Spraying device and water plating equipment

Abstract

The utility model discloses a kind of spraying device and water plating equipment, comprising: liquid storage part, top is equipped with the liquid inlet channel for being connected with filter pump, bottom is equipped with multiple liquid outlet channels;Spraying part, the bottom of the liquid storage part is connected, the top of the spraying part is communicated with each the liquid outlet channel, the bottom of the spraying part is equipped with several spray nozzles;Among them, multiple the liquid outlet channel is configured to be able to make electroplating solution from the different positions of the top of the spraying part evenly flow into the spraying part.The utility model adopts the above structure, can reduce spray nozzle flow rate, the consistency of each spray nozzle flow rate is good, to improve product deformation, improve yield.

Description

Technical Field

[0001] This utility model relates to the field of electroplating equipment technology, and in particular to a spraying device and a water plating equipment. Background Technology

[0002] Composite current collectors, a novel lithium-ion battery material with a "metal-substrate-metal" multilayer structure, are gradually replacing traditional metal current collectors due to their significant advantages in improving safety, energy density, and reducing costs. In their preparation, a metal layer is typically deposited onto the surface of a polymer substrate using water plating equipment. Water plating equipment usually includes a filter pump, a storage tank, and a plating bath. The inlet and outlet of the filter pump are connected to the storage tank and plating bath, respectively, to pump the plating solution from the storage tank into the plating bath. The substrate is then immersed in the plating solution in the plating bath for electroplating.

[0003] In addition, existing technologies typically include a spray device within the plating tank, which is immersed in the electroplating solution with its spray nozzles facing downwards and close to the film surface. The inlet of the filter pump is connected to a branch line, one leading to the bottom of the plating tank and the other to the spray device, to uniformly replenish the electroplating solution within the tank, ensuring a more uniform plating layer on both the upper and lower surfaces of the substrate. Furthermore, since the electroplating solution flows out from the bottom of the tank, it can easily push and disturb the base film. The spray device sprays the solution downwards, achieving a stabilizing effect and maintaining stable transport of the base film to prevent substrate deformation.

[0004] However, in actual use, when the electroplating solution is sprayed directly from the nozzle, it exerts excessive impact on the soft substrate surface, causing irreversible plastic deformation. Because the spraying device is directly connected to the pump pipeline, its internal flow field is uneven, resulting in differences in flow velocity at each spray nozzle. This causes varying degrees of deformation in different areas of the substrate surface and disrupts the overall uniformity of the flow field within the plating tank, ultimately exacerbating uneven coating thickness. These defects collectively lead to low product yield, and this problem becomes increasingly prominent as the industry moves towards wide-format composite materials, severely hindering the development of wide-format composite current collectors.

[0005] Therefore, it is necessary to improve the existing technology to overcome the aforementioned defects. Utility Model Content

[0006] The purpose of this invention is to provide a spraying device and a water plating equipment that can reduce the flow rate of the spray nozzles and ensure the consistency of the flow rate of each spray nozzle, so as to improve product deformation and increase the yield.

[0007] The purpose of this utility model is achieved through the following technical solution: a spraying device, comprising:

[0008] The liquid storage section has an inlet channel at the top for connecting to the filter pump and multiple outlet channels at the bottom.

[0009] A spray section is connected to the bottom of the liquid storage section. The top of the spray section is connected to each of the liquid outlet channels, and the bottom of the spray section is provided with a plurality of spray nozzles.

[0010] The plurality of liquid outlet channels are configured to allow the electroplating solution to flow evenly into the spray section from different positions on the top of the spray section.

[0011] Furthermore, in the vertical direction, the projections of each of the liquid outlet channels are evenly distributed at various positions on the bottom of the spray section.

[0012] Furthermore, the spraying device includes a housing, and a partition is provided inside the housing to divide the inner cavity of the housing into the liquid storage section and the spraying section, and the liquid outlet channel is formed in the partition.

[0013] Furthermore, the cross-sectional area of ​​the spray section gradually increases along the vertically downward flow direction.

[0014] Furthermore, the spray section is provided with a turbulence structure, which is located on the flow path between the liquid outlet channel and the spray nozzle. The turbulence structure is configured to reduce the flow rate of the electroplating solution and balance the flow field.

[0015] Furthermore, the turbulence structure is adapted to divide the spray section into an upper cavity and a lower cavity, the turbulence structure having a plurality of through-holes connecting the upper cavity and the lower cavity, the through-holes not overlapping at least partially with the projection of the liquid outlet channel in the vertical direction.

