Shaking device for electroless plating equipment and electroless plating equipment

Abstract

The application provides a shaking device for a chemical plating equipment and the chemical plating equipment. The shaking device comprises a mounting frame, a driving part and at least one position detecting element. The driving part is mounted on the mounting frame; the driving part comprises a main body and a pushing rod, the pushing rod comprises a connecting end, the connecting end is used for being connected with a shaking frame of the chemical plating equipment; the main body of the driving part can drive the pushing rod to move linearly back and forth along the extension direction of the pushing rod. The at least one position detecting element is mounted on the mounting frame and comprises a first position detecting element; the first position detecting element is configured to detect whether the connecting end of the pushing rod passes through a position opposite to the first position detecting element in a first direction perpendicular to the extension direction.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and in particular to a shaking device for electroless plating equipment and electroless plating equipment. Background Technology

[0002] In the semiconductor industry, a chemical plating process can be used to form a metal coating on the surface of a wafer. Specifically, the wafer is placed in a solution bath containing a chemical solution, where metal ions in the chemical solution are reduced to metal and deposited on the surface of the wafer.

[0003] During the electroless plating process, the wafer can be shaken to improve the contact between the electroless plating solution and the wafer, increase the chemical reaction rate, and prevent air bubbles from adhering to the wafer surface, thereby improving the plating quality. Therefore, it is necessary to provide a shaking device to drive the wafer to shake. Utility Model Content

[0004] This application provides a shaking device for a chemical plating equipment and a chemical plating equipment.

[0005] According to a first aspect of the embodiments of this application, a shaking device for a chemical plating apparatus is provided, the shaking device comprising: Mounting rack; A drive unit is mounted on the mounting frame; the drive unit includes a main body and a push rod, the push rod includes a connecting end for connecting to the vibration frame of the chemical plating equipment; the main body of the drive unit can drive the push rod to reciprocate linearly along the extension direction of the push rod; At least one position detection element is mounted on the mounting bracket, including a first position detection element; the first position detection element is configured to detect whether the connecting end of the push rod passes through a position opposite to the first position detection element in a first direction perpendicular to the extension direction.

[0006] In one embodiment, the drive unit includes a servo electric cylinder; the jitter device further includes a controller, and the servo electric cylinder is controlled by the controller.

[0007] In one embodiment, the position detection element includes a light emitter and a light sensor arranged opposite to each other. The light emitter and the light sensor of the same position detection element are arranged in a second direction, which is perpendicular to the extension direction of the push rod and perpendicular to the first direction. The connecting end of the push rod is provided with a blocking part; when the connecting end of the push rod is opposite to the position detection element in the first direction, the blocking part is located between the light emitter and the light sensor, blocking the light emitted by the light emitter.

[0008] In one embodiment, the jitter device further includes a controller electrically connected to the light sensor of each of the position detection elements, configured to determine whether the connecting end of the push rod passes through a position opposite to the position detection element in the first direction based on whether the light sensor receives a light signal.

[0009] In one embodiment, the at least one position detection element includes a plurality of position detection elements arranged in a direction parallel to the extension direction of the push rod; the at least one position detection element further includes a first limit position detection element and a second limit position detection element, the first limit position detection element and the second limit position detection element being located on opposite sides of the first position detection element.

[0010] In one embodiment, the at least one position detection element further includes a second position detection element located between the first extreme position detection element and the first position detection element; when the push rod is in the initial position, the second position detection element is opposite to the connecting end of the push rod in the first direction.

[0011] According to a second aspect of the embodiments of this application, a chemical plating apparatus is provided, the chemical plating apparatus including a shaking frame, a solution tank and the above-described shaking device for the chemical plating apparatus; the shaking frame includes a support plate for placing the component to be plated, the support plate of the shaking frame extends into the solution tank, and the shaking device is located outside the solution tank and connected to the shaking frame.

[0012] In one embodiment, the shaking device is located below the solution tank, and the shaking frame includes two connecting side plates and a bottom plate arranged opposite to each other; the bottom plate is located below the solution tank and is connected to the connecting end of the push rod; the two connecting side plates are located on opposite sides of the solution tank and are respectively connected to the support plate and the bottom plate.

[0013] In one embodiment, the shaking device is located above the solution tank.

[0014] In one embodiment, the shaking device is located on the side of the solution tank.

