A carrier suitable for a glass single-sided thinning process

Abstract

The application provides a carrier suitable for a glass single-face thinning process, characterized in that the carrier comprises a base, an inner side of the base is provided with a base plate, the base plate separates an inner cavity of the base into a containing cavity and a functional cavity, an inner wall of the containing cavity is provided with a pressing strip, an upper surface of the base plate is provided with a buffer plate, the functional cavity is provided with a support plate through a connecting piece, an upper surface of the support plate is provided with a plurality of support columns, the base is provided with through holes corresponding to the support columns, the buffer plate is provided with functional holes corresponding to the support columns, upper ends of the support columns pass through the holes and enter the functional holes, and the support columns are detachably provided with adhesive blocks at top ends, the height of the support plate in the vertical direction is adjusted through the connecting piece, so that the upper surface of the adhesive blocks protrudes from the upper surface of the buffer plate, and the lower surface of the adhesive blocks is below the upper surface of the buffer plate at the same time. The application ensures that the glass product to be thinned is fixed stably, and can effectively prevent the glass from being damaged.

Description

Technical Field

[0001] This invention belongs to the field of glass thinning technology, and in particular relates to a carrier suitable for single-sided glass thinning process. Background Technology

[0002] In the field of glass substrate thinning technology, especially in the single-sided thinning process of large-size and ultra-thin glass substrates, the fixation effect and protective performance of the carrier directly affect the product yield. Existing carriers generally suffer from insufficient fixation stability. Some methods that use adhesives or films to bond the glass to the carrier plate either result in excessive stress during separation due to the large bonding area, or loosening due to improper adhesive design, making the glass prone to displacement during etching, or even breakage when peeled off the carrier. Carriers relying solely on frames or simple support structures cannot provide comprehensive and stable constraint on the glass, and similarly cannot prevent shaking and damage during transportation or etching. For ultra-large glass substrates, existing carriers cannot effectively distribute the stress on the glass, and ultra-thin glass substrates themselves have extremely low strength. Without precise fixation and cushioning protection, they are highly susceptible to edge damage, surface scratches, or overall breakage. Summary of the Invention

[0003] In view of this, the present invention aims to overcome the deficiencies in the prior art and propose a carrier suitable for glass single-sided thinning process.

[0004] To achieve the above objectives, the technical solution created by this invention is implemented as follows: A carrier suitable for single-sided glass thinning process includes a base, an inner substrate, and a substrate that divides the inner cavity of the base into a receiving cavity and a functional cavity, with the receiving cavity located above the functional cavity. A pressure strip is provided on the inner wall of the receiving cavity. A buffer plate is mounted on the upper surface of the substrate. A support plate is mounted in the functional cavity via a connector. Several support columns are provided on the upper surface of the support plate. Through holes are provided on the base corresponding to each support column. Functional holes are provided on the buffer plate corresponding to each support column. The upper end of each support column passes through a through hole into a functional hole, and an adhesive block is detachably mounted on the top of each support column. The vertical height of the support plate is adjusted via the connector so that the upper surface of the adhesive block protrudes above the upper surface of the buffer plate, while simultaneously ensuring that the lower surface of the adhesive block is below the upper surface of the buffer plate.

[0005] Furthermore, neither the lower surface of the support plate nor the lower end face of the connector protrudes beyond the lower surface of the base.

[0006] Furthermore, a recessed platform is provided on the lower surface of the support plate corresponding to the position of the connector, and the nut of the connector is at least partially submerged in the recessed platform.

[0007] Furthermore, the connector is a screw, and the base plate is provided with a connecting hole adapted to the connector. The support plate is provided with a positioning hole corresponding to the connector. The lower end of the connector passes through the positioning hole and is clearance-fitted with the positioning hole. The upper end of the connector passes through the positioning hole and is threadedly connected to the connecting hole. The support plate is driven to rise and fall in the vertical direction by rotating and adjusting the connector.

[0008] Furthermore, the buffer plate is made of silicone or rubber material.

