Wafer damage prevention receptacle

CN224899512UActive Publication Date: 2026-10-27WUXI JIUTIAN NEW MATERIALS CO LTD
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Patent Information

Application Number
CN202522580038.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-12-04
Publication Date
2026-10-27
Estimated Expiration
2035-12-04

AI Technical Summary

Technical Problem

[0004]本实用新型的目的是为了解决现有调节卡槽间距时出现剐蹭硅片的问题,而提出的一种防止硅片损坏的接料盒

Benefits of technology

1.通过拉动连接板使得滑动杆在安装块上移动,从而带动第二夹板沿着安装槽移动,从而调整第一夹板与第二夹板之间的间隙,此种方式可以避免对硅片造成损坏。

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a prevent the material receiving box of silicon wafer damage, including box body, the top of box body is connected with the sealing cover through the hinge, and both sides inner wall of box body all are fixedly connected with the mounting block, and the one side of mounting block is equipped with the mounting groove, and the outer wall of mounting groove is integrally formed with a plurality of first clamping plates, the one end of mounting block is slidably inserted with the sliding rod, and the sliding rod is located in the mounting groove, and the outer wall of sliding rod is connected with a plurality of second clamping plates, and the second clamping plate is located in the one side of first clamping plate, and the one end of two sliding rods is connected with the connecting plate of box body thermoplastics, and the one side screw thread connection of connecting plate is equipped with the adjusting bolt, and the one end of adjusting bolt is rotatably connected with box body. The utility model discloses by pulling the connecting plate and makes the sliding rod move on the mounting block to drive the second clamping plate and move along the mounting groove to adjust the gap between first clamping plate and second clamping plate, and this kind of mode can avoid causing damage to the silicon wafer.
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Description

Technical Field

[0001] This utility model relates to the field of silicon wafer production technology, and in particular to a receiving box for preventing damage to silicon wafers. Background Technology

[0002] As a key carrier for silicon wafer transfer, the core function of the receiving box is to prevent the silicon wafer from hard contact with the outside world, vibration and collision, isolate dust and moisture, prevent electrostatic adsorption, ensure the integrity and cleanliness of the silicon wafer surface, and provide a qualified substrate for subsequent precision processing such as photolithography and etching during the transfer, storage and process connection.

[0003] Currently, the internal slot spacing of existing silicon wafer receiving boxes is fixed. This necessitates manual disassembly and reassembly of the slot modules to adjust the spacing. Manual handling of the slot modules can easily lead to collisions with residual silicon wafers inside the box or the box's side walls. Alternatively, during installation, the modules must be forcibly aligned with the slots, causing the sharp edges of the modules to scratch the edges and surfaces of the silicon wafers. Therefore, to better reduce damage to silicon wafers when adjusting the spacing of the silicon wafer receiving box, and to promote technological advancement and enhance core technological competitiveness in the industry, this application proposes a new implementation scheme for a receiving box that differs from existing technologies in preventing silicon wafer damage. Utility Model Content

[0004] The purpose of this invention is to solve the problem of silicon wafers being scratched when adjusting the spacing of the card slots, and to propose a receiving box to prevent damage to the silicon wafers.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: A receiving box for preventing damage to silicon wafers includes a box body. The top of the box body is connected to a sealing cover via a hinge. Mounting blocks are fixedly connected to the inner walls of both sides of the box body. One side of the mounting block is provided with a mounting groove. Multiple first clamping plates are integrally formed on the outer wall of the mounting groove. A sliding rod is slidably inserted into one end of the mounting block. The sliding rod is located in the mounting groove. Multiple second clamping plates are snapped onto the outer wall of the sliding rod. The second clamping plates are located on one side of the first clamping plates. One end of two of the sliding rods protrudes from the box body and is thermoplasticized with a connecting plate. An adjusting bolt is threaded to one side of the connecting plate. One end of the adjusting bolt is rotatably connected to the box body.

[0006] Furthermore, a scale is fixedly connected to one end of the outer wall of the box.

