A shielding device for semiconductor coating

Abstract

The utility model discloses a kind of shielding devices for semiconductor coating, it is related to semiconductor coating technical field, including rectangular box, rectangular box one end face is opened and is inserted with drawer, wafer is placed in the middle of rectangular box top surface, rectangular box top surface is opened with the through-hole coaxial with wafer, rectangular box top surface is fixed with the fixed outer ring coaxial with wafer, fixed outer ring inner wall is equipped with the fixed assembly for fixing the edge of wafer bottom surface and is installed;The utility model is rotated by the cooperation of rotating inner ring and mounting ring in the fixed assembly of fixed outer ring inner wall, movable block is movably arranged in the inclined through slot of rotating inner ring, movable block is connected by pivot and the installation groove of mounting ring, when rotating inner ring rotates, movable block can be pushed along inclined through slot and move, it is convenient to adjust the abutment position of movable block according to wafer size;Finally solve the problem that traditional shielding device uses single compression ring or edge clamping to fixed wafer easily lead to wafer deformation, high risk of damage to thin wafer, improve the reliability of wafer placement and the protection effect to thin wafer.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor coating technology, and in particular to a shielding device for semiconductor coating. Background Technology

[0002] In the semiconductor device manufacturing process, the coating process is a key step in realizing the electrical performance, optical performance and stability of the device. Its core requirement is to accurately deposit thin films in specific areas on the wafer surface, while avoiding contamination of non-target areas by the coating material. Traditional shielding devices often use a single pressure ring or edge clamping structure to fix the wafer. Pressure ring fixation is prone to wafer deformation due to uneven pressure, especially for thin wafers, which have a high risk of damage. Therefore, improvements are needed to address these issues. Utility Model Content

[0003] The purpose of this invention is to address the shortcomings of existing technologies by proposing a shielding device for semiconductor coating.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a shielding device for semiconductor coating, comprising a rectangular box, one end of which is open and a drawer is inserted; a wafer is placed in the center of the top surface of the rectangular box; a through hole coaxial with the wafer is opened on the top surface of the rectangular box; a fixing outer ring coaxial with the wafer is fixedly connected to the top surface of the rectangular box; a fixing component for fixing the bottom edge of the wafer is installed on the inner wall of the fixing outer ring; a docking hole coaxial with the through hole is opened on the top surface of the drawer; a ring groove is opened on the bottom surface of the drawer at the docking hole; multiple limiting grooves inclined towards the axis of the ring groove are equidistantly opened on the inner circumference of the ring groove; a baffle is abutting the top surface of the ring groove; and multiple through grooves for coating are evenly opened in the center of the top surface of the baffle.

[0005] Preferably, a positioning post is provided at one location on the top surface of the limiting groove, a limiting ring is provided abutting the top surface of the baffle, a limiting plate corresponding to the limiting groove is fixedly connected to the outer periphery of the limiting ring, and a positioning hole for engaging the positioning post is opened on the limiting plate.

[0006] Preferably, the drawer has two symmetrical telescopic grooves at one end, and a spring telescopic rod is provided in the two telescopic grooves. The telescopic end of the spring telescopic rod abuts against the inner wall of the rectangular box. A locking block is provided on the side of the drawer away from the spring telescopic rod, and a corresponding locking groove is provided on the inner wall of the rectangular box.

[0007] Preferably, the outer wall of the rectangular box has a reset groove at the upper end of the slot, a reset spring is provided in the reset groove, one end of the reset spring is fixedly connected to a push rod that slides in the reset groove, one end of the push rod extends out of the reset groove and is fixedly connected to a reset block, the outer wall of the rectangular box has a connecting groove that communicates with the slot, and one end of the reset block extends into the connecting groove.

[0008] Preferably, the fixing component includes a rotating inner ring, with multiple oblique through grooves evenly spaced on the inner wall of the rotating inner ring, and a stop block movably disposed in the oblique through groove. An installation ring is provided between the rotating inner ring and the fixed outer ring, and an installation groove is formed on the surface of the installation ring opposite to the rotating inner ring. A rotating shaft is passed through one end of the top surface of the stop block, and the rotating shaft is fixedly connected in the installation groove.

