Electroplating system based on split rectifier

Abstract

The utility model discloses a kind of electroplating system based on split rectifier, the quantity of the utility model rectifier is multiple, each rectifier is provided with a group of output copper bar, multiple rectifiers at least include first rectifier and second rectifier, first rectifier, second rectifier is respectively placed in the both sides of electroplating tank or interval is placed in the same side of electroplating tank;With following beneficial effects: (1) the utility model is replaced by single high-power rectifier by using multiple smaller power rectifiers, so that the volume and weight of single rectifier significantly reduce.(2) the advantage of split rectifier arrangement is that the length of each copper bar of each rectifier is reduced, and the thickness of each copper bar is also reduced.(3) reduce the security risk of copper bar heating, reduce the pressure drop, keep uniform flow.(4) each face of workpiece can be set different current to plating different thickness.(5) current compensation mechanism can be realized, and the operation stability of electroplating system is improved.

Description

Technical Field

[0001] This utility model relates to the field of electroplating technology, specifically to an electroplating system based on a split-type rectifier. Background Technology

[0002] In the electroplating industry, the electroplating tank is the core equipment for realizing the electroplating process, and the electroplating tank is powered by a rectifier. Currently, the traditional power supply mode commonly used in electroplating plants is to configure a rectifier with a corresponding power based on the size of the electroplating tank and the total current required by the process. This rectifier is usually placed on one side or the side of the electroplating tank. In practical applications, this centralized single rectifier power supply system has exposed many inherent defects, which seriously restricts the efficiency, quality and safety of electroplating production.

[0003] First, in high-power applications, to meet the high current requirements, the size and weight of a single rectifier are exceptionally large. This not only occupies a large amount of production space, but also brings great difficulties to the handling, installation and daily maintenance of the equipment, increasing operating costs.

[0004] Secondly, regarding electrical connections, such as Figure 1 As shown, because each rectifier is centrally located in a single position, long copper busbars (i.e., output copper busbars) need to be laid to guide the current from the rectifier output to both sides of the electroplating tank and even the entire edge of the tank. This wiring method requires at least to span the entire tank, resulting in a huge amount of copper busbars and high costs. More importantly, excessively long copper busbars introduce significant line resistance, causing unnecessary power loss. Utility Model Content

[0005] In view of the shortcomings of the prior art, this utility model provides an electroplating system based on a split rectifier, which can solve at least one of the above-mentioned technical problems.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution: an electroplating system based on a split-type rectifier, including an electroplating tank, conductive hangers, and a rectifier. The electroplating tank is equipped with an anode device, and the conductive hangers are arranged above the electroplating tank. There are multiple rectifiers, and each rectifier is equipped with a set of output copper busbars. The multiple rectifiers include at least a first rectifier and a second rectifier. The first rectifier and the second rectifier are placed on opposite sides of the electroplating tank or placed at intervals on the same side of the electroplating tank. The positive terminals of the output copper busbars of the first rectifier and the second rectifier are connected to the anode device, and the negative terminals of the output copper busbars of the first rectifier and the second rectifier are connected to the conductive hangers.

[0007] Preferably, the multiple rectifiers also include a third rectifier and a fourth rectifier. The positive terminals of the output copper busbars of the third rectifier and the fourth rectifier are also connected to the anode device, and the negative terminals of the output copper busbars of the third rectifier and the fourth rectifier are also connected to the conductive hanger.

[0008] Preferably, the first rectifier and the third rectifier are placed alternately on one side of the electroplating tank, and the second rectifier and the fourth rectifier are placed alternately on the other side of the electroplating tank.

[0009] Preferably, the first rectifier, the second rectifier, the third rectifier, and the fourth rectifier are arranged at intervals on one side of the electroplating tank.

[0010] Preferably, the anode device comprises a plurality of anodes connected in parallel.

[0011] Compared with the prior art, this utility model provides an electroplating system based on a split-type rectifier, which has the following beneficial effects: (1) This utility model includes multiple rectifiers. Compared with the prior art, this utility model allows multiple smaller power rectifiers to replace a single high-power rectifier, which significantly reduces the size and weight of a single rectifier. This not only reduces the requirements for installation space, but also makes the handling, installation, and subsequent maintenance and replacement of the rectifiers more convenient and flexible, effectively overcoming the disadvantages of traditional large-volume rectifiers being difficult to handle and occupying a lot of space.

