A tin-silver electroplating tooling for semiconductor devices

Abstract

The utility model provides a kind of tin silver electroplating frock of semiconductor device, it is related to semiconductor device frock field, including device bottom plate, jacking plate, positioning disc one and positioning disc two, device bottom plate top side is fixedly connected concave plate one and concave plate two respectively, and concave plate one and concave plate two top end are equipped with the semiconductor bearing plate for placing semiconductor device, two hinged pedestals one are equipped in the recess of concave plate one, two hinged pedestals one are equipped with hinged shaft one between, hinged shaft one circumferential outside rotation sleeve set L-shaped positioning plate one, and L-shaped positioning plate one and positioning disc one are equipped with buffer assembly one between.Synchronous movement of L-shaped positioning plate one and L-shaped positioning plate two, it is limited to ensure that electric positioning disc one to semiconductor device side edge;Positioning disc two is pressed to the top side of circuit board in the same time formation constraint, avoid the position deviation of circuit board lower pressing plate caused by action difference in traditional side first or top first, it is convenient for subsequent tin silver electroplating.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device tooling, and in particular to a tin-silver electroplating tooling for semiconductor devices. Background Technology

[0002] The tin-silver electroplating fixture for semiconductor devices is a core piece of equipment used to achieve high-precision tin-silver alloy plating on the surface of semiconductor components. It is widely used in key processes such as chip packaging, wire bonding, and solder ball connection.

[0003] In existing tooling, the side stops and top pressure plates are controlled by independent drive units: the side stops are typically adjusted manually with knobs, driven by individual cylinders, or driven by micro motors; the top pressure plates rely on another set of independent pneumatic push rods, manual levers, or electric modules. There is no mechanical linkage structure or synchronous control logic between the two. When releasing the fixation, the operator needs to perform two steps: first, by using buttons, knobs, or manual adjustment, the side stops are opened outward to release the lateral constraint of the semiconductor device; then, the drive unit of the top pressure plate is operated to lift it upward to release the longitudinal compression of the semiconductor device. For simple tooling with low automation, it may even be necessary to manually adjust the side stops on both sides one by one, and then operate the top pressure plate separately. The operation process is cumbersome and prone to delays in action connection.

[0004] Therefore, it is necessary to provide a new tin-silver electroplating fixture for semiconductor devices to solve the above-mentioned technical problems. Utility Model Content

[0005] To solve the above-mentioned technical problems, this utility model provides a tin-silver electroplating fixture for semiconductor devices.

[0006] This utility model provides a tin-silver electroplating fixture for semiconductor devices, including a base plate, a lifting plate, a first positioning disk, and a second positioning disk. Concave plates one and two are fixedly connected to the top sides of the base plate, respectively. A semiconductor carrier plate for placing semiconductor devices is provided between the tops of the first and second concave plates. Two hinged bases one are provided in the groove of the first concave plate, and a hinge shaft one is provided between the two hinged bases one. An L-shaped positioning plate one is rotatably sleeved on the outer circumference of the hinge shaft one. A buffer is provided between the L-shaped positioning plate one and the first positioning disk. Component 1, a guide rod is provided between the inner walls of the concave plate 2 and the groove. A guide arc groove is opened on the L-shaped positioning plate 2. A buffer component 2 is provided between the L-shaped positioning plate 2 and the positioning disc 2. A guide rod is slidably provided inside the guide arc groove. A lifting component is provided between the device base plate and the semiconductor carrier plate for driving the lifting plate to rise and fall. When the lifting plate rises, it drives the L-shaped positioning plate 1 and L-shaped positioning plate 2 away from the semiconductor carrier plate. The L-shaped positioning plate 1 and L-shaped positioning plate 2 respectively drive the positioning disc 1 and positioning disc 2 to move away from the conductor carrier plate simultaneously. When the lifting plate falls, it drives the L-shaped positioning plate 1 and L-shaped positioning plate 2 away from the semiconductor carrier plate to release the fixation of the semiconductor device. The L-shaped positioning plate 1 and L-shaped positioning plate 2 respectively drive the positioning disc 1 and positioning disc 2 to move closer to the conductor carrier plate to fix the semiconductor device.