[0016] Furthermore, the turbulence structure is a wing, which is a single-piece structure with the passage opening on it; or, the wing is a multi-piece structure and is arranged in an array at intervals, with the passage opening formed between adjacent wing pieces.

[0017] Furthermore, a first connecting pipe is connected between the filter pump and the liquid storage unit. The first connecting pipe includes a main section and a plurality of first branch sections connected to the main section. The main section is connected to the outlet end of the filter pump, and the plurality of first branch sections are located in different areas on the top of the liquid storage unit.

[0018] In addition, this utility model also provides a water plating device, comprising:

[0019] The aforementioned spraying device;

[0020] A plating tank is used to hold the spraying device and the substrate to be electroplated.

[0021] The storage tank contains the electroplating solution;

[0022] The filter pump has its outlet end connected to the plating tank and the spraying device respectively via a first connecting pipe, and its inlet end connected to the liquid storage tank via a second connecting pipe.

[0023] Furthermore, an overflow port is provided on the side wall near the top of the plating tank. The overflow port is located at a preset liquid level height of the plating tank, and the top of the storage tank is connected to the overflow port through a third connecting pipe.

[0024] Compared with the prior art, the present invention has the following beneficial effects: By adopting the above-mentioned spray device, the electroplating solution is pressurized by the filter pump and sent into the higher storage section through the pipeline. The liquid flow impacts the stable liquid surface in the storage section, and its high-speed kinetic energy is largely consumed through splashing and vortex mixing, completing the first stage of deceleration and flow stabilization, transforming the unstable pipeline pressure flow into a stable static pressure flow. Subsequently, under the constant static pressure drive, the electroplating solution flows out at low speed from multiple outlet channels at the bottom of the storage section, and the total flow is dispersed, achieving the second stage of deceleration. The double deceleration significantly reduces the flow velocity of the electroplating solution that finally flows out of the spray nozzle, and the impact force is significantly weakened, greatly reducing the risk of plastic deformation of the product due to liquid flow impact.

[0025] Furthermore, compared to existing spray devices where single-point liquid inlet leads to uneven internal pressure and consequently uneven flow rates at each spray nozzle, this spray device provides a stable static pressure source for the spray section by incorporating a liquid storage unit. The electroplating solution flows smoothly and evenly into the spray section through multiple outlet channels at the bottom of the storage unit in a constant, low-speed static pressure flow, resulting in a more balanced internal flow field and better consistency of flow rates at each spray nozzle. The electroplating solution can evenly and gently cover the entire surface of the substrate, providing a stable fluid environment for uniform deposition of metal ions. This effectively avoids defects such as uneven coating thickness caused by uneven spraying and significantly improves the yield rate of the substrate after electroplating. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of the spraying device of this utility model.

[0027] Figure 2 This is a structural schematic diagram of the water plating equipment of this utility model.

[0028] Explanation of reference numerals in the attached figures:

[0029] 100. Spraying device; 110. Liquid storage section; 111. Liquid outlet channel; 120. Spraying section; 121. Spray nozzle; 122. Upper chamber; 123. Lower chamber; 130. Outer shell; 140. Partition plate; 150. Turbulence structure; 151. Through port; 200. Filter pump; 300. First connecting pipe; 310. Main section; 320. First branch section; 330. Second branch section; 400. Plating tank; 500. Liquid storage tank; 600. Second connecting pipe; 700. Third connecting pipe; 800. Substrate. Detailed Implementation

[0030] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0031] The terms “comprising” and “having”, and any variations thereof, used in this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0032] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0033] Please see Figure 1 and Figure 2 As shown, a spraying device 100 corresponding to a preferred embodiment of the present invention includes: a liquid storage section 110, with an inlet channel (not shown) at the top for connection with a filter pump 200, and a plurality of outlet channels 111 at the bottom; a spraying section 120 connected to the bottom of the liquid storage section 110, with the top of the spraying section 120 communicating with each outlet channel 111, and a plurality of spray nozzles 121 at the bottom of the spraying section 120; wherein, the plurality of outlet channels 111 are configured to allow the electroplating solution to flow evenly into the spraying section 120 from different positions at the top of the spraying section 120.