[0007] Furthermore, a rectangular groove is provided on one side of the connecting plate, and the scale slides within the rectangular groove.

[0008] Furthermore, the top of the box is provided with a slot, and a rubber ring is fixedly connected to the bottom of the sealing cover, with the rubber ring engaging with the slot.

[0009] Furthermore, a first rubber pad is fixedly connected to one side of the mounting block.

[0010] Furthermore, a second rubber pad is fixedly connected to the outer wall of the first clamping plate.

[0011] Furthermore, a third rubber pad is fixedly connected to the outer wall of the second clamping plate.

[0012] The beneficial effects of this utility model are as follows: 1. By pulling the connecting plate, the sliding rod moves on the mounting block, thereby moving the second clamping plate along the mounting groove, thus adjusting the gap between the first clamping plate and the second clamping plate. This method can avoid damaging the silicon wafer.

[0013] 2. The second and third rubber pads increase the friction between the silicon wafer and the clamping plate, preventing the silicon wafer from sliding and shifting, while also buffering the clamping force to avoid direct pressure from the clamping plate causing damage to the silicon wafer. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of a receiving box for preventing silicon wafer damage according to the present invention. Figure 2 This is a schematic diagram of the internal structure of a receiving box for preventing damage to silicon wafers according to this utility model. Figure 3 This is a schematic diagram of the clamping plate structure of a receiving box for preventing damage to silicon wafers, as proposed in this utility model. Figure 4 This is a partial three-dimensional structural diagram of a receiving box for preventing damage to silicon wafers proposed in this utility model.

[0015] In the diagram: 1. Box body; 2. Sealing cover; 3. Slot; 4. Rubber ring; 5. Mounting block; 6. First rubber pad; 7. Mounting groove; 8. First clamping plate; 9. Second rubber pad; 10. Sliding rod; 11. Second clamping plate; 12. Third rubber pad; 13. Connecting plate; 14. Rectangular groove; 15. Adjusting bolt; 16. Scale. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0017] Reference Figures 1-4 A receiving box for preventing damage to silicon wafers includes a box body 1, a sealing cover 2 connected to the top of the box body 1 by a hinge, mounting blocks 5 integrally formed on both inner walls of the box body 1, a mounting groove 7 provided on one side of the mounting block 5, and multiple first clamping plates 8 integrally formed on the outer wall of the mounting groove 7. A sliding rod 10 is slidably inserted into one end of the mounting block 5. The sliding rod 10 is located in the mounting groove 7. Multiple second clamping plates 11 are snapped onto the outer wall of the sliding rod 10. The second clamping plates 11 are located on one side of the first clamping plate 8 and can fit against the first clamping plate 8. One end of each of the two sliding rods 10 extends out of the box body 1 and is thermoplastically connected to a connecting plate 13. One side of the connecting plate 13 is threaded with an adjusting bolt 15, and one end of the adjusting bolt 15 is rotatably connected to the outer wall of the box body 1.

[0018] Tighten the adjusting bolt 15, and the connecting plate 13 feeds on the adjusting bolt 15, so that the sliding rod 10 moves on the mounting block 5, thereby driving the second clamping plate 11 to move along the mounting groove 7, thereby adjusting the gap between the first clamping plate 8 and the second clamping plate 11 to suit silicon wafers of different thicknesses. A scale 16 is fixed to one end of the outer wall of the box body 1 by bolts. The scale 16 has an accuracy of 0.1mm. A rectangular groove 14 is provided on one side of the connecting plate 13. The scale 16 slides in the rectangular groove 14. The connecting plate 13 moves along the scale 16, thereby precisely adjusting the gap between the first clamping plate 8 and the second clamping plate 11.

[0019] The top of the box 1 is provided with a slot 3, and the bottom of the sealing cover 2 is bonded with a rubber ring 4. The rubber ring 4 is engaged with the slot 3. The rubber ring 4 is a hollow silicone ring. When compressed, it completely fills the gap between the slot 3 and the sealing cover 2, thereby achieving a dustproof and waterproof seal and preventing dust or oxidation from adhering to the surface of the silicon wafer.

