Tool for binding target material

Abstract

The utility model discloses a kind of tool for target material binding, it is related to target material binding technical field, including backplate and annular positioning structure being set on the backplate, the annular positioning structure is set around target material to be bound, including at least two sectional positioning arc plates, the inner side wall of each positioning arc plate is equipped with flow guide groove, and outlet is formed between adjacent positioning arc plates, for collecting and guiding the solder overflow from between target material and backplate;The inner side of the annular positioning structure is equipped with limiting structure, the limiting structure includes limiting arc plate and limiting block welded in the outer side of the positioning arc plate, the limiting block is used to fix limiting arc plate on positioning arc plate, and the limiting structure is used to limit the movement of target material in horizontal direction.The tool guarantees the stability of binding process from structure, it is helpful to uniform distribution of solder, to improve welding rate, reduce defect such as off-target, cracking;Integral structure is simple and reliable, easy to assemble and disassemble, can be repeatedly used, and practicality is strong.

Description

Technical Field

[0001] This utility model relates to the field of target bonding technology, and in particular to a tooling for target bonding. Background Technology

[0002] Target bonding is a core step in target preparation. It refers to the process of firmly bonding sputtering targets (such as aluminum-scandium alloys) to backplates or tubes (such as copper or aluminum alloys) using physical or chemical methods. This ensures that the target can efficiently conduct heat and current during sputtering and prevents it from detaching from the target or cracking.

[0003] In traditional bonding processes, insufficient positioning accuracy between the target and the backing plate can easily lead to misalignment or displacement, affecting bonding quality. Furthermore, molten solder (such as indium) tends to overflow during welding, resulting in solder waste, potential equipment contamination, reduced bonding interface uniformity, and even defects such as localized overheating, target detachment, or cracking. Therefore, there is an urgent need for a tooling device that can improve positioning accuracy and effectively guide solder flow. Utility Model Content

[0004] The purpose of this invention is to provide a tooling for target bonding, so as to solve the problems of low positioning accuracy and easy solder overflow in the bonding process between the target and the backplate in the prior art.

[0005] The technical solution adopted by this utility model to solve the above-mentioned technical problems is as follows: a tooling for bonding a target material, including a back plate and an annular positioning structure disposed on the back plate. The annular positioning structure is arranged around the target material and includes at least two segmented positioning arc plates. The inner sidewall of each positioning arc plate is provided with a guide groove, and an outlet is formed between adjacent positioning arc plates for collecting and guiding the solder overflowing from between the target material and the back plate. The inner side of the annular positioning structure is provided with a limiting structure. The limiting structure includes a limiting arc plate and a limiting block welded to the outside of the positioning arc plate. The limiting block is used to fix the limiting arc plate on the positioning arc plate, and the limiting structure is used to restrict the movement of the target material in the horizontal direction.

[0006] Furthermore, the cross-section of the guide channel is one of U-shape, V-shape or trapezoid, and the bottom of the channel has a slope, which is inclined towards the direction of the outlet.

[0007] Furthermore, the outlet is located at the lowest point of the guide channel.

[0008] Furthermore, the height of the limiting arc plate is less than the thickness of the target material, and it is used to limit the target material from its outer periphery.

[0009] Furthermore, mounting holes are respectively provided on the positioning arc plate and the limiting block, and the mounting holes are distributed in a ring array.

[0010] Furthermore, the back plate is provided with threaded holes corresponding to the mounting holes, for fixing the annular positioning structure and the limiting structure to the back plate by fasteners.

[0011] Furthermore, the back plate, positioning arc plate, limiting arc plate, and limiting block are all made of stainless steel, nickel-plated steel, or chromium-plated steel.

[0012] Based on the above technical solution, the beneficial effects of this utility model are: This invention, through the combination of a ring-shaped positioning structure and a limiting structure, can precisely limit the horizontal displacement of the target material, ensuring high coaxiality between the target material and the back plate. The guide groove and discharge port on the inner side of the segmented positioning arc plate effectively collect and guide overflowing solder, preventing solder accumulation from affecting positioning accuracy. This fixture structurally ensures the stability of the bonding process, promotes uniform solder distribution, thereby improving the bonding rate and reducing defects such as target detachment and cracking. Simultaneously, the back plate, positioning arc plate, and limiting structure are made of high-temperature resistant, thermally conductive, and solder-non-wetting materials, enhancing the fixture's durability and applicability in high-temperature bonding environments. The overall structure is simple and reliable, easy to assemble and disassemble, reusable, highly practical, and economical. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 for Figure 1 A sectional view at point AA; Figure 3 This is a schematic diagram of the flow guiding structure of this utility model.

[0014] The markings in the diagram are: 1. Back plate, 11. Threaded hole, 2. Positioning arc plate, 21. Guide groove, 22. Mounting hole, 3. Discharge port, 4. Limiting arc plate, 5. Limiting block, 6. Fixing component, 7. Target material. Detailed Implementation

[0015] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0016] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the implementation conditions of this utility model. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and purposes that this utility model can produce, should still fall within the scope of the technical content disclosed in this utility model.

[0017] like Figure 1-3As shown, a tooling for bonding a target material includes a back plate 1 and an annular positioning structure disposed on the back plate 1. The annular positioning structure is disposed around the target material 7 and includes at least two segmented positioning arc plates 2. Each positioning arc plate 2 has a guide groove 21 on its inner sidewall. An outlet 3 is formed between adjacent positioning arc plates 2 for collecting and guiding the solder overflowing from between the target material 7 and the back plate 1.

