Anti-edge overplating electroplating fixture

Abstract

The utility model provides a kind of prevent edge overplating electroplating fixture, including upper clamping component and the lower clamping component of corresponding arrangement with the upper clamping component, the lower clamping component includes annular lower bottom plate, the outer sealing ring of setting on the annular lower bottom plate outer edge end face, the inner sealing ring of setting on the annular lower bottom plate inner edge end face and by outer to inner sequentially between the lower outer sealing ring and the lower inner sealing ring electrically conductive component, lower magnetic attraction component and lower cathode contact component, every corner portion of the annular lower bottom plate is formed with several magnet mounting hole platforms to its adjacent two edge direction extension, the lower magnetic attraction component is set on several the magnet mounting hole platform, the upper clamping component includes annular upper pressing plate and the inner sealing ring of setting on the annular upper pressing plate inner edge end face, the upper clamping component with the lower clamping component is clamped by magnetic force towards.This utility model relates to electroplating fixture technical field.

Description

Technical Field

[0001] This utility model relates to the field of electroplating fixture technology, and in particular to an electroplating fixture for preventing edge overplating. Background Technology

[0002] In the semiconductor and microelectronics manufacturing industry, technologies such as through-glass via (TGV) often require selective electroplating of substrates such as wafers. Currently, most existing TGV electroplating fixtures use simple mechanical clamping methods, directly clamping the edge of the product to be electroplated through conductive parts on the fixture to achieve electrical conduction. During the electroplating process, the electroplating solution can easily seep into the gap at the junction of the fixture and the product, causing the edge area of ​​the product that should be covered and protected by the fixture to be exposed to the electric field, resulting in unnecessary electroplating deposition, i.e., edge overplating.

[0003] The drawback of the existing technology is that its clamping structure lacks effective sealing and isolation and conductive partitioning design. Simple physical clamping cannot form a reliable sealing barrier between the conductive contact area and the area to be protected. After the electroplating solution seeps in, it directly causes the product edge to be over-plated, which not only affects the dimensional accuracy and electrical performance of the product, but also wastes precious metal electroplating solution and reduces product yield.

[0004] Therefore, the inventors urgently need a plating fixture to prevent edge overplating in order to solve the above problems. Utility Model Content

[0005] In view of the above-mentioned defects in the prior art, this utility model provides an anti-edge over-plating electroplating fixture, which aims to solve the technical problem in the prior art where electroplating fixtures with poor structural sealing cause electroplating solution to seep in, thereby causing over-plating of product edges.

[0006] To achieve the above objectives, the technical solution adopted by this utility model is: an anti-edge over-plating electroplating fixture, comprising an upper clamping assembly and a lower clamping assembly corresponding to the upper clamping assembly. The lower clamping assembly includes an annular lower base plate, a lower outer sealing ring disposed on the outer edge end face of the annular lower base plate, a lower inner sealing ring disposed on the inner edge end face of the annular lower base plate, and a conductive assembly, a lower magnetic attraction assembly, and a lower cathode contact assembly disposed sequentially from the outside to the inside between the lower outer sealing ring and the lower inner sealing ring. Each corner of the annular lower base plate extends towards its two adjacent sides to form a plurality of magnet mounting holes. The lower magnetic attraction assembly is disposed on the plurality of magnet mounting holes. The upper clamping assembly includes an annular upper pressure plate and an upper inner sealing ring disposed on the inner edge end face of the annular upper pressure plate. The upper clamping assembly and the lower clamping assembly are clamped together by magnetic force, so that the upper inner sealing ring and the lower inner sealing ring are pressed together against the inner edge of the upper and lower surfaces of the product to be electroplated.

