A delivery system for a chip detection device

Abstract

The utility model relates to the technical field of semiconductor, disclose a conveying system of chip detection device for conveying the carrier board with chip, it is including: track, be provided with conveying mechanism on the track, conveying mechanism is used for driving carrier board movement along the track, support platform is close to the track setting, and can lift carrier board, make carrier board from track separate, support platform is provided with the cavity that air current passes through and the air current interface that communicates with the cavity, be equipped with a plurality of adsorption holes on the support plane of support platform, and a plurality of adsorption holes communicate with the cavity, when the air current interface is connected to the cavity and carries out the vacuumizing, carrier board is adsorbed on the support plane of support platform, the utility model's advantage lies in, this conveying system through the mode of bottom vacuum adsorption fixes carrier board with chip on the support plane of support platform, can effectively reduce the imaging bending and the misjudgment due to carrier board warping, and then guarantee the detection accuracy of detection device.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a conveying system for a chip testing device. Background Technology

[0002] After the flip chip process and before reflow soldering, the chip materials on the carrier board currently require specialized automated optical inspection equipment to detect defects such as positional misalignment, visible cracks, edge chipping, and surface scratches. During the inspection process, the carrier board carrying multiple chips is transported between different workstations via the equipment's conveyor system.

[0003] In existing automated optical inspection equipment for chip mounting, a cylinder ejection mechanism on the side of the carrier board is typically used to restrain the carrier board within the track, ensuring that it does not shift during inspection. However, the die-bonded chip can shift due to external forces, easily affecting the production yield. Furthermore, carrier boards are mostly made of flexible materials and are relatively thin, making them prone to bending and warping due to manufacturing quality issues. This can lead to blurred or displaced chip images, resulting in false positives (i.e., qualified chip materials are judged as unqualified), thus affecting the inspection results. Utility Model Content

[0004] In view of the above-mentioned shortcomings of the existing technology, the technical problem to be solved by this utility model is to provide a conveying system for a chip detection device with good fixation effect and reduced false detection.

[0005] The technical solution adopted by this utility model to solve its technical problem is to propose a conveying system for a chip detection device, used to convey a carrier board carrying chips, comprising:

[0006] A track, on which a conveying mechanism is configured, the conveying mechanism being used to drive the carrier plate to move along the track;

[0007] A support platform is positioned close to the track and is capable of lifting the carrier plate to detach it from the track. The support platform is equipped with a cavity for airflow and an airflow interface communicating with the cavity. The support surface of the support platform is provided with multiple adsorption holes, and the multiple adsorption holes are communicating with the cavity.

[0008] When the cavity is evacuated by the airflow interface, the carrier plate is adsorbed onto the support plane of the support platform.

[0009] Furthermore, the adsorption holes are opened perpendicular to the support plane, and when the carrier plate is adsorbed onto the support plane, the adsorption force is perpendicular to the carrier plate.

[0010] Furthermore, the support platform includes an upper air plate and a lower air plate. The upper air plate has a downward-facing groove, and the groove is part of the cavity. The lower air plate seals the opening of the groove and surrounds it to form the cavity.

[0011] Furthermore, the lower air plate and the upper air plate are detachably and fixedly connected;

[0012] The upper air plate and / or lower air plate are provided with sealing grooves along the circumference of the cavity, and sealing rings are provided in the sealing grooves.

[0013] Furthermore, a lifting mechanism is provided below the support platform;

[0014] The lifting mechanism includes a top plate and a lifting cylinder. The top plate is located at the output end of the lifting cylinder. The lifting cylinder lifts the support platform by pushing against the top plate, so that the carrier plate is removed from the track.

[0015] The force exerted by the lifting mechanism on the support platform is perpendicular to the support plane.

[0016] Furthermore, a mounting plate is provided below the top plate, and the lifting cylinder is mounted on the mounting plate;

[0017] The top plate is provided with multiple guide posts, which are arranged perpendicular to the support plane. The mounting plate is provided with multiple guide sleeves corresponding to the multiple guide posts, and the multiple guide posts are respectively inserted into the multiple guide sleeves.

[0018] Furthermore, at least two side-mounted cylinders are provided on the side of the track. The side-mounted cylinders extend synchronously from the same side of the track to the carrier plate on the support platform to correct the attitude of the carrier plate.

[0019] Furthermore, a stop block and a photoelectric sensor are provided at one end near the track. The stop block is used to limit the movement position of the carrier plate; the photoelectric sensor is used to detect the carrier plate.