[0034] Since the electroplating solution has high kinetic and pressure energy after being pressurized by the filter pump 200, this utility model adopts a spray device 100 with the above-mentioned structure. After being pressurized by the filter pump 200, the electroplating solution is sent into the higher-positioned storage section 110 through the pipeline. The liquid flow impacts the stable liquid surface in the storage section 110, and its high-speed kinetic energy is largely consumed through splashing and vortex mixing, completing the first stage of deceleration and flow stabilization, transforming the unstable pipeline pressure flow into a stable static pressure flow. Subsequently, driven by constant static pressure, the electroplating solution flows out at low speed from multiple outlet channels 111 at the bottom of the storage section 110, and the total flow rate is dispersed, achieving the second stage of deceleration. The double deceleration significantly reduces the flow velocity of the electroplating solution that finally flows out from the spray nozzle 121, and the impact force is significantly weakened, greatly reducing the risk of plastic deformation of the product due to liquid flow impact.

[0035] Furthermore, compared to the existing spray device 100, which suffers from uneven internal pressure due to single-point liquid inlet and consequently uneven flow rates at each spray nozzle 121, this spray device 100 provides a stable static pressure source for the spray section 120 by setting up a liquid storage section 110. The electroplating solution flows smoothly and evenly into the spray section 120 through multiple liquid outlet channels 111 at the bottom of the liquid storage section 110 in the form of a constant, low-speed static pressure flow. This makes the internal flow field of the spray section 120 more balanced, and the flow rate of each spray nozzle 121 more consistent. The electroplating solution can evenly and gently cover the entire surface of the substrate 800, providing a stable fluid environment for the uniform deposition of metal ions. This effectively avoids defects such as uneven coating thickness caused by uneven spraying and significantly improves the yield of the substrate 800 after electroplating.

[0036] Furthermore, the spraying device 100 includes a housing 130, within which a partition 140 is provided, dividing the inner cavity of the housing 130 into a liquid storage section 110 and a spraying section 120. Liquid outlet channels 111 are formed in the partition 140 and are evenly distributed on the partition 140. In the vertical direction, the projections of each liquid outlet channel 111 are evenly distributed at various positions on the bottom of the spraying section 120, thus ensuring that the electroplating liquid flowing out from the multiple liquid outlet channels 111 flows evenly into the spraying section 120, achieving consistency in the outflow velocity of the spray nozzles 121.

[0037] Furthermore, the spray section 120 has a diffuser structure, meaning that the cross-sectional area of ​​the spray section 120 gradually increases along the vertically downward flow direction. The electroplating solution flows in from the smaller cross-section at the top of the spray section 120 and flows to the larger cross-section at the bottom. This process does not require any external energy or complex control, and can achieve smooth and continuous attenuation of the flow rate, achieving low-impact spraying of the substrate 800. The reduction in flow rate reduces the dynamic pressure, and this part of the energy is converted into static pressure to create a uniform static pressure environment, ensuring that the driving pressure on each spray nozzle 121 at the bottom of the spray section 120 is basically the same, so that the flow rate of each spray nozzle 121 is uniform.

[0038] The spray section 120 can be in the shape of a frustum or a truncated pyramid. In this embodiment, the liquid storage section 110 is a cuboid structure, and the outer shell 130 is a truncated pyramid so that its top surface and the bottom surface of the liquid storage section 110 are in the same shape and area, thus improving the aesthetics.

[0039] Furthermore, the spray device 100 also includes a turbulence structure 150 disposed in the spray section 120. The turbulence structure 150 is located on the flow path between the liquid outlet channel 111 and the spray nozzle 121. The turbulence structure 150 is configured to reduce the flow rate of the electroplating solution and balance the flow field.

[0040] Specifically, after the electroplating solution flows into the spray section 120 from the inlet, it first flows through the turbulence structure 150 to induce violent flow separation and generate large-scale, unstable vortices downstream. During the generation, development and breakup of the vortex, a large amount of fluid mechanical energy is consumed, which further reduces the flow rate of the electroplating solution. In addition, the vortex generated by the turbulence structure 150 has a strong mixing effect on the electroplating solution in the spray section 120, thereby making the pressure and momentum distribution of the liquid in the area near the spray nozzle 121 tend to be highly uniform.

[0041] Furthermore, the turbulence structure 150 is adapted to divide the spray section 120 into an upper cavity 122 and a lower cavity 123. The turbulence structure 150 has a plurality of guide ports 151 connecting the upper cavity 122 and the lower cavity 123. The guide ports 151 and the liquid outlet channel 111 do not at least partially coincide in the vertical direction.

