A plating workpiece via hole bubble removal device

Abstract

The utility model provides a kind of electroplating workpiece through-hole bubble removal device, it is related to electroplating processing field.This kind of electroplating workpiece through-hole bubble removal device includes electroplating pool, the left and right sides of electroplating pool are fixedly installed with hydraulic telescopic link, the top of hydraulic telescopic link is fixedly installed with workpiece hanger, the rear side below of electroplating pool is provided with circulation pipe, and the outside of electroplating pool is provided with bubble cleaning subassembly;Bubble cleaning subassembly includes filter mechanism, and filter mechanism is fixedly connected to the rear side of circulation pipe.This kind of electroplating workpiece through-hole bubble removal device by aiming at the through-hole position on wafer workpiece with serpentine pipe end nozzle, makes electroplating solution from nozzle to wafer workpiece through-hole with umbrella-like diffusion flow, bubble attached in through-hole is separated from through-hole and floats off electroplating solution surface under the joint action of buoyancy and electroplating solution flow force, effectively eliminates bubble in through-hole, prevents its stagnation, and ensures the electroplating quality of wafer.

Description

Technical Field

[0001] This utility model relates to an electroplating device for wafer products, specifically a device for removing air bubbles from through holes in electroplated workpieces, belonging to the field of electroplating processing technology. Background Technology

[0002] Wafers are the core substrate for semiconductor manufacturing, mainly used in the production of integrated circuits and light-emitting diodes. During their production and processing, wafers need to be electroplated. In wafer electroplating, the wafer is fixed on an electroplating device and placed inside the electroplating solution of the device. The electroplating solution inside the device deposits a thin metal film on the surface of the wafer for circuit interconnection, electrode fabrication, or functionalization, thus completing the wafer electroplating step.

[0003] In wafer manufacturing, the electroplating technology for high aspect ratio vias becomes particularly critical. When the aspect ratio (AR) reaches or exceeds 10:1, the problem of bubble retention during the electroplating process becomes prominent. These problems lead to uneven plating, cracking, and even electroplating failure, seriously affecting the quality of the wafer. Therefore, how to effectively eliminate bubbles in high aspect ratio via electroplating has become an urgent problem to be solved. Utility Model Content

[0004] (a) Technical problems to be solved The purpose of this invention is to provide a device for removing air bubbles from through-holes in electroplated workpieces in order to solve the above-mentioned problems. This device addresses the issue in the prior art where the retention of air bubbles during the electroplating process of high aspect ratio through-holes leads to uneven plating, cracking, or even electroplating failure, thus affecting the quality of the wafer.

[0005] (II) Technical Solution This utility model is achieved through the following technical solution: a device for removing air bubbles from through-holes of electroplated workpieces, comprising an electroplating tank, with hydraulic telescopic rods fixedly installed on both the left and right sides of the electroplating tank, and a workpiece hanger fixedly installed on the top of the hydraulic telescopic rods; a circulation pipe is provided below the rear side of the electroplating tank, and a bubble-removing assembly is provided outside the electroplating tank; the bubble-removing assembly includes a filtration mechanism, which is fixedly connected to the rear side of the circulation pipe, and a circulation pump is fixedly installed on the rear side of the filtration mechanism; a diversion pipe is fixedly connected to the outlet end of the circulation pump, and two infusion pipes located on the left and right sides of the filtration mechanism are fixedly connected to the ends of the diversion pipes. Multiple branch pipes leading into the electroplating tank are fixedly connected to the outer wall of the infusion tube. A serpentine tube is fixedly installed at the end of the branch pipe away from the infusion tube, and a nozzle is fixedly connected to the other end of the serpentine tube. The circulation pump model can be ISG50-160. By driving the circulation pump, the electroplating solution in the electroplating tank enters the filtration mechanism through the circulation pipe. After removing impurities, it passes through the branch pipe, the infusion tube and the branch pipe in sequence, and is finally sprayed out by the nozzle guided by the serpentine tube. The sprayed electroplating solution forms a water flow with a certain pressure, which directly acts on the through-hole area of ​​the electroplated workpiece suspended on the workpiece rack. The water flow impact removes the air bubbles in the through-hole, ensuring the electroplating quality of the workpiece.

[0006] Preferably, the serpentine tubes are symmetrically distributed on the left and right sides of the workpiece hanger, so that the nozzle can be stably aligned with the through hole of the workpiece to adapt to the through hole position of different workpieces and further improve the bubble removal effect.

