Electroplating transport mechanism

Abstract

The utility model relates to electroplating equipment field especially, a kind of electroplating conveying mechanism, a kind of electroplating conveying mechanism, there is the conductive roller according to longitudinal level distribution, there is the close space of self-adapting adjustment between upper and lower layer conductive roller, it is characterized in that, the shaft end of each layer conductive roller is as the conductive input end of connection cathode, for the independent power supply of upper and lower conductive roller;The mode of independent power supply to shaft end eliminates the situation of current interruption, in the process that circuit board is involved into close space, the longitudinal coordinate variation of upper layer conductive roller makes close space adhere to circuit board by making self-adapting adjustment, this design deliberately avoids the separation between conductive roller to affect the copper effect of circuit board, the mode of separate power supply design changes original design defect, solves the problem that bottom copper effect is not ideal.

Description

Technical Field

[0001] This utility model relates to the field of electroplating equipment, and more particularly to an electroplating conveying mechanism. Background Technology

[0002] As an electroplating equipment for coating copper onto workpieces, a conveyor that contacts the workpiece is usually connected to the cathode to facilitate the integration of workpiece conveying and electroplating.

[0003] The floating phenomenon of the conductive roller weakens the copper plating effect:

[0004] Within the circuit board conveying mechanism, conductive rollers contact the surface and bottom of the circuit board through the tight space between the upper and lower rows, thereby depositing a dense copper layer on the circuit board. However, the conduction of current between the upper and lower rows of conductive rollers relies on meshing. The tight space adaptively adjusts the longitudinal position of the upper row of conductive rollers as the circuit board enters, causing occasional disengagement between the gears. The current conducting element is only connected to the gears of the upper row of conductive rollers, resulting in insufficient aggregation of copper ions on the bottom surface and an insufficient total concentration on the bottom surface. Utility Model Content

[0005] To address the aforementioned problems, this utility model provides an electroplating conveying mechanism, which aims to solve the problem of unsatisfactory copper plating effect on the bottom surface.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is: an electroplating conveying mechanism, comprising conductive rollers distributed in a longitudinal layer, wherein there is a close space for adaptive adjustment between the upper and lower conductive rollers, characterized in that the shaft end of each conductive roller serves as a conductive input end connected to the cathode, used to independently power the upper and lower conductive rollers.

[0007] The beneficial effects of this utility model are:

[0008] The independent power supply to the shaft end eliminates the possibility of current interruption. During the process of the circuit board being rolled into the tight space, the longitudinal coordinate change of the upper conductive roller causes the tight space to adaptively adjust and fit the circuit board. This design deliberately avoids the separation between the conductive rollers from affecting the copper plating effect of the circuit board. The independent power supply design changes the original design defects and solves the problem of unsatisfactory copper plating effect on the bottom surface.

[0009] In other words, the upper and lower conductive rollers are powered separately to prevent insufficient aggregation of copper ions in the area surrounding the lower conductive roller.

[0010] The electroplating conveyor mechanism includes a transmission plate and a plug-in. The plug-in is mounted on the transmission plate, and the lower conductive roller is fixed on the plug-in. The plug-in has a movable groove that provides longitudinal movement space. The shaft end of the upper conductive roller is embedded in the movable groove and moves longitudinally in the movable space along the change of the tight space. This passive adjustment tight space design has wider compatibility. This design, which emphasizes the adaptation effect, meets the requirements of copper plating on circuit boards of different thicknesses. At the same time, based on establishing stronger universal compatibility, fewer parts are used, and the structure is improved by weight reduction.

[0011] Considering the stability and assembly difficulty between the plug-in and the transmission plate, the plug-in and the transmission plate are connected by a sliding fit. The transmission plate is hollowed out to form multiple arrayed mating blocks. The side of the plug-in has a mating groove that mates with the aforementioned mating blocks. The sliding engagement between the mating blocks and the mating grooves firmly fixes the plug-in and the transmission plate, ultimately achieving both stability and easier disassembly and assembly.

[0012] The lower conductive roller needs to provide power for conveying the circuit board. The shaft end of the lower conductive roller is fitted with a driven gear. The power source in the electroplating conveying mechanism drives the driven gear to rotate through the transmission mechanism.

[0013] It should be noted that the electroplating conveying mechanism also includes an anode connecting rod, which penetrates the transmission plate and connects to the anode plate below the conductive roller. The copper plating solution soaking the circuit board forms a metal plating layer on the circuit board through electrolytic deposition.

[0014] It should also be noted that in this specific embodiment, an existing rectifier power supply is used to separately power the driven gear and the upper conductive roller. Attached Figure Description

[0015] Figure 1 This is a perspective view of the present invention.

[0016] Figure 2 yes Figure 1 An enlarged diagram of A in the diagram.

[0017] Figure 3 yes Figure 1 A 3D view from another direction.

[0018] Figure 4 yes Figure 3 Enlarged diagram of point B.

[0019] Figure 5 This is an exploded view of this utility model.

[0020] Figure 6 yes Figure 5 Enlarged diagram of point C.

