Moulded heating and cooling device

Abstract

The utility model relates to optical device manufacturing technical field discloses a mould pressing heating cooling device, including heating assembly, first cooling structure, heat insulation structure and second cooling structure, heating assembly includes heating structure and all heat structure, all heat structure and heating structure abut, the side face of all heat structure away from heating structure is heating surface, the first cooling structure surrounds the peripheral arrangement of all heat structure, heat insulation structure and heating structure abut the side face away from all heat structure, second cooling structure and heat insulation structure abut the side face away from heating structure, the utility model discloses through all heat structure generates the heat rapid horizontal conduction, makes it form a very uniform temperature field in the mould surface of contact glass, reduced the internal stress in the lens forming process, improved the optical precision and the yield of product, through the peripheral setting first cooling structure of all heat structure, through the cooling of first cooling structure to all heat structure, improves the cooling rate.

Description

Technical Field

[0001] This utility model relates to the field of optical device manufacturing technology, specifically to a molding heating and cooling device. Background Technology

[0002] Optical lens molding is a high-precision net-shape forming technology used for the mass production of optical components with complex shapes such as aspherical and freeform surfaces. Its core process involves placing a pre-shaped glass piece in a precision mold, heating it to above its glass transition temperature under a controlled nitrogen atmosphere to soften it, then applying pressure to fill the mold cavity. Following a precise annealing and cooling process, a lens with a specific optical surface shape is obtained. In this process, the performance of the mold's heating and cooling system directly determines the product quality, production efficiency, and cost.

[0003] Traditional heating and cooling structures are prone to temperature differences between the edges and center of the mold cavity. The fundamental reason is the mismatch between the location of heat generation and dissipation and the mold geometry; this non-uniformity limits further improvements in the surface accuracy and consistency of the lenses. Current technologies often choose to increase heating power or coolant flow rate to improve the cooling rate, which often exacerbates temperature non-uniformity. For example, excessively rapid cooling may cause some areas of the mold surface to be "quenched," while other areas remain at high temperatures, introducing significant internal stress. Utility Model Content

[0004] This invention provides a molding heating and cooling device to solve the problem of uneven mold surface temperature in the prior art, which leads to poor product quality.

[0005] This utility model provides a molding heating and cooling device, including a heating component, a first cooling structure, a heat insulation structure, and a second cooling structure; the heating component includes a heating structure and a heat equalization structure, the heat equalization structure abuts against the heating structure, and the side of the heat equalization structure away from the heating structure is a heating surface, which is adapted to abut against the workpiece; the first cooling structure is arranged circumferentially around the heat equalization structure; the heat insulation structure abuts against the side of the heating structure away from the heat equalization structure; the second cooling structure abuts against the side of the heat insulation structure away from the heating structure.

[0006] Beneficial effects: The heat generated is rapidly conducted laterally through the heat homogenization structure, forming a very uniform temperature field on the mold surface in contact with the glass. This reduces internal stress and surface deviation during lens forming, directly improving the optical accuracy and yield of the product. By placing the heat insulation structure between the heating structure and the second cooling structure, the "heat absorption" interference of the cooling system on the heating zone during heating and the "residual heat" interference of the heating zone during cooling are effectively blocked, making the heating and cooling processes more direct and efficient. By setting the first cooling structure circumferentially on the heat homogenization structure, the cooling rate is improved by cooling the heat homogenization structure through the first cooling structure.

[0007] In one optional embodiment, the first cooling structure includes cooling pipes, which are arranged in several layers. The layers of cooling pipes are uniformly arranged along the thickness direction of the heat dissipation structure, and the cooling pipes are adapted to communicate with a cooling source.

[0008] Beneficial effects: The multi-layer cooling pipes are evenly distributed along the thickness of the heat-spreading structure, which expands the cooling coverage area and ensures that the cooling rate of each area of ​​the heat-spreading structure is consistent. This avoids localized over-cooling or under-cooling caused by a single cooling layer, further enhances temperature uniformity, and improves cooling efficiency.

[0009] In one optional embodiment, the heat dissipation structure has a plurality of embedding slots along its thickness direction, and the plurality of cooling pipes are embedded in the plurality of embedding slots in a one-to-one correspondence.

[0010] Beneficial effects: The cooling pipes are embedded in the grooves one-to-one, which makes the cooling pipes fit tightly with the heat dissipation structure, reducing contact thermal resistance and improving heat exchange efficiency.