[0009] Furthermore, there are two connectors, which are symmetrically arranged at both ends of the support plate.

[0010] Furthermore, there are 3-5 support columns, and each support column is arranged at equal intervals on the support plate.

[0011] Furthermore, the pressure strips are symmetrically distributed on opposite sides of the receiving cavity, and the pressure strips are detachably installed in the receiving cavity.

[0012] Furthermore, the upper surface of the adhesive block protrudes 0.05mm-0.5mm beyond the upper surface of the buffer plate.

[0013] Compared with existing technologies, the present invention has the following advantages: This invention features a rational structural design, employing a fixing method that combines adhesive blocks and pressure strips. The adhesive blocks provide vertical fixation, while the pressure strips provide horizontal positioning. This dual fixation ensures that the glass does not shift during processing. The buffer plate prevents rigid contact between the glass and the carrier. Therefore, using this carrier can ensure the stable fixing of the glass product to be thinned, while also effectively preventing scratches on the glass surface, edge damage, and internal cracks, thereby guaranteeing the processing quality of the glass. Attached Figure Description

[0014] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments and descriptions of the invention are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings: Figure 1 A schematic diagram of the structure created for this invention; Figure 2 for Figure 1 A diagram showing the result after removing the adhesive block; Figure 3 for Figure 2 A schematic diagram after removing the support plate; Figure 4 This is a schematic diagram of the support plate portion in this invention. Figure 5 for Figure 4 A diagram showing the result after removing the adhesive block; Figure 6 A schematic diagram of the base in this invention; Figure 7 A schematic diagram of the buffer plate in this invention; Figure 8 This is a schematic diagram of the support column portion in this invention. Figure 9 This is a schematic diagram of an embodiment of the invention where the pressure strip is equipped with an adjustment mechanism; Figure 10 for Figure 9 A schematic diagram showing the intermediate pressure strip adjusted inwards towards the base using the adjustment mechanism; Figure 11 A schematic diagram of a pressure bar with an adjustment mechanism in an embodiment of the present invention; Figure 12 for Figure 11 A schematic diagram after removing the trim strip; Figure 13 for Figure 12 A diagram showing the result after removing the baffle. Detailed Implementation

[0015] It should be noted that, unless otherwise specified, the embodiments and features described in the present invention can be combined with each other.

[0016] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this invention. Furthermore, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0017] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art will understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0018] The invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0019] A carrier suitable for single-sided glass thinning processes, such as Figures 1 to 13 As shown, the system includes a base 1, with a substrate 2 on the inner side of the base. The substrate divides the inner cavity of the base into a receiving cavity 3 and a functional cavity 4, with the receiving cavity located above the functional cavity. A pressure strip 5 is provided on the inner wall of the receiving cavity. A buffer plate 6 is installed on the upper surface of the substrate. A support plate 7 is installed in the functional cavity through a connector 12. A plurality of support columns 8 are provided on the upper surface of the support plate. Through holes 9 are provided on the base corresponding to the support columns. Functional holes 10 are provided on the buffer plate corresponding to the support columns. The upper end of the support column passes through the through hole and enters the functional hole. An adhesive block 11 is detachably installed on the top of the support column. The vertical height of the support plate is adjusted by the connector so that the upper surface of the adhesive block protrudes above the upper surface of the buffer plate, while the lower surface of the adhesive block is below the upper surface of the buffer plate.

[0020] The lower surface of the support plate and the lower end face of the connector do not protrude from the lower surface of the base. The nut of the connector is at least partially submerged in the recess. This structural design avoids interference between the support plate / connector and the external structure. The connector uses a screw, and the base plate of the base has a connecting hole 21 that matches the connector. The lower surface of the support plate has a recess 13 corresponding to the position of the connector, and the support plate has a positioning hole corresponding to the connector. The lower end of the connector passes through the positioning hole and is clearance-fitted with the positioning hole, while the upper end of the connector passes through the positioning hole and is threadedly connected to the connecting hole. The support plate is driven to rise and fall vertically by rotating and adjusting the connector.

