Electroplating equipment for PCB production

Abstract

The utility model provides a kind of electroplating equipment for PCB production, more particularly in the technical field of equipment transportation, to solve the technical problem of the existing technology that water accumulation in hole before PCB plate enters slot causes electroplating quality defect.The device, high-pressure clean air blowing system module is provided with two groups, respectively corresponding to the installation in the slot (1) of each plating tank The slot station side and the slot station side;Each high-pressure clean air blowing system module includes two groups of respectively corresponding PCB plate front and back independent running blowing unit;Gantry type transmission module is used to drive PCB plate along gantry line horizontal transfer, and realizes vertical lifting;PLC control system module is electrically connected with high-pressure clean air blowing system module, gantry type transmission module respectively.The device realizes water removal before PCB plate enters slot, leakage plating, recycling plating solution after slot reduces environmental protection cost, while ensuring that structure and gantry line process are adapted without interference.

Description

Technical Field

[0001] This utility model relates to the field of equipment transportation technology, and more specifically, to an electroplating equipment for PCB board production. Background Technology

[0002] Electroplating is one of the core processes in PCB manufacturing. Its function is to deposit a metal layer on the surface and inside the holes of the PCB to achieve electrical connection, signal transmission, and corrosion protection. As electronic devices become smaller and denser, the hole diameter of PCBs is gradually decreasing and the blind slot structure is increasing, which greatly increases the requirements for electroplating quality. At the same time, it also places higher demands on plating solution recovery and wastewater reduction during the electroplating process.

[0003] Currently, the mainstream process in the industry is gantry electroplating for mass production of PCBs. This process uses a gantry-type transmission module to transport the PCB horizontally and vertically between multiple plating tanks, sequentially completing the electroplating of different metal layers. It boasts advantages such as high automation and high production efficiency. However, in practical applications, existing gantry electroplating equipment still suffers from a technical problem: water accumulation in the holes of the PCB before it enters the plating tank leads to plating quality defects. Specifically, before entering the plating tank, the PCB needs to undergo pretreatment cleaning processes (such as degreasing, pickling, and washing). After cleaning, moisture easily remains on its surface, especially in small holes and at the bottom of blind tanks. Existing equipment does not have an effective water removal structure to address this problem, relying solely on natural descent, which makes it difficult to completely remove water from the holes and small areas to be plated. When a PCB with accumulated water is vertically immersed in the plating tank, the water in the holes dilutes the surrounding plating solution, resulting in uneven concentration of the plating solution within the holes. At the same time, the "water column resistance" formed by the accumulated water hinders the smooth entry of the plating solution into the holes, causing insufficient metal layer deposition within the holes, or even localized missed plating, seriously affecting the electrical performance and reliability of the PCB. Utility Model Content

[0004] The purpose of this utility model is to provide an electroplating equipment for PCB board production, which can solve the technical problem of electroplating quality defects caused by water accumulation in the holes before the PCB board enters the tank in the prior art.

[0005] The embodiments of this utility model are achieved through the following technical solutions: An electroplating equipment for PCB board production includes multiple plating tanks and a gantry transmission module, as well as a high-pressure clean air blowing system module and a PLC control system module; The high-pressure clean air blowing system module is provided in two sets, which are respectively installed on the inlet station side and the outlet station side of each plating tank arranged along the horizontal transfer path of the gantry line; each high-pressure clean air blowing system module includes two sets of independently operating blowing units corresponding to the front and back of the PCB board respectively. The gantry-type transmission module is used to drive the PCB board to move horizontally along the gantry line and to achieve vertical lifting and lowering, thereby completing different processes of multiple plating tanks in sequence. The PLC control system module is electrically connected to the high-pressure clean air blowing system module and the gantry transmission module, respectively, and photoelectric sensors that are connected to the PLC control system module are respectively provided on the inlet and outlet sides of the plating tank.

[0006] In some embodiments, the plating tank is provided with an inlet station side and an outlet station side along the horizontal transfer direction of the gantry line. The inside of the plating tank opening is provided with two sides corresponding to the inlet station side and the outlet station side, forming an installation area. The installation area is integrally connected with the edge of the tank opening and is used to install the blowing unit of the high-pressure clean air blowing system module on the corresponding side.

[0007] In some embodiments, the edge of the plating tank extends inward at an angle to form a liquid guiding slope, which smoothly transitions with the tank wall; a plating solution circulation interface is provided through the bottom of the plating tank, which is connected to an external collection device; a liquid level sensor is fixed on the outside of the plating tank wall, the detection end of the liquid level sensor extends through the tank wall into the tank, and the signal end is electrically connected to the PLC control system module.