[0007] Based on the above, the beneficial effect of a non-overplating edge electroplating fixture is to solve the technical problem in the prior art where electroplating fixtures, due to poor structural sealing, allow electroplating solution to seep in, thereby causing overplating at the product edges; this is mainly reflected in: 1. This utility model provides a lower outer sealing ring and a lower inner sealing ring in the lower clamping assembly, and a corresponding upper outer sealing ring and an upper inner sealing ring in the upper clamping assembly. When the upper and lower clamping assemblies are clamped, the upper inner sealing ring and the lower inner sealing ring can press together against the inner edge of the upper and lower surfaces of the product to be electroplated. At the same time, the cooperation of the lower outer sealing ring and the upper outer sealing ring forms an effective sealing barrier on the inner and outer sides of the product edge, fundamentally preventing the electroplating solution from seeping into the edge area of ​​the product that needs to be protected. 2. This utility model, by setting a conductive component and a lower cathode contact component between the lower outer sealing ring and the lower inner sealing ring, restricts the electrical conduction functional area to the annular area surrounded by the inner and outer sealing rings, so that the electroplating reaction is precisely controlled within a predetermined range, ensuring that the inner edge area of ​​the product sealed and protected by the inner and outer sealing rings is isolated from the electroplating environment, thereby avoiding overplating in this area. 3. This utility model provides a magnet mounting hole platform and a lower magnetic suction assembly on the annular bottom plate, and uses the magnetic force between the upper and lower clamping assemblies to achieve opposite clamping. This magnetic clamping method can provide uniform and stable clamping force, ensuring that the upper and lower inner sealing rings are tightly fitted to the product surface, ensuring the reliability of the seal, and simplifying the clamping operation of the fixture.

[0008] Furthermore, the conductive component includes power-connecting pins threaded to the four corners of the annular lower base plate and an annular copper strip, the annular copper strip being electrically connected to each of the power-connecting pins.

[0009] Based on the above, the beneficial effects of the connecting pins are that their threaded engagement with the annular bottom plate enables the conductive components to be securely installed and electrically connected on the annular bottom plate, introducing external power to the annular copper strip and providing a stable current input for the electroplating process; the beneficial effects of the annular copper strip are that, through its electrical connection with each connecting pin, it forms a uniformly distributed annular conductive circuit, uniformly transmitting current to the cathode contact points of each cathode conductive sheet, ensuring the uniformity of electroplating at the product edges, and avoiding local overplating or underplating caused by uneven current distribution.

[0010] Furthermore, the lower cathode contact assembly includes an elastic support and a cathode conductive sheet. The elastic support is attached to the annular lower base plate, and the cathode conductive sheet is attached to the elastic support and maintains contact with the annular copper strip under the support of the elastic support.

[0011] Based on the above, the beneficial effects of the elastic support are that it adheres to the annular bottom plate through its elastic properties and provides support for the cathode conductive sheet, which not only achieves flexible electrical contact between the cathode conductive sheet and the annular copper strip, ensuring the reliability of conductivity, but also compensates for the small gap between the fixture and the product through its elastic deformation, enhancing the stability of the contact; the beneficial effects of the cathode conductive sheet are that it maintains contact with the annular copper strip through the extension under the support of the elastic support and directly supports the product to be electroplated through the inner side of the body.

[0012] Furthermore, the elastic support is double-sided adhesive foam, and the cathode conductive sheet is a cathode copper sheet.

[0013] Furthermore, the number of the lower cathode contact assemblies corresponds to the number of sides of the annular lower base plate, and the elastic support and the center of the cathode conductive sheet of each lower cathode contact assembly extend toward the annular copper strip.

[0014] Furthermore, the lower magnetic suction assembly includes several magnets, an L-shaped pressure frame, and several fastening pins. Each magnet is housed in its respective magnet mounting hole platform. The L-shaped pressure frame covers the several magnet mounting hole platforms. Each fastening pin passes through the magnet mounting hole platform and the magnet in sequence and is threadedly fixed to the L-shaped pressure frame.