[0007] Preferably, the lifting assembly includes a telescopic electric cylinder and four light rods. Four light rods are respectively provided between the four corners of the device base plate and the semiconductor carrier plate. The lifting plate is slidably connected to the outer side of the four light rods. The output end of the telescopic electric cylinder is connected to the lifting plate.

[0008] Preferably, the buffer assembly includes a spring rod, an anti-detachment plate, and a buffer spring. The vertical end of the L-shaped positioning plate is slidably connected to the spring rod. The anti-detachment plate is sleeved on the outer circumference of one end of the spring rod. The other end of the spring rod is fixedly connected to the positioning disc. The buffer spring is sleeved on the outer circumference of the spring rod. The buffer spring is located between the positioning disc and the L-shaped positioning plate. The horizontal end of the L-shaped positioning plate is provided with an auxiliary assembly.

[0009] Preferably, the auxiliary component includes a reset spring and a connecting block. The bottom end of the horizontal end of the L-shaped positioning plate is fixedly connected to the connecting block. The connecting block cooperates with the lifting plate. A reset spring is provided between the top end of the horizontal end of the L-shaped positioning plate and the bottom end of the semiconductor carrier plate.

[0010] Preferably, the second buffer assembly includes a second spring rod, a second anti-detachment plate, a second positioning disc, and a second buffer spring. The second L-shaped positioning plate is slidably connected to the second spring rod at its horizontal end. The second anti-detachment plate is sleeved on the outer side of the top circumference of the second spring rod. The second positioning disc is fixedly connected to the bottom end of the second spring rod. The second buffer spring is sleeved on the outer side of the circumference of the second spring rod. The second buffer spring is located between the second positioning disc and the second L-shaped positioning plate. The second L-shaped positioning plate has a hinge assembly at its inclined end.

[0011] Preferably, the hinge assembly includes two hinge bases and a hinge shaft. The two hinge bases are located on the side of the lifting plate away from the top of the connecting round block. A hinge shaft is provided between the two hinge bases. An L-shaped positioning plate is rotatably sleeved on the outer circumference of the hinge shaft.

[0012] Compared with related technologies, the tin-silver electroplating fixture for semiconductor devices provided by this utility model has the following advantages: When the lifting plate descends, L-shaped positioning plates 1 and 2 move positioning discs 1 and 2 closer to the semiconductor device to fix the sides and top of the semiconductor device. When the lifting plate rises, L-shaped positioning plates 1 and 2 move positioning discs 1 and 2 away from the semiconductor device to release the fixation on the sides and top of the circuit board. The synchronous movement of L-shaped positioning plates 1 and 2 ensures that the positioning discs limit the sides of the semiconductor device. The pressing of positioning disc 2 on the top of the circuit board forms a constraint at the same time, avoiding the displacement of the circuit board pressure plate position caused by the time difference of the traditional side-first-top or top-first-side movement, which is convenient for subsequent tin-silver electroplating. Attached Figure Description

[0013] Figure 1 A schematic diagram of a preferred embodiment of a tin-silver electroplating fixture for a semiconductor device provided by this utility model; Figure 2 for Figure 1 The diagram shows the structure of buffer component one. Figure 3 for Figure 1 The diagram shows the structure of the lifting assembly. Figure 4 for Figure 1 The schematic diagram of the second buffer component is shown.