[0020] Furthermore, the conveying mechanism includes a drive motor, a driving pulley, a driven pulley, and a conveyor belt, the conveyor belt being wound between the driving pulley and the driven pulley, and the drive motor being connected to the driving pulley.

[0021] Furthermore, the track includes a first track and a second track arranged side by side, and the distance between the first track and the second track is adjustable;

[0022] The support platform is movably positioned between the first track and the second track.

[0023] Compared with the prior art, the present invention has at least the following beneficial effects:

[0024] In this invention, the support platform is equipped with a cavity for airflow and an airflow interface. The support plane is provided with multiple adsorption holes communicating with the cavity. When the vacuuming equipment is connected to the airflow interface to evacuate the vacuum, the carrier plate is adsorbed onto the support plane of the support platform. That is, the carrier plate carrying the chip is fixed on the support plane of the support platform by bottom vacuum adsorption, which can effectively reduce the imaging bending and false detection caused by the warping of the carrier plate, thereby ensuring the detection accuracy of the detection device.

[0025] In this invention, multiple adsorption holes on the support plane are opened perpendicular to the support plane, so that when the carrier is adsorbed on the support plane, the adsorption force is perpendicular to the carrier and there is no lateral force, thus ensuring that the chip mounting position will not be shifted.

[0026] In this invention, the upper air plate has a downward-facing groove, and the lower air plate seals its opening. The upper and lower air plates together form a cavity, ensuring simple processing. Furthermore, the upper and / or lower air plates are provided with sealing grooves along the circumference of the cavity, and a sealing ring is provided to ensure reliable cavity sealing.

[0027] In this utility model, a lifting mechanism is provided below the support platform, which includes a top plate and a lifting cylinder. The lifting cylinder lifts the top plate to raise the support platform, so that the carrier plate on the support platform is removed from the track. This makes it easier to bring the carrier plate with the chip on the support platform closer to the imaging system for convenient detection.

[0028] In this invention, the track includes a first track and a second track arranged side by side, and the distance between the first track and the second track is adjustable. The support platform is movably arranged between the first track and the second track, making it suitable for conveying carrier plates of different specifications. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the conveying system (when conveying the carrier board) of the chip detection device of this utility model;

[0030] Figure 2 for Figure 1 A structural diagram from another perspective;

[0031] Figure 3 for Figure 1 A structural diagram from a rear-side view;

[0032] Figure 4 A structural diagram illustrating the conveying mechanism and support platform for transporting the carrier plate.

[0033] Figure 5This is a schematic diagram of a structure in which the carrier plate is fixed to the support platform.

[0034] Figure 6 for Figure 5 Half-section view along the airflow interface;

[0035] Figure 7 for Figure 5 Exploded view (sealing ring omitted);

[0036] Figure 8 for Figure 7 A structural diagram from another perspective;

[0037] Figure 9 This is a structural diagram of the lifting mechanism, support platform, and carrier plate.

[0038] In the picture:

[0039] 1. Track; 1A. First track; 1B. Second track; 10. Conveying mechanism; 11. Side-mounted cylinder; 12. Stop block; 13. Photoelectric sensor; 100. Drive motor; 101. Driving pulley; 102. Driven pulley; 103. Conveyor belt; 104. Handwheel; 105. Lead screw;

[0040] 2. Support platform; 20. Support plane; 21. Upper air plate; 22. Lower air plate; 23. Sealing ring; 24. Base plate; 200. Cavity; 201. Airflow interface; 202. Adsorption hole; 210. Groove; 220. Sealing groove; 240. Airflow channel;

[0041] 3. Lifting mechanism; 30. Lifting cylinder; 31. Top plate; 32. Mounting plate; 310. Guide column; 320. Guide sleeve;

[0042] 4. Carrier plate. Detailed Implementation

[0043] The following are specific embodiments of the present invention, which are described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments.

[0044] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0045] Furthermore, in this utility model, the use of terms such as "first," "second," and "a" is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0046] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0047] Furthermore, the technical solutions of the various embodiments of this utility model can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0048] like Figures 1-9 As shown in the figure, the conveying system of the chip testing device in this embodiment is used to convey the carrier board 4 carrying the chip (not shown in the figure). The carrier board 4 carrying the chip can be conveyed to various stations of the chip testing device through the conveying system of this embodiment.