[0015] Based on the above, the beneficial effect of the L-shaped clamp is that by covering the top of several magnet mounting holes and fixing the magnets with fastening pins, the dispersed magnets are integrated into a unified magnetic attraction unit. This not only protects the magnets from corrosion by the electroplating solution, but also ensures the uniformity and stability of the magnetic force distribution when the upper and lower magnetic attraction components are in contact.

[0016] Furthermore, the upper clamping assembly also includes an upper outer sealing ring, an upper magnetic attraction assembly, and an upper cathode contact assembly disposed on the outer edge end face of the annular upper pressure plate. The upper magnetic attraction assembly and the upper cathode contact assembly are disposed on the annular upper pressure plate and located between the upper outer sealing ring and the upper inner sealing ring. When the upper clamping assembly is clamped with the lower clamping assembly, the upper magnetic attraction assembly contacts the lower magnetic attraction assembly, and the outward extensions of the upper cathode contact assembly and the lower cathode contact assembly both contact the annular copper strip. The inner sides of the upper cathode contact assembly and the lower cathode contact assembly cooperate to clamp the edge of the product to be electroplated.

[0017] Based on the above, the beneficial effect of the upper outer sealing ring is that when the upper and lower clamping components are clamped together, they fit tightly with the lower outer sealing ring, forming a second sealing barrier on the outer edge of the product to be electroplated, completely blocking the path of the electroplating solution from the outside into the conductive area.

[0018] Furthermore, the upper outer sealing ring, upper inner sealing ring, lower outer sealing ring, and lower inner sealing ring are all sealing rubber rings.

[0019] Based on the above, the beneficial effect of the sealing ring is that it utilizes the flexibility and sealing properties of its material to realize the upper outer sealing ring, upper inner sealing ring, lower outer sealing ring, and lower inner sealing ring. When subjected to pressure, it can undergo elastic deformation and tightly fill the microscopic unevenness of the contact surface between the fixture and the product, thereby achieving the most effective physical isolation from the electroplating solution.

[0020] Furthermore, when the upper clamping assembly and the lower clamping assembly clamp the product to be electroplated, the upper inner sealing ring and the lower inner sealing ring form a sealed area that isolates the electroplating environment by surrounding the inner edge of the product to be electroplated. The surfaces of the product to be electroplated where the upper cathode contact assembly and the lower cathode contact assembly are located are within the sealed area of ​​the isolated electroplating environment.

[0021] Based on the above, the beneficial effect of the sealing area formed by the upper inner sealing ring and the lower inner sealing ring is that it clearly defines the physical boundary of the electroplating reaction, precisely isolates the product surface where the upper and lower cathode contact components are located from the electroplating environment, fundamentally eliminates the conditions for electrochemical deposition in this area from space, and ultimately solves the problem of edge overplating.

[0022] To more clearly illustrate the above-mentioned features of this utility model and the objectives it aims to achieve, the following description, in conjunction with the accompanying drawings and specific embodiments, will further explain this utility model. Attached Figure Description

[0023] Figure 1 : This is a three-dimensional schematic diagram of the present invention; Figure 2 : This is a schematic diagram of the lower clamping component of this utility model; Figure 3 :for Figure 2 An enlarged schematic diagram of part A; Figure 4 : This is a schematic diagram of the upper clamping component of this utility model.

[0024] Explanation of reference numerals: 1-Upper clamping assembly, 11-Annular upper pressure plate, 12-Upper outer sealing ring, 13-Upper inner sealing ring, 14-Upper magnetic suction assembly, 15-Upper cathode contact assembly, 2-Lower clamping assembly, 21-Annular lower base plate, 211-Magnet mounting hole platform, 22-Lower outer sealing ring, 23-Lower inner sealing ring, 24-Conductive assembly, 241-Electrification pin, 242-Annular copper strip, 25-Lower magnetic suction assembly, 251-Magnet, 252-L-shaped pressure frame, 253-Fasting pin, 26-Lower cathode contact assembly, 261-Elastic support, 262-Cathode conductive sheet. Detailed Implementation