[0007] Preferably, the nozzle is a fan-shaped nozzle, which can disperse the electroplating solution into a uniform fan-shaped water flow surface, expand the coverage of the through-hole area of ​​the workpiece, and allow the water flow to act on multiple points on the inner wall of the through-hole at the same time. This avoids excessive local impact or missed areas caused by concentrated water flow, further enhancing the thoroughness of bubble removal. At the same time, the pressure distribution of the fan-shaped water flow is more even, which will not cause additional damage to the surface of the workpiece and ensures the stability of the electroplating process.

[0008] Preferably, the serpentine tube is covered with a corrosion-resistant layer made of polytetrafluoroethylene (PTFE), which has excellent acid and alkali resistance and high temperature resistance. It can effectively resist long-term corrosion by the electroplating solution and extend the service life of the serpentine tube. At the same time, the material has good insulation properties, which can prevent unnecessary electrochemical reactions between the serpentine tube, the electroplating solution, and the workpiece, ensuring the safety and stability of the electroplating process and further improving the overall reliability of the device.

[0009] Preferably, the filtration mechanism includes a housing with an opening on the left side. A frame is movably engaged inside the housing, and a filter block is movably engaged inside the frame. A sealing plate is fixedly connected to the left side of the frame, and a fixing bolt is movably installed inside the sealing plate. By engaging the fixing bolt with the threaded hole at the opening on the left side of the housing, the sealing plate can be tightly fixed to the housing, achieving stable positioning of the frame and filter block. The filter block can intercept large particles of impurities in the electroplating solution, ensuring the purity of the electroplating solution entering the serpentine tube and nozzle, and preventing impurities from clogging the nozzle or adhering to the inner wall of the workpiece's through-hole, thus affecting the electroplating quality. The frame and housing adopt a sliding engagement structure. When it is necessary to replace or clean the filter block, the fixing bolt can be unscrewed, allowing the sealing plate, frame, and filter block to be pulled out as a whole. This convenient operation effectively shortens maintenance time and improves the continuous operating efficiency of the device.

[0010] Preferably, connecting pipes are provided on both the front and rear sides of the housing. The connecting pipes are respectively connected to the circulation pipe and the circulation pump. The connecting pipe on the front side of the housing is sealed and connected to the outlet end of the circulation pipe through a flange, while the connecting pipe on the rear side is fixedly connected to the inlet end of the circulation pump to ensure smooth liquid flow.

[0011] Preferably, the filter block is made of sponge material and is disposed against the rear of the frame. A limiting plate is disposed at the rear of the filter block and is integrally formed with the frame. The limiting plate can provide stable locking support for the filter block and prevent it from shifting or deforming under liquid impact. The sponge material has a rich pore structure, which can efficiently adsorb suspended impurities in the electroplating solution without excessively hindering the liquid flow, thus ensuring filtration efficiency while maintaining stable circulation pressure of the electroplating solution.

[0012] Preferably, the fixing bolts are located at the four corners of the sealing plate and are threaded into the inside of the housing. The symmetrical distribution of the fixing bolts at the four corners can create uniform pressure on the sealing plate, ensuring the sealing performance between the sealing plate and the housing and effectively preventing the electroplating solution from leaking from the connection during circulation.

[0013] This utility model provides a device for removing air bubbles from through holes in electroplated workpieces, which has the following beneficial effects: 1. This device for removing air bubbles from through-holes in electroplated workpieces involves aligning the nozzle at the end of a serpentine tube with the through-hole location on the wafer workpiece, starting a circulating pump to draw electroplating solution into a distribution pipe and a delivery pipe into a branch pipe, and then diffusing the solution from the nozzle in an umbrella-like pattern to the through-hole of the wafer workpiece. Under the combined action of buoyancy and the thrust of the electroplating solution flow, the air bubbles attached to the through-hole detach from the through-hole and float to the surface of the electroplating solution, effectively eliminating air bubbles in the through-hole, preventing their retention, and ensuring the electroplating quality of the wafer.

[0014] 2. This device for removing air bubbles from through-holes in electroplated workpieces allows the electroplating solution to flow into the housing and pass through a filter block when the solution circulates via a circulation pump. This prevents impurities from entering the circulation pump and subsequent distribution pipes. The sealing plate and frame can be removed by disassembling the fixing bolts to clean the filter block, thereby effectively preventing impurities from entering the distribution pipe and delivery pipe and causing blockages, ensuring a stable electroplating process. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the structure of the bubble-removing component of this utility model located outside the electroplating tank; Figure 3 This is a schematic diagram of the structure of the foaming component of this utility model; Figure 4 This is an exploded view of the structure of the filtration mechanism of this utility model; Figure 5 This is a cross-sectional structural diagram of the filtration mechanism of this utility model.