[0049] The conveying system of this embodiment mainly includes: a track 1, on which a conveying mechanism 10 is configured; the conveying mechanism 10 is used to drive the carrier plate 4 to move along the track 1 to transmit the carrier plate 4 carrying the chip; a support platform 2, located close to the track 1, the support platform 2 is configured to be liftable, that is, the support platform can lift the carrier plate 4 so that the carrier plate 4 is detached from the track 1; the support platform 2 is configured with a cavity 200 through which airflow can pass and an airflow interface 201 communicating with the cavity 200; the support plane 20 of the support platform 2 is provided with a plurality of adsorption holes 202, and the plurality of adsorption holes 202 are communicating with the cavity 200; in actual use, when the vacuum equipment is connected to the airflow interface 201 and the cavity 200 is evacuated, the air pressure in the cavity 200 is lower than the atmospheric pressure, forming a negative pressure, so that the carrier plate 4 is adsorbed on the support plane 20 of the support platform 2.

[0050] In this embodiment, the support platform 2 is equipped with a cavity 200 for airflow and an airflow interface 201. The support plane 20 is provided with a plurality of adsorption holes 202 communicating with the cavity 200. When the vacuuming device is connected to the airflow interface 201 to perform vacuuming, the carrier plate 4 is adsorbed on the support plane 20 of the support platform 2. That is, the carrier plate 4 carrying the chip is fixed on the support plane 20 of the support platform 2 by bottom vacuum adsorption, which can effectively reduce the imaging bending and false detection caused by the warping of the carrier plate 4, thereby ensuring the detection accuracy of the detection device.

[0051] Specifically, such as Figures 5-8 As shown, the support plane 20 of the support platform 2 is provided with multiple rows and columns of adsorption holes 202, which can effectively increase the adsorption range of the support platform 2 and thus adapt to more types of carrier boards 4. Furthermore, the adsorption holes 202 on the support plane 20 are opened perpendicular to the support plane 20. In actual use, when the carrier board 4 is adsorbed on the support plane 20, since the adsorption holes 202 are opened perpendicular to the support plane 20, the adsorption force is perpendicular to the carrier board 4, and there is no lateral force. Therefore, it can be ensured that the chip mounting position will not be shifted.

[0052] In this embodiment, the support platform 2 includes an upper air plate 21 and a lower air plate 22. The support plane 20 is located on the upper air plate 21, specifically configured as the upper surface of the upper air plate 21. The upper air plate 21 has a downward-facing groove 210, which is part of the cavity 200. The lower air plate 22 seals the opening of the groove 210 and surrounds it to form the cavity 200. That is, the support platform 2 is configured as a split type. For ease of processing, the support platform 2 can be divided into multiple stacked plates. If the support platform 2 is a single piece, the cavity 200 is difficult to process. In this embodiment, the cavity 200 is formed by the upper air plate 21 and the lower air plate 22. The groove 210 can be provided on the upper air plate 21, and the corresponding groove can be not provided on the lower air plate 22, or the corresponding groove can be provided on the lower air plate 22, making the cavity 200 easier to process. For example, it can be processed by milling.

[0053] The lower air plate 22 and the upper air plate 21 are fixed together by multiple bolts arranged circumferentially. The two are detachably fixed by locking the bolts, ensuring convenient disassembly and assembly and reliable fixation. The upper air plate 21 and / or the lower air plate 22 are provided with a sealing groove 220 along the circumference of the cavity 200. A sealing ring 23 is provided in the sealing groove 220. The sealing groove 220 can be provided only on the upper air plate 21, or only on the lower air plate 22, or both the upper air plate 21 and the lower air plate 22 can be provided with sealing grooves 220 along the circumference of the cavity 200. The sealing ring 23 is provided in the sealing groove 220 to ensure the airtightness of the cavity 200. When the cavity 200 is evacuated, there will be no air leakage between the upper air plate 21 and the lower air plate 22.

[0054] As a preferred embodiment, the support platform 2 is divided into an upper air plate 21, a lower air plate 22, and a base plate 24 arranged sequentially from top to bottom, to facilitate the processing of various features on the support platform 2. The support plane 20 is located on the upper air plate 21, the cavity 200 is located between the upper air plate 21 and the lower air plate 22, the airflow interface 201 is located on the base plate 24, and the base plate 24 is provided with an airflow channel 240 that communicates with the cavity 200 and is arranged laterally, which facilitates processing.

[0055] Furthermore, in this embodiment, a lifting mechanism 3 is provided below the support platform 2. The main function of the lifting mechanism 3 is to lift the support platform 2 upward, thereby causing the carrier plate 4 carrying the chip on the support platform 2 to move upward. The chip will then be closer to the imaging system of the chip detection device, ensuring that the imaging system can more easily detect the chip.