[0018] The inner side of the annular positioning structure is provided with a limiting structure, which includes a limiting arc plate 4 and a limiting block 5 welded to the outer side of the positioning arc plate 2. The limiting block 5 is used to vertically fix the limiting arc plate 4 on the positioning arc plate 2, and the limiting structure is used to restrict the movement of the target material 7 in the horizontal direction. Furthermore, the height of the limiting arc plate 4 is less than the thickness of the target material 7, so as to limit the movement from the outer periphery of the target material 7.

[0019] In practical applications, the ring-shaped positioning structure adopts a segmented design. Preferably, the structure is composed of four positioning arc plates 2 connected end to end to facilitate its installation and removal on the back plate 1. An outlet 3 is formed between adjacent positioning arc plates 2, thus the entire binding fixture has four outlets 3. The binding fixture includes two spaced-apart limiting arc plates 4, with a limiting block 5 welded to each of the two ends of each limiting arc plate 4. Accordingly, the binding fixture has two oppositely arranged limiting arc plates 4 and four limiting blocks 5.

[0020] Specifically, the cross-section of the flow guide trough 21 is U-shaped, V-shaped, or trapezoidal, and its bottom has a slope that is inclined towards the outlet 3. The outlet 3 is located at the lowest point of the flow guide trough 21 to ensure that the solder can flow smoothly to the outlet 3.

[0021] Furthermore, mounting holes 22 are respectively provided on the positioning arc plate 2 and the limiting block 5, and the mounting holes 22 are distributed in a ring array. The back plate 1 is provided with threaded holes 11 corresponding to the mounting holes 22, which are used to fix the ring-shaped positioning structure and the limiting structure to the back plate 1 by means of the fastener 6.

[0022] The back plate 1, positioning arc plate 2, limiting arc plate 4 and limiting block 5 are all made of materials that are resistant to high temperature, have good thermal conductivity and are not wetted by solder indium, preferably stainless steel, nickel-plated or chromium-plated steel, or specific high-temperature alloys.

[0023] This invention, through the combination of a ring-shaped positioning structure and a limiting structure, can precisely limit the horizontal displacement of the target material, ensuring high coaxiality between the target material and the back plate. The guide groove and discharge port on the inner side of the segmented positioning arc plate effectively collect and guide overflowing solder, preventing solder accumulation from affecting positioning accuracy. This fixture structurally ensures the stability of the bonding process, promotes uniform solder distribution, thereby improving the bonding rate and reducing defects such as target detachment and cracking. Simultaneously, the back plate, positioning arc plate, and limiting structure are made of high-temperature resistant, thermally conductive, and solder-non-wetting materials, enhancing the fixture's durability and applicability in high-temperature bonding environments. The overall structure is simple and reliable, easy to assemble and disassemble, reusable, highly practical, and economical.

[0024] In the actual installation process, firstly, the annular positioning structure is placed on the back plate 1, and the welded limiting structure is placed on the annular positioning structure. By aligning the mounting hole 22 with the threaded hole 11 on the back plate 1, the limiting structure, the annular positioning structure and the back plate 1 are fixed with the fastener 6.

[0025] Next, indium solder is placed in the central area of ​​back plate 1, and copper wires with a diameter of 0.3 to 1 mm are evenly distributed on the surface of back plate 1. Then, the assembled fixture is placed on a heating platform and heated until the indium solder is completely melted, and then the target material 7 is placed in the central area of ​​back plate 1.

[0026] Finally, apply a vertical pressure of 2-6 kg above the target 7 and maintain it for 30-60 minutes; then stop heating and wait for the solder to completely solidify before releasing the pressure. Then remove the limiting structure and the annular positioning structure in sequence to complete the bonding of the target 7.

[0027] It should be noted that the above embodiments are only used to illustrate the present utility model, but the present utility model is not limited to the above embodiments. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present utility model shall fall within the protection scope of the present utility model.

Claims

1. A tooling for target bonding, characterized in that: The device includes a back plate (1) and an annular positioning structure disposed on the back plate (1). The annular positioning structure is disposed around the target material (7) to be bound and includes at least two segmented positioning arc plates (2). Each positioning arc plate (2) has a guide groove (21) on its inner sidewall. An outlet (3) is formed between adjacent positioning arc plates (2) to collect and guide the solder overflowing from between the target material (7) and the back plate (1). The inner side of the annular positioning structure is provided with a limiting structure. The limiting structure includes a limiting arc plate (4) and a limiting block (5) welded to the outside of the positioning arc plate (2). The limiting block (5) is used to fix the limiting arc plate (4) on the positioning arc plate (2). The limiting structure is used to restrict the movement of the target material (7) in the horizontal direction.

2. The tooling for target bonding according to claim 1, characterized in that, The cross-section of the guide channel (21) is one of U-shape, V-shape or trapezoid, and the bottom of the channel has a slope, which is inclined towards the outlet (3).

3. The tooling for target bonding according to claim 2, characterized in that, The outlet (3) is located at the lowest point of the guide channel (21).

4. The tooling for target bonding according to claim 1, characterized in that, The height of the limiting arc plate (4) is less than the thickness of the target material (7), and it is used to limit the target material (7) from the outer periphery.

5. The tooling for target bonding according to claim 1, characterized in that, The positioning arc plate (2) and the limiting block (5) are respectively provided with mounting holes (22), and the mounting holes (22) are distributed in a ring array.

6. The tooling for target bonding according to claim 5, characterized in that, The back plate (1) is provided with a threaded hole (11) corresponding to the mounting hole (22), which is used to fix the annular positioning structure and the limiting structure to the back plate (1) by means of the fastener (6).

7. The tooling for target bonding according to claim 1, characterized in that, The back plate (1), positioning arc plate (2), limiting arc plate (4) and limiting block (5) are all made of stainless steel, nickel-plated steel or chromium-plated steel.

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