A knock-down product

Abstract

The utility model discloses a kind of products, including product, the surface of product is provided with bearing film, the utility model, realize whole plate taking plate, reduce product loss: by the overall adhesion of bearing film and product ontology, dispersed product forms stable whole plate structure, when taking plate, directly whole plate blanking can be, avoid the knock, scratch caused by single pickup, improve product intact rate;Production and test efficiency are improved: when testing, whole plate can be operated, without positioning and placing one by one, test time is shortened, simultaneously, product on bearing film can be quickly arranged into standard array, adaptive test machine automatic grabbing and identification, further simplify process.

Description

Technical Field

[0001] This utility model relates to the field of component assembly technology, and in particular to a component assembly product. Background Technology

[0002] In the production of assembled products in industries such as electronics and precision machinery, the assembled products are typically in a scattered, individual state, lacking an effective overall support structure. This scattered structure brings several problems: First, the board removal process requires picking up individual products one by one, which is cumbersome and inefficient, and also easily causes product bumps and scratches, affecting product quality; Second, during subsequent testing processes, the scattered products need to be positioned and placed individually, which is time-consuming and severely restricts production capacity; Third, existing industry-standard manual integration or simple tooling fixation solutions suffer from low positioning accuracy, poor stability, and the inability to achieve whole-board board removal, making it difficult to meet the needs of efficient, large-scale production. Therefore, there is an urgent need for a design structure that can achieve overall support for assembled products, facilitate board removal and testing, and solve the pain points of traditional production models. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a product for packaging, through...

[0004] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: A type of packaged product, comprising a packaged product having a carrier film disposed on its surface.

[0005] To solve the above-mentioned technical problems, another technical solution adopted by this utility model is: the thickness of the carrier film is 125μm, and the carrier film is a high-adhesion film with a peel force of 20gf / 25mm.

[0006] To solve the above-mentioned technical problems, another technical solution adopted by this utility model is as follows: the carrier film is provided with clearance holes corresponding to the positions of components on the product body, and the product body is precisely attached and fixed by the adhesiveness of the carrier film to form an integral whole plate structure.

[0007] To solve the above-mentioned technical problems, another technical solution adopted by this utility model is as follows: the carrier film is made by die-cutting the whole roll by a die-cutting machine, the die-cutting shape is adapted to the arrangement spacing of the product body, and the aperture of the clearance hole is 0.1-0.3mm larger than the maximum outer diameter of the corresponding component.

[0008] To solve the above-mentioned technical problems, another technical solution adopted by this utility model is as follows: the whole plate structure is laser-shaped and cut, and the laser-shaped and cut uses a picosecond laser with the following laser parameters: wavelength 355nm, power 20W, processing speed 2300mm / s, processing times 15 times, and spot diameter 20μm.

[0009] In order to solve the above technical problems, another technical solution adopted by this utility model is: the temperature range of the carrier film (2) is -40℃~85℃.

[0010] The beneficial effects of this utility model are as follows: 1. Enable whole-sheet picking and reduce product loss: By bonding the carrier film to the product body, the product is dispersed to form a stable whole-sheet structure. When picking up the whole sheet, it can be cut directly, avoiding bumps and scratches caused by picking up individual pieces, thus improving the product integrity rate. 2. Improve production and testing efficiency: The entire board can be operated during the subsequent testing process, eliminating the need to position and place each product individually, thus shortening the testing time. At the same time, the products on the carrier film can be quickly arranged into a standard array, which is compatible with the automatic gripping and identification of the testing machine, further simplifying the process. 3. Strong compatibility and stability: By adjusting the punching shape, clearance hole position and size of the carrier film, it can be adapted to different specifications and types of punched products, with a wide range of applications; the adhesiveness and mechanical properties of the carrier film are adapted to the entire production process, the positioning is accurate after bonding, there is no offset during laser cutting, and the overall plate structure has high stability. 4. Easy to use and leaves no residue: The carrier film can be peeled off manually, leaving no adhesive residue on the product surface after peeling. It does not affect the subsequent assembly and use of the product, and the operation is convenient and requires no additional cleaning process. Attached Figure Description

[0011] Figure 1 This is a structural diagram of a type of packaging product according to an embodiment of the present utility model.