[0016] [Explanation of Key Component Symbols] 1. Electroplating tank; 2. Hydraulic telescopic rod; 3. Workpiece hanger; 4. Circulation pipe; 5. Foaming assembly; 51. Filter mechanism; 511. Housing; 512. Connecting pipe; 513. Frame; 514. Filter block; 515. Sealing plate; 516. Fixing bolt; 52. Circulation pump; 53. Diverter pipe; 54. Infusion pipe; 55. Diverter branch pipe; 56. Serpentine pipe; 57. Nozzle. Detailed Implementation

[0017] This utility model provides a device for removing air bubbles from through holes in electroplated workpieces.

[0018] Example 1, please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 The system includes an electroplating tank 1, with hydraulic telescopic rods 2 fixedly installed on both the left and right sides of the electroplating tank 1. A workpiece hanger 3 is fixedly installed on the top of the hydraulic telescopic rods 2. A circulation pipe 4 is provided below the rear side of the electroplating tank 1. A foam-clearing assembly 5 is provided outside the electroplating tank 1. The foam-clearing assembly 5 includes a filter mechanism 51, which is fixedly connected to the rear side of the circulation pipe 4. A circulation pump 52 is fixedly installed on the rear side of the filter mechanism 51. A diversion pipe 53 is fixedly connected to the outlet end of the circulation pump 52. Two liquid delivery pipes 54 located on the left and right sides of the filter mechanism 51 are fixedly connected to the end of the diversion pipe 53. Multiple branch pipes 55 that penetrate into the electroplating tank 1 are fixedly connected to the outer walls of the two liquid delivery pipes 54. A serpentine pipe 56 is fixedly installed at the end of the branch pipe 55 away from the liquid delivery pipe 54. A nozzle 57 is fixedly connected to the other end of the serpentine pipe 56.

[0019] The serpentine tubes 56 are symmetrically distributed on the left and right sides of the workpiece hanger 3.

[0020] Nozzle 57 is a fan-shaped nozzle.

[0021] The serpentine tube 56 is covered with a corrosion-resistant layer.

[0022] In use, the following steps are taken: After aligning the nozzle 57 at the end of the serpentine tube 56 with the through-hole position on the wafer workpiece, the circulation pump 52 is started to draw the electroplating solution into the distribution pipe 53. Subsequently, the electroplating solution flows into the delivery pipe 54 through the distribution pipe 53, and then into the distribution branch pipe 55. The nozzle 57 on the connected serpentine tube 56 causes the electroplating solution to diffuse in an umbrella shape to the through-hole of the wafer workpiece, changing the flow direction of the electroplating solution. After the electroplating solution enters the through-hole, the air bubbles attached to the through-hole are detached from the through-hole and float to the surface of the electroplating solution under the combined action of buoyancy and the thrust of the electroplating solution flow, thereby effectively eliminating the air bubbles in the through-hole, preventing them from stagnating, and ensuring the electroplating quality of the wafer.

[0023] Example 2, please refer to again Figure 1 , Figure 2 , Figure 4 and Figure 5 The filter mechanism 51 includes a housing 511, which has an opening on the left side. A frame 513 is movably engaged inside the housing 511. A filter block 514 is movably engaged inside the frame 513. A sealing plate 515 is fixedly connected to the left side of the frame 513. A fixing bolt 516 is movably installed inside the sealing plate 515.

[0024] Connecting pipes 512 are provided on both the front and rear sides of the housing 511, and the connecting pipes 512 are connected to the circulation pipe 4 and the circulation pump 52 respectively.

[0025] The filter block 514 is made of sponge material and is positioned at the rear of the frame 513.

[0026] The fixing bolts 516 are located at the four corners of the sealing plate 515 and are threaded into the inside of the housing 511.

[0027] In use, when the electroplating solution is circulated by the circulation pump 52, it flows into the housing 511 and is intercepted by the filter block 514. This prevents impurities from entering the circulation pump 52 and the subsequent diversion pipe 53. Afterwards, the sealing plate 515 and the frame 513 can be removed by disassembling the fixing bolts 516 to replace the filter block 514 and clean the filtered impurities. This effectively prevents impurities from entering the diversion pipe 53 and the infusion pipe 54 and causing blockage, ensuring the stable operation of the electroplating process.