[0008] In some embodiments, two sets of blowing units of each high-pressure clean air blowing system module are installed in the installation area on the corresponding side, and a channel is formed between the two sets of blowing units for the PCB board to be vertically lifted and lowered through; each set of blowing units includes an air source supply component, a drying and filtering component, and a blowing duct connected in sequence; the air outlet of the air source supply component and the air inlet of the drying and filtering component are connected through a sealed pipe, and the drying and filtering component is provided with an oil removal filter layer, a water removal filter layer, and a dust removal filter layer connected in series along the airflow direction; multiple sets of nozzles are provided on the blowing duct, and the nozzles are spaced apart along the length of the blowing duct, and the spray direction of the nozzles is towards the surface of the PCB board in the channel.

[0009] In some embodiments, each of the blowing units is equipped with a precision pressure regulating valve and a flow meter connected in series to the blowing pipe of the PLC control system module; the adjustment range of the precision pressure regulating valve of the blowing unit on the inlet station side is greater than the adjustment range of the precision pressure regulating valve of the blowing unit on the outlet station side.

[0010] In some embodiments, the gantry transmission module includes a gantry frame, a traveling body, a lifting drive assembly, and a titanium alloy bracket; two gantry frames are horizontally positioned above the plating tank, and the traveling body can move horizontally along the guide rails of the gantry frames; the lifting drive assembly is fixed below the traveling body, and the bracket is connected to the output end of the lifting drive assembly, enabling it to be vertically lifted and lowered with the lifting drive assembly; the bracket adopts an L-shaped suspension arm, one end of which is vertically fixed to the lifting drive assembly, and the other end uses elastic grippers to hold the non-plating area of ​​the PCB board edge, and the vertical length of the bracket is adapted to the liquid depth in the plating tank.

[0011] In some embodiments, the PLC control system module includes a PLC controller and a touch screen. The touch screen is bidirectionally connected to the PLC controller via a communication line, and the PLC controller has a parameter storage unit.

[0012] In some embodiments, the signal input terminal of the PLC controller is also electrically connected to the air source pressure sensor, the drying filter assembly differential pressure sensor, and the crane position sensor, respectively; the air source pressure sensor is installed at the air outlet of the air source supply assembly, the two ends of the drying filter assembly differential pressure sensor are respectively connected to the air inlet and air outlet of the drying filter assembly, and the crane position sensor is installed at the gantry entry station and the gantry exit station of the gantry frame.

[0013] In some embodiments, an auxiliary protection module is also included, which includes a protective cover and a cleaning interface; the protective cover has a semi-enclosed shell structure and is respectively installed under the two sets of blower units; the cleaning interface is located at the end of the blower duct and is sealed by a plug.

[0014] The technical solution of this utility model embodiment has at least the following advantages and beneficial effects: 1. This device is equipped with two sets of high-pressure clean air blowing units covering the front and back of the PCB board on the side of each plating tank entry station and the side of each plating tank exit station. It is combined with a gantry-type transmission module that can drive the PCB board to move horizontally and lift vertically, and a PLC control system that is electrically connected to both and linked with the sensors. This device can remove water and prevent plating leakage before the PCB board enters the tank, and recycle the plating solution after exiting the tank to reduce environmental protection costs. At the same time, it ensures that the structure is compatible with the gantry line process without interference. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 A side view of an electroplating device for PCB board production provided in an embodiment of this utility model; Figure 2 This is a schematic diagram of the internal structure of the plating tank provided in an embodiment of the present invention; Figure 3 for Figure 2 A magnified view of part A in the middle; Figure 4 This is a structural diagram of the plating tank in the inner mounting area of ​​an embodiment of the present invention.

