A detachable wafer cassette device

CN224899448UActive Publication Date: 2026-10-27WUXI JIUTIAN NEW MATERIALS CO LTD
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Patent Information

Application Number
CN202522580033.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-12-04
Publication Date
2026-10-27
Estimated Expiration
2035-12-04

AI Technical Summary

Technical Problem

[0003]本实用新型的目的是为了解决现有放置架上的硅片易于与硅片盒间产生碰撞的问题,而提出的一种可拆卸式硅片盒装置

Benefits of technology

1.通过放置架的侧面与泡沫框的接触,从而对放置架进行限位,进而防止放置架的晃动,再通过泡沫块压在硅片上,从而对硅片进行固定,进而避免对硅片造成损坏。

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Abstract

The utility model discloses a detachable silicon wafer box device, including holding subassembly, the holding subassembly includes the lower box, and the top of lower box is connected with the upper box through the hinge, and the bottom inner wall of lower box is fixedly connected with the locating frame, and the locating frame is provided with the placing subassembly, and the multiple inner walls of lower box are bonded with the foam frame, the bottom inner wall of upper box is fixedly connected with the fixed frame, and the bottom inner wall of upper box is bonded with the foam block, and the foam block is located in the fixed frame, the placing subassembly includes the placing frame, and the placing frame is placed in the locating frame, and the inner wall of placing frame is equipped with a plurality of placing grooves, the top of upper box is equipped with a plurality of recess, and the top of lower box is fixedly connected with a plurality of convex blocks. The utility model discloses the side of placing frame and the contact of foam frame to the placing frame is positioned to prevent the shaking of placing frame, and then through the foam block pressure on the silicon wafer to fix the silicon wafer, and then avoid damaging the silicon wafer.
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Description

Technical Field

[0001] This utility model relates to the field of silicon wafer cassette technology, and in particular to a detachable silicon wafer cassette device. Background Technology

[0002] Currently, after silicon rods are processed into silicon wafers, if they need to be stored for a long time, the silicon wafers are placed in a special rack, and then the rack is placed in a wafer box to protect the silicon wafers. However, when using existing wafer boxes, the fit between the rack and the wafer box is not good, and they are prone to shaking. This causes the silicon wafers on the rack to collide with the wafer box, resulting in damage. Therefore, this application proposes a new implementation scheme that is different from the silicon wafer box structure in the prior art. Utility Model Content

[0003] The purpose of this invention is to solve the problem that silicon wafers on existing placement racks are prone to collision with silicon wafer boxes, and to propose a detachable silicon wafer box device.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: A detachable silicon wafer cassette device includes a holding assembly. The holding assembly includes a lower cassette, the top of which is hinged to an upper cassette. A positioning frame is fixedly connected to the bottom inner wall of the lower cassette, and a placement assembly is disposed within the positioning frame. A foam frame is bonded between multiple inner walls of the lower cassette. A fixing frame is fixedly connected to the bottom inner wall of the upper cassette, and a foam block is bonded to the bottom inner wall of the upper cassette, with the foam block located within the fixing frame. The placement assembly includes a placement rack, which is placed within the positioning frame, and the inner wall of the placement rack has multiple placement slots.

[0005] Furthermore, the top of the upper box is provided with multiple grooves, and the top of the lower box is fixedly connected with multiple protrusions, with the protrusions holding the components engaging with another groove holding the components.

[0006] Furthermore, the lower box is provided with side grooves on multiple sides.

[0007] Furthermore, a rubber ring is provided between the lower box and the upper box.

[0008] Furthermore, the placement rack has side openings on both sides, with connecting ribs fixedly connected between the inner walls of the two sides of the side openings, support blocks fixedly connected to both sides of the top of the placement rack, and rubber pads glued to the bottom of the placement rack.

[0009] Furthermore, a locking component is provided on one side of the holding component. The locking component includes a card holder, which is integrally formed on one side outer wall of the lower box, and the card holder is provided with a slot.

[0010] Furthermore, a top seat is fixedly connected to one side of the outer wall of the upper box, an arc plate is fixedly connected to the bottom of the top seat, the arc plate passes through the bayonet, a locking block is fixedly connected to the outer wall of the arc plate, the locking block can be locked into the bottom of the card seat, and a protruding plate is fixedly connected to the bottom of the locking block.