[0009] Preferably, a handle is fixedly connected to one side of the outer wall of the rotating inner ring, an arc-shaped telescopic rod is fixedly connected to one side of the handle, a fixing block located in the mounting groove is fixedly connected to the fixed end of the arc-shaped telescopic rod, one end of the handle extends out of the outer wall of the mounting ring and the fixed outer ring in sequence, and both the mounting ring and the fixed outer ring have sliding grooves at the handle.

[0010] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model uses a fixing component that fixes the inner wall of the outer ring to rotate the inner ring and engages with the mounting ring. A stop block is movably provided in the inclined groove of the rotating inner ring. The stop block is connected to the mounting groove of the mounting ring through a rotating shaft. When the inner ring rotates, it can push the stop block to move along the inclined groove, which facilitates the adjustment of the stop block's contact position according to the wafer size, improving the adaptability of the stop block to wafers of different specifications, and thus enabling precise contact support for the bottom edge of the flat wafer. Furthermore, the handle on the outer wall of the rotating inner ring engages with the arc-shaped telescopic rod. The fixed end of the arc-shaped telescopic rod is connected to the fixing block. After rotating the handle, the arc-shaped telescopic rod can fix the position of the rotating inner ring, which facilitates locking the contact state of the stop block, improving the stability of wafer placement, and thus avoiding the squeezing of the wafer due to uneven pressure of the traditional pressure ring. Finally, it solves the problem that traditional shielding devices using a single pressure ring or edge clamping to fix the wafer are prone to wafer deformation and have a high risk of damage to thin wafers, improving the reliability of wafer placement and the protection effect for thin wafers. Attached Figure Description

[0011] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings: Figure 1 This is a first-view schematic diagram of the overall structure proposed in this utility model; Figure 2 This is a second-view schematic diagram of the overall structure proposed in this utility model; Figure 3 This is a schematic diagram of the overall structure of the arc-shaped telescopic rod proposed in this utility model; Figure 4 This is a schematic diagram of the overall structure of the drawer proposed in this utility model; Figure 5 The present utility model proposes Figure 2 Enlarged cross-sectional view of the structure at point A in the diagram.

[0012] The numbers in the diagram are: 1. Rectangular box; 2. Drawer; 3. Fixed outer ring; 4. Stop block; 5. Fixing block; 6. Arc-shaped telescopic rod; 7. Handle; 8. Baffle; 9. Return spring; 10. Positioning post; 11. Spring telescopic rod; 12. Return block. Detailed Implementation

