Semiconductor chip carrier with cushioning function

Abstract

The utility model discloses a semiconductor chip bearing platform with buffer function relates to semiconductor chip bearing tool technical field, including mesa, four mounting blocks of symmetrical equidistance installation on mesa upper end and the supporting plate of installation on the upper end of mounting block, the upper end of supporting plate is hinged and is installed with the apron, is equipped with a plurality of chip main parts between supporting plate and apron, the lower end of four corners of supporting plate all slidingly installed has the locating post, the inside sliding of locating post has the push piece, the inside of mounting block is provided with connecting hole, and the inside of connecting hole is equipped with buffer assembly, and the clamping assembly is equipped between buffer assembly and locating post, the utility model discloses through the cooperation of first spring and buffer column, locating post, realizes efficient buffer function, through the cooperation of clamping block and card slot, push piece, realizes convenient positioning function, through the cooperation of buffer gasket and mounting hole, limiting hole, realizes accurate limiting function, through the cooperation of magnetic attraction piece and apron, supporting plate, realizes quick fixing function.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor chip carrier equipment technology, and in particular to a semiconductor chip carrier platform with a buffer function. Background Technology

[0002] Semiconductor chips are tiny and have a precise structure, making them susceptible to damage from vibration and collisions during transportation and storage. This places extremely high demands on the cushioning protection and positioning stability of the carrier platform. Traditional carrier platforms lack effective cushioning structures and precise positioning functions, making it difficult to meet the safety requirements of chips during multi-stage transfers. Existing semiconductor chip carrier stages have significant drawbacks. Traditional carrier stages typically consist of a fixed platform, a simple support plate, and a bolt-fixed cover plate. The support plate is rigidly connected to the platform without any cushioning components, allowing vibrations to be directly transmitted to the chip during transport, potentially causing chip pin deformation or internal circuit damage. Chips are placed solely in the grooves of the support plate without additional restraint structures, making them prone to sliding and collisions on the carrier stage. The cover plate is bolted in place, making opening and closing cumbersome and reducing chip handling efficiency. The positioning structure is unreliable, allowing the support plate to easily shift, leading to chip misalignment. Ultimately, this results in insufficient cushioning and inconvenient chip handling. Therefore, this application designs a semiconductor chip carrier stage with a cushioning function to address these problems. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of existing technologies by proposing a semiconductor chip carrier platform with a buffer function.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a semiconductor chip carrier platform with a buffer function, comprising a platform, four mounting blocks symmetrically and equidistantly mounted on the upper part of the platform, and a support plate mounted on the upper part of the mounting blocks. A cover plate is hinged to the upper end of the support plate, and multiple chip bodies are disposed between the support plate and the cover plate. Positioning posts are slidably mounted on the lower ends of the four corners of the support plate, and push blocks are slidably mounted inside the positioning posts. A connecting hole is opened inside the mounting block, and a buffer component is disposed inside the connecting hole. A snap-fit ​​component is disposed between the buffer component and the positioning post.

[0005] Preferably, the positioning post is installed inside the connecting hole, and a push plate is installed on the upper end of the push block.

[0006] Preferably, the upper end of the support plate is provided with a plurality of mounting holes at equal intervals, and the plurality of chip bodies are respectively installed inside the plurality of mounting holes. Magnetic blocks are installed on the same side of the support plate and the cover plate.

[0007] Preferably, a buffer pad is provided between the chip body and the mounting hole, and a limiting hole corresponding to the mounting hole is provided at the upper end of the cover plate.

[0008] Preferably, the buffer assembly consists of a first spring and a buffer post, the lower end of the connecting hole has a cavity, the buffer post is slidably installed inside the cavity, and the first spring is installed between the buffer post and the inner wall of the cavity.

[0009] Preferably, the snap-fit ​​assembly consists of a snap-fit ​​block and a snap-fit ​​groove. The snap-fit ​​block is installed on the side end of the buffer post, the snap-fit ​​groove is opened on the inner side wall of the positioning post, and a second spring is installed between the push block and the positioning post.

