Conductive adhesive tape with cushioning structure

Abstract

The utility model relates to conductive adhesive tape technical field discloses a conductive adhesive tape with buffer structure, including limit disc, adhesive tape main part, the adhesive tape main part is from top to bottom distribution has base material, buffer layer and adhesive layer, the limit disc is fixed with mounting panel on the bolt, the bottom fixed joggle of pressure lever, the end face of mounting panel is fixed with the connecting block of upper position, the bottom of connecting block is connected with return spring, the utility model discloses through the adhesive tape main part is from top to bottom distribution has base material, buffer layer and adhesive layer, this buffer layer is located between base material and adhesive layer, and thus the buffer layer can be by the material of specific function for example silicon oxide, aluminium oxide or organic polymer metal oxide or is composed, the main role is optimization interface characteristic, thereby promotes the comprehensive performance of conductive film, improves the adhesion by improving, reduces the defect, and regulates stress matching, optimizes film layer density and surface topography, and then under the provision of buffer layer, the buffer effect of adhesive tape main part has been improved.

Description

Technical Field

[0001] This utility model relates to the field of conductive tape technology, specifically a conductive tape with a buffer structure. Background Technology

[0002] Conductive tape is a special type of tape that achieves conductivity through a metal substrate (such as aluminum foil or copper foil) or the addition of metal particles. It is mainly used for electromagnetic shielding and electrostatic protection. Its core function is to introduce external electromagnetic interference or static electricity to the ground through a conductive path, thereby protecting electronic equipment from interference. Therefore, conductive tape is a common item in the industrial field. Conductive tapes are mostly used in industrial settings during installation or application. Therefore, they are prone to direct contact with sharp surfaces or fast-moving parts. This can cause mechanical stress due to friction or collision, leading to damage or detachment of the tape structure. Furthermore, if the conductive tape's cushioning effect is poor, it can easily affect its working performance. Utility Model Content

[0003] The purpose of this invention is to provide a conductive tape with a buffer structure to solve the problem mentioned in the background art that conductive tapes are prone to direct contact with sharp surfaces or fast-moving parts, which may cause mechanical stress due to friction or collision, resulting in damage or detachment of the tape structure.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a conductive tape with a buffer structure, comprising a limiting disc and a tape body. The tape body has a substrate, a buffer layer, and an adhesive layer distributed from top to bottom. A mounting plate is fixed to the limiting disc. A sliding groove is formed in the mounting plate. A slider is connected in the sliding groove. A pressure rod is fixed between the front and rear sliders. A serrated block is fixed to the bottom of the pressure rod. A connecting block is fixed to the upper part of the end face of the mounting plate. A return spring is connected to the bottom of the connecting block.

[0005] As a further technical solution of this utility model, the bottom surface of the sawtooth block is sawtooth-shaped, and a sliding connection is formed between the groove and the slider.

[0006] As a further technical solution of this utility model, the reset springs are symmetrically distributed about the central axis of the pressure rod, and the limiting plate and the mounting plate are fixed by bolt connection.

[0007] As a further technical solution of this utility model, the limiting discs are connected to the limiting bushings, and the limiting discs are symmetrically distributed about the central axis of the limiting bushings.

[0008] As a further technical solution of this utility model, both the limiting disc and the limiting bushing are hollow designs, and the tape body is wrapped around the outside of the limiting bushing.

[0009] As a further technical solution of this utility model, the top of the reset spring is connected to the bottom surface of the connecting block, and the bottom of the reset spring is connected to the top surface of the pressure rod.

[0010] Compared with the prior art, the beneficial effects of this utility model are: the conductive tape with a buffer structure not only improves the buffering capacity, but also improves the cutting capacity and limiting capacity of the conductive tape. The tape body consists of a substrate, a buffer layer, and an adhesive layer distributed from top to bottom. The buffer layer is located between the substrate and the adhesive layer. This buffer layer can be composed of materials with specific functions, such as metal oxides like silicon dioxide and aluminum oxide, or organic polymers. Its main function is to optimize interface characteristics, thereby improving the overall performance of the conductive film. By improving adhesion, reducing defects, regulating stress matching, and optimizing film density and surface morphology, the buffer layer enhances the buffering effect of the tape body. The mounting plate is fixed to the limiting plate with bolts, and the connection between the connecting block and the pressure rod is completed by the return spring. The two mounting plates are installed on the two limiting plates. Therefore, when cutting is required, the pressure rod can be pressed to allow the slider to slide inside the slide groove. At the same time, the return spring is stretched to allow the serrated block to reach the tape body. Then, the serrated shape of the serrated block is used for cutting. After the cutting is completed, the return spring rebounds, thereby improving the overall cutting ability. By fixing a limiting sleeve between two limiting discs, and both the limiting discs and the limiting sleeves being hollow, and the diameter of the limiting disc being larger than the diameter of the limiting sleeve, the tape body is wound around the outside of the limiting sleeve. At this time, the two limiting discs can limit movement on both sides, thereby improving the overall limiting capability during operation. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the main structure of this utility model; Figure 2 This is a three-dimensional structural diagram of the limiting disc of this utility model; Figure 3 This is a side view of the pressure bar structure of this utility model; Figure 4 This is a frontal cross-sectional view of the tape body of this utility model.

