Auxiliary device for integrated circuit nickel plating

Abstract

The utility model belongs to the technical field of circuit board processing especially relates to an auxiliary device for integrated circuit nickel plating processing, including bottom plate: the upper surface fixed mounting of bottom plate has nickel plating cylinder, this device is through the cooperation between motor, placing box, vertical rod and mixing rod, every circuit board is set apart in the inside of placing box, makes the circuit board inside driving of placing box rotate through the drive of motor, through the mixing and stirring of liquid in the inside of nickel plating cylinder through the stirring rod of vertical rod and support rod outer surface, through the forced flow of rotation, eliminates concentration difference polarization, solved the nickel plating reaction in the existing, when placing circuit board, easy to accumulate circuit board in solution, after the reaction, the Ni of cathode surface 2 will gradually be poor because of deposition, leads to current density drop, deposition speed slows down, makes the concentration of this area and the concentration of the rest position difference is larger, leads to the problem of the performance of plating layer weakening.

Description

Technical Field

[0001] This utility model belongs to the technical field of circuit board processing, and in particular relates to an auxiliary device for nickel plating of integrated circuits. Background Technology

[0002] Electroless nickel plating, also known as electroless nickel plating or electroless nickel plating, involves depositing a uniform palladium catalytic layer on a clean copper surface beforehand via a displacement reaction. The workpiece then enters the electroless nickel plating bath, where, under the catalysis of palladium, nickel ions in the electroless nickel plating bath undergo an autocatalytic reaction to deposit a nickel-phosphorus layer (phosphorus content typically between 7-11%). The workpiece then enters the gold plating bath, where a layer of gold is deposited on the nickel surface through a displacement reaction between nickel and gold ions. Utilizing the low contact resistance and resistance to oxidation of gold, it provides excellent conductivity and soldering protection.

[0003] However, in existing nickel plating reactions, when placing the circuit board, it is easy for the circuit board to accumulate in the solution. After the reaction, the Ni²⁺ on the cathode (circuit board) surface will gradually become depleted due to deposition, resulting in a decrease in current density and a slowdown in deposition rate. This causes a large difference in concentration between this area and other locations, leading to a weakening of the plating performance. In view of this, we propose an auxiliary device for nickel plating of integrated circuits. Utility Model Content

[0004] The purpose of this invention is to provide an auxiliary device for nickel plating of integrated circuits to solve the problems mentioned in the background art.

[0005] In view of this, the present invention provides an auxiliary device for nickel plating of integrated circuits, comprising a base plate: a nickel plating cylinder is fixedly installed on the upper surface of the base plate, a telescopic rod is fixedly installed on the upper surface of the base plate, a top plate is fixedly connected to the top end of the telescopic rod, a motor is fixedly installed on the upper surface of the top plate, a rotating rod is fixedly connected to the output shaft end of the motor, the bottom end of the rotating rod rotates through the upper surface of the top plate, and a rotating plate is fixedly installed at the bottom end of the rotating rod; The bottom surface of the rotating plate is fitted with a clamping plate, the bottom surface of the clamping plate is fixedly connected with a support rod, the bottom end of the support rod is fixedly connected with a placement box, the outer surface of the placement box is provided with a flow groove, and the bottom surface of the placement box is fixedly connected with a vertical rod.

[0006] In this technical solution, the telescopic rod in the device is an electric telescopic rod, which is equipped with a motor, a lead screw nut and a guide rod. After the motor is powered on, it starts to rotate and transmits the power to the transmission components through the gearbox. The rotation of the lead screw drives the nut to move linearly, thereby causing the telescopic rod to extend and retract.

[0007] In the above technical solution, the bottom surface of the rotating plate is provided with a slot, and the inner wall of the slot is slidably connected to the outer surface of the plate.

[0008] In this technical solution, although the number of mounting cards can be determined by the amount of nickel plating required on the circuit board, the number of mounting cards is limited by the length of the card slot.

[0009] In the above technical solution, the outer surface of the placement box is provided with an installation groove, and the inner wall of the installation groove is slidably connected with a cover plate.