[0042] Because the guide port 151 is misaligned with the liquid outlet channel 111, the electroplating liquid flowing out of the liquid outlet channel 111 first impacts the surface of the turbulence structure 150, thereby consuming energy and achieving efficient deceleration. Then, after spreading and turning on the surface of the turbulence structure 150, it enters the lower cavity 123 through the dispersed guide ports 151, which greatly enhances the mixing and homogenization of the electroplating liquid in the upper cavity 122. After being homogenized, the electroplating liquid undergoes secondary mixing in the lower cavity 123 downstream of the turbulence structure 150, ensuring the uniformity of the flow field before reaching the spray nozzle 121 and achieving uniform speed spraying.

[0043] The spoiler structure 150 can specifically be a wing, a grille, a baffle, or other structure. In this embodiment, it is preferably a wing, such as a delta wing or a trapezoidal wing. The wing can be a single-piece structure with a guide opening 151. Alternatively, the wing can be a multi-piece structure, arranged in an array at intervals, with the guide opening 151 formed between adjacent wing pieces.

[0044] Furthermore, a first connecting pipe 300 connects the liquid storage section 110 and the filter pump 200. The first connecting pipe 300 includes a main section 310 and multiple first branch sections 320 connected to the main section 310. The main section 310 is connected to the outlet end of the filter pump 200. The multiple first branch sections 320 are arranged vertically and located in different areas of the top of the liquid storage section 110. With this design, the multiple first branch sections 320 can disperse the total flow of the main section 310 and inject the electroplating solution from different areas of the top of the liquid storage section 110, which greatly weakens the jet intensity entering the liquid storage section 110, allowing the electroplating solution to enter the liquid storage section 110 more smoothly. This reduces the impact and disturbance to the existing electroplating solution in the liquid storage section 110, and helps the liquid storage section 110 to perform its static pressure buffering function more quickly.

[0045] The spray device 100 of this invention, with the above-described structure, when the electroplating solution is pumped into the storage section 110, the high-speed liquid flow impacts the internal liquid surface. Its kinetic energy is largely dissipated through vortex mixing and splashing, achieving initial deceleration. At the same time, a stable static pressure source is established within the storage section 110, eliminating pumping pulses and achieving initial flow stabilization. Under static pressure, the electroplating solution flows smoothly out from multiple outlet channels 111 at the bottom of the storage section 110, and the total flow rate is evenly distributed, significantly reducing the local flow velocity of each liquid stream. The low speed and low pressure of the electroplating solution, after entering the spray section 120, impact the turbulence structure 150, generating a violent vortex, further dissipating kinetic energy to achieve deep speed reduction. At the same time, the strong turbulence effect forces the mixed liquid flow, which extremely homogenizes the pressure and momentum distribution inside the spray section 120, ultimately ensuring that the electroplating solution can be sprayed out from each spray nozzle 121 at a uniform speed, low speed and low pressure, so as to achieve a uniform and gentle coverage of the substrate 800 surface, effectively preventing the substrate 800 from deforming and ensuring the uniformity of the coating.

[0046] In addition, this utility model also provides a water plating device, including a spray device 100, a plating tank 400, a storage tank 500, and a filter pump 200. The plating tank 400 is used to accommodate the spray device 100 and the substrate 800 to be electroplated. The storage tank 500 stores the electroplating solution.

[0047] The filter pump 200 is connected to the plating tank 400 and the spray device 100 via a first connecting pipe 300. Specifically, the first connecting pipe 300 also includes a second branch section 330, which is arranged vertically, with one end connected to the main section 310 and the other end connected to the bottom of the plating tank 400. Preferably, there are multiple second branch sections 330 to slow down the flow rate of the electroplating solution pumped into the bottom of the plating tank 400.

[0048] A second connecting pipe 600 connects the filter pump 200 and the storage tank 500. One end of the second connecting pipe 600 is connected to the inlet of the filter pump 200, and the other end is connected to the bottom of the storage tank 500. During the electroplating process, impurities generated during electroplating will settle to the bottom of the storage tank 500 due to gravity. By connecting the second connecting pipe 600 to the bottom of the storage tank 500, when the filter pump 200 pumps the electroplating solution in the storage tank 500, it can send the electroplating solution containing the most impurities into the filter pump 200 for filtration, ensuring the cleanliness of the storage tank 500 and facilitating subsequent cleaning of the storage tank 500. It also prevents the filter pump 200 from being sucked dry due to a drop in the liquid level in the storage tank 500, thus preventing damage to the filter pump 200.