[0017] Icons: 1. Plating tank; 2. Photoelectric sensor; 3. Installation area; 4. Liquid guide slope; 5. Plating solution circulation interface; 6. Liquid level sensor; 7. Air supply component; 8. Air blowing duct; 9. Oil removal filter layer; 10. Water removal filter layer; 11. Dust removal filter layer; 12. Housing; 13. Removable end cap; 14. Nozzle; 15. Pipeline; 16. Pressure regulating valve; 17. Flow meter; 18. Gantry frame; 19. Crane body; 20. Hanger; 21. Guide rail; 22. Slider; 23. Servo motor; 24. Lifting drive component; 25. Elastic gripper; 26. Independent control cabinet; 28. Air source pressure sensor; 29. ​​Differential pressure sensor; 30. Crane position sensor; 31. Protective cover; 32. Cleaning interface; 33. Plug. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0019] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0020] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0021] In the description of this utility model, it should be noted that if terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" appear to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0022] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0023] Please see Figures 1-4 As shown, the main body of this embodiment is an electroplating equipment for PCB board production, suitable for gantry line electroplating processes. It can realize continuous electroplating of PCB boards between multiple plating tanks 1, and at the same time solve the problem of water accumulation in the holes and plating solution carry-out through a high-pressure clean air blowing system. The equipment as a whole includes multiple plating tanks 1, a gantry transmission module, a high-pressure clean air blowing system module, a PLC control system module, an auxiliary protection module, and a supporting pipeline system 15.

[0024] Furthermore, multiple plating tanks 1 are arranged sequentially along the horizontal direction of the gantry line. Their types may include acid degreasing tanks, water washing tanks, micro-etching tanks, activation tanks, copper plating tanks, and tin plating tanks. A gantry-type transmission module is installed above all plating tanks 1, which can drive the PCB board to be transported horizontally and lifted vertically. A set of high-pressure clean air blowing system modules is installed on the inlet and outlet sides of each plating tank 1. The PLC control system module is installed in the equipment operation area and is electrically connected to each actuator through wires to realize fully automatic control.

[0025] Furthermore, the plating tank 1 is a rectangular tank made of welded polypropylene sheet, which is resistant to acid and alkali corrosion and does not produce impurities. Along the horizontal transport direction of the gantry line, the left side of the plating tank 1 is the inlet station side, and the right side is the outlet station side. The sidewalls inside the tank openings on both sides protrude outwards to form installation areas 3. The installation areas 3 are seamlessly connected to the tank opening edges via a rounded transition, used to fix the blowing unit of the high-pressure clean air blowing system module. The top height of the installation area 3 is higher than the highest path of the PCB board's vertical lifting, avoiding interference with the hanger 20 of the gantry transmission module.

[0026] Furthermore, the edge of the plating tank 1 extends inward at an angle to form a liquid guiding slope 4. The liquid guiding slope 4 is inclined and smoothly transitions to the tank wall with rounded corners to prevent plating solution from overflowing and guide backflow. A plating solution circulation interface 5 is provided through the center of the bottom of the tank, which is sealed to an external plating solution collection device (such as a storage tank or filter pump group) through a flange to realize the recycling and reuse of the plating solution.

[0027] Furthermore, a liquid level sensor 6, which is an immersion hydrostatic level gauge, is fixed to the middle of the outer side of the plating tank 1 wall by a bracket. Its detection end extends through the tank wall to below the liquid surface inside the tank, and its signal end is electrically connected to the PLC control system module through a shielded wire to monitor the liquid level in real time and feed it back to the control system.

[0028] Furthermore, each plating tank 1 is equipped with a high-pressure clean air blowing system module on both the inlet and outlet sides. Each system includes two independent blowing units, corresponding to the front and back sides of the PCB board, respectively. The blowing unit includes an air supply component 7, which is an oil-free silent air compressor. The air outlet is connected to the drying and filtering component through a stainless steel sealed pipe.

[0029] Drying and filtering assembly: The outer shell 12 is made of aluminum alloy. Inside, along the airflow direction, there is an oil removal filter layer 9 using a glass fiber filter element, a water removal filter layer 10 using a molecular sieve desiccant, and a dust removal filter layer 11 using a HEPA high-efficiency filter. The outer shell 12 is equipped with a removable end cap 13 for easy replacement. The air inlet of the drying and filtering assembly is coaxially arranged with the air source pipe, and the air outlet is sealed to the air blowing pipe 8.

[0030] The blowing duct 8 is made of PVDF material, its length is adapted to the plating tank 1, and it is horizontally fixed on the installation area 3. The nozzle assembly consists of multiple adjustable angle fan-shaped nozzles 14, which are installed on the pipe 15. The pipe 15 is spaced apart along the length of the blowing duct 8. The nozzles 14 are rotatably connected to the pipe via ball joints, and the spray direction is directly facing the PCB board surface. A channel is formed between the pipes of the two blowing units, allowing the PCB board to be vertically lifted and lowered through.

[0031] Each blower unit has a precision pressure regulating valve 16 and a flow meter 17 connected in series on its blower duct 8, both of which are connected to the PLC control system module via signal lines. The pressure regulating valve 16 on the inlet station side has a larger pressure regulating range than the pressure regulating valve 16 on the outlet station side, to adapt to different process requirements.

