to the first connecting part 11, that is, the two second connecting parts 12 are axially symmetrical with respect to the second direction Y as the axis of symmetry. In this way, the distance from each soldering pin 1211 to the geometric center of the first connecting part 11 is approximately equal, thereby making the flow path of each chip 2 to the first connecting part 11 approximately equal.

[0057] Of course, it is also possible that the multiple welding portions 121 in the two second connecting portions 12 are centrally symmetrical with respect to the geometric center of the first connecting portion 11, or other arrangements that make the flow path of each chip 2 to the first connecting portion 11 approximately equal. Those skilled in the art can make such arrangements according to actual needs, and this application does not limit them.

[0058] like Figure 3 and Figure 4 As shown, in some embodiments of this application, a bridge arm structure is also proposed, including: a plurality of chips 2, a substrate 3 and a connector 1 as described in any of the above embodiments, wherein the plurality of chips 2 are disposed between the substrate 3 and the connector 1, each chip 2 is welded to a welding part 121, and the first connecting part 11 is welded to the substrate 3.

[0059] In the embodiments of this application, each chip 2 is welded to a welding part 121, the first connecting part 11 is welded to the substrate 3, and the bridge arm structure has the connector 1 described in any of the above embodiments, so the bridge arm structure has the beneficial effects of the connector 1 described in any of the above embodiments, which will not be repeated here.

[0060] Understandably, the bridge arm structure is specifically the "upper bridge" or "lower bridge" in the power module, and can also be called the "high-end switch" or "low-end switch" in the power module.

[0061] In specific applications, the substrate 3 can be any one of aluminum-based copper-clad laminate, ceramic copper-clad laminate, active metal brazing (AMB) substrate, etc. Those skilled in the art can set it according to actual needs, and this application does not limit it.

[0062] Preferably, the substrate 3 is an active metal brazing substrate, which means that ceramics and metals are connected together by high-temperature brazing, resulting in higher bonding strength, stronger thermal conductivity, and better current carrying capacity.

[0063] like Figure 3 and Figure 4 As shown, in some embodiments of this application, the substrate 3 includes an insulating portion 31, a first metal portion 32, and a second metal portion 33. The first metal portion 32 and the second metal portion 33 are disposed on the side of the insulating portion 31 facing the chip 2, and the second metal portion 33 is spaced apart on the side of the first metal portion 32 along the first direction X. The first metal portion 32 is welded to the first connecting portion 11, and a plurality of chips 2 are spaced apart on the second metal portion 33 along the second direction Y. Each chip 2 is electrically connected to the second metal portion 33.

[0064] In this embodiment, the first metal part 32 and the second metal part 33 are electrically isolated. The first metal part 32 is welded to the first connecting part 11, so that external current can be led through the first metal part 32 and the first connecting part 11 to the source (first electrode 21) of each chip 2. Multiple chips 2 are spaced apart on the second metal part 33, and each chip 2 is electrically connected to the second metal part 33. Thus, the second metal part 33 provides a common potential platform for each chip 2 to share the current flowing through each chip 2. At the same time, the second metal part 33 can dissipate heat for each chip 2.

[0065] In specific applications, chip 2 also has a third electrode, which is a drain electrode. The drain electrode is electrically connected to the second metal part 33. Specifically, the connection can be achieved by using silver paste or silver film with silver sintering process, or by directly soldering with solder paste or solder pads. The second metal part 33 is soldered to the first connection part 11. The first connection part 11 is also suitable for being electrically connected to the main power circuit. The main power circuit specifically refers to the main current path integrated inside the module, used to bear high voltage and large current, and to complete the conversion of electrical energy form (such as DC→AC), and all the semiconductor components contained therein.

[0066] Understandably, in practical applications, there are two second metal parts 33. The two second metal parts 33 are spaced apart on both sides of the first metal part 32 along the first direction X. Each second metal part 33 corresponds to a plurality of chips 2 electrically connected to a second connecting part 12, thereby enabling the plurality of chips 2 to be connected in parallel and ensuring the heat dissipation of each chip 2.

[0067] It should be explained that, in practical applications, the current flow in the bridge arm structure is as follows: external current → second metal part 33 → third electrode (drain) of chip 2 → first electrode (source) of chip 2 → solder pin 1211 of connector 1 → first connection part 11 of connector 1 → first metal part 32 → out; where connector 1 is an integral structure and has a large current-carrying cross-sectional area, it can carry a large current, reduce parasitic inductance, and improve the reliability of the bridge arm structure.

[0068] Understandably, the insulating part 31 may be ceramic, or may be composed of an adhesive organic resin and a highly thermally conductive inorganic filler. The organic resin includes epoxy resin, phenolic resin, polyimide and polyphenylene ether, etc., and the inorganic filler includes alumina, silicon nitride, aluminum nitride and magnesium oxide, etc. Preferably, the insulating part 31 is ceramic, which facilitates heat dissipation.