[0013] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0014] Example: See Figures 1 to 5This utility model discloses a shielding device for semiconductor coating, comprising a rectangular box 1, with an opening at one end and a drawer 2 inserted therein. A wafer is placed in the center of the top surface of the rectangular box 1. A through hole coaxial with the wafer is formed on the top surface of the rectangular box 1. A fixing outer ring 3 coaxial with the wafer is fixedly connected to the top surface of the rectangular box 1. A fixing component for fixing the bottom edge of the wafer is installed on the inner wall of the fixing outer ring 3. A mating hole coaxial with the through hole is formed on the top surface of the drawer 2. A ring groove is formed on the bottom surface of the drawer 2 at the mating hole. Multiple limiting grooves inclined towards the axis of the ring groove are equidistantly formed on the inner circumference of the ring groove. A baffle 8 is abutting against the top surface of the ring groove. Multiple baffles are evenly formed in the center of the top surface of the baffle 8 for... The coating channel; rectangular box 1, drawer 2, fixing outer ring 3, and baffle 8 are all made of 304 stainless steel, which has good corrosion resistance and structural strength, can adapt to the complex environment of the coating process, and extend the life of the device; among them, rectangular box 1 provides a basic installation carrier for the device, drawer 2 facilitates the placement and replacement of baffle 8, fixing outer ring 3 provides an installation base for fixing components, and baffle 8 achieves precise coating of specific areas of the wafer through the channel, avoiding contamination of non-target areas; the above components constitute the basic framework of the device, providing core structural support for wafer placement, fixing, and precise coating; positioning posts 10 are provided on the top surface of the limiting slot, and the top surface of baffle 8 abuts against the limiting post 10. The positioning ring has a limiting plate fixed to its outer circumference, corresponding to the limiting groove. The limiting plate has positioning holes for engaging the positioning post 10. The positioning post 10 is made of 45# steel, which is high in hardness and wear-resistant, and is not easily deformed over long-term use. The limiting ring and limiting plate are made of polytetrafluoroethylene (PTFE), with a smooth surface that does not stick to the coating material, preventing the coating material from adhering and affecting future use. The positioning post 10, in conjunction with the positioning holes of the limiting plate, can precisely limit the position of the limiting ring, thereby fixing the baffle 8 and preventing it from shifting during the coating process. This ensures that the through groove on the baffle 8 is precisely aligned with the target area of ​​the wafer, improving coating accuracy. The drawer 2 has two symmetrical telescopic grooves at one end. A spring telescopic rod 11 is installed inside the telescopic groove. The telescopic end of the spring telescopic rod 11 abuts against the inner wall of the rectangular box 1. A locking block is provided on the side of the drawer 2 away from the spring telescopic rod 11, and a corresponding locking groove is opened on the inner wall of the rectangular box 1. The spring telescopic rod 11 is a small compression spring telescopic rod, and its spring part is made of piano wire, which has a high elastic limit and long fatigue life, and can provide elastic force stably for a long time. The spring telescopic rod 11 pushes the drawer 2 to make the locking block tightly embedded in the locking groove, realizing the reliable locking of the drawer 2 and the rectangular box 1, and preventing the drawer 2 from loosening during coating. At the same time, the elasticity of the spring telescopic rod 11 makes it easy for the drawer 2 to pop out automatically when unlocked later, improving the convenience of operation.

[0015] In this utility model, a reset groove is formed on the outer wall of the rectangular box 1 at the upper end of the slot. A reset spring 9 is provided in the reset groove. One end of the reset spring 9 is fixedly connected to a push rod that slides in the reset groove. One end of the push rod extends out of the reset groove and is fixedly connected to a reset block 12. A connecting groove is formed on the outer wall of the rectangular box 1, which connects to the slot. One end of the reset block 12 extends into the connecting groove. The reset spring 9 is a cylindrical helical compression spring, and the spring part is made of piano wire, which is elastic and stable. The reset block 12 is made of 45# steel, which is hard and wear-resistant. When the reset block 12 is pressed, the push rod compresses the reset spring 9, and the reset block 12... 2. The card block in the slot can be squeezed out to quickly unlock drawer 2 without the need for additional tools, simplifying the unlocking operation; the return spring 9 can drive the return block 12 to reset after it is released, preparing for the next locking and improving the efficiency of the device's repeated use; the fixing component includes a rotating inner ring, with multiple oblique slots evenly spaced on the inner wall of the rotating inner ring, and a stop 4 movably installed in the oblique slots. A mounting ring is provided between the rotating inner ring and the fixed outer ring 3, and a mounting groove is opened on the surface of the mounting ring opposite to the rotating inner ring. A rotating shaft is inserted through one end of the top surface of the stop 4 and is fixed in the mounting groove; the stop 4 and the rotating shaft are made of 30 4. Made of stainless steel, it has good corrosion resistance and strength, and can work stably for a long time. When the inner ring rotates, the oblique groove can push the stop 4 to rotate along the axis of rotation, realizing the extension and retraction of the stop 4. It is convenient to adjust the position of the stop 4 according to the wafer size and adapt to wafers of different specifications. The stop 4 is fixed by abutting against the edge of the bottom surface of the wafer, avoiding wafer deformation caused by traditional pressure ring fixing and protecting thin wafers. A handle 7 is fixedly connected to one side of the outer wall of the rotating inner ring, and an arc-shaped telescopic rod 6 is fixedly connected to one side of the handle 7. The fixed end of the arc-shaped telescopic rod 6 is fixedly connected to a fixing block 5 located in the mounting groove. One end of the handle 7 extends out of the mounting ring and the fixing block 5 in sequence. The outer wall of the outer ring 3, the mounting ring and the fixed outer ring 3 are all provided with sliding grooves at the handle 7; the handle 7 and the fixing block 5 are made of 304 stainless steel, which has high structural strength and is not easily damaged; the arc-shaped telescopic rod 6 is an arc-shaped spring telescopic rod, and the spring part is made of piano wire, which has long-lasting elasticity; the handle 7 makes it easy for the operator to drive the inner ring to rotate, reducing the difficulty of operation; the arc-shaped telescopic rod 6 can provide a reset spring force after the handle 7 is rotated, which drives the stop block 4 to automatically abut against the wafer and lock the position, without the need for manual fixing, thus improving the efficiency of operation; the sliding groove provides space for the handle 7 to move, ensuring that the inner ring can rotate flexibly.