[0010] In this technical solution, the outer surface of the cover plate is also provided with a through groove to facilitate the flow of liquid.

[0011] In the above technical solution, there are four card slots, symmetrically distributed on the bottom surface of the rotating plate, and rubber blocks are slidably connected to the inner wall of the card slots.

[0012] In this technical solution, the rotating plate is made of PVC as a whole, which is insulating and corrosion resistant, and rubber blocks can be embedded in the inner walls of the four slots on its bottom surface.

[0013] In the above technical solution, a bracket is fixedly installed on the bottom surface of the nickel plating cylinder, and a drain pipe is fixedly connected to the bottom surface of the nickel plating cylinder.

[0014] In this technical solution, the bracket serves to support and lift the nickel plating cylinder, facilitating the arrangement of the bottom pipeline. The drain pipe is located at the bottom of the nickel plating cylinder, is made of polypropylene, and is equipped with a ball valve to facilitate the discharge of plating solution.

[0015] In the above technical solution, furthermore, a hybrid rod is fixedly connected to the outer surface of the support rod and the vertical rod, and the hybrid rod is evenly distributed along the axial direction of the support rod and the vertical rod.

[0016] In this technical solution, the mixing rod is fixed to the outer surface of the support rod and the vertical rod. The mixing rod is uniformly distributed and disturbs the plating solution when rotating, thereby reducing concentration polarization.

[0017] In the above technical solution, furthermore, three card plates can be installed on the inner wall of one card slot, and the device can perform nickel plating on twelve circuit boards separately at one time.

[0018] In this technical solution, the cover of the placement box is opened, and each box can hold one circuit board. After the cover is closed, the entire placement box is inserted into the slot on the bottom of the rotating plate by the card plate. Each slot can install up to three card plates, so the device can process up to twelve circuit boards at a time.

[0019] The beneficial effects of this utility model are: 1. This auxiliary device for nickel plating of integrated circuits, through the cooperation of a motor, a placement box, a vertical rod, and a mixing rod, separates each circuit board inside the placement box. Simultaneously, the motor drives the placement box to rotate the circuit boards inside. The stirring rod on the outer surface of the vertical rod and support rod mixes and stirs the liquid inside the nickel plating cylinder. The forced flow generated by the rotation optimizes the mass transfer process of the plating solution, eliminates concentration polarization, and improves the plating performance. This solves the problem in existing nickel plating reactions where circuit boards tend to accumulate in the solution during placement, and after the reaction, the Ni² on the cathode (circuit board) surface gradually becomes depleted due to deposition, leading to a decrease in current density, a slower deposition rate, and a weakened plating performance.

[0020] 2. This auxiliary device for nickel plating of integrated circuits, through the cooperation between the telescopic rod, the placement box, the flow channel, the mounting channel and the cover plate, allows the circuit board to be placed inside the placement box from the outside, and then the cover plate to be clamped on the inner wall of the mounting channel, so that one circuit board is placed inside the placement box, preventing the circuit board from accumulating inside the nickel plating cylinder when it is immersed in liquid. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is an exploded view of a partial structure of this utility model; Figure 3 This is a partial structural diagram of the present invention; Figure 4 This is an exploded view showing the positional relationship between the placement box and the cover plate in this utility model; Figure 5 In this utility model Figure 2 Enlarged view of the structure of section A in the middle.

[0022] The markings in the diagram are as follows: 1. Base plate; 2. Nickel-plated cylinder; 3. Telescopic rod; 4. Top plate; 5. Motor; 6. Rotating rod; 7. Turning plate; 8. Card plate; 9. Support rod; 10. Placement box; 11. Flow channel; 12. Vertical rod; 13. Card slot; 14. Mounting slot; 15. Cover plate; 16. Rubber block; 17. Bracket; 18. Drain pipe; 19. Mixing rod. Detailed Implementation

[0023] The following is in conjunction with the appendix Figures 1-5 This application will be described in further detail.