[0012] Reference numerals: 1. Packaged product; 2. Supporting film. Detailed Implementation

[0013] To explain in detail the technical content, objectives, and effects of this utility model, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0014] Before detailing the embodiments of this application, some related concepts will first be explained: PET carrier film: an adhesive film made of polyethylene terephthalate, possessing excellent mechanical properties, resistance to high and low temperatures and chemical stability, and widely used in temporary carrier and protection scenarios for electronic products; Peel force 20gf / 25mm: This means that the force required to peel a 25mm wide carrier film from the surface of the packaged product is 20 grams. This parameter is the optimal value that balances "firm adhesion" and "easy peeling", avoiding excessive stickiness that damages the product or excessive looseness that causes it to fall off. Clearance holes: pre-drilled holes on the carrier film corresponding to the components of the packaged product, used to avoid the components and prevent the components from being squeezed or scratched during bonding; Picosecond laser: Output laser pulse width is in the picosecond range (10^10). -12 The laser with a cutting speed of 1 second has the characteristics of high cutting precision and small heat-affected zone, which can avoid damage to the cut products due to high temperature; Whole-plate structure: The products are bonded together by a carrier film to form an integral plate structure, which can realize whole-plate picking and whole-plate testing.

[0015] In existing technologies, the current manufacturing processes for products such as electronic component boards and precision mechanical small parts, after completion, present three major pain points due to their small individual size (typically 5-20mm) and large quantities (hundreds per batch) in a dispersed manner: picking up each board individually results in an efficiency of less than 100 boards per hour, with a high damage rate of up to 5% due to impacts; during testing, manual positioning and arranging of each board into a standard array is required, consuming up to 70% of the total testing time; and simple tooling integration solutions have a positioning accuracy of only ±0.5mm, which cannot meet the automatic gripping requirements of testing machines (≤±0.1mm). This invention addresses these problems through a combined design of "precise bonding of the carrier film + laser forming."

[0016] To at least solve the above problems, please refer to Figure 1 This utility model embodiment provides a crimping product, including crimping product 1, and a bearing film 2 is provided on the surface of crimping product 1.

[0017] Furthermore, the thickness of the carrier film 2 is 125μm, and the carrier film 2 is a high-adhesion film with a peel force of 20gf / 25mm.

[0018] As described above, a thickness of 125μm is crucial: a thinner carrier film, such as 50μm, is prone to tearing during laser cutting or board removal, while a thicker carrier film, such as 200μm, increases the overall board thickness, making it unsuitable for narrow testing machine workbenches. A thickness of 125μm ensures sufficient mechanical strength to withstand the weight of 200 batches of products without breakage, while keeping the overall board thickness within a reasonable range of ≤1mm, ensuring compatibility with existing production equipment. A peel force of 20gf / 25mm is also important: excessive peel force can damage the product surface or components, such as tearing the product plating, when peeling the carrier film after testing; insufficient peel force can cause the product to detach during laser cutting and board removal. A peel force of 20gf / 25mm achieves "firm adhesion without detachment, manual peeling with no residue," requiring no additional tools, simplifying the process, and preventing residue from affecting subsequent product assembly, such as welding or bonding other components.

[0019] Furthermore, the carrier film 2 has clearance holes corresponding to the positions of components on the main body of the product 1. The main body of the product 1 is precisely attached and fixed by the adhesive of the carrier film to form an integral whole plate structure.