[0011] The beneficial effects of this utility model are as follows: 1. The placement rack is limited by contact between its side and the foam frame, thus preventing it from shaking. The foam block is then pressed onto the silicon wafer to fix it in place, thereby preventing damage to the silicon wafer.

[0012] 2. By engaging the protrusion of one component with the groove of another component, multiple components can be stacked, effectively saving storage and transportation space. Attached Figure Description

[0013] Figure 1 This is a three-dimensional structural diagram of a detachable silicon wafer cassette device proposed in this utility model; Figure 2 This is a cross-sectional front view schematic diagram of a detachable silicon wafer cassette device proposed in this utility model; Figure 3 This is a cross-sectional view of the locking assembly of a detachable silicon wafer cassette device proposed in this utility model. Figure 4 This is a three-dimensional structural diagram of the placement component of a detachable silicon wafer cassette device proposed in this utility model; Figure 5 This is a front view structural diagram of the silicon wafer loading state of a detachable silicon wafer cassette device proposed in this utility model; Figure 6 This is a three-dimensional structural diagram of the stacked silicon wafer cassette of the detachable silicon wafer cassette device proposed in this utility model.

[0014] In the diagram: 1. Component holding box; 101. Lower box; 102. Positioning frame; 103. Foam frame; 104. Upper box; 105. Fixing frame; 106. Foam block; 107. Groove; 108. Protrusion; 109. Side groove; 110. Rubber ring; 2. Component placement box; 201. Placement rack; 202. Placement slot; 203. Side opening; 205. Connecting rib; 206. Support block; 207. Rubber pad; 3. Locking component; 301. Card holder; 302. Card slot; 303. Top seat; 304. Arc plate; 305. Card block; 306. Protrusion plate. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0016] Reference Figures 1-6 A detachable silicon wafer cassette device includes a holding component 1, which includes a lower box 101. The top of the lower box 101 is connected to an upper box 104 via a hinge. A positioning frame 102 is integrally formed on the bottom inner wall of the lower box 101. A placement component 2 is disposed inside the positioning frame 102. A foam frame 103 is bonded between the multiple inner walls of the lower box 101. A fixing frame 105 is integrally formed on the bottom inner wall of the upper box 104. A foam block 106 is bonded to the bottom inner wall of the upper box 104. The foam block 106 is located inside the fixing frame 105 and presses on the silicon wafer to fix the silicon wafer. The placement component 2 includes a placement rack 201, which is placed inside the positioning frame 102. The side of the placement rack 201 contacts the foam frame 103, thereby limiting the placement rack 201 and preventing it from shaking. The inner wall of the placement rack 201 is provided with multiple placement slots 202.

[0017] The top of the upper box 104 is provided with multiple grooves 107, and the top of the lower box 101 is integrally formed with multiple protrusions 108. The protrusions 108 that hold the component 1 engage with the grooves 107 of another component 1, so that multiple components 1 can be stacked and placed, effectively saving storage and transportation space.

[0018] The lower box 101 has side grooves 109 on multiple sides, which makes it easy to insert fingers to grasp and prevent the silicon wafer box from slipping and falling during handling, thus improving operational safety.

[0019] A rubber ring 110 is provided between the lower box 101 and the upper box 104. It is a ring-shaped sealing ring made of silicone material. After the upper box 104 is closed, it is deformed by pressure and fills the joint gap between the lower box 104 and the upper box 101, thereby preventing dust and moisture from entering the box and enhancing the sealing of the snap-fit.

[0020] The placement rack 201 has side openings 203 on both sides. A connecting rib 205 is integrally formed between the inner walls of the two sides of the side openings 203. The connecting rib 205 enhances the structural rigidity of the placement rack 201 and prevents the placement rack 201 from deforming due to the weight of the silicon wafer. The top of the placement rack 201 has support blocks 206 integrally formed on both sides. A rubber pad 207 is glued to the bottom of the placement rack 201 to absorb the contact impact between the placement rack 201 and the bottom of the lower box 101, while increasing the friction and preventing the placement rack 201 from sliding during transportation.