[0012] (2) The multiple rectifiers of this utility model are arranged separately on both sides or one side of the electroplating tank, and the current output point is closer to the power consumption point, thereby effectively shortening the length of the copper busbar. At the same time, this utility model distributes the total current through multiple rectifiers, so that the current carrying capacity required by each output copper busbar is reduced, that is, thinner and smaller copper busbars can be used. Under the combined effect of these two factors, this utility model not only greatly reduces the amount and specifications of copper busbars, but also effectively reduces the line resistance and voltage drop.

[0013] (3) By setting up multiple rectifiers, when one of the rectifiers on the same side of the electroplating tank fails, the other rectifiers on the same side can compensate for the corresponding current, so as to better ensure that the electroplating system still operates stably and improve the stability of the system.

[0014] (4) Since the length of the copper busbar is reduced and the length of each section of the copper busbar is preferably set to be consistent, the current of each section of the anode and cathode of the electrolytic cell can be kept consistent, thereby reducing the safety hazard of copper busbar heating, reducing voltage drop, and maintaining current uniformity. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the planar structure of an existing electroplating system based on a single high-power rectifier. Figure 2 This is a schematic diagram of the structure of an electroplating system based on a split-type rectifier according to the present invention. Figure 3 This is a perspective view of the first rectifier of this utility model; Figure 4 This is a schematic diagram of the structure of an electroplating system based on a split-type rectifier according to the present invention, in embodiment two. Figure 5 This is a schematic diagram of the structure of an electroplating system based on a split-type rectifier according to the present invention, in embodiment three. Figure 6 This is a schematic diagram of the control structure of each rectifier and control unit of this utility model.

[0016] The diagram is labeled as follows: 1. Electroplating tank, 2. Conductive hanger, 3. Output copper busbar, 4. Anode device, 5. First rectifier, 6. Second rectifier, 7. Third rectifier, 8. Fourth rectifier, 9. Control unit. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] This invention provides an electroplating system based on a split-type rectifier, including an electroplating tank 1, conductive hangers 2, and a rectifier. The electroplating tank 1 is equipped with an anode device 4, and the conductive hangers 2 are positioned above the electroplating tank 1. This invention uses multiple rectifiers, each equipped with a set of output copper busbars 3 (hereinafter referred to as copper busbars). Preferably, the anode device 4 includes multiple anodes connected in parallel. The anodes of the electroplating tank 1 can specifically utilize existing titanium metal anode plates, etc., without further limitation. The conductive hangers 2 can be mounted on a gantry or conveyor belt, and their movement and lifting are achieved through a transmission mechanism and a lifting mechanism. Preferably, the length of the output copper busbars 3 of each rectifier is the same.

[0019] like Figure 2As shown, in this embodiment, multiple rectifiers include a first rectifier 5 and a second rectifier 6. The first rectifier 5 and the second rectifier 6 are respectively placed on both sides of the electroplating tank 1. The positive terminals of the output copper busbars 3 of both the first rectifier 5 and the second rectifier 6 are connected to the anode device 4 via connecting wires. Preferably, the anode device 4 includes two parallel anodes, which are respectively disposed on both sides of the electroplating tank 1. The positive terminal of the output copper busbar of the first rectifier 5 is connected to the nearest anode, and the positive terminal of the output copper busbar of the second rectifier 6 is connected to the other anode. The negative terminals of the output copper busbars of both the first rectifier 5 and the second rectifier 6 are connected to the conductive hanger 2 via connecting wires.

[0020] The electroplating tank 1 contains an electroplating solution. The anode device 4 of the electroplating tank 1 is connected to the positive terminal of the output copper busbar 3 of the first rectifier 5 and the second rectifier 6, releasing metal ions. The conductive hanger 2 is used to suspend the workpiece to be electroplated. The conductive hanger 2 is connected to the negative terminal of the output copper busbar of the first rectifier 5 and the second rectifier 6, making the workpiece the cathode of the electroplating circuit, and metal ions are deposited on the surface of the workpiece to form a plating layer. The electroplating tank, conductive hanger, rectifier, and electroplating working principle of this utility model are all existing technologies and will not be described in detail here.