[0015] The main technical effects achieved by the embodiments of this application are: The vibration device and electroless plating equipment provided in this application embodiment can drive the push rod to reciprocate linearly along the extension direction of the push rod. The push rod can then drive the vibration frame connected to it to reciprocate linearly, thereby driving the wafer to vibrate. By setting a first position detection element, it can detect whether the end of the push rod periodically passes through the position opposite to the first position detection element in the first direction. Thus, it can determine whether the vibration device is driving the vibration frame to vibrate based on the signal detected by the first position detection element. This can be done in time when the drive unit fails to drive the vibration frame to vibrate, thereby avoiding affecting the quality of the plating layer formed on the surface of the component to be plated. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of an exemplary embodiment of the electroless plating apparatus provided in this application; Figure 2 This is a partial structural schematic diagram of an exemplary embodiment of the electroless plating apparatus provided in this application; Figure 3 This is a schematic diagram of the structure of a chemical plating apparatus provided in another exemplary embodiment of this application; Figure 4 This is a schematic diagram of the structure of an electroless plating apparatus provided in another exemplary embodiment of this application. Specific Implementation

[0017] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0018] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The singular forms “a,” “the,” and “the” used in this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the term “and / or” as used herein refers to and includes any or all possible combinations of one or more of the associated listed items.

[0019] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0020] This application provides a vibration device for a chemical plating equipment and a chemical plating equipment. For example... Figure 1As shown, the electroless plating equipment includes a shaking device 100, a shaking frame 200 for placing the component to be plated, and a solution tank 300. The shaking frame 200 includes a support plate 210 for placing the component to be plated, the support plate 210 extending into the solution tank 300; the solution tank 300 is used to contain the electroless plating solution; the shaking device 100 is located outside the solution tank 300 and is connected to the shaking frame 200.

[0021] The electroless plating equipment provided in this application embodiment, since the shaking device 100 is connected to the shaking frame 200, and the component to be plated is placed on the support plate 210 of the shaking frame 200, when the shaking device 100 drives the shaking frame 200 to shake, the component to be plated can shake along with it; the shaking of the component to be plated can improve the contact effect between the electroless plating solution and the component to be plated, thereby ensuring that the chemical reaction is carried out uniformly on the entire surface of the component to be plated, and improving the uniformity of the coating formed on the surface of the component to be plated; and the shaking of the component to be plated can accelerate the diffusion rate of ions in the electroless plating solution, and increase the rate of chemical reaction; during the electroless plating process, bubbles will be generated in the electroless plating solution due to the chemical reaction, and there may also be some tiny impurities in the electroless plating solution. The shaking of the component to be plated helps to quickly remove bubbles and impurities from the surface of the component to be plated, preventing bubbles and impurities from adhering to the surface of the component to be plated and causing defects in the coating.

[0022] In one embodiment, the element to be plated may be a wafer.

[0023] In one embodiment, the electroless plating equipment further includes a material box, in which the wafer is placed, and the material box is placed on the carrier plate 210. Multiple wafers can be placed in the material box simultaneously, allowing multiple wafers to be plated at the same time.

[0024] In one embodiment, the jittering device 100 includes a mounting frame 10, a drive unit 20, and at least one position detection element 30. The drive unit 20 is mounted on the mounting frame 10; the drive unit 20 includes a main body 21 and a push rod 22, the push rod 22 including a connecting end 221 for connection to the jittering frame 200. The main body 21 of the drive unit 20 can drive the push rod 22 to reciprocate linearly along the extension direction X of the push rod 22. Each of the position detection elements 30 is mounted on the mounting frame 10, including a first position detection element 31; the first position detection element 31 is configured to detect whether the connecting end 221 of the push rod 22 passes through a position opposite to the first position detection element 31 in a first direction Y perpendicular to the extension direction X.

[0025] The vibration device for electroless plating equipment provided in this application embodiment has a driving unit 20 whose main body 21 can drive the push rod 22 to reciprocate linearly along the extension direction X of the push rod 22. The push rod 22 can then drive the vibration frame connected to it to reciprocate linearly, thereby driving the wafer to vibrate. By setting a first position detection element 31, it can detect whether the end of the push rod 22 periodically passes through the position opposite to the first position detection element 31 in the first direction Y. Therefore, it can be determined whether the vibration device is driving the vibration frame to vibrate based on the signal detected by the first position detection element 31. This can be detected in time when the driving unit fails to drive the vibration frame to vibrate, thereby avoiding affecting the quality of the plating layer formed on the surface of the component to be plated.