[0016] Working Principle: When using this utility model, firstly, the wafer placement is prepared by operating the fixing assembly. Pushing the handle 7 on the outer wall of the rotating inner ring causes the handle 7 to move along the sliding groove between the mounting ring and the fixed outer ring 3, rotating the inner ring. Simultaneously, the telescopic end of the arc-shaped telescopic rod 6 on one side of the rotating inner ring retracts, causing the oblique through groove on the inner wall of the rotating inner ring to rotate synchronously. The oblique through groove drives the internal stop 4 to rotate along the axis, causing the stop 4 to retract away from the center of the rectangular box 1, freeing up space for the wafer placement. Then, the wafer to be coated is placed flat in the center of the top surface of the rectangular box 1, ensuring that the wafer is coaxial with the through hole on the top surface of the rectangular box 1. Releasing the external force pushing the handle 7 causes the built-in spring in the arc-shaped telescopic rod 6 to release its elasticity, pushing the handle 7 back to its original position through the telescopic end. The handle 7 then rotates. The inner ring rotates in the opposite direction, and the oblique through groove pushes the stop block 4 towards the wafer until the stop block 4 precisely abuts against the edge of the wafer's bottom surface. At the same time, the arc-shaped telescopic rod 6 fixes the position of the rotating inner ring through the fixing block 5, locking the abutment state of the stop block 4, thus completing the stable support of the wafer and preventing the wafer from shifting during the coating process. Next, the baffle 8 with the through groove is placed in the annular groove on the bottom surface of the drawer 2, so that the bottom surface of the baffle 8 is in contact with the top surface of the annular groove. Then, the limiting ring is placed on the top surface of the baffle 8, so that the limiting plate on the outer wall of the limiting ring corresponds to the limiting groove on the inner wall of the annular groove. The positioning hole on the limiting plate is aligned with the positioning post 10 on the top surface of the limiting groove. Pressing the limiting ring causes the positioning post 10 to be inserted into the positioning hole, achieving precise positioning of the baffle 8 and preventing the baffle 8 from shifting and causing misalignment of the coating area. Then, the drawer 2 is pushed towards the wafer. When the open end of rectangular box 1 is inserted, the spring telescopic rod 11 at one end of drawer 2 is compressed until the locking block on the other side of drawer 2 is embedded in the slot on the inner wall of rectangular box 1. The elastic force of the spring telescopic rod 11 pushes drawer 2 tightly against the inner wall of rectangular box 1, completing the locking of drawer 2. At this time, the mating hole on the top surface of drawer 2 is coaxial with the through hole on the top surface of rectangular box 1, and the baffle 8 is located directly below the wafer, preparing for coating. Then the coating operation is carried out. After the coating equipment is started, the coating material passes through the through slot on the baffle 8 and is precisely deposited on the target area on the wafer surface. The baffle 8 blocks the non-target area of ​​the wafer to avoid contamination of the coating material, achieving precise coating. Finally, after the coating is completed, if it is necessary to open drawer 2, press the reset block 12 on the outer wall of rectangular box 1. The reset block 12 pushes the push rod. The reset spring 9 in the compression reset slot is compressed, and one end of the reset block 12 extends into the slot along the connecting groove, directly squeezing out the block in the slot so that the block is completely disengaged from the slot. At this time, the compressed spring telescopic rod 11 at one end of the drawer 2 quickly returns to its original state, and the resulting elastic force pops out the part of the drawer 2 near the opening end, making it easy for the operator to directly grab the popped-out part of the drawer 2 and pull it out completely. Then, push the handle 7 of the rotating inner ring again to stretch the arc telescopic rod 6 and drive the stop 4 to retract, releasing the stop 4 from abutting the wafer, and the coated wafer can be removed. If the baffle 8 needs to be replaced, the limiting ring can be pulled up, the old baffle 8 can be removed, and the above baffle 8 installation steps can be repeated to complete the device reset and prepare for the next coating operation. At this point, the device is used successfully.