[0011] In one alternative embodiment, the cooling pipe contains a cooling medium, which is one of water, oil, or gas.

[0012] Beneficial effects: The cooling medium can be water, oil, gas, etc., and can be flexibly adapted according to the temperature requirements and cooling rate requirements of different molding processes.

[0013] In one optional embodiment, the heat insulation structure includes a heat insulation plate and a transition plate. The heat insulation plate abuts against the heating structure, and the transition plate is disposed between the heat insulation plate and the second cooling structure, and abuts against both the heat insulation plate and the second cooling structure.

[0014] Beneficial effects: The combined design of the heat insulation plate and the adapter plate not only blocks the direct heat exchange between the core heating area and the second cooling structure through the heat insulation plate, but also optimizes the fit of the structure through the adapter plate. The adapter plate can buffer thermal stress and avoid gaps between the heat insulation plate and the second cooling structure due to the difference in thermal expansion coefficients, ensuring the stability of the heat insulation effect, while improving the assembly accuracy and mechanical reliability of the overall structure.

[0015] In one optional embodiment, the heat insulation plate has a first surface and a second surface, the first surface abutting against the heating structure, the second surface abutting against the adapter plate, and heat insulation holes are provided on the heat insulation plate, the heat insulation holes being provided on the first surface and / or the second surface.

[0016] Beneficial effects: The heat insulation holes are opened on the first and / or second surfaces. By optimizing the position and area of ​​the holes through simulation, the contact thermal resistance can be precisely controlled, thus achieving "controllable heat conduction".

[0017] In one optional embodiment, the heating structure includes a first plate and a heating rod. The first plate has a perforation, and the heating rod is disposed in the perforation. The two opposite sides of the first plate abut against the heat equalization structure and the heat insulation structure, respectively.

[0018] Beneficial effects: The heating rod is embedded in the perforation of the first plate, which makes the heat source distribution more uniform and the heat is stably transferred to the heat equalization structure through the first plate; the embedded design fixes the position of the heating rod, avoids the heat source shift caused by displacement during heating, ensures the uniformity of the temperature distribution of the heating surface, and facilitates the installation, maintenance and replacement of the heating rod.

[0019] In one alternative embodiment, the heating structure and the heat spreader structure are integrally formed.

[0020] Beneficial effects: The one-piece molding structure eliminates the assembly gap between the two parts, greatly reduces the contact thermal resistance, makes the heat transfer more direct and faster, and improves the thermal response speed; it reduces the stress concentration points caused by the connection of parts, improves the overall rigidity and thermal stability of the structure, avoids thermal deformation or loosening caused by assembly gaps under long-term thermal cycling, and extends the service life of the device.

[0021] In one alternative embodiment, the second cooling structure includes a second plate with a cooling channel formed therein, the cooling channel being adapted to communicate with a cooling source.

[0022] Beneficial effects: The cooling channels inside the second plate are connected to the cooling source, forming an integral cooling surface at the bottom, which enhances cooling power, helps to cool down quickly, and facilitates integration with the overall device. Attached Figure Description

[0023] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the overall structure of the molding heating and cooling device according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the heating assembly according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the structure of the heat insulation plate according to an embodiment of the present utility model; Figure 4 This is a simulation diagram of a heat insulation plate with multiple different heat insulation holes according to an embodiment of the present invention.

[0025] Explanation of reference numerals in the attached figures: 10. Heating component; 11. Heating structure; 111. First plate; 112. Perforation; 12. Heat dissipation structure; 121. Embedded groove; 20. First cooling structure; 21. Cooling pipe; 30. Heat insulation structure; 31. Heat insulation plate; 311. Heat insulation hole; 32. Adapter plate; 40. Second cooling structure; 41. Second plate; 42. Cooling channel. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0027] The following is combined Figures 1 to 4 The following describes embodiments of the present invention.

[0028] According to an embodiment of the present invention, a molding heating and cooling device is provided, including a heating component 10, a first cooling structure 20, a heat insulation structure 30, and a second cooling structure 40; the heating component 10 includes a heating structure 11 and a heat-spreading structure 12, the heat-spreading structure 12 abutting against the heating structure 11, and the side of the heat-spreading structure 12 away from the heating structure 11 is a heating surface, which is suitable for abutting against the workpiece; the first cooling structure 20 is arranged circumferentially around the heat-spreading structure 12; the heat insulation structure 30 abuts against the side of the heating structure 11 away from the heat-spreading structure 12; the second cooling structure 40 abuts against the side of the heat insulation structure 30 away from the heating structure 11.