[0020] A first rubber pad 6, made of soft silicone, is adhered to one side of the mounting block 5 to prevent the edge of the silicon wafer from making hard contact with the mounting block 5.

[0021] The outer wall of the first clamping plate 8 is bonded with a second rubber pad 9, and the outer wall of the second clamping plate 11 is bonded with a third rubber pad 12. The second rubber pad 9 and the third rubber pad 12 are made of anti-static silicone, which increases the friction between the silicon wafer and the clamping plate, prevents the silicon wafer from sliding and shifting, and buffers the clamping force to avoid the clamping plate directly squeezing and causing the silicon wafer to break.

[0022] The working principle of this embodiment is as follows: When in use, first, open the sealing cover 2, then loosen the adjusting bolt 15, and then adjust the gap between the first clamping plate 8 and the second clamping plate 11 according to the size of the silicon wafer to be stored. The operation is as follows: Tighten the adjusting bolt 15, and the connecting plate 13 feeds on the adjusting bolt 15, so that the sliding rod 10 moves on the mounting block 5, thereby driving the second clamping plate 11 to move along the mounting groove 7, thereby adjusting the gap between the first clamping plate 8 and the second clamping plate 11. At the same time, the connecting plate 13 moves along the scale 16, thereby precisely adjusting the gap between the first clamping plate 8 and the second clamping plate 11. After adjustment, the adjusting bolt 15 is tightened to lock the position of the second clamping plate 11. Then, the silicon wafers are inserted one by one vertically into the gap between the first clamping plate 8 and the second clamping plate 11. At this time, the silicon wafers are in contact with the first rubber pad 6, the second rubber pad 9 and the third rubber pad 12, thereby avoiding contact between the silicon wafers and the first clamping plate 8, the second clamping plate 11 and the mounting block 5. After all the silicon wafers are placed, the sealing cover 2 is closed, and the rubber ring 4 is engaged with the slot 3, thereby improving the sealing between the sealing cover 2 and the box 1, so as to facilitate the subsequent transfer of silicon wafers.

[0023] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A receiving box for preventing damage to silicon wafers, comprising a box body (1), characterized in that, The top of the box (1) is connected to a sealing cover (2) by a hinge. The inner walls of both sides of the box (1) are fixedly connected to mounting blocks (5). One side of the mounting block (5) is provided with a mounting groove (7). Multiple first clamping plates (8) are integrally formed on the outer wall of the mounting groove (7). A sliding rod (10) is slidably inserted into one end of the mounting block (5). The sliding rod (10) is located in the mounting groove (7). Multiple second clamping plates (11) are snapped onto the outer wall of the sliding rod (10). The second clamping plates (11) are located on one side of the first clamping plates (8). One end of the two sliding rods (10) extends out of the box (1) and is thermoplasticized with a connecting plate (13). One side of the connecting plate (13) is threaded with an adjusting bolt (15). One end of the adjusting bolt (15) is rotatably connected to the box (1).

2. The receiving box for preventing silicon wafer damage according to claim 1, characterized in that, A scale (16) is fixedly connected to the outer wall of one end of the box (1).

3. A receiving box for preventing silicon wafer damage according to claim 1, characterized in that, The connecting plate (13) has a rectangular groove (14) on one side, and the scale (16) slides in the rectangular groove (14).

4. A receiving box for preventing silicon wafer damage according to claim 1, characterized in that, The top of the box (1) is provided with a slot (3), and the bottom of the sealing cover (2) is fixedly connected with a rubber ring (4), which is engaged with the slot (3).

5. A receiving box for preventing silicon wafer damage according to claim 1, characterized in that, A first rubber pad (6) is fixedly connected to one side of the mounting block (5).

6. A receiving box for preventing silicon wafer damage according to claim 1, characterized in that, The outer wall of the first clamping plate (8) is fixedly connected to a second rubber pad (9).

7. A receiving box for preventing silicon wafer damage according to claim 1, characterized in that, A third rubber pad (12) is fixedly connected to the outer wall of the second clamping plate (11).