[0017] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A shielding device for semiconductor coating, comprising a rectangular box (1), characterized in that: The rectangular box (1) has an opening on one end face and a drawer (2) is inserted therein. A wafer is placed in the middle of the top surface of the rectangular box (1). A through hole coaxial with the wafer is opened on the top surface of the rectangular box (1). A fixed outer ring (3) coaxial with the wafer is fixedly connected to the top surface of the rectangular box (1). A fixing component for fixing the bottom edge of the wafer is installed on the inner wall of the fixed outer ring (3). A docking hole coaxial with the through hole is opened on the top surface of the drawer (2). A ring groove is opened on the bottom surface of the drawer (2) at the docking hole. Multiple limiting grooves inclined towards the axis of the ring groove are opened at equal intervals on the inner wall of the ring groove. A baffle (8) is abutted on the top surface of the ring groove. Multiple through grooves for coating are evenly opened in the middle of the top surface of the baffle (8).

2. The shielding device for semiconductor coating according to claim 1, characterized in that: A positioning post (10) is provided at one point on the top surface of the limiting groove. A limiting ring is provided on the top surface of the baffle (8). A limiting plate corresponding to the limiting groove is fixed to the outer wall of the limiting ring. A positioning hole for engaging the positioning post (10) is opened on the limiting plate.

3. The shielding device for semiconductor coating according to claim 2, characterized in that: The drawer (2) has two symmetrical telescopic grooves at one end, and a spring telescopic rod (11) is provided in the two telescopic grooves. The telescopic end of the spring telescopic rod (11) abuts against the inner wall of the rectangular box (1). The drawer (2) has a locking block on the side away from the spring telescopic rod (11), and the inner wall of the rectangular box (1) has a corresponding locking groove.

4. The shielding device for semiconductor coating according to claim 3, characterized in that: The outer wall of the rectangular box (1) has a reset groove at the upper end of the slot. A reset spring (9) is provided in the reset groove. One end of the reset spring (9) is fixedly connected to a push rod that slides in the reset groove. One end of the push rod extends out of the reset groove and is fixedly connected to a reset block (12). The outer wall of the rectangular box (1) has a connecting groove that connects to the slot. One end of the reset block (12) extends into the connecting groove.

5. A shielding device for semiconductor coating according to claim 4, characterized in that: The fixing component includes a rotating inner ring, and multiple oblique through grooves are equidistantly opened on the inner wall of the rotating inner ring. A stop block (4) is movably provided in the oblique through groove. An installation ring is provided between the rotating inner ring and the fixed outer ring (3). An installation groove is opened on the surface of the installation ring opposite to the rotating inner ring. A rotating shaft is passed through one end of the top surface of the stop block (4), and the rotating shaft is fixed in the installation groove.

6. The shielding device for semiconductor coating according to claim 5, characterized in that: A handle (7) is fixedly connected to one side of the outer wall of the rotating inner ring, and an arc-shaped telescopic rod (6) is fixedly connected to one side of the handle (7). A fixing block (5) located in the mounting groove is fixedly connected to the fixed end of the arc-shaped telescopic rod (6). One end of the handle (7) extends out of the outer wall of the mounting ring and the fixed outer ring (3) in sequence. Sliding grooves are opened at the handle (7) of both the mounting ring and the fixed outer ring (3).

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