[0026] In one embodiment, the extension direction X of the push rod 22 can be longitudinal, and the first direction Y can be horizontal. Thus, the shaking device 100 drives the shaking frame 200 to reciprocate longitudinally, thereby achieving the shaking of the shaking frame 200.

[0027] In one embodiment, the drive unit 20 includes a servo electric cylinder. A servo electric cylinder is an electromechanical integrated actuator that precisely converts the rotational motion of a servo motor into linear motion via a transmission mechanism such as a lead screw. It combines the high-precision control capability of a servo motor with the linear thrust output of a cylinder. Using a servo electric cylinder in the drive unit 20 allows for higher control precision and faster response of the jitter device. Furthermore, it allows for changes to parameters such as jitter frequency and amplitude without altering the structure of the jitter device, thus broadening the applicability of the jitter device 100. The push rod 22 can be the push rod of the servo electric cylinder, which can output thrust in a linear direction. The main body 21 of the servo electric cylinder may include a servo motor 23, a transmission mechanism (e.g., a lead screw), and a cylinder body 24.

[0028] In one embodiment, the vibration device further includes a controller, and the servo cylinder is controlled by the controller. Specifically, the controller can adjust the operating parameters of the servo cylinder as needed to change the vibration frequency, vibration amplitude, etc. of the vibration frame. In some embodiments, the controller may include a host computer and a servo controller. The host computer may include a human-machine interface, where operators can edit the operating parameters of the servo cylinder. The servo motor includes an encoder, which can provide real-time feedback on the rotor position, speed, and other information of the motor. The servo driver receives the information fed back by the encoder and compares it with the operating parameters set by the host computer; if there is a deviation, the servo driver will immediately calculate the required current and voltage and adjust the servo motor accordingly.

[0029] In one embodiment, the controller is signal-connected to the first position detection element 31. The controller can determine the frequency at which the connecting end 221 of the push rod 22 passes through a position opposite to the first position detection element 31 in the first direction Y, based on the signal detected by the first position detection element 31. This frequency is the frequency at which the shaking device drives the shaking frame to shake. Specifically, each time the connecting end 221 of the push rod 22 passes through a position opposite to the first position detection element 31 in the direction Y perpendicular to the aforementioned extension direction X, the first position detection element 31 generates a detection signal and sends it to the controller. The controller can determine the shaking frequency of the shaking frame based on the frequency of the detection signal received from the first position detection element 31.

[0030] In one embodiment, the controller can compare a set jitter frequency with a jitter frequency determined based on the detection signal from the first position detection element 31. If the two frequencies are the same, the jitter device is considered to be operating normally. If they are different, the jitter device is controlled to stop operating. Thus, by combining the jitter frequency set by the controller with the jitter frequency determined based on the detection signal from the first position detection element 31, the accuracy of the judgment can be improved.

[0031] In one embodiment, such as Figure 2 As shown, the position detection element 30 includes a light emitter 301 and a light sensor 302 arranged opposite to each other. The light emitter 301 and the light sensor 302 of the same position detection element 30 are arranged in a second direction Z, which is perpendicular to the extension direction X of the push rod 22 and perpendicular to the first direction Y. The connecting end of the push rod 22 is provided with a blocking part 222. In the first direction Y, when the connecting end 221 of the push rod 22 is opposite to the position detection element 30, the blocking part 222 is located between the light emitter 301 and the light sensor 302, blocking the light emitted by the light emitter 301. When the connecting end 221 of the push rod 22 is not moved to a position opposite to the position detection element 30, the light sensor 302 of the position detection element 30 can receive the light emitted by the light emitter 301; when the connecting end 221 of the push rod 22 moves to a position opposite to the position detection element 30, the light emitted by the light emitter 301 is blocked by the blocking part 222, and the light sensor 302 cannot receive the light. Therefore, whether the light sensor 302 receives a light signal can determine whether the connecting end 221 of the push rod 22 has moved to a position opposite to the position detection element 30. This configuration results in a simple structure for the position detection element 30, ease of implementation, and a relatively simple judgment process. In some embodiments, the blocking part 222 can be made of metal, thus providing better light blocking effect.

[0032] In one embodiment, the controller is electrically connected to the light sensor 302 of each of the position detection elements 30, and is configured to determine whether the connecting end 221 of the push rod 22 has passed a position opposite to the position detection element 30 in the first direction Y based on whether each of the light sensors 302 receives a light signal. Thus, the controller's determination process is simple.