[0025] like Figures 1-4 As shown, an anti-edge over-plating electroplating fixture includes an upper clamping assembly 1 and a lower clamping assembly 2 corresponding to the upper clamping assembly 1. The lower clamping assembly 2 includes an annular lower base plate 21, a lower outer sealing ring 22 disposed on the outer edge end face of the annular lower base plate 21, a lower inner sealing ring 23 disposed on the inner edge end face of the annular lower base plate 21, and a conductive assembly 24, a lower magnetic suction assembly 25, and a lower cathode contact assembly 26 disposed sequentially from the outside to the inside between the lower outer sealing ring 22 and the lower inner sealing ring 23. Each corner of the bottom plate 21 extends toward its two adjacent sides to form a plurality of magnet mounting holes 211. The lower magnetic suction assembly 25 is disposed on the plurality of magnet mounting holes 211. The upper clamping assembly 1 includes an annular upper pressure plate 11 and an upper inner sealing ring 13 disposed on the inner edge end face of the annular upper pressure plate 11. The upper clamping assembly 1 and the lower clamping assembly 2 are clamped together by magnetic force, so that the upper inner sealing ring 13 and the lower inner sealing ring 23 are pressed together on the inner edge of the upper and lower surfaces of the product to be electroplated.

[0026] The conductive component 24 includes power-connecting pins 241 and annular copper strips 242 that are threaded into the four corners of the annular lower base plate 21, and the annular copper strips 242 are electrically connected to each of the power-connecting pins 241.

[0027] The lower cathode contact assembly 26 includes an elastic support 261 and a cathode conductive sheet 262. The elastic support 261 is attached to the annular lower base plate 21, and the cathode conductive sheet 262 is attached to the elastic support 261 and maintains contact with the annular copper strip 242 under the support of the elastic support 261.

[0028] The elastic support 261 is double-sided adhesive foam, and the cathode conductive sheet 262 is a cathode copper sheet.

[0029] The number of lower cathode contact assemblies 26 corresponds to the number of sides of the annular lower base plate 21, and the middle of the elastic support 261 and the cathode conductive sheet 262 of each lower cathode contact assembly 26 extends toward the annular copper strip 242.

[0030] The lower magnetic suction assembly 25 includes a plurality of magnets 251, an L-shaped pressure frame 252 and a plurality of fastening pins 253. Each magnet 251 is housed in its respective magnet mounting hole platform 211. The L-shaped pressure frame 252 covers the plurality of magnet mounting hole platforms 211. Each fastening pin 253 passes through the magnet mounting hole platform 211 and the magnet 251 in sequence and is threadedly fixed to the L-shaped pressure frame 252.

[0031] The upper clamping assembly 1 further includes an upper outer sealing ring 12, an upper magnetic attraction assembly 14, and an upper cathode contact assembly 15 disposed on the outer edge end face of the annular upper pressure plate 11. The upper magnetic attraction assembly 14 and the upper cathode contact assembly 15 are disposed on the annular upper pressure plate 11 and located between the upper outer sealing ring 12 and the upper inner sealing ring 13. When the upper clamping assembly 1 is clamped with the lower clamping assembly 2, the upper magnetic attraction assembly 14 contacts the lower magnetic attraction assembly 25, and the outward extensions of the upper cathode contact assembly 15 and the lower cathode contact assembly 26 both contact the annular copper strip 242. The inner sides of the upper cathode contact assembly 15 and the lower cathode contact assembly 26 cooperate to clamp the edge of the product to be electroplated.

[0032] The upper outer sealing ring 12, upper inner sealing ring 13, lower outer sealing ring 22, and lower inner sealing ring 23 are all sealing rubber rings.