[0024] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," and "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0025] Example 1: This example provides an auxiliary device for nickel plating of integrated circuits, including a base plate 1: a nickel plating cylinder 2 is fixedly installed on the upper surface of the base plate 1, a telescopic rod 3 is fixedly installed on the upper surface of the base plate 1, a top plate 4 is fixedly connected to the top end of the telescopic rod 3, a motor 5 is fixedly installed on the upper surface of the top plate 4, a rotating rod 6 is fixedly connected to the output shaft end of the motor 5, the bottom end of the rotating rod 6 rotates through the upper surface of the top plate 4, and a rotating plate 7 is fixedly installed at the bottom end of the rotating rod 6; A card plate 8 is snapped onto the bottom surface of the rotating plate 7. A support rod 9 is fixedly connected to the bottom surface of the card plate 8. A placement box 10 is fixedly connected to the bottom end of the support rod 9. A flow groove 11 is opened on the outer surface of the placement box 10. A vertical rod 12 is fixedly connected to the bottom surface of the placement box 10.

[0026] Each circuit board is separately placed inside the placement box 10. The motor 5 drives the placement box 10 to rotate the circuit boards inside. The liquid inside the nickel plating cylinder 2 is mixed and stirred by the mixing rod 19 on the outer surface of the vertical rod 12 and the support rod 9. The Ni²⁺ on the surface of the cathode circuit board will gradually become depleted due to deposition, resulting in a decrease in current density and a slowdown in deposition rate. The rotation and stirring can quickly transport Ni²⁺, H⁺ and other ions in the plating solution to the cathode surface, replenish the consumed ions, maintain a uniform ion concentration gradient, and improve current efficiency.

[0027] Example 2: This example provides an auxiliary device for nickel plating of integrated circuits. In addition to the technical solutions of the above examples, it also has the following technical features: the bottom surface of the rotating plate 7 is provided with a slot 13, and the inner wall of the slot 13 is slidably connected to the outer surface of the plate 8.

[0028] The slot 13 is convex, and the card plate 8 can be precisely inserted into the slot 13. The number of card plates 8 installed can be determined according to the amount of nickel plating required for the circuit board.

[0029] Example 3: This example provides an auxiliary device for nickel plating of integrated circuits. In addition to the technical solutions of the above examples, it also has the following technical features: the outer surface of the placement box 10 is provided with a mounting groove 14, and the inner wall of the mounting groove 14 is slidably connected with a cover plate 15.

[0030] The cover plate 15 is inserted into the mounting slot 14 to prevent the circuit board inside the placement box 10 from detaching from the placement box 10 when it is rotated.

[0031] Example 4: This example provides an auxiliary device for nickel plating of integrated circuits. In addition to the technical solutions of the above examples, it also has the following technical features: there are four slots 13, which are symmetrically distributed on the bottom surface of the rotating plate 7, and rubber blocks 16 are slidably connected to the inner wall of the slots 13.

[0032] The shape of the rubber block 16 matches the shape of the slot 13, and the rubber block 16 is locked in the inner wall of the slot 13 to prevent the card plate 8 from falling out of the slot 13.

[0033] Example 5: This example provides an auxiliary device for nickel plating of integrated circuits. In addition to the technical solutions of the above examples, it also has the following technical features: a bracket 17 is fixedly installed on the bottom surface of the nickel plating cylinder 2, and a drain pipe 18 is fixedly connected to the bottom surface of the nickel plating cylinder 2.

[0034] Among them, the base plate 1, the bracket 17 and the nickel plating cylinder 2 are made of 304 stainless steel plates to ensure corrosion resistance and structural stability in the nickel plating solution environment.

[0035] Example 6: This example provides an auxiliary device for nickel plating of integrated circuits. In addition to the technical solutions of the above examples, it also has the following technical features: a mixing rod 19 is fixedly connected to the outer surface of the support rod 9 and the vertical rod 12. The mixing rod 19 is evenly distributed along the axial direction of the support rod 9 and the vertical rod 12.