[0069] Specifically, the first metal part 32 and the second metal part 33 can be made of conductive metal materials, such as aluminum, copper, etc. Preferably, the first metal part 32 and the second metal part 33 are made of copper, which has low resistance and facilitates heat dissipation.

[0070] In some embodiments of this application, a half-bridge unit is also proposed, including the connector 1 as described in any of the above embodiments; or the bridge arm structure as described in any of the above embodiments.

[0071] In practical applications, a half-bridge unit typically consists of two bridge arm structures, namely the "upper bridge" and the "lower bridge," which are connected to form the half-bridge unit.

[0072] In some embodiments of this application, a power module is also proposed, including the bridge arm structure as described in any of the above embodiments; or the half-bridge unit as described in the above embodiments.

[0073] In specific applications, the power module can be any one of IGBT power module, SiC (silicon carbide) MOSFET power module or hybrid module. The power module is specifically used in the main drive circuit, on-board charger circuit or auxiliary power supply circuit of the vehicle. Those skilled in the art can configure it according to actual needs, and this application does not limit it.

[0074] In some embodiments of this application, a vehicle is also proposed, including a half-bridge unit as described in any of the above embodiments; or a power module as described in the above embodiments.

[0075] In specific applications, the vehicle can be a motor vehicle, such as a passenger car, a truck, or a derivative thereof; it can also be a special vehicle, such as a tractor, an excavator, a fire truck, or an ambulance; it can also be a water vehicle, such as an amphibious vehicle; or it can be a rail transit vehicle, such as a train, a subway, or a tram. Those skilled in the art can configure it according to actual needs, and this application does not impose any restrictions on it.

[0076] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0077] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A connector for electrically connecting multiple chips (2), characterized in that, include: The first connecting part (11) is adapted to be welded to the substrate (3); The second connecting part (12) is connected to the first connecting part (11) along the first direction (X). The second connecting part (12) has a plurality of welding parts (121) at one end away from the first connecting part (11). The plurality of welding parts (121) are arranged at intervals along the second direction (Y). Each welding part (121) is adapted to be welded to one of the chips (2). The third connecting part (13) is provided on the side of the second connecting part (12) away from the first connecting part (11). The third connecting part (13) is fixedly connected to each of the welding parts (121). The first direction (X) intersects with the second direction (Y).

2. The connector according to claim 1, characterized in that, The chip (2) has a second electrode (22) and two first electrodes (21) along the second direction (Y), with the second electrode (22) disposed between the two first electrodes (21); each of the welding portions (121) includes two welding pins (1211), which are spaced apart along the second direction (Y), and each welding pin (1211) is welded to one of the first electrodes (21) and fixedly connected to the third connection portion (13); Each of the welding portions (121) is also provided with a relief groove (1212), which is disposed between the two welding pins (1211) along the second direction (Y) and is used to accommodate the second electrode (22).

3. The connector according to claim 1, characterized in that, The first connecting part (11) is provided with a receiving groove (111), and the receiving groove (111) passes through the first connecting part (11) along the third direction (Z). The first direction (X), the second direction (Y) and the third direction (Z) intersect each other.

4. The connector according to any one of claims 1-3, characterized in that, The second connecting part (12) and the third connecting part (13) are provided in twos. The two second connecting parts (12) are spaced apart on both sides of the first connecting part (11) along the first direction (X). Each third connecting part (13) is fixedly connected to the corresponding welding part (121).

5. The connector according to claim 4, characterized in that, The two second connecting parts (12) are symmetrically arranged with respect to the second direction (Y).

6. A bridge arm structure, characterized in that, include: The assembly includes a plurality of chips (2), a substrate (3), and a connector (1) as described in any one of claims 1-5, wherein the plurality of chips (2) are disposed between the substrate (3) and the connector (1), each chip (2) is welded to a welding portion (121), and the first connecting portion (11) is welded to the substrate (3).

7. The bridge arm structure according to claim 6, characterized in that, The substrate (3) includes an insulating portion (31), a first metal portion (32), and a second metal portion (33). The first metal portion (32) and the second metal portion (33) are disposed on the side of the insulating portion (31) facing the chip (2), and the second metal portion (33) is disposed at a distance from the first metal portion (32) on the side along the first direction (X). The first metal part (32) is welded to the first connecting part (11), and a plurality of chips (2) are spaced apart on the second metal part (33) along the second direction (Y), and each chip (2) is electrically connected to the second metal part (33).

8. A half-bridge unit, characterized in that, include: The connector (1) as described in any one of claims 1-5; or the bridge arm structure as described in any one of claims 6-7.

9. A power module, characterized in that, include: The bridge arm structure as described in any one of claims 6-7; Alternatively, the half-bridge unit as described in claim 8.

10. A vehicle, characterized in that, include: The half-bridge unit as described in claim 8; or the power module as described in claim 9.

Images