[0020] As described above, the avoidance holes protect components: Components on the surface of the assembled product, such as resistors, capacitors, and precision pins, are small in size and low in strength. If the carrier film directly covers them, it will cause extrusion deformation. The avoidance holes precisely correspond to the positions of the components, and the hole diameter is 0.1-0.3mm larger than the maximum outer diameter of the component. This avoids extrusion of the components during bonding and also guides the assembled product to achieve precise alignment with the carrier film, with a positioning error ≤±0.05mm. The whole-board structure is suitable for automated testing: In traditional decentralized product testing, products need to be manually arranged into a standard array, such as a 20×10 arrangement, which takes up 70% of the total testing time, and the positioning accuracy is only ±0.5mm, which cannot meet the requirements of automatic gripping by testing machines with an accuracy ≤±0.1mm. The whole-board structure formed by bonding the carrier film is itself a standard array, requiring no additional positioning. It can be directly placed into the testing machine, which can automatically grip the product through visual recognition, improving testing efficiency by more than 60% and avoiding errors from manual placement.

[0021] Furthermore, the carrier film 2 is made by die-cutting the entire roll by a die-cutting machine. The die-cutting shape is adapted to the arrangement spacing of the main body of the die-cut product 1, and the diameter of the clearance hole is 0.1-0.3mm larger than the maximum outer diameter of the corresponding component.

[0022] As described above, this process design is tailored to the needs of large-scale production: High efficiency of whole-roll punching: Traditional manual cutting of carrier film has an efficiency of 10 sheets / hour and a large dimensional error of ±0.5mm; the die-cutting machine can achieve "continuous production" by punching whole rolls, punching 500 sheets of carrier film per hour, increasing efficiency by 50 times, while the punching accuracy reaches ±0.02mm, ensuring that the position and shape of the clearance holes on each carrier film are completely consistent; Punching shape adapts to the array: The die-cutting machine can accurately punch the outline of the carrier film according to the arrangement spacing of the products, such as 10mm×10mm, so that the carrier film and the product array are perfectly matched, avoiding edge products that cannot be attached or waste of carrier film material due to improper carrier film size, thus reducing production costs; Precise clearance hole size: The clearance amount of 0.1-0.3mm is the optimal range verified by multiple tests - less than 0.1mm is easy to jam components, and greater than 0.3mm will cause the product to shift on the carrier film. This size can ensure "no squeezing during clearance and no offset during positioning".

[0023] Furthermore, the entire plate structure is laser-cut using a picosecond laser with the following parameters: wavelength 355nm, power 20W, processing speed 2300mm / s, processing times 15 times, and spot diameter 20μm.

[0024] As described above, the laser parameter design is optimized for products that are mostly made of metal, plastic, or coated materials: Picosecond laser + parameter settings: Traditional CO2 lasers with a wavelength of 10.6μm have a large heat-affected zone (HAZ) of ≥50μm during cutting, which can easily lead to product deformation and component failure; Picosecond lasers with a wavelength of 355nm have an extremely short pulse width in the picosecond range, resulting in a HAZ of ≤5μm, which is negligible; The combination of parameters—20W power, 2300mm / s processing speed, and 15 processing cycles—ensures complete separation of the product from the waste material without damaging the product body or the supporting film due to excessive laser energy; 20μm spot diameter: The small spot diameter enables high-precision cutting with an edge error of ≤±0.01mm, avoiding product size defects caused by cutting deviations, while ensuring complete removal of waste material between adjacent products, preventing "joining" of materials (i.e., products and waste not being completely separated), and ensuring that the product is independent and intact when the board is removed.

[0025] Furthermore, the operating temperature range of the carrier membrane 2 is -40℃ to 85℃.

[0026] As described above, this temperature resistance range covers all scenarios of production, transportation, and storage of packaged products: Production Environment Adaptability: In some production workshops, such as those without heating in northern winters or those in southern summers with large temperature fluctuations, low temperatures can cause the carrier film to become brittle, while high temperatures can cause it to soften and deform. A temperature resistance range of -40℃ to 85℃ ensures that the carrier film maintains its original performance, adhesion, and strength even in extreme workshop environments, without affecting bonding and cutting effects. Transportation and Storage Adaptability: Packaged products may require long-distance transportation, such as from the south to northern winters, or long-term storage, such as 6 months of inventory. This temperature resistance range prevents the carrier film from aging and failing due to changes in ambient temperature, ensuring that the product can still be used normally after transportation and storage. Testing Environment Adaptability: Some tests, such as high-temperature performance tests, may cause the product temperature to rise briefly to 60-70℃. The carrier film will not soften or fall off at this temperature, ensuring the product's position remains stable during testing.