[0036] The mixing rod 19 can be rotated inside the nickel plating cylinder 2 by the motor 5, thereby improving the current efficiency.

[0037] Example 7: This example provides an auxiliary device for nickel plating of integrated circuits. In addition to the technical solutions of the above examples, it also has the following technical features: three card plates 8 can be installed on the inner wall of a card slot 13. The device can perform nickel plating on twelve circuit boards at a time.

[0038] The motor 5 in this device is a stepper motor 5, which converts electrical pulses into angular displacement. The rotation angle and speed of the motor 5 are controlled by controlling the number and frequency of the pulse signals, and forward and reverse rotation is achieved by changing the order of the pulse signals.

[0039] Working principle: When using this device, each circuit board is placed separately inside the placement box 10. The telescopic rod 3 is shortened, and the placement box 10 is immersed in the liquid. The motor 5 is started, and the output shaft of the motor 5 drives the rotating plate 7 to rotate through the rotating rod 6, causing the placement box 10 to rotate and drive the circuit boards inside to rotate. The liquid inside the nickel plating cylinder 2 is mixed and stirred by the mixing rod 19 on the outer surface of the vertical rod 12 and the support rod 9. The forced flow generated by the rotation optimizes the mass transfer process of the plating solution, eliminates concentration polarization, and improves the plating performance. After the nickel plating is completed, the telescopic rod 3 is extended, which moves the placement box 10 upward and away from the liquid, and the circuit board is taken out from the inside of the placement box 10.

[0040] The embodiments of this application have been described above with reference to the accompanying drawings. Unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other. This application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. An auxiliary device for nickel plating in integrated circuit processing, characterized in that, Includes a base plate (1): a nickel-plated cylinder (2) is fixedly installed on the upper surface of the base plate (1), a telescopic rod (3) is fixedly installed on the upper surface of the base plate (1), a top plate (4) is fixedly connected to the top end of the telescopic rod (3), a motor (5) is fixedly installed on the upper surface of the top plate (4), a rotating rod (6) is fixedly connected to the output shaft end of the motor (5), the bottom end of the rotating rod (6) rotates through the upper surface of the top plate (4), and a rotating plate (7) is fixedly installed at the bottom end of the rotating rod (6). The bottom surface of the rotating plate (7) is fitted with a card plate (8), the bottom surface of the card plate (8) is fixedly connected with a support rod (9), the bottom end of the support rod (9) is fixedly connected with a placement box (10), the outer surface of the placement box (10) is provided with a flow groove (11), and the bottom surface of the placement box (10) is fixedly connected with a vertical rod (12).

2. The auxiliary device for nickel plating of integrated circuits according to claim 1, characterized in that, The bottom surface of the rotating plate (7) is provided with a slot (13), and the inner wall of the slot (13) is slidably connected to the outer surface of the plate (8).

3. The auxiliary device for nickel plating of integrated circuits according to claim 1, characterized in that, The outer surface of the placement box (10) is provided with an installation groove (14), and the inner wall of the installation groove (14) is slidably connected with a cover plate (15).

4. The auxiliary device for nickel plating of integrated circuits according to claim 2, characterized in that, There are four slots (13) symmetrically distributed on the bottom surface of the rotating plate (7), and rubber blocks (16) are slidably connected to the inner wall of the slots (13).

5. The auxiliary device for nickel plating of integrated circuits according to claim 1, characterized in that, A bracket (17) is fixedly installed on the bottom surface of the nickel plating cylinder (2), and a drain pipe (18) is fixedly connected to the bottom surface of the nickel plating cylinder (2).

6. The auxiliary device for nickel plating of integrated circuits according to claim 1, characterized in that, The outer surfaces of the support rod (9) and the vertical rod (12) are fixedly connected with a hybrid rod (19), which is evenly distributed along the axial direction of the support rod (9) and the vertical rod (12).

7. An auxiliary device for nickel plating of integrated circuits according to claim 2, characterized in that, The inner wall of the slot (13) can be fitted with three card plates (8), and the device can perform nickel plating on twelve circuit boards at a time.

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