[0033] In one embodiment, such as Figure 2 As shown, the mounting bracket 10 has two opposing extensions 11 in the second direction Z. The light emitter 301 of each position detection element 30 is mounted on one extension 11, and the light sensor 302 is mounted on the other extension 11. The blocking part 222 of the push rod 22 moves through the gap between the light emitter 301 and the light sensor 302 of each position detection element 30.

[0034] In one embodiment, such as Figure 1 As shown, the shaking device 100 includes a plurality of position detection elements 30 arranged in a direction parallel to the extension direction X of the push rod 22; the plurality of position detection elements 30 further includes a first limit position detection element 32 and a second limit position detection element 33, the first limit position detection element 32 and the second limit position detection element 33 being located on opposite sides of the first position detection element 31. The connecting end 221 of the push rod 22 has two extreme positions of movement in its extension direction X, located on opposite sides of the first position detection element 31 respectively. If the push rod 22 moves to the extreme position, the controller will sound an alarm to remind the operator to adjust the shaking device. The positions where the first limit position detection element 32 and the second limit position detection element 33 intersect with the extension direction X of the push rod 22 in the first direction Y are the two extreme movement positions of the connecting end 221 of the push rod 22. By setting the first limit position detection element 32 and the second limit position detection element 33, the controller can determine whether the connecting end 221 of the push rod 22 has moved to the extreme position based on the signals detected by them.

[0035] In one embodiment, such as Figure 1 As shown, the first extreme position detection element 32 is located above the first position detection element 31, and the second extreme position detection element 33 is located below the first position detection element 31.

[0036] In one embodiment, such as Figure 1As shown, the at least one position detection element 30 further includes a second position detection element 34 located between the first extreme position detection element 32 and the first position detection element 31; when the push rod 22 is in its initial position, the second position detection element 34 is opposite to the connecting end 221 of the push rod 22 in the first direction Y. The sum of the maximum upward distance and the maximum downward distance of the push rod 22 from its initial position is the vibration amplitude of the vibration frame. If the servo motor 23 malfunctions halfway through operation, such as a power outage, the controller cannot accurately control the upward and downward movement distance of the vibration frame. In this case, the connecting end 221 of the push rod 22 can be controlled to return to the initial position, and then the servo cylinder can be controlled to run according to the set vibration amplitude. By setting the second position detection element 34, it is possible to determine whether the connecting end 221 of the push rod 22 has returned to the initial position based on the signal detected by the second position detection element 34.

[0037] The position of the shaking device in the electroless plating equipment provided in this application embodiment can be placed according to the spatial layout of the electroless plating equipment.

[0038] In one embodiment, such as Figure 1 As shown, the shaking device 100 is located above the solution tank 300. The connecting end 221 of the push rod 22 is located below the main body 21. The shaking frame 200 includes a first connecting part 220, a second connecting part 230, and a third connecting part 240 connected in sequence. The first connecting part 220 and the third connecting part 240 can extend longitudinally, and the second connecting part 230 can extend horizontally. The first connecting part 220 and the second connecting part 230 are located above the solution tank 300. The top end of the first connecting part 220 is connected to the connecting end 221 of the push rod 22. The third connecting part 240 is partially located inside the solution tank 300, and its bottom end is connected to the support plate 210. During the shaking process of the shaking device 100 driving the shaking frame to shake, when the second connecting part 230 moves to the lowest point, there is a gap between it and the wall of the solution tank 300 to avoid the solution tank 300 affecting the movement of the second connecting part 230.

[0039] In another embodiment, such as Figure 3As shown, the shaking device 100 is located on the side of the solution tank 300. The shaking frame 200 includes a fourth connecting part 250, a fifth connecting part 260, and a sixth connecting part 270 connected in sequence. The fourth connecting part 250 and the sixth connecting part 270 can extend longitudinally, and the fifth connecting part 260 can extend horizontally. The fourth connecting part 250 is partially located inside the solution tank 300 and connected to the support plate 210, while the fifth connecting part 260 and the sixth connecting part 270 are located outside the solution tank 300. The bottom end of the sixth connecting part 270 is connected to the connecting end 221 of the push rod 22. During the shaking process of the shaking device 100 driving the shaking frame to shake, when the fifth connecting part 260 moves to the lowest point, there is a gap between it and the wall of the solution tank 300 to avoid the solution tank 300 affecting the movement of the fifth connecting part 260.