[0033] When the upper clamping assembly 1 and the lower clamping assembly 2 clamp the product to be electroplated, the upper inner sealing ring 13 and the lower inner sealing ring 23 form a sealed area that isolates the electroplating environment by enclosing the inner side of the edge of the product to be electroplated. The surfaces of the product to be electroplated where the upper cathode contact assembly 15 and the lower cathode contact assembly 26 are located are within the sealed area that isolates the electroplating environment.

[0034] In summary, the specific embodiments of this utility model are as follows: First, place the product to be electroplated on the lower cathode contact assembly 26 of the lower clamping assembly 2, so that the edge area of ​​the product is in contact with the cathode conductive sheet 262. At this time, the lower inner sealing ring 23 of the annular lower base plate 21 is located on the inner side below the edge of the product. Next, the annular upper pressure plate 11 of the upper clamping assembly 1 is aligned with the annular lower bottom plate 21 of the lower clamping assembly 2. Through the magnetic force between the upper magnetic suction assembly 14 and the lower magnetic suction assembly 25, the upper clamping assembly 1 and the lower clamping assembly 2 automatically move towards each other and fit tightly together. During this process, the upper inner sealing ring 13 set on the annular upper pressure plate 11 is pressed against the inner side of the upper surface edge of the product, while the lower inner sealing ring 23 is pressed against the inner side of the lower surface edge of the product. Together, they form the first sealing barrier on the inner side of the product edge. As the clamping action is completed, the upper outer sealing ring 12 and the lower outer sealing ring 22 fit tightly together, forming a second sealing barrier on the outer side of the product edge. At the same time, the outward extensions of the upper cathode contact assembly 15 and the lower cathode contact assembly 26 both contact the annular copper strip 242 and stabilize the edge of the product to be electroplated through their inner sides. Finally, the upper inner sealing ring 13 and the lower inner sealing ring 23 press against the inner side of the edge of the product to be electroplated, and the upper outer sealing ring 12 and the lower outer sealing ring 22 press against the outer side of the edge of the product to be electroplated, together forming an annular sealing area that completely isolates the electroplating environment between the clamp and the product. During electroplating, an external power source conducts current to annular copper strip 242 through connecting pin 241. Annular copper strip 242 distributes current evenly to each cathode conductive sheet 262. The current is conducted through cathode conductive sheet 262 to the exposed edge area of ​​the product to be electroplated. Electroplating deposition is completed under the action of electric field. Since the product surface where the upper cathode contact assembly 15 and the lower cathode contact assembly 26 are located is completely sealed in the isolation area, the electroplating solution cannot penetrate into the area, thereby effectively preventing overplating at the product edge. After the electroplating process is completed, external force is applied to separate the upper clamping component 1 and the lower clamping component 2, and the electroplated product can be taken out. Throughout the process, the elastic support provided by the double-sided adhesive foam 261 ensures close contact between the cathode conductive sheet 262 and the product surface, while the L-shaped pressure frame 252 ensures the uniformity and stability of the magnetic attraction force, thus guaranteeing the reliability of the sealing effect.

[0035] The above description is only the optimal solution embodiment of this utility model and is not intended to limit this utility model. Various modifications or substitutions made by those skilled in the art to this utility model without departing from the essence and protection scope of this utility model should also be within the protection scope of this utility model.

Claims

1. A plating fixture for preventing edge over-plating, characterized in that: The assembly includes an upper clamping component (1) and a lower clamping component (2) corresponding to the upper clamping component (1). The lower clamping component (2) includes an annular lower base plate (21), a lower outer sealing ring (22) disposed on the outer edge end face of the annular lower base plate (21), a lower inner sealing ring (23) disposed on the inner edge end face of the annular lower base plate (21), and a conductive component (24), a lower magnetic attraction component (25), and a lower cathode contact component (26) disposed sequentially from the outside to the inside between the lower outer sealing ring (22) and the lower inner sealing ring (23). 1) Each corner extends to its two adjacent sides to form a plurality of magnet mounting holes (211). The lower magnetic suction assembly (25) is disposed on the plurality of magnet mounting holes (211). The upper clamping assembly (1) includes an annular upper pressure plate (11) and an upper inner sealing ring (13) disposed on the inner edge end face of the annular upper pressure plate (11). The upper clamping assembly (1) and the lower clamping assembly (2) are clamped together by magnetic force, so that the upper inner sealing ring (13) and the lower inner sealing ring (23) are pressed together on the inner edge of the upper and lower surfaces of the product to be electroplated.