[0021] The adhesive block has an adhesive layer on its upper surface, with a thickness of 1mm-3mm. For example, the adhesive layer may be a UV adhesive layer or an acid / alkali resistant layer. Preferably, under normal conditions, the adhesive layer protrudes 0.05mm-0.5mm from the upper surface of the buffer plate. The buffer plate is made of silicone or rubber. For example, the buffer plate has a thickness of 0.5-3mm. The glass product is placed in the receiving cavity with its processed surface facing upwards. The lower surface of the glass product is bonded and fixed to the adhesive layer on the upper surface of the adhesive block. Since the upper surface of the adhesive block only protrudes 0.05mm-0.5mm from the upper surface of the buffer plate under normal conditions, after the glass product is placed in the receiving groove, its own weight can press down the portion of the adhesive block protruding from the buffer plate, allowing the glass product to be supported by the buffer plate. Therefore, the buffer plate made of elastic and wear-resistant material can effectively absorb vibrations during processing, preventing direct rigid contact between the glass and the substrate. Simultaneously, the wear-resistant properties extend the service life of the buffer plate. The 0.5-3mm thickness design ensures the buffering effect without affecting the positioning stability of the glass due to excessive thickness.

[0022] In an optional embodiment, the adhesive block is detachably mounted to the top of the support column by a fixing screw 14. A recessed structure 15 is provided on the upper surface of the adhesive block, and the nut of the fixing screw is recessed into the recessed structure, with the upper end face of the fixing screw nut at least 1 mm away from the upper surface of the adhesive block. The detachable connection method facilitates the replacement of the adhesive block. When the adhesive block is worn or aged, a new adhesive block can be quickly replaced without replacing the entire support column, reducing usage costs.

[0023] Two connectors are provided, symmetrically arranged at both ends of the support plate, enabling the support plate to be raised and lowered. Three to five support columns are provided, evenly spaced on the support plate. When the glass product is bonded and fixed to the adhesive blocks at the top of each support column, the stability is excellent.

[0024] The pressure strips are symmetrically distributed on opposite sides of the receiving cavity, and the pressure strips are detachably installed in the receiving cavity. The symmetrical distribution of the pressure strips ensures that the limiting force on both sides of the glass is uniform, preventing the glass from deforming due to excessive force on one side; the detachable connection method facilitates the replacement and maintenance of the pressure strips, and the adjustable length of the horizontal section allows the pressure strips to adapt to glass of different widths, improving the versatility of the carrier.

[0025] In use, the height of the support plate is adjusted by rotating the connector so that the upper surface of the adhesive block at the top of the support column protrudes 0.1mm-0.5mm above the upper surface of the buffer plate. Then, the glass product to be thinned is placed on the buffer plate, and the lower surface of the glass contacts the adhesive block and is fixed by the adhesive block. At the same time, the outer sides of the glass product are attached to the pressure strip to achieve horizontal positioning of the glass. At this time, the surface of the glass to be thinned is exposed on the upper side, and the lower surface of the non-thinned surface is flexibly supported by the buffer plate.

[0026] When it is necessary to remove the glass product, simply use a suction cup to remove it from the receiving cavity. To further prevent damage to the glass product, in practice, the adhesive block can be released from the glass product first. There are two specific methods: First, use heat or ultraviolet light to detach the adhesive block, then loosen the pressure strip and use the suction cup to remove the glass. Second, first twist the connector downwards, causing the support plate to move downwards along the support column, thereby separating the adhesive block from the glass product, and then use the suction cup to remove the glass product from the receiving cavity. To facilitate pulling the support plate downwards, a hanging ring can be installed on the lower surface of the support plate. After twisting the connector downwards, the support plate can be moved downwards by pulling the hanging ring, thereby separating the adhesive block from the glass product.