[0040] In yet another embodiment, such as Figure 4 As shown, the shaking device 100 is located below the solution tank 300, and the shaking frame 200 includes two connecting side plates 280 and a bottom plate 290 arranged opposite to each other; the bottom plate 290 is located below the solution tank 300 and is connected to the connecting end 221 of the push rod 22; the two connecting side plates 280 are located on opposite sides of the solution tank 300 and are respectively connected to the bearing plate 210 and the bottom plate 290. Specifically, each connecting side plate 280 includes a first sub-side plate 281, a second sub-side plate 282, and a third sub-side plate 283 connected sequentially. The first sub-side plate 281 and the third sub-side plate 283 can extend longitudinally, while the second sub-side plate 282 can extend horizontally. The first sub-side plate 281 and the second sub-side plate 282 are located outside the solution tank 300, and the bottom end of the first sub-side plate 281 is connected to the bottom plate 260. The third sub-side plate 283 is partially located inside the solution tank 300, and its bottom end is connected to the support plate 210. With this configuration, when the shaking device 100 drives the shaking frame 200 to move, the shaking frame 200 moves relatively smoothly.

[0041] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0042] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A vibration device for electroless plating equipment, characterized in that, The shaking device includes: Mounting rack; A drive unit is mounted on the mounting frame; the drive unit includes a main body and a push rod, the push rod includes a connecting end for connecting to the vibration frame of the electroless plating equipment; the main body of the drive unit can drive the push rod to reciprocate linearly along the extension direction of the push rod; At least one position detection element is mounted on the mounting bracket, including a first position detection element; the first position detection element is configured to detect whether the connecting end of the push rod passes through a position opposite to the first position detection element in a first direction perpendicular to the extension direction.

2. The shaking device for electroless plating equipment according to claim 1, characterized in that, The drive unit includes a servo electric cylinder; the vibration device also includes a controller, and the servo electric cylinder is controlled by the controller.

3. The shaking device for electroless plating equipment according to claim 1, characterized in that, The position detection element includes a light emitter and a light sensor arranged opposite to each other. The light emitter and the light sensor of the same position detection element are arranged in a second direction, which is perpendicular to the extension direction of the push rod and also perpendicular to the first direction. The connecting end of the push rod is provided with a blocking part; when the connecting end of the push rod is opposite to the position detection element in the first direction, the blocking part is located between the light emitter and the light sensor, blocking the light emitted by the light emitter.

4. The shaking device for electroless plating equipment according to claim 3, characterized in that, The jitter device further includes a controller electrically connected to the light sensor of each of the position detection elements, and configured to determine whether the connecting end of the push rod passes through a position opposite to the position detection element in the first direction based on whether the light sensor receives a light signal.

5. The shaking device for electroless plating equipment according to claim 1, characterized in that, The at least one position detection element includes a plurality of position detection elements arranged in a direction parallel to the extension direction of the push rod; the at least one position detection element further includes a first limit position detection element and a second limit position detection element, the first limit position detection element and the second limit position detection element being located on opposite sides of the first position detection element.

6. The shaking device for electroless plating equipment according to claim 5, characterized in that, The at least one position detection element further includes a second position detection element located between the first extreme position detection element and the first position detection element; when the push rod is in the initial position, the second position detection element is opposite to the connecting end of the push rod in the first direction.

7. A chemical plating apparatus, characterized in that, The electroless plating equipment includes a shaking frame, a solution tank, and a shaking device for electroless plating equipment as described in any one of claims 1 to 6; the shaking frame includes a support plate for placing the component to be plated, the support plate of the shaking frame extends into the solution tank, and the shaking device is located outside the solution tank and connected to the shaking frame.

8. The electroless plating equipment according to claim 7, characterized in that, The shaking device is located below the solution tank, and the shaking frame includes two connecting side plates and a bottom plate arranged opposite to each other; the bottom plate is located below the solution tank and is connected to the connecting end of the push rod; the two connecting side plates are located on opposite sides of the solution tank and are respectively connected to the support plate and the bottom plate.

9. The electroless plating equipment according to claim 7, characterized in that, The shaking device is located above the solution tank.

10. The electroless plating equipment according to claim 7, characterized in that, The shaking device is located on the side of the solution tank.

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