2. The anti-edge over-plating electroplating fixture according to claim 1, characterized in that: The conductive component (24) includes power-connecting pins (241) threaded to the four corners of the annular lower base plate (21) and an annular copper strip (242), the annular copper strip (242) being electrically connected to each of the power-connecting pins (241).

3. The anti-edge over-plating electroplating fixture according to claim 2, characterized in that: The lower cathode contact assembly (26) includes an elastic support (261) and a cathode conductive sheet (262). The elastic support (261) is attached to the annular lower base plate (21), and the cathode conductive sheet (262) is attached to the elastic support (261) and maintains contact with the annular copper strip (242) under the support of the elastic support (261).

4. The anti-edge over-plating electroplating fixture according to claim 3, characterized in that: The elastic support (261) is double-sided adhesive foam, and the cathode conductive sheet (262) is a cathode copper sheet.

5. The anti-edge over-plating electroplating fixture according to claim 3, characterized in that: The number of the lower cathode contact assemblies (26) corresponds to the number of sides of the annular lower base plate (21), and the middle of the elastic support (261) and the cathode conductive sheet (262) of each lower cathode contact assembly (26) extends toward the annular copper strip (242).

6. The anti-edge over-plating electroplating fixture according to claim 1, characterized in that: The lower magnetic suction assembly (25) includes a plurality of magnets (251), an L-shaped pressure frame (252) and a plurality of fastening pins (253). Each magnet (251) is housed in its respective magnet mounting hole platform (211). The L-shaped pressure frame (252) covers the plurality of magnet mounting hole platforms (211). Each fastening pin (253) passes through the magnet mounting hole platform (211) and the magnet (251) in sequence and is threadedly fixed to the L-shaped pressure frame (252).

7. The anti-edge over-plating electroplating fixture according to claim 2, characterized in that: The upper clamping assembly (1) further includes an upper outer sealing ring (12), an upper magnetic suction assembly (14), and an upper cathode contact assembly (15) disposed on the outer edge end face of the annular upper pressure plate (11). The upper magnetic suction assembly (14) and the upper cathode contact assembly (15) are disposed on the annular upper pressure plate (11) and located between the upper outer sealing ring (12) and the upper inner sealing ring (13). When the upper clamping assembly (1) is clamped with the lower clamping assembly (2), the upper magnetic suction assembly (14) contacts the lower magnetic suction assembly (25), and the outward extensions of the upper cathode contact assembly (15) and the lower cathode contact assembly (26) both contact the annular copper strip (242). The inner sides of the upper cathode contact assembly (15) and the lower cathode contact assembly (26) cooperate to clamp the edge of the product to be electroplated.

8. The anti-edge over-plating electroplating fixture according to claim 7, characterized in that: The upper outer sealing ring (12), upper inner sealing ring (13), lower outer sealing ring (22) and lower inner sealing ring (23) are all sealing rubber rings.

9. A plating fixture for preventing edge over-plating according to claim 7, characterized in that: When the upper clamping assembly (1) and the lower clamping assembly (2) clamp the product to be electroplated, the upper inner sealing ring (13) and the lower inner sealing ring (23) form a sealed area that isolates the electroplating environment by enclosing the inner side of the edge of the product to be electroplated. The surfaces of the product to be electroplated where the upper cathode contact assembly (15) and the lower cathode contact assembly (26) are located are within the sealed area of ​​the isolated electroplating environment.

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