[0029] The molding heating and cooling device of this embodiment rapidly conducts the generated heat laterally through the heat homogenizing structure 12, forming a very uniform temperature field on the mold surface in contact with the glass. This reduces internal stress and surface deviation during lens forming, directly improving the optical accuracy and yield of the product. By placing the heat insulation structure 30 between the heating structure 11 and the second cooling structure 40, the interference of the cooling system's "heat absorption" on the heating zone during heating and the interference of the heating zone's "residual heat" during cooling are effectively blocked, making the heating and cooling processes more direct and efficient. By setting the first cooling structure 20 around the heat homogenizing structure 12, the cooling rate of the heat homogenizing structure 12 is improved.

[0030] It should be noted that the heating component 10 heats the workpiece to form the above-mentioned heating zone. During heating, the overall temperature of the molding heating and cooling device is relatively high. In order to avoid the high temperature affecting the equipment around the molding heating and cooling device, it is necessary to cool it down through the second cooling structure 40. However, in order to avoid the "heat absorption" interference of the cooling system on the heating zone during heating and the "residual heat" interference of the heating zone during cooling, a heat insulation structure 30 is provided.

[0031] It should be noted that in related technologies, increasing the heating power or increasing the coolant flow rate is often chosen to improve the rate, which often exacerbates the temperature non-uniformity. Therefore, in this embodiment, the heat generated is rapidly conducted laterally through the heat equalization structure 12, so that it forms a very uniform temperature field on the mold surface in contact with the glass, reducing the internal stress and surface deviation during the lens forming process, and directly improving the optical accuracy and yield of the product.

[0032] Specifically, the heat-spreading structure 12 is a heat-spreading plate, and the side of the heat-spreading plate away from the heating structure 11 is the heating surface. When the workpiece needs to be heated, other moving components (such as a robot) are used to move the molding heating and cooling device to the workpiece processing area, and then the heating surface of the heat-spreading plate is brought into contact with the workpiece to heat it up. After the heating is completed, the heat-spreading structure 12 is cooled by the first cooling structure 20, and the heat-spreading effect of the heat-spreading structure 12 is used to make the temperature of the workpiece drop uniformly, so as to avoid large temperature differences in different parts of the workpiece and avoid quenching in some parts of the workpiece, which would generate large stress.

[0033] In one embodiment, the cooling pipe 21 contains a cooling medium, which is one of water, oil, or gas.

[0034] Specifically, in this embodiment, cooling water is selected as the cooling medium.

[0035] It should be noted that in other alternative implementations, other cooling media such as oil or gas can be selected according to different process temperature requirements.

[0036] It is worth noting that the cooling medium can be water, oil, gas, etc., and can be flexibly adapted according to the temperature requirements and cooling rate requirements of different molding processes.

[0037] In one embodiment, such as Figure 2 As shown, the first cooling structure 20 includes a cooling pipe 21, which is provided in several layers. The layers of cooling pipe 21 are uniformly arranged along the thickness direction of the heat dissipation structure 12, and the cooling pipe 21 is adapted to be connected to a cooling source.

[0038] Specifically, such as Figure 2 As shown, the cooling pipe 21 has two layers and is connected to the cooling water source; as Figure 2 As shown, the cooling pipe 21 is arranged around the heat dissipation structure 12, and the two ends of the cooling pipe 21 are connected to the inlet and outlet of the cooling water source, respectively, to ensure the supply of cooling medium.

[0039] It is worth noting that the multi-layer cooling pipes 21 are evenly distributed along the thickness direction of the heat-spreading structure 12, which expands the cooling coverage area and makes the cooling rate of each area of ​​the heat-spreading structure 12 consistent. This avoids localized over-cooling or under-cooling caused by a single cooling layer, further enhances temperature uniformity, and improves cooling efficiency.

[0040] Furthermore, such as Figure 2 As shown, the heat dissipation structure 12 has several embedded grooves 121 along its thickness direction, and several cooling pipes 21 are embedded in the grooves 121 in a one-to-one correspondence.