[0014] The diagram is labeled as follows: 1. Device base plate; 101. Smooth rod; 2. Concave plate one; 201. Hinge base one; 202. Hinge shaft one; 3. Concave plate two; 301. Guide rod; 4. Telescopic electric cylinder; 5. Lifting plate; 501. Hinge base two; 502. Hinge shaft two; 6. Semiconductor carrier plate; 601. Pin positioning hole; 7. L-shaped positioning plate one; 701. Spring rod one; 702. Anti-detachment plate one; 703. Buffer spring one; 704. Positioning disc one; 705. Reset spring; 706. Connecting block; 8. L-shaped positioning plate two; 801. Guide arc groove; 802. Buffer spring two; 803. Anti-detachment plate two; 804. Buffer spring two; 805. Positioning disc two. Detailed Implementation

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0016] Please refer to the following: Figure 1-4 ,in, Figure 1 A schematic diagram of a preferred embodiment of a tin-silver electroplating fixture for a semiconductor device provided by this utility model; Figure 2 for Figure 1 The diagram shows the structure of buffer component one. Figure 3 for Figure 1 The diagram shows the structure of the lifting assembly. Figure 4 for Figure 1 The schematic diagram of the second buffer component is shown.

[0017] In the specific implementation process, such as Figure 1-4 As shown, the device includes a base plate 1, a lifting plate 5, a positioning disc 704, and a positioning disc 805. Concave plates 2 and 3 are fixedly connected to the top sides of the base plate 1, respectively. A semiconductor carrier plate 6 for placing semiconductor devices is provided between the tops of the concave plates 2 and 3. Two hinge bases 201 are provided in the groove of the concave plate 2, and a hinge shaft 202 is provided between the two hinge bases 201. An L-shaped positioning plate 7 is rotatably fitted around the outer circumference of the hinge shaft 202. A buffer assembly is provided between the L-shaped positioning plate 7 and the positioning disc 704. The concave plate 805... A guide rod 301 is provided between the inner walls. A guide arc groove 801 is opened on the L-shaped positioning plate 2 8. A buffer assembly 2 is provided between the L-shaped positioning plate 2 8 and the positioning disc 2 805. The guide rod 301 is slidably provided inside the guide arc groove 801. A lifting assembly for driving the lifting plate 5 to rise and fall is provided between the device base plate 1 and the semiconductor carrier plate 6. When the lifting plate 5 rises, it drives the L-shaped positioning plate 1 7 and the L-shaped positioning plate 2 8 away from the semiconductor carrier plate 6. The L-shaped positioning plate 1 7 and the L-shaped positioning plate 2 8 respectively drive the positioning disc 1 704 and the positioning disc 2 805 to move away from the conductor carrier plate 6 simultaneously. When the lifting plate 5 falls, it drives the L-shaped positioning plate 1 7 and the L-shaped positioning plate 2 8 away from the semiconductor carrier plate 6 to release the fixation of the semiconductor device. The L-shaped positioning plate 1 7 and the L-shaped positioning plate 2 8 respectively drive the positioning disc 1 704 and the positioning disc 2 805 to move closer to the conductor carrier plate 6 to fix the semiconductor device.

[0018] In the specific implementation process, such as Figure 2 and Figure 4As shown, the system includes a buffer assembly consisting of a spring rod 701, an anti-detachment plate 702, and a buffer spring 703. The vertical end of an L-shaped positioning plate 7 is slidably connected to the spring rod 701. An anti-detachment plate 702 is fitted around the outer circumference of one end of the spring rod 701. The other end of the spring rod 701 is fixedly connected to a positioning disc 704. A buffer spring 703 is fitted around the outer circumference of the spring rod 701 and is positioned between the positioning disc 704 and the L-shaped positioning plate 7. An auxiliary assembly is located at the horizontal end of the L-shaped positioning plate 7. This auxiliary assembly includes a reset spring 705 and a connecting block 706. The bottom end of the horizontal end of the L-shaped positioning plate 7 is fixedly connected to the connecting block 706, which cooperates with a lifting plate 5. A reset spring 705 is located between the top end of the horizontal end of the L-shaped positioning plate 7 and the bottom end of the semiconductor carrier plate 6. Component 2 includes a spring rod 802, an anti-detachment plate 803, a positioning disc 805, and a buffer spring 804. The horizontal end of the L-shaped positioning plate 8 is slidably connected to the spring rod 802. The anti-detachment plate 803 is sleeved on the outer circumference of the top of the spring rod 802. The bottom end of the spring rod 802 is fixedly connected to the positioning disc 805. The buffer spring 804 is sleeved on the outer circumference of the spring rod 802. The buffer spring 804 is located between the positioning disc 805 and the L-shaped positioning plate 8. The inclined end of the L-shaped positioning plate 8 is provided with a hinge assembly, which includes two hinge bases 501 and a hinge shaft 502. The two hinge bases 501 are located on the side of the lifting plate 5 away from the top of the connecting block 706. The hinge shaft 502 is located between the two hinge bases 501. The L-shaped positioning plate 8 is rotatably sleeved on the outer circumference of the hinge shaft 502.