[0027] The pressure strip is installed in the pressure strip mounting groove 22. In an optional embodiment, a baffle 16 is provided on the inner side wall of the pressure strip, and the pressure strip can be adhered to the baffle. An adjustment mechanism is provided on the side wall of the base. Specifically, the adjustment mechanism includes an adjustment screw 17, which is screwed into the base. A locking member 18 is installed at the front end of the adjustment screw. The locking member includes a connecting part 19 and a limiting part 20. The diameter of the limiting part is larger than the diameter of the connecting part. The connecting part is fixed to the end of the adjustment screw, and a limiting groove is formed between the limiting part and the adjustment screw. The baffle is located in the limiting groove between the locking member and the adjustment screw. Furthermore, the inner end of the adjustment screw extends into the pressure strip mounting groove. By turning the adjustment screw, the baffle is moved, thereby realizing the adjustment of the pressure strip in the horizontal direction. This can adapt to glass products of different specifications. At the same time, it is also very convenient to remove the glass products when the pressure strip is loosened. For example, the outer wall of the connecting part is provided with external threads, and the end of the adjusting screw is provided with a threaded hole that matches the connecting part. The locking part that is threaded onto the end of the adjusting screw can be easily disassembled. After the locking part is removed, the pressure strip can be easily removed from the adjusting mechanism.

[0028] This invention features a rational structural design, employing a fixing method that combines adhesive blocks and pressure strips. The adhesive blocks provide vertical fixation, while the pressure strips provide horizontal positioning. This dual fixation ensures that the glass does not shift during processing. The buffer plate prevents rigid contact between the glass and the carrier. Therefore, using this carrier can ensure the stable fixing of the glass product to be thinned, while also effectively preventing scratches on the glass surface, edge damage, and internal cracks, thereby guaranteeing the processing quality of the glass.

[0029] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A carrier suitable for single-sided glass thinning process, characterized in that: The device includes a base, with a substrate inside the base. The substrate divides the inner cavity of the base into a receiving cavity and a functional cavity, with the receiving cavity located above the functional cavity. A pressure strip is provided on the inner wall of the receiving cavity. A buffer plate is installed on the upper surface of the substrate. A support plate is installed in the functional cavity through a connector. Several support columns are provided on the upper surface of the support plate. A through hole is provided on the base corresponding to each support column. A functional hole is provided on the buffer plate corresponding to each support column. The upper end of the support column passes through the through hole and enters the functional hole. An adhesive block is detachably installed on the top of the support column. The vertical height of the support plate is adjusted by the connector so that the upper surface of the adhesive block protrudes above the upper surface of the buffer plate, while the lower surface of the adhesive block is below the upper surface of the buffer plate.

2. The carrier suitable for single-sided glass thinning process according to claim 1, characterized in that: The lower surface of the support plate and the lower end face of the connector do not protrude from the lower surface of the base.

3. A carrier suitable for single-sided glass thinning process according to claim 2, characterized in that: The lower surface of the support plate is provided with a recessed platform corresponding to the position of the connector, and the nut of the connector is at least partially submerged in the recessed platform.

4. A carrier suitable for single-sided glass thinning process according to claim 1, characterized in that: The connector is made of screws, and the base plate has connection holes that are adapted to the connector.

5. A carrier suitable for single-sided glass thinning process according to claim 1, characterized in that: The buffer plate is made of silicone or rubber material.

6. A carrier suitable for single-sided glass thinning process according to claim 1, characterized in that: Two connectors are provided, which are symmetrically arranged at both ends of the support plate.

7. A carrier suitable for single-sided glass thinning process according to claim 1, characterized in that: There are 3-5 support columns, and each support column is arranged at equal intervals on the support plate.

8. A carrier suitable for single-sided glass thinning process according to claim 1, characterized in that: The pressure strips are symmetrically distributed on opposite sides of the receiving cavity, and the pressure strips are detachably installed in the receiving cavity.

9. A carrier suitable for single-sided glass thinning process according to claim 1, characterized in that: The upper surface of the adhesive block protrudes 0.05mm-0.5mm above the upper surface of the buffer plate.

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