[0041] Specifically, such as Figure 2As shown, two embedding grooves 121 are formed along the thickness direction of the heat dissipation structure 12, such as... Figure 1 As shown, the two cooling pipes 21 are respectively embedded in the two embedding slots 121.

[0042] It should be noted that in other alternative embodiments, the number of embedded slots 121 and the number of cooling pipes 21 can be provided in other numbers according to the actual situation.

[0043] It is worth noting that the cooling pipes 21 and the embedded grooves 121 are embedded in a one-to-one correspondence, so that the cooling pipes 21 and the heat dissipation structure 12 are in close contact, reducing contact thermal resistance and improving heat exchange efficiency.

[0044] In one embodiment, such as Figure 1 As shown, the heat insulation structure 30 includes a heat insulation plate 31 and a transition plate 32. The heat insulation plate 31 abuts against the heating structure 11, and the transition plate 32 is disposed between the heat insulation plate 31 and the second cooling structure 40, and abuts against the heat insulation plate 31 and the second cooling structure 40 respectively.

[0045] It is worth noting that the combined design of the heat insulation plate 31 and the adapter plate 32 not only blocks the direct heat exchange between the core heating area and the second cooling structure 40 through the heat insulation plate 31, but also optimizes the structural fit through the adapter plate 32. The adapter plate 32 can buffer thermal stress and prevent gaps from forming between the heat insulation plate 31 and the second cooling structure 40 due to the difference in thermal expansion coefficients, thus ensuring the stability of the heat insulation effect and improving the assembly accuracy and mechanical reliability of the overall structure.

[0046] Furthermore, the heat insulation plate 31 has a first surface and a second surface. The first surface abuts against the heating structure 11, and the second surface abuts against the adapter plate 32. Heat insulation holes 311 are provided on the heat insulation plate 31, and the heat insulation holes 311 are provided on the first surface and the second surface.

[0047] Specifically, such as Figure 3 As shown, the heat insulation holes 311 on the first and second surfaces are correspondingly arranged and connected to penetrate the entire heat insulation plate 31.

[0048] It should be noted that, in this embodiment, in order to obtain a suitable size for the heat insulation holes 311, simulation calculations were performed on the heat insulation plate 31 with 20mm×20mm heat insulation holes 311, 30mm×30mm heat insulation holes 311, 40mm×40mm heat insulation holes 311, two 40mm×40mm heat insulation holes 311 on the first side, and a 40mm×40mm heat insulation hole 311 on the second side, respectively. Figure 4 As shown, the results show that opening the heat insulation hole 311 on the first side is more effective than opening the heat insulation hole 311 on the second side. When opening the heat insulation hole 311 on the same side, the larger the area of ​​the heat insulation hole 311, the better.

[0049] To further explain, the contact area between the heat insulation plate 31 and the heating plate is A, and the contact thermal resistance of the heat insulation plate 31 is R. The contact area A between the heat insulation plate 31 and the heating plate is inversely proportional to the contact thermal resistance R of the heat insulation plate 31. The heat flux density in the contact area between the heat insulation plate 31 and the heating plate is q, the heating rate of the workpiece is T1, and the cooling rate of the workpiece is T2, which satisfies q=(T1-T2) / R. Therefore, changing the size of the heat insulation hole 311 will change the contact thermal resistance, thereby affecting the heating rate, cooling rate, and temperature uniformity of the workpiece.

[0050] It is worth noting that the heat insulation hole 311 is opened on the first and / or second surface. By optimizing the opening position and area through simulation, the contact thermal resistance is precisely controlled to achieve "controllable heat conduction".

[0051] In one embodiment, such as Figure 1 As shown, the second cooling structure 40 includes a second plate 41, and a cooling channel 42 is provided in the second plate 41. The cooling channel 42 is adapted to communicate with a cooling source.

[0052] Specifically, the second cooling structure 40 is a water-cooled plate, and the second cooling structure 40 is connected to the cooling water source.

[0053] Furthermore, such as Figure 1 As shown, the cooling channel 42 has an interface at its opening to facilitate connection with a cooling water source.

[0054] It is worth noting that the cooling channel 42 inside the second plate 41 is connected to the cooling source to form an integral cooling surface at the bottom, which enhances the cooling power, helps to cool down quickly, and facilitates integration with the overall device.