[0012] In the diagram: 1. Limiting disc; 2. Adhesive tape body; 3. Mounting plate; 4. Limiting bushing; 5. Slide groove; 6. Slider; 7. Connecting block; 8. Pressure rod; 9. Serrated block; 10. Return spring; 11. Substrate; 12. Buffer layer; 13. Adhesive layer. Detailed Implementation

[0013] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0014] Please see Figure 1-4 An embodiment of this utility model provides: a conductive tape with a buffer structure, including a limiting plate 1 and a tape body 2. The tape body 2 has a substrate 11, a buffer layer 12 and an adhesive layer 13 distributed from top to bottom. A mounting plate 3 is fixed on the limiting plate 1. A sliding groove 5 is opened in the mounting plate 3. A slider 6 is connected in the sliding groove 5. A pressure rod 8 is fixed between the front and rear sliders 6. A serrated block 9 is fixed at the bottom of the pressure rod 8. A connecting block 7 is fixed at the upper position of the end face of the mounting plate 3. A return spring 10 is connected to the bottom of the connecting block 7.

[0015] As a further technical solution of this utility model, the bottom surface of the sawtooth block 9 is sawtooth-shaped, and a sliding connection is formed between the sliding groove 5 and the slider 6.

[0016] As a further technical solution of this utility model, the reset spring 10 is symmetrically distributed about the central axis of the pressure rod 8, and the limiting plate 1 and the mounting plate 3 are fixed by bolt connection.

[0017] As a further technical solution of this utility model, a limiting sleeve 4 is connected between the limiting discs 1, and the limiting discs 1 are symmetrically distributed about the central axis of the limiting sleeve 4.

[0018] As a further technical solution of this utility model, both the limiting disc 1 and the limiting bushing 4 are hollow designs, and the tape body 2 surrounds the outside of the limiting bushing 4.

[0019] As a further technical solution of this utility model, the top of the reset spring 10 is connected to the bottom surface of the connecting block 7, and the bottom of the reset spring 10 is connected to the top surface of the pressure rod 8. Furthermore, the substrate 11 can be a metal foil, such as aluminum foil, copper foil, etc., and metal particles such as silver powder and carbon nanotubes can be added to the adhesive layer 13 according to the requirements. A continuous current path is formed through conductive particles. This structure ensures both adhesion and low resistance conduction. Furthermore, the buffer layer 12 can be composed of materials with specific functions, such as metal oxides or organic polymers like silicon oxide and aluminum oxide. The buffer layer 12 has a significant impact on the conductivity, optical properties, mechanical properties and stability of the conductive film. Furthermore, by combining known technologies, a smooth deposition interface can be formed through the buffer layer 12, which promotes the uniform growth of the conductive layer. For example, the buffer layer prepared by precision processes such as atomic layer deposition (ALD) can completely cover the submicron-level pores on the substrate surface, thus achieving a smooth deposition interface.

[0020] Working principle: First, the tape body 2 has a substrate 11, a buffer layer 12 and an adhesive layer 13 distributed from top to bottom. The buffer layer 12 is located between the substrate 11 and the adhesive layer 13. The buffer layer 12 can be composed of materials with specific functions, such as metal oxides or organic polymers such as silicon dioxide and aluminum oxide. By improving adhesion, reducing defects, regulating stress matching, and optimizing film density and surface morphology, the mounting plate 3 is fixed to the limiting plate 1 with bolts. The connection between the connecting block 7 and the pressure rod 8 is completed by the return spring 10. When cutting is required, after pressing the pressure rod 8, the slider 6 slides inside the groove 5. At the same time, the return spring 10 is stretched accordingly, allowing the serrated block 9 to reach the tape body 2. Then, the serrated shape of the serrated block 9 is used for cutting.

[0021] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

Claims

1. A conductive tape with a buffer structure, comprising a limiting disc (1), a tape body (2), and a limiting bushing (4), characterized in that: The tape body (2) has a substrate (11), a buffer layer (12) and an adhesive layer (13) distributed from top to bottom. A mounting plate (3) is fixed on the limiting plate (1). A groove (5) is opened in the mounting plate (3). A slider (6) is connected in the groove (5). A pressure rod (8) is fixed between the front and rear sliders (6). A serrated block (9) is fixed at the bottom of the pressure rod (8). A connecting block (7) is fixed at the upper position of the end face of the mounting plate (3). A reset spring (10) is connected to the bottom of the connecting block (7).

2. The conductive tape with a buffer structure according to claim 1, characterized in that: The bottom surface of the sawtooth block (9) is sawtooth-shaped, and a sliding connection is formed between the groove (5) and the slider (6).

3. The conductive tape with a buffer structure according to claim 1, characterized in that: The reset spring (10) is symmetrically distributed about the central axis of the pressure rod (8), and the limiting plate (1) and the mounting plate (3) are fixed by bolts.

4. The conductive tape with a buffer structure according to claim 1, characterized in that: The limiting discs (1) are connected by limiting bushings (4), and the limiting discs (1) are symmetrically distributed about the central axis of the limiting bushings (4).

5. The conductive tape with a buffer structure according to claim 4, characterized in that: Both the limiting disc (1) and the limiting bushing (4) are hollow designs, and the tape body (2) surrounds the outside of the limiting bushing (4).

6. The conductive tape with a buffer structure according to claim 1, characterized in that: The top of the reset spring (10) is connected to the bottom surface of the connecting block (7), and the bottom of the reset spring (10) is connected to the top surface of the pressure rod (8).

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