[0028] Working principle: During use, the wafer to be electroplated is fixed below the workpiece holder 3, and the workpiece holder 3 is lowered by controlling the hydraulic telescopic rod 2, so that the wafer on the workpiece holder 3 is immersed in the electroplating solution in the electroplating tank 1. Through the movable serpentine tube 56, the nozzle 57 at the end of the serpentine tube 56 is aligned with the through hole position on the wafer workpiece. Then, when the wafer workpiece is electroplated in the electroplating tank 1, the circulation pump 52 is turned on. The circulation pump 52 draws the electroplating solution through the circulation pipe 4 and the filter mechanism 51 into the distribution pipe 53, and then delivers it to the left and right sides respectively through the distribution pipe 53. The electroplating solution is then diverted to the branch pipe 55 and enters the serpentine tube 56 connected to the branch pipe 55 before flowing out from the nozzle 57. The electroplating solution flows out to the through hole of the wafer workpiece. The serpentine tube 56 causes the electroplating solution to diffuse in an umbrella shape, changing the direction of the electroplating solution. The electroplating solution flows into the through hole, causing the air bubbles attached to the through hole to float to the surface of the electroplating solution under the combined action of buoyancy and the thrust of the electroplating solution. This facilitates the elimination of air bubbles attached to the through hole, avoids stagnation, and ensures the electroplating quality of the wafer. When the electroplating solution is circulated by the circulation pump 52, it first enters the housing 511 through the circulation pipe 4. The electroplating solution passes through the filter block 514 to filter out impurities before entering the circulation pump 52. This prevents impurities from entering the circulation pump 52 and the subsequent diversion pipe 53. Subsequently, the sealing plate 515 and the frame 513 can be removed by disassembling the fixing bolts 516. The filter block 514 can be replaced and the filtered impurities can be cleaned. This effectively prevents impurities from entering the diversion pipe 53 and the infusion pipe 54 and causing blockage, thus ensuring stable electroplating.

[0029] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A device for removing air bubbles from through-holes of electroplated workpieces, comprising an electroplating tank (1), characterized in that: Hydraulic telescopic rods (2) are fixedly installed on both the left and right sides of the electroplating tank (1). A workpiece hanger (3) is fixedly installed on the top of the hydraulic telescopic rods (2). A circulation pipe (4) is provided on the lower rear side of the electroplating tank (1). A foam-clearing component (5) is provided on the outside of the electroplating tank (1). The foaming assembly (5) includes a filter mechanism (51), which is fixedly connected to the rear side of the circulation pipe (4). A circulation pump (52) is fixedly installed on the rear side of the filter mechanism (51). A diversion pipe (53) is fixedly connected to the outlet end of the circulation pump (52). Two infusion pipes (54) located on the left and right sides of the filter mechanism (51) are fixedly connected to the end of the diversion pipe (53). Multiple diversion branch pipes (55) that penetrate into the electroplating tank (1) are fixedly connected to the outer side walls of the two infusion pipes (54). A serpentine pipe (56) is fixedly installed at one end of the diversion branch pipe (55) away from the infusion pipe (54). A nozzle (57) is fixedly connected to the other end of the serpentine pipe (56).

2. The device for removing air bubbles from through-holes of electroplated workpieces according to claim 1, characterized in that: The serpentine tubes (56) are symmetrically distributed on the left and right sides of the workpiece hanger (3).

3. The device for removing air bubbles from through-holes of electroplated workpieces according to claim 1, characterized in that: The nozzle (57) is a fan-shaped nozzle.

4. The device for removing air bubbles from through-holes of electroplated workpieces according to claim 1, characterized in that: The serpentine tube (56) is covered with a corrosion-resistant layer.

5. The device for removing air bubbles from through-holes of electroplated workpieces according to claim 1, characterized in that: The filter mechanism (51) includes a housing (511) with an opening on the left side. A frame (513) is movably attached inside the housing (511). A filter block (514) is movably attached to the inner side of the frame (513). A sealing plate (515) is fixedly connected to the left side of the frame (513). A fixing bolt (516) is movably installed inside the sealing plate (515).

6. The device for removing air bubbles from through-holes of electroplated workpieces according to claim 5, characterized in that: The housing (511) is provided with connecting pipes (512) on both the front and rear sides, and the connecting pipes (512) are respectively connected to the circulation pipe (4) and the circulation pump (52).

7. The device for removing air bubbles from through-holes of electroplated workpieces according to claim 5, characterized in that: The filter block (514) is made of sponge material and is positioned at the rear of the frame (513).

8. The device for removing air bubbles from through-holes of electroplated workpieces according to claim 5, characterized in that: The fixing bolts (516) are located at the four corners of the sealing plate (515), and the fixing bolts (516) are threaded into the interior of the housing (511).

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