[0055] In one embodiment, the heating structure 11 includes a first plate 111 and a heating rod, such as Figure 2 As shown, a perforation 112 is provided on the first plate 111, and a heating rod is disposed in the perforation 112. The two opposite sides of the first plate 111 abut against the heat equalization structure 12 and the heat insulation structure 30, respectively.

[0056] Specifically, such as Figure 2 As shown, the first plate 111 has five through holes 112, and each through hole 112 is equipped with a heating rod; the heating rod is a resistance heating rod, and the heating rod is heated rapidly by passing electricity through it and utilizing the resistance characteristics.

[0057] It is worth noting that the heating rod is embedded in the perforation 112 of the first plate 111, which makes the heat source distribution more uniform and the heat is smoothly transferred to the heat equalization structure 12 through the first plate 111. The embedded design fixes the position of the heating rod, avoids the heat source shift caused by displacement during heating, ensures the uniformity of the temperature distribution of the heating surface, and facilitates the installation, maintenance and replacement of the heating rod.

[0058] Furthermore, such as Figure 2 As shown, the heating structure 11 and the heat dissipation structure 12 are integrally formed.

[0059] It is worth noting that the one-piece molding structure eliminates the assembly gap between the two parts, greatly reducing the contact thermal resistance, making heat transfer more direct and faster, and improving the thermal response speed; it also reduces the stress concentration points caused by component connections, improves the overall rigidity and thermal stability of the structure, avoids thermal deformation or loosening caused by assembly gaps under long-term thermal cycling, and extends the service life of the device.

[0060] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A molding heating and cooling device, characterized in that, include: Heating assembly (10), the heating assembly (10) includes a heating structure (11) and a heat-spreading structure (12), the heat-spreading structure (12) abuts against the heating structure (11), the side of the heat-spreading structure (12) away from the heating structure (11) is a heating surface, the heating surface is adapted to abut against the workpiece; A first cooling structure (20) is arranged circumferentially around the heat dissipation structure (12); A heat insulation structure (30) is provided, wherein the heat insulation structure (30) abuts against the side of the heating structure (11) away from the heat equalization structure (12); The second cooling structure (40) abuts against the side of the heat insulation structure (30) away from the heating structure (11).

2. The molding heating and cooling device according to claim 1, characterized in that, The first cooling structure (20) includes a cooling pipe (21), which is provided in several layers. The several layers of cooling pipe (21) are uniformly arranged along the thickness direction of the heat dissipation structure (12), and the cooling pipe (21) is adapted to be connected to a cooling source.

3. The molding heating and cooling device according to claim 2, characterized in that, The heat dissipation structure (12) has a plurality of embedded grooves (121) along its thickness direction, and the plurality of cooling pipes (21) are embedded in the plurality of embedded grooves (121) in a one-to-one correspondence.

4. The molding heating and cooling device according to claim 2, characterized in that, The cooling pipe (21) contains a cooling medium, which is one of water, oil, or gas.

5. The molding heating and cooling apparatus according to any one of claims 1-4, characterized in that, The heat insulation structure (30) includes a heat insulation plate (31) and a transition plate (32). The heat insulation plate (31) abuts against the heating structure (11). The transition plate (32) is disposed between the heat insulation plate (31) and the second cooling structure (40), and abuts against the heat insulation plate (31) and the second cooling structure (40) respectively.

6. The molding heating and cooling device according to claim 5, characterized in that, The heat insulation plate (31) has a first surface and a second surface. The first surface abuts against the heating structure (11), and the second surface abuts against the adapter plate (32). The heat insulation plate (31) has a heat insulation hole (311) on it. The heat insulation hole (311) is located on the first surface and / or the second surface.

7. The molding heating and cooling apparatus according to any one of claims 1-4, characterized in that, The heating structure (11) includes a first plate (111) and a heating rod. The first plate (111) has a perforation (112) and the heating rod is disposed in the perforation (112). The two opposite sides of the first plate (111) abut against the heat equalization structure (12) and the heat insulation structure (30) respectively.

8. The molding heating and cooling apparatus according to any one of claims 1-4, characterized in that, The heating structure (11) and the heat equalization structure (12) are integrally formed.

9. The molding heating and cooling apparatus according to any one of claims 1-4, characterized in that, The second cooling structure (40) includes a second plate (41), and a cooling channel (42) is provided in the second plate (41), the cooling channel (42) being adapted to communicate with a cooling source.

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