[0010] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model utilizes a first spring in conjunction with a buffer post and a positioning post. The buffer post absorbs vibration energy under the action of the first spring, reducing the impact of external forces on the chip, thus improving the buffering and protection effect, preventing chip damage, and achieving a highly efficient buffering function. Furthermore, the use of a locking block in conjunction with a slot and a push block allows the locking block to engage with the slot to fix the positioning post and the support plate. Pressing the push block unlocks the chip, facilitating quick opening and closing of the cover to pick up and place the chip, improving operational convenience and achieving a convenient positioning function. The use of a buffer pad in conjunction with mounting holes and limiting holes allows the buffer pad to fill the gap between the chip and the mounting hole, while the limiting holes precisely constrain the chip's position, preventing chip sliding and collision, improving positioning stability, and achieving a precise limiting function. Finally, the use of a magnetic block in conjunction with the cover plate and the support plate allows the magnetic block to quickly attract and fix the cover plate, replacing bolt fixation, simplifying the opening and closing steps, improving pick-up and place efficiency, and achieving a rapid fixing function. Ultimately, this solves the problems of insufficient buffering and inconvenient pick-up and place of existing support platforms. Attached Figure Description

[0011] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the overall three-dimensional structure proposed in this utility model; Figure 2 This is a schematic diagram of the three-dimensional structure of the support plate proposed in this utility model; Figure 3 This is a three-dimensional structural diagram of the exploded cross-section of the mounting block proposed in this utility model; Figure 4 This is a three-dimensional cross-sectional structural diagram of the positioning column proposed in this utility model.

[0012] The numbers in the diagram are: 1. Platform; 2. Mounting block; 3. Support plate; 4. Cover plate; 5. Chip body; 6. Positioning post; 7. Buffer post; 8. Locking block; 9. Push block; 10. First spring; 11. Second spring; 12. Push plate. Detailed Implementation

[0013] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0014] Example: See Figures 1 to 4 This utility model discloses a semiconductor chip carrier platform with a buffer function, comprising a platform 1, four mounting blocks 2 symmetrically and equidistantly mounted on the upper end of the platform 1, and a support plate 3 mounted on the upper end of the mounting blocks 2; a cover plate 4 is hinged to the upper end of the support plate 3, and multiple chip bodies 5 are disposed between the support plate 3 and the cover plate 4; positioning posts 6 are slidably mounted on the lower ends of the four corners of the support plate 3, and push blocks 9 are slidably mounted inside the positioning posts 6; the mounting blocks 2 have connecting holes inside, and buffer components are disposed inside the connecting holes; a snap-fit ​​component is disposed between the buffer components and the positioning posts 6; the platform 1 provides the mounting base, the mounting blocks 2 support the support plate 3, the cover plate 4 protects the chip bodies 5, the positioning posts 6 achieve precise positioning, and the buffer components absorb... The vibration and snap-fit ​​assembly fixing structure ensures chip safety; the positioning post 6 is installed inside the connection hole, and the push plate 12 is installed on the upper end of the push block 9; the push plate 12 makes it easy for the operator to press the push block 9, and unlock the snap-fit ​​assembly through the push block 9, realizing the quick separation of the support plate 3 and the mounting block 2, simplifying the maintenance and chip handling steps; the upper end of the support plate 3 has multiple mounting holes at equal intervals, and multiple chip bodies 5 are respectively installed inside the multiple mounting holes; magnetic blocks are installed on the same side of the support plate 3 and the cover plate 4; the mounting holes accurately place the chip body 5 to avoid chip slippage, and the magnetic blocks quickly attract and fix the cover plate 4, replacing the traditional bolt fixing and improving the opening and closing efficiency of the cover plate 4; the gasket used in this device is an anti-static silicone gasket.