[0019] When the positioning disc 704 moves closer to the side of the semiconductor device, the elastic buffer spring 703 prevents the rigid fixation from squeezing and damaging the side of the semiconductor device, effectively protecting the semiconductor device. During the downward pressure of positioning disk 805, buffer spring 804 elastically buffers and dissipates rigid pressure, preventing direct compression of solder joints and surface-mount components on the top side of the semiconductor device. Simultaneously, it prevents pressure from being transmitted to the sides, causing board deformation or component detachment, thus comprehensively protecting the integrity of the semiconductor device. In the specific implementation process, such as Figure 3 As shown, the lifting assembly includes a telescopic electric cylinder 4 and four light rods 101. The four light rods 101 are respectively provided between the four corners of the device base plate 1 and the semiconductor carrier plate 6. The lifting plate 5 is slidably connected to the outer side of the four light rods 101. The output end of the telescopic electric cylinder 4 is connected to the lifting plate 5.

[0020] The working principle provided by this utility model is as follows: the semiconductor device is placed on the semiconductor carrier plate 6, and multiple pins on both sides of the semiconductor device are inserted into the semiconductor device 601. The telescopic electric cylinder 4 is activated to push the lifting plate 5 to rise along the four light rods 101, and the following steps are generated simultaneously.

[0021] Step 1: When the lifting plate 5 rises, it pushes the connecting block 706 and the L-shaped positioning plate 7 to rotate away from the semiconductor carrier plate 6 around the hinge shaft 202. Then, the L-shaped positioning plate 7 simultaneously squeezes the reset spring 705, so that the L-shaped positioning plate 7 drives the positioning disc 704 away from the side of the semiconductor device through the spring rod 701, thereby releasing the fixation on the side of the semiconductor device. The above operation is performed in reverse. The reset spring 705 pushes the L-shaped positioning plate 7 to reset. Then, the L-shaped positioning plate 7 drives the positioning disc 704 to fix the side of the semiconductor device through the spring rod 701.

[0022] Step Two: When the lifting plate 5 rises, the L-shaped positioning plate 8 is lifted by the two hinged bases 501. The auxiliary guide between the guide groove 801 and the guide rod 301 causes the L-shaped positioning plate 8 to rise to the bend and rotate away from the semiconductor carrier plate 6. Then, the L-shaped positioning plate 8, through the spring rod 802, drives the positioning disc 805 away from the top side of the semiconductor device, thereby releasing the fixation on the top side of the semiconductor device. The above operation is then performed in reverse. The L-shaped positioning plate 8, through the spring rod 802, drives the positioning disc 805 to fix the top side of the semiconductor device. The circuits and controls involved in this utility model are all existing technologies, and will not be described in detail here.