[0056] like Figure 9As shown, the lifting mechanism 3 mainly includes a top plate 31, a lifting cylinder 30, and a mounting plate 32. The top plate 31 is located at the output end of the lifting cylinder 30, and moves up and down with the lifting movement of the output end of the lifting cylinder 30. The lifting cylinder 30 lifts the support platform 2 by pushing against the top plate 31, thereby causing the carrier plate 4 on the support platform 2 to detach from the track 1. The force exerted by the lifting mechanism 3 on the support platform 2 is perpendicular to the support plane 20, ensuring that the carrier plate 4 carrying the chip on the support platform 2 is not subjected to lateral external forces, thus ensuring that the chip mounting position does not shift. The mounting plate 32 is located below the top plate 31, and the lifting cylinder 30 is mounted on the mounting plate 32, ensuring convenient installation of the lifting cylinder 30. Multiple guide posts 310 are provided on the top plate 31. Specifically, the top plate 31 is rectangular, with one guide post 310 near each of its four corners. The multiple guide posts 310 are perpendicular to the support plane 20. Since the movement direction of the top plate 31 is vertical, the multiple guide posts 310 are arranged vertically and are all perpendicular to the support plane 20. Multiple guide sleeves 320 corresponding to the multiple guide posts 310 are provided on the mounting plate 32. Specifically, the mounting plate 32 is also rectangular, with one guide sleeve 320 near each of its four corners. The four guide posts 310 are inserted into the four guide sleeves 320 for movement guidance, ensuring reliable lifting and lowering movement of the top plate 31.

[0057] Furthermore, in this embodiment, at least two side-mounted cylinders 11 are provided on the side of the track 1. The side-mounted cylinders 11 extend synchronously from the same side of the track 1 towards the carrier plate 4 on the support platform 2 to correct the attitude of the carrier plate 4. The track 1 includes a first track 1A and a second track 1B arranged side by side. That is, in this embodiment, at least two side-mounted cylinders 11 are simultaneously arranged on the first track 1A or the second track 1B, and the side-mounted cylinders 11 extend synchronously towards the carrier plate 4 on the support platform 2, causing the carrier plate 4 to move to the other side. By using at least two side-mounted cylinders 11 to push against the carrier plate 4, the attitude of the carrier plate 4 is corrected, ensuring the positional accuracy of the carrier plate 4.

[0058] Furthermore, the distance between the first track 1A and the second track 1B is adjustable, and the support platform 2 is movably positioned between the first track 1A and the second track 1B. Therefore, the track 1 in this embodiment can be used to transport carrier plates 4 of different specifications. Understandably, the second track 1B in this embodiment is mounted on a slide table and is equipped with a screw and nut mechanism. The end of the screw 105 is equipped with an adjusting handwheel 104. The user can rotate the adjusting handwheel 104 to rotate the screw 105, thereby causing the second track 1B to move closer to or further away from the first track 1A, thus adjusting the distance between the first track 1A and the second track 1B.

[0059] A stop block 12 and a photoelectric sensor 13 are provided near one end of the track 1. The stop block 12 is used to limit the position of the carrier plate 4. When the conveying mechanism 10 drives the carrier plate 4 to move to abut against the stop block 12, the stop block 12 abuts against the carrier plate 4, limiting the carrier plate 4 from continuing to be fed. That is, the carrier plate 4 has reached the limit position of this station. After the carrier plate 4 moves to abut against the stop block 12, the photoelectric sensor 13 can detect whether there is a carrier plate 4 on the support platform 2. When the photoelectric sensor 13 detects that there is a carrier plate 4 on the support platform 2, the chip detection device can proceed to the next step.

[0060] like Figures 1-4 As shown, in this embodiment, the conveying mechanism 10 on track 1 specifically includes a drive motor 100, a driving pulley 101, a driven pulley 102, and a conveyor belt 103. The conveyor belt 103 is wound between the driving pulley 101 and the driven pulley 102. The drive motor 100 is connected to the driving pulley 101. Specifically, the driving pulley 101 can be directly mounted on the output shaft of the drive motor 100, or it can be connected to the driving pulley 101 after being reduced in speed by a gear mechanism, belt drive mechanism, or chain drive mechanism. When the carrier plate 4 is mounted on the conveyor belt 103, a conveyor belt 103 is provided on each of the two sides of the carrier plate 4. The drive motor 100 drives the active pulley 101 to rotate, and the active pulley 101 drives the driven pulley 102 to rotate through the conveyor belt 103. At this time, the conveyor belt 103 drives the carrier plate 4 on it to move. That is, the conveying mechanism 10 in this embodiment adopts a belt drive mechanism. Of course, it can also be replaced by a chain drive mechanism, that is, the carrier plate 4 is driven to move through the transmission chain. Since the existing method can be implemented in a variety of ways, it will not be described in detail here.