[0021] A locking component 3 is provided on one side of the holding component 1. The locking component 3 includes a card holder 301, which is integrally formed on one side outer wall of the lower box 101. The card holder 301 is provided with a slot 302. A top seat 303 is integrally formed on one side outer wall of the upper box 104. An arc plate 304 is integrally formed at the bottom of the top seat 303. The arc plate 304 passes through the slot 302. A locking block 305 is integrally formed on the outer wall of the arc plate 304. The locking block 305 can be locked at the bottom of the card holder 301. A protruding plate 306 is integrally formed at the bottom of the locking block 305. The arc plate 304, the locking block 305, and the protruding plate 306 pass through the slot 302 until the locking block 305 engages with the bottom of the card holder 301, thereby locking the upper box 104.

[0022] The working principle of this embodiment is as follows: When in use, first, push the protruding plate 306 inward to separate the card block 305 from the bottom of the card seat 301, then pull the upper box 104 upward to disengage the arc plate 304 from the slot 302, then insert the silicon wafer into the placement slot 202 of the placement rack 201, then place the placement rack 201 in the positioning frame 102 of the lower box 101, and the side of the placement rack 201 contacts the foam frame 103, thereby limiting the placement rack 201 and preventing the placement rack 201 from shaking. Then, the upper box 104 is placed inside the lower box 101, while the arc plate 304, the locking block 305, and the protruding plate 306 pass through the locking slot 302 until the locking block 305 engages with the bottom of the card seat 301, thereby locking the upper box 104. At this time, the foam block 106 presses on the silicon wafer, thereby fixing the silicon wafer and further preventing the silicon wafer from shaking. When multiple holding components 1 need to be stacked, the protrusion 108 of one holding component 1 is engaged with the groove 107 of another holding component 1, thereby stacking multiple holding components 1.

[0023] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A detachable silicon wafer cassette device, comprising a holding assembly (1), characterized in that, The holding component (1) includes a lower box (101), the top of which is connected to an upper box (104) via a hinge. A positioning frame (102) is fixedly connected to the bottom inner wall of the lower box (101), and a placement component (2) is provided inside the positioning frame (102). A foam frame (103) is bonded between multiple inner walls of the lower box (101). A fixing frame (105) is fixedly connected to the bottom inner wall of the upper box (104), and a foam block (106) is bonded to the bottom inner wall of the upper box (104). The foam block (106) is located inside the fixing frame (105). The placement component (2) includes a placement rack (201), which is placed inside the positioning frame (102). The inner wall of the placement rack (201) is provided with multiple placement slots (202).

2. The detachable silicon wafer cassette device according to claim 1, characterized in that, The top of the upper box (104) is provided with multiple grooves (107), and the top of the lower box (101) is fixedly connected with multiple protrusions (108). The protrusion (108) holding the component (1) engages with the groove (107) of another component (1).

3. The detachable silicon wafer cassette device according to claim 1, characterized in that, The lower box (101) is provided with side grooves (109) on multiple sides.

4. The detachable silicon wafer cassette device according to claim 1, characterized in that, A rubber ring (110) is provided between the lower box (101) and the upper box (104).

5. A detachable silicon wafer cassette device according to claim 1, characterized in that, The placement rack (201) has side openings (203) on both sides, and connecting ribs (205) are fixedly connected between the inner walls of the two sides of the side openings (203). Support blocks (206) are fixedly connected to both sides of the top of the placement rack (201), and rubber pads (207) are glued to the bottom of the placement rack (201).

6. A detachable silicon wafer cassette device according to claim 1, characterized in that, The holding component (1) has a locking component (3) on one side. The locking component (3) includes a card holder (301), which is integrally formed on the outer wall of one side of the lower box (101). The card holder (301) has a slot (302).

7. A detachable silicon wafer cassette device according to claim 6, characterized in that, A top seat (303) is fixedly connected to one side of the outer wall of the upper box (104). An arc plate (304) is fixedly connected to the bottom of the top seat (303). The arc plate (304) passes through the bayonet (302). A locking block (305) is fixedly connected to the outer wall of the arc plate (304). The locking block (305) can be locked at the bottom of the card seat (301). A protruding plate (306) is fixedly connected to the bottom of the locking block (305).