[0027] Preparation of carrier film: PET high-adhesion film with a thickness of 125μm and a peel force of 20gf / 25mm is selected. Based on the size of the electronic component board of the product to be processed (300mm×200mm), the product arrangement spacing (10mm×10mm), and the distribution position of component 4, a punching die is designed. The carrier film 2 is punched in roll by a die-cutting machine to open the clearance hole 3. The diameter of the clearance hole 3 is 0.2mm larger than the maximum outer diameter of the corresponding component 4 to ensure that there is no extrusion.

[0028] Positioning and bonding: The punched carrier film 2 is laid flat on the bonding worktable with the adhesive side of the carrier film 2 facing up and the non-component mounting side of the product body 1 facing down. Through the correspondence between the clearance hole 3 and the component 4, the product body 1 is guided to be accurately embedded into the preset position of the carrier film 2. The bonding is achieved by gently pressing. After bonding, the spacing error of the product body 1 in the whole board structure 5 is controlled within ±0.05mm.

[0029] Laser forming and cutting: The bonded whole plate structure 5 is placed on the laser processing table with the product body 1 facing up and the carrier film 2 facing down. The picosecond laser is started and cut according to the preset path. The laser parameters are set as follows: wavelength 355nm, power 20W, processing speed 2300mm / s, processing times 15 times, and spot diameter 20μm. After the cutting is completed, the product body 1 is firmly attached to the carrier film 2, and the waste is separated from the whole plate structure 5.

[0030] Whole board removal and testing: The whole board structure 5 after cutting is directly removed and transferred to the testing station; the product body 1 on the carrier film 2 is quickly arranged into a standard array 6, and the testing machine completes the batch test through the automatic gripping and recognition function; after the test is completed, the carrier film 2 is manually peeled off, and there is no residual glue on the product surface, and it enters the subsequent assembly process.

[0031] This invention effectively solves the problems of difficult board removal and low testing efficiency in traditional decentralized product assembly by precisely fitting the carrier film to the assembly product. It has a simple structure, strong practicality, and can be widely used in the large-scale production of various assembly products.

[0032] The above are merely embodiments of this utility model and do not limit the patent scope of this utility model. Any equivalent modifications made based on the content of this utility model specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A type of packaging product, comprising packaging product (1), characterized in that: The surface of the packaged product (1) is provided with a carrier film (2).

2. The packaged product according to claim 1, characterized in that: The thickness of the carrier film (2) is 125 μm, and the carrier film (2) is a high-adhesion film with a peel force of 20 gf / 25 mm.

3. The packaged product according to claim 1, characterized in that: The carrier film (2) has clearance holes corresponding to the positions of components on the body of the component product (1). The body of the component product (1) is precisely attached and fixed by the adhesive of the carrier film to form an integral whole plate structure.

4. The packaged product according to claim 1, characterized in that: The carrier film (2) is made by die-cutting the whole roll by a die-cutting machine. The die-cutting shape is adapted to the arrangement spacing of the main body of the die-cut product (1). The diameter of the clearance hole is 0.1-0.3mm larger than the maximum outer diameter of the corresponding component.

5. The packaged product according to claim 1, characterized in that: The entire plate structure is laser-cut using a picosecond laser with the following parameters: wavelength 355nm, power 20W, processing speed 2300mm / s, processing times 15, and spot diameter 20μm.

6. The packaged product according to claim 1, characterized in that: The operating temperature range of the carrier membrane (2) is -40℃ to 85℃.

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