[0023] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A tin-silver electroplating fixture for semiconductor devices, characterized in that, The device includes a base plate (1), a lifting plate (5), a positioning disc 1 (704), and a positioning disc 2 (805). The top two sides of the base plate (1) are respectively fixedly connected to a concave plate 1 (2) and a concave plate 2 (3). A semiconductor carrier plate (6) for placing semiconductor devices is provided between the tops of the concave plate 1 (2) and the concave plate 2 (3). Two hinge bases 1 (201) are provided in the groove of the concave plate 1 (201). A hinge shaft 1 (202) is provided between the two hinge bases 1 (201). An L is rotatably sleeved on the outer circumference of the hinge shaft 1 (202). A buffer assembly is provided between the L-shaped positioning plate (7) and the positioning disc (704), and a guide rod (301) is provided between the inner walls of the groove of the concave plate (3). A guide arc groove (801) is opened on the L-shaped positioning plate (8), and a buffer assembly is provided between the L-shaped positioning plate (8) and the positioning disc (805). A guide rod (301) is slidably provided inside the guide arc groove (801). A lifting assembly for driving the lifting plate (5) to rise and fall is provided between the device base plate (1) and the semiconductor carrier plate (6). When the lifting plate (5) rises, it drives the L-shaped positioning plate one (7) and the L-shaped positioning plate two (8) away from the semiconductor carrier plate (6). The L-shaped positioning plate one (7) and the L-shaped positioning plate two (8) drive the positioning disc one (704) and the positioning disc two (805) away from the conductor carrier plate (6) in sync. When the lifting plate (5) falls, it drives the L-shaped positioning plate one (7) and the L-shaped positioning plate two (8) away from the semiconductor carrier plate (6) to release the fixation of the semiconductor device. The L-shaped positioning plate one (7) and the L-shaped positioning plate two (8) drive the positioning disc one (704) and the positioning disc two (805) in sync to approach the conductor carrier plate (6) to fix the semiconductor device.

2. The tin-silver electroplating fixture for a semiconductor device according to claim 1, characterized in that, The lifting assembly includes a telescopic electric cylinder (4) and four light rods (101). Four light rods (101) are respectively provided between the four corners of the device base plate (1) and the semiconductor carrier plate (6). The lifting plate (5) is slidably connected to the outer side of the four light rods (101). The output end of the telescopic electric cylinder (4) is connected to the lifting plate (5).

3. The tin-silver electroplating fixture for a semiconductor device according to claim 2, characterized in that, The buffer assembly includes a spring rod (701), an anti-detachment plate (702), and a buffer spring (703). The vertical end of the L-shaped positioning plate (7) is slidably connected to the spring rod (701). The anti-detachment plate (702) is sleeved on the outer circumference of one end of the spring rod (701). The other end of the spring rod (701) is fixedly connected to the positioning disc (704). The buffer spring (703) is sleeved on the outer circumference of the spring rod (701). The buffer spring (703) is located between the positioning disc (704) and the L-shaped positioning plate (7). The horizontal end of the L-shaped positioning plate (7) is provided with an auxiliary assembly.

4. The tin-silver electroplating fixture for a semiconductor device according to claim 3, characterized in that, The auxiliary component includes a reset spring (705) and a connecting block (706). The bottom of the horizontal end of the L-shaped positioning plate (7) is fixedly connected to the connecting block (706). The connecting block (706) cooperates with the lifting plate (5). The top of the horizontal end of the L-shaped positioning plate (7) and the bottom of the semiconductor carrier plate (6) are provided with a reset spring (705).

5. The tin-silver electroplating fixture for a semiconductor device according to claim 4, characterized in that, The second buffer assembly includes a second spring rod (802), a second anti-detachment plate (803), a second positioning disc (805), and a second buffer spring (804). The horizontal end of the second L-shaped positioning plate (8) is slidably connected to the second spring rod (802). The second anti-detachment plate (803) is sleeved on the outer side of the top circumference of the second spring rod (802). The bottom end of the second spring rod (802) is fixedly connected to the second positioning disc (805). The second buffer spring (804) is sleeved on the outer side of the circumference of the second spring rod (802). The second buffer spring (804) is located between the second positioning disc (805) and the second L-shaped positioning plate (8). The oblique end of the second L-shaped positioning plate (8) is provided with a hinge assembly.

6. The tin-silver electroplating fixture for a semiconductor device according to claim 5, characterized in that, The hinge assembly includes two hinge bases (501) and a hinge shaft (502). The two hinge bases (501) are located on the side of the lifting plate (5) away from the top of the connecting round block (706). The hinge shaft (502) is located between the two hinge bases (501). An L-shaped positioning plate (8) is rotatably sleeved on the outer circumference of the hinge shaft (502).

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