[0021] Figure 7 yes Figure 5 Enlarged diagram of point D. Detailed Implementation

[0022] like Figure 1-7 As shown, an electroplating conveying mechanism includes conductive rollers 1 arranged in a longitudinal layer, with an adaptively adjustable tight space 2 between the upper and lower conductive rollers 1. The mechanism is characterized in that the shaft end 1a of each conductive roller 1 serves as a conductive input end connected to the cathode, used to independently power the upper and lower conductive rollers 1.

[0023] The beneficial effects of this utility model are:

[0024] The independent power supply to the shaft end eliminates the current interruption. During the process of the circuit board being rolled into the tight space 2, the longitudinal coordinate change of the upper conductive roller 1 causes the tight space 2 to make adaptive adjustments to fit the circuit board. This design deliberately avoids the separation between the conductive rollers 1 from affecting the copper plating effect of the circuit board. The independent power supply design changes the original design defects and solves the problem of unsatisfactory copper plating effect on the bottom surface.

[0025] In other words, the upper and lower conductive rollers 1 are powered separately to prevent insufficient aggregation of copper ions in the area surrounding the lower conductive roller 1.

[0026] The electroplating conveying mechanism includes a transmission plate 3a and a plug-in 3b. The plug-in 3b is mounted on the transmission plate 3a, and the lower conductive roller 1 is fixed on the plug-in 3b. The plug-in 3b is provided with a movable groove 3b-1 that provides longitudinal movement space. The shaft end 1a of the upper conductive roller 1 is embedded in the movable groove 3b-1 and moves longitudinally in the movable space along the movement of the tight space 2. This passive adjustment tight space 2 design has wider compatibility. This design, which emphasizes the adaptability, meets the requirements of copper plating on circuit boards of different thicknesses. At the same time, based on establishing stronger universal compatibility, fewer parts are used, and the structure is improved by weight reduction.

[0027] Considering the stability and assembly difficulty between the plug-in 3b and the transmission plate 3a, the plug-in 3b and the transmission plate 3a are connected by a sliding fit. The transmission plate 3a is hollowed out to form multiple arrayed mating blocks 3a-1. The side of the plug-in 3b has a mating groove 3b-2 that mates with the aforementioned mating blocks 3a-1. The sliding engagement between the mating blocks 3a-1 and the mating groove 3b-2 firmly fixes the plug-in 3b and the transmission plate 3a, thus achieving both stability and easier disassembly and assembly.

[0028] The lower conductive roller 1 needs to provide power for conveying the circuit board. The bushing of the lower conductive roller 1 is fitted with a driven gear 3. The power source in the electroplating conveying mechanism drives the driven gear 3 to rotate through the transmission mechanism.

[0029] It should be noted that the electroplating conveying mechanism also includes an anode connecting rod 4, which penetrates the transmission plate 3a and connects to the anode plate 4a below the conductive roller 1. The copper plating solution soaking the circuit board forms a metal plating layer on the circuit board through electrolytic deposition.

[0030] It should also be noted that in this specific embodiment, an existing rectifier power supply is used to separately power the driven gear 3 and the upper conductive roller 1.

[0031] The above embodiments are merely preferred embodiments of the present utility model and are not intended to limit the scope of the present utility model. Various modifications and improvements made to the technical solutions of the present utility model by those skilled in the art without departing from the spirit of the present utility model should fall within the protection scope defined by the claims of the present utility model.

Claims

1. An electroplating conveying mechanism, comprising conductive rollers arranged in longitudinal layers, wherein the upper and lower layers of conductive rollers have an adaptively adjustable tight space, characterized in that, The shaft end of each conductive roller serves as the conductive input terminal connected to the cathode, used to independently power the upper and lower conductive rollers.

2. The electroplating conveying mechanism according to claim 1, characterized in that, The electroplating conveying mechanism includes a transmission plate and a plug. The plug is mounted on the transmission plate, and the lower conductive roller is fixed on the plug. The plug is provided with a movable groove that provides longitudinal movement space. The shaft end of the upper conductive roller is embedded in the movable groove and moves longitudinally in the movable space along the movement of the tight space.

3. The electroplating conveying mechanism according to claim 2, characterized in that, The plug and the transmission plate are connected by a sliding fit. The transmission plate is hollowed out to form multiple arrayed mating blocks. The side of the plug has a mating groove that mates with the aforementioned mating blocks. The sliding engagement between the mating blocks and the mating grooves firmly fixes the plug and the transmission plate together.

4. The electroplating conveying mechanism according to claim 1, characterized in that, The lower conductive roller has a driven gear fitted on its shaft end, and the power source in the electroplating conveying mechanism drives the driven gear to rotate through the transmission mechanism.

5. The electroplating conveying mechanism according to claim 1, characterized in that, The electroplating conveying mechanism also includes an anode connecting rod, which penetrates the transmission plate and connects to the anode plate below the conductive roller.

6. The electroplating conveying mechanism according to claim 4, characterized in that, It also includes a rectifier power supply, which provides separate power to the driven gear and the upper conductive roller.

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