[0049] In addition, an overflow port is provided on the side wall near the top of the plating tank 400. The overflow port is located at the preset liquid level height of the plating tank 400, and the top of the storage tank 500 is connected to the overflow port through a third connecting pipe 700.

[0050] With the above structure, when the flow rate of the filter pump 200 into the liquid storage section 110 is too large due to abnormal operation, the overflow port can receive the excess electroplating liquid, realize the automatic drainage of the plating tank 400, and improve the reliability of the system. At the same time, it keeps the electroplating liquid in the plating tank 400 at the preset liquid level, ensuring normal electroplating operation.

[0051] The working process of this water plating equipment is as follows: Initially, electroplating solution is injected into the storage tank 500, and the filter pump 200 is started. The filter pump 200 pumps the electroplating solution in the storage tank 500 to the plating tank 400 and the spray device 100 through the connecting pipeline. At the spray device 100, the electroplating solution sequentially fills the storage part 110 and the spray part 120 and flows into the plating tank 400. When the electroplating solution in the plating tank 400 is at a preset height and the flow rate of each spray nozzle 121 reaches a stable state, the electroplating substrate 800 can be stably transported in the electroplating solution in the plating tank 400 to realize the electroplating operation.

[0052] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A spraying device, characterized in that, include: The liquid storage section (110) has an inlet channel at the top for connecting to the filter pump (200) and multiple outlet channels (111) at the bottom; A spray section (120) is connected to the bottom of the liquid storage section (110). The top of the spray section (120) is connected to each of the liquid outlet channels (111). The bottom of the spray section (120) is provided with a plurality of spray nozzles (121). The plurality of liquid outlet channels (111) are configured to allow the electroplating solution to flow into the spray section (120) uniformly from different positions on the top of the spray section (120).

2. The spraying device as described in claim 1, characterized in that, In the vertical direction, the projections of each of the liquid outlet channels (111) are evenly distributed at various positions on the bottom of the spray section (120).

3. The spraying device as described in claim 1, characterized in that, The spraying device (100) includes a housing (130), and a partition (140) is provided inside the housing (130) to divide the inner cavity of the housing (130) into the liquid storage part (110) and the spraying part (120), and the liquid outlet channel (111) is opened in the partition (140).

4. The spraying device as described in claim 1, characterized in that, The cross-sectional area of ​​the spray section (120) gradually increases along the vertically downward flow direction.

5. The spraying device as described in claim 1, characterized in that, The spray section (120) is provided with a turbulence structure (150), which is located on the flow path between the liquid outlet channel (111) and the spray nozzle (121). The turbulence structure (150) is configured to reduce the flow rate of the electroplating solution and balance the flow field.

6. The spraying device as described in claim 5, characterized in that, The turbulence structure (150) is adapted to divide the spray section (120) into an upper cavity (122) and a lower cavity (123). The turbulence structure (150) has a plurality of channels (151) connecting the upper cavity (122) and the lower cavity (123). The channels (151) and the liquid outlet channel (111) do not overlap at least partially in the vertical direction.

7. The spraying device as described in claim 6, characterized in that, The turbulence structure (150) is a wing, which is a single-piece structure with the passage opening (151) on it; or, the wing is a multi-piece structure and is arranged in an array at intervals, with the passage opening (151) formed between adjacent wing pieces.

8. The spraying device as described in claim 1, characterized in that, A first connecting pipe (300) is connected between the filter pump (200) and the liquid storage unit (110). The first connecting pipe (300) includes a main section (310) and a plurality of first branch sections (320) connected to the main section (310). The main section (310) is connected to the outlet end of the filter pump (200). The plurality of first branch sections (320) are located in different areas on the top of the liquid storage unit (110).

9. A water plating device, characterized in that, include: The spraying device (100) as described in any one of claims 1 to 8; A plating tank (400) is used to accommodate the spraying device (100) and the substrate (800) to be electroplated; A storage tank (500) stores electroplating solution; The filter pump (200) has its outlet end connected to the plating tank (400) and the spray device (100) respectively through the first connecting pipe (300), and its inlet end connected to the liquid storage tank (500) through the second connecting pipe (600).

10. The water plating equipment as described in claim 9, characterized in that, An overflow port is provided on the side wall near the top of the plating tank (400). The overflow port is located at a preset liquid level height of the plating tank (400). The top of the storage tank (500) is connected to the overflow port through a third connecting pipe (700).

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