[0061] In this embodiment, the working principle of the conveying system is as follows:

[0062] After passing through the previous process, the carrier board 4, carrying several chips to be inspected, is conveyed onto the conveyor belt 103. The drive motor 100 in the conveying mechanism 10 rotates, causing the drive pulley 101 to rotate. This drive pulley, via the conveyor belt 103, drives the driven pulley 102 to rotate. The conveyor belt 103 then moves the carrier board 4 along the first track 1A and the second track 1B to the stopping position (inspection station). When the carrier board 4 reaches the stopping block 12, the stopping block 12 blocks the carrier board 4. The photoelectric sensor 13 detects the presence of the carrier board 4 at the inspection station, and the side-mounted cylinder 11 extends towards the carrier board 4 to correct its posture. The lifting cylinder 30 in the lifting mechanism 3 pushes the top plate 31 upwards, causing the top plate 31 to move upwards. This, in turn, causes the support platform 2 and the carrier board 4 on the support platform 2 to move upwards, bringing the chips to be inspected on the carrier board 4 closer to the imaging system for easier inspection.

[0063] In this solution, the carrier plate 4 carrying the chip is fixed on the support plane 20 of the support platform 2 by bottom vacuum adsorption, which can effectively reduce the imaging bending and false detection caused by the warping of the carrier plate 4 and ensure the detection accuracy of the detection device.

Claims

1. A conveying system for a chip inspection device, used for conveying a carrier board carrying chips, characterized in that, include: A track, on which a conveying mechanism is configured, the conveying mechanism being used to drive the carrier plate to move along the track; A support platform is positioned close to the track and is capable of lifting the carrier plate to detach it from the track. The support platform is equipped with a cavity for airflow and an airflow interface communicating with the cavity; the support plane of the support platform is provided with multiple adsorption holes, and the multiple adsorption holes are communicating with the cavity. When the cavity is evacuated by the airflow interface, the carrier plate is adsorbed onto the support plane of the support platform.

2. The conveying system of the chip detection device according to claim 1, characterized in that, The adsorption holes are opened perpendicular to the support plane, and when the carrier plate is adsorbed on the support plane, the adsorption force is perpendicular to the carrier plate.

3. The conveying system of the chip detection device according to claim 1 or 2, characterized in that, The support platform includes an upper air plate and a lower air plate. The upper air plate has a downward-facing groove, and the groove is part of the cavity. The lower air plate seals the opening of the groove and surrounds it to form the cavity.

4. The conveying system of the chip detection device according to claim 3, characterized in that, The lower air plate and the upper air plate are detachably and fixedly connected; The upper air plate and / or lower air plate are provided with sealing grooves along the circumference of the cavity, and sealing rings are provided in the sealing grooves.

5. The conveying system of the chip detection device according to claim 1, characterized in that, A lifting mechanism is provided below the support platform; The lifting mechanism includes a top plate and a lifting cylinder. The top plate is located at the output end of the lifting cylinder. The lifting cylinder lifts the support platform by pushing against the top plate, so that the carrier plate is removed from the track. The force exerted by the lifting mechanism on the support platform is perpendicular to the support plane.

6. The conveying system of the chip detection device according to claim 5, characterized in that, A mounting plate is provided below the top plate, and the lifting cylinder is mounted on the mounting plate; The top plate is provided with multiple guide posts, which are arranged perpendicular to the support plane. The mounting plate is provided with multiple guide sleeves corresponding to the multiple guide posts, and the multiple guide posts are respectively inserted into the multiple guide sleeves.

7. The conveying system of the chip testing device according to claim 1, characterized in that, The track is provided with at least two side-mounted cylinders, which extend synchronously from the same side of the track to the carrier plate on the support platform to correct the attitude of the carrier plate.

8. The conveying system of the chip detection device according to claim 1, characterized in that, A stop block and a photoelectric sensor are provided at one end near the track. The stop block is used to limit the movement position of the carrier plate; the photoelectric sensor is used to detect the carrier plate.

9. The conveying system of the chip detection device according to claim 1, characterized in that, The conveying mechanism includes a drive motor, a drive pulley, a driven pulley, and a conveyor belt. The conveyor belt is wound between the drive pulley and the driven pulley, and the drive motor is connected to the drive pulley.

10. The conveying system of the chip inspection device according to claim 1, characterized in that, The track includes a first track and a second track arranged side by side, and the distance between the first track and the second track is adjustable; The support platform is movably positioned between the first track and the second track.

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