[0021] In addition, such as Figure 4 As shown, the difference between this second embodiment and the first embodiment is that the first embodiment includes two rectifiers and the anode device of the electroplating tank 1 includes two anodes, while this second embodiment includes four rectifiers and the anode device includes four anodes. Specifically, this second embodiment includes a first rectifier 5, a second rectifier 6, a third rectifier 7, and a fourth rectifier 8. The four anodes are arranged in pairs on both sides of the electroplating tank 1. The positive terminals of the output copper busbars of the four rectifiers are connected to the four anodes one by one, and the negative terminals of the output copper busbars of the four rectifiers are all connected to the conductive hanger 2. In this second embodiment, the first rectifier 5 and the third rectifier 7 are placed alternately on one side of the electroplating tank 1, and the second rectifier 6 and the fourth rectifier 8 are placed alternately on the other side of the electroplating tank 1.

[0022] In addition, such as Figure 5 As shown, this embodiment three, like the above embodiment two, includes four rectifiers. The difference between this embodiment three and the above embodiment two is that the first rectifier 5, the second rectifier 6, the third rectifier 7 and the fourth rectifier 8 in this embodiment are placed at intervals on the same side of the electroplating tank 1.

[0023] The first and second embodiments of this utility model can be specifically applied to existing gantry-type electroplating production lines. Conductive hangers are mounted on the gantry frame to allow for their movement, enabling the workpiece to be electroplated in different electroplating tanks, thus achieving continuous electroplating. The third embodiment of this utility model can be specifically applied to existing vertical electroplating production lines, such as circular electroplating production lines and inclined electroplating production lines. The specific application can be determined according to actual electroplating needs, and no further limitations are imposed here.

[0024] In addition, in other embodiments, the number of rectifiers can be set to other quantities, and the rectifiers can be arranged in any of the above-described arrangements. For example, there are a total of six rectifiers. The six rectifiers can be arranged in a three-by-three distribution on both sides of the electroplating tank, or the six rectifiers can be arranged at intervals on the same side of the electroplating tank. No further restrictions are imposed here.

[0025] Preferably, the present invention may further include a control unit 9, which may be in the form of a host computer or a control head. The control unit 9 can be connected to the signal of all rectifiers via an R485 line and adjust and control the working status of each rectifier. In use, the control unit 9 can set one rectifier as the master and the rest as slaves. The rectifier set as the master operates in voltage regulation mode, and the rectifiers set as slaves operate in current regulation mode. By setting the master and slaves, parallel rectification can be achieved, thereby avoiding current fluctuations that could lead to poor coating quality.

[0026] Furthermore, each rectifier can also independently set and adjust parameters (such as current and voltage) through the aforementioned control unit 9, enabling operators to apply precise and independent current intensities to meet the specific needs of the upper and lower surfaces of the workpiece. In this way, on the one hand, the electroplating effect of complex-shaped workpieces can be optimized without blindly increasing the overall current to accommodate low-potential surfaces, thus saving energy and raw materials; on the other hand, it can proactively realize the advanced process of depositing coatings of different thicknesses on different surfaces of the same workpiece, greatly expanding the application range of electroplating technology and meeting diverse product design requirements.

[0027] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0028] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An electroplating system based on a split-type rectifier, comprising an electroplating tank, conductive hangers, and a rectifier, wherein the electroplating tank is equipped with an anode device, and the conductive hangers are disposed above the electroplating tank, characterized in that: The number of rectifiers is multiple, and each rectifier is equipped with a set of output copper busbars. The multiple rectifiers include at least a first rectifier and a second rectifier. The first rectifier and the second rectifier are respectively placed on both sides of the electroplating tank or placed at intervals on the same side of the electroplating tank. The positive terminals of the output copper busbars of the first rectifier and the second rectifier are connected to the anode device, and the negative terminals of the output copper busbars of the first rectifier and the second rectifier are connected to the conductive hanger.

2. The electroplating system based on a split-type rectifier according to claim 1, characterized in that: The multiple rectifiers also include a third rectifier and a fourth rectifier. The positive terminals of the output copper busbars of the third rectifier and the fourth rectifier are also connected to the anode device, and the negative terminals of the output copper busbars of the third rectifier and the fourth rectifier are also connected to the conductive hanger.

3. The electroplating system based on a split-type rectifier according to claim 2, characterized in that: The first rectifier and the third rectifier are placed at intervals on one side of the electroplating tank, and the second rectifier and the fourth rectifier are placed at intervals on the other side of the electroplating tank.

4. The electroplating system based on a split-type rectifier according to claim 2, characterized in that: The first rectifier, the second rectifier, the third rectifier, and the fourth rectifier are placed at intervals on one side of the electroplating tank.

5. The electroplating system based on a split-type rectifier according to claim 1, characterized in that: The anode device includes multiple anodes connected in parallel.

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