[0015] In this invention, a buffer pad is provided between the chip body 5 and the mounting hole, and a limiting hole corresponding to the mounting hole is opened at the upper end of the cover plate 4. The buffer pad buffers the collision between the chip body 5 and the mounting hole, and the limiting hole further constrains the position of the chip body 5 to prevent the chip from shaking and being damaged during transportation. The buffer assembly consists of a first spring 10 and a buffer post 7. A cavity is opened at the lower end of the connecting hole, and the buffer post 7 is slidably installed inside the cavity. The first spring 10 is installed between the buffer post 7 and the inner wall of the cavity. The first spring 10 and the buffer post 7 work together to absorb external vibrations, reduce the impact of vibrations on the chip body 5 on the support plate 3, and improve the buffer protection effect. The snap-fit ​​assembly consists of a snap-fit ​​block 8 and a snap-fit ​​groove. The snap-fit ​​block 8 is installed on the side end of the buffer post 7, and the snap-fit ​​groove is opened on the inner side wall of the positioning post 6. A second spring 11 is installed between the push block 9 and the positioning post 6. The snap-fit ​​block 8 snaps into the snap-fit ​​groove to fix the positioning post 6 and the buffer post 7. Pressing the push block 9 pushes the snap-fit ​​block 8 out of the snap-fit ​​groove to unlock it. The second spring 11 assists the push block 9 in resetting, ensuring the stability of the snap-fit ​​assembly for repeated use.

[0016] Working principle: When using this utility model, first press the push plate 12 at the upper end of the support plate 3, which drives the push block 9 to move down and squeeze the locking block 8, so that the locking block 8 disengages from the slot of the positioning post 6 and unlocks the positioning post 6; after removing the support plate 3, flip open the cover plate 4 and place the chip body 5 into the mounting hole of the support plate 3. The buffer pad between the chip body 5 and the mounting hole plays a preliminary buffering and limiting role; close the cover plate 4, and the magnetic block on the cover plate 4 and the support plate 3 attract and fix each other. The limiting hole of the cover plate 4 is aligned with the chip body 5 to further constrain the position; insert the positioning post 6 into the connection hole of the mounting block 2. The buffer post 7 supports the positioning post 6 under the action of the first spring 10, and the locking block 8 automatically locks into the slot to fix the support plate 3; during transportation or storage, the first spring 10 and the buffer post 7 absorb vibration energy and protect the chip body 5 from impact; when it is necessary to remove the chip, press the push plate 12 again to unlock, open the cover plate 4 and remove the chip, thus completing the entire usage process.

[0017] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A semiconductor chip carrier platform with a buffer function, comprising a platform (1), four mounting blocks (2) symmetrically and equidistantly mounted on the upper end of the platform (1), and a support plate (3) mounted on the upper end of the mounting blocks (2), characterized in that: The upper end of the support plate (3) is hinged to a cover plate (4). Multiple chip bodies (5) are provided between the support plate (3) and the cover plate (4). Positioning posts (6) are slidably installed at the lower ends of the four corners of the support plate (3). Push blocks (9) are slidably installed inside the positioning posts (6). A connecting hole is opened inside the mounting block (2). A buffer component is provided inside the connecting hole. A snap-fit ​​component is provided between the buffer component and the positioning post (6).

2. A semiconductor chip carrier platform with buffering function according to claim 1, characterized in that: The positioning post (6) is installed inside the connecting hole, and the upper end of the push block (9) is equipped with a push plate (12).

3. A semiconductor chip carrier platform with buffering function according to claim 2, characterized in that: The upper end of the support plate (3) is provided with multiple mounting holes at equal intervals, and multiple chip bodies (5) are respectively installed inside the multiple mounting holes. Magnetic blocks are installed on the same side of the support plate (3) and the cover plate (4).

4. A semiconductor chip carrier platform with buffering function according to claim 3, characterized in that: A buffer pad is provided between the chip body (5) and the mounting hole, and a limiting hole corresponding to the mounting hole is provided at the upper end of the cover plate (4).

5. A semiconductor chip carrier platform with buffering function according to claim 4, characterized in that: The buffer assembly consists of a first spring (10) and a buffer post (7). A cavity is provided at the lower end of the connecting hole. The buffer post (7) is slidably installed inside the cavity. The first spring (10) is installed between the buffer post (7) and the inner wall of the cavity.

6. A semiconductor chip carrier platform with buffering function according to claim 5, characterized in that: The snap-fit ​​assembly consists of a snap-fit ​​block (8) and a snap-fit ​​groove. The snap-fit ​​block (8) is installed on the side of the buffer post (7), and the snap-fit ​​groove is opened on the inner side wall of the positioning post (6). A second spring (11) is installed between the push block (9) and the positioning post (6).

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