Deposition apparatus and semiconductor processing apparatus

Abstract

The application provides a deposition device and a semiconductor processing equipment, and relates to the technical field of semiconductor processing equipment. The deposition device comprises a base, a side wall baffle ring and a cover. The base is provided with a reaction cavity, and the side wall of the base is provided with a plurality of first through holes which are in communication with the reaction cavity. The side wall baffle ring is movably arranged on the outer circumferential surface of the base, and the side wall baffle ring moves to a first position to avoid the first through holes and moves to a second position to block the first through holes. The side wall baffle ring is provided with a second through hole, and the axis of the second through hole is parallel to the axial direction of the side wall baffle ring. The cover covers the opening at one end of the reaction cavity and is connected with the side wall baffle ring. When the reaction cavity is exhausted, the exhaust can be performed simultaneously from the side wall baffle ring and the first through holes, the flow rate of the airflow is reduced, the through holes are prevented from being blocked due to condensation caused by temperature reduction, the exhaust is more thorough, and residues are reduced.

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