[0032] Furthermore, the gantry transmission module includes a gantry frame 18, a traveling body 19, a lifting drive assembly 24, and a titanium alloy bracket 20, used to realize the horizontal transport and vertical lifting of the PCB board. The gantry frame 18 is made of welded steel profiles. Two gantry frames 18 are provided, with their tops horizontally spanning all plating tanks 1. Parallel guide rails 21 are connected above the gantry frames 18, located on the outer sides of both ends of the plating tanks 1. The length of the guide rails 21 covers the entire arrangement range of all plating tanks 1, and the surface of the guide rails 21 is chrome-plated to reduce wear.

[0033] Furthermore, the bottom of the trolley body 19 is provided with a slider 22 adapted to the guide rail 21. Driven by the servo motor 23, it can move horizontally along the guide rail 21 to realize the transfer of the PCB board between each plating tank 1.

[0034] Furthermore, the lifting drive assembly 24 is existing technology. It is fixed below the vehicle body 19 and includes a geared motor, a drive sprocket, a driven sprocket, and a chain (not shown in the figure). The end of the chain is connected to the titanium alloy bracket 20, and the bracket 20 is driven to lift vertically by the forward and reverse rotation of the motor.

[0035] The hanger 20 can be forged from TC4 titanium alloy, thus resisting corrosion from the plating solution. It has an L-shaped structure, with the top of its horizontal section fixed to the end of the chain, and the bottom of its vertical section equipped with elastic grippers 25 to hold the non-plating area of ​​the PCB board edge. The vertical length of the hanger 20 is adapted to the liquid depth of the plating tank 1, ensuring that the plating area is completely submerged when the PCB board is immersed.

[0036] Furthermore, the PLC control system module is based on a Siemens S7-1214CPLC, equipped with a touch screen, and installed in an independent control cabinet 26.

[0037] The PLC's signal input terminals are connected to the following sensors via signal lines: 1. Photoelectric sensor 2, model Omron E3Z-LS61, two are installed in each plating tank 1, respectively installed in the corresponding positions of the installation area 3 on the tank inlet and tank outlet sides, to detect the signal of the PCB board entering or leaving the air blowing channel; 2. Air source pressure sensor 28, model SICKPTG500, is installed at the air outlet of the air compressor to monitor the air source pressure; 3. Differential pressure sensor 29, model SMCISE30A, is connected at both ends to the air inlet and air outlet of the drying filter assembly to monitor the filter element blockage status; 4. Crane position sensor 30, model Pepperl+Fuchs PVM58N, is installed at the tank inlet and tank outlet positions of the gantry 18, and the real-time position of the crane is fed back through an encoder.

[0038] When the crane body 19 moves the PCB board to the inlet station, the photoelectric sensor 2 triggers a signal, and the PLC controls the inlet side blowing unit to start, blowing air at a preset pressure for a period of time. At the same time, the lifting drive component 24 is controlled to descend, vertically immersing the PCB board into the plating tank 1. After the electroplating is completed, the lifting component drives the PCB board to rise to the outlet side blowing channel. The PLC controls the outlet side blowing unit to start, blowing off the residual plating solution. The crane then transfers the PCB board to the next process.

[0039] Furthermore, the auxiliary protection module includes a protective cover 31, which is made of transparent PC board to form a semi-enclosed shell. It is fixed below the installation area 3 of the plating tank 1, covering the blowing unit to prevent plating solution from splashing. It also includes a cleaning interface 32, which is located at the end of the blowing duct 8 and equipped with a threaded plug 33. The plug 33 is opened periodically and connected to a pure water pipe to flush out residual plating solution crystals inside the pipe and prevent the nozzle 14 from becoming clogged.

[0040] Equipment Workflow Taking continuous electroplating in three plating tanks as an example, the workflow is as follows: 1. Loading and initialization: The operator clamps the edge of the PCB board onto the elastic gripper 25 of the titanium alloy hanger 20, selects the corresponding process on the touch screen, and the PLC control system module initializes the parameters.

[0041] 2. Pre-entry air blowing: The gantry-type transmission module's traveling body 19 moves along the gantry frame 18 to the entry station side of the first plating tank 1. The photoelectric sensor 2 detects the PCB board, and the PLC controls the entry side air blowing unit to start. The upper and lower nozzle groups spray high-pressure clean air onto the front and back of the PCB board to blow away moisture in the holes and small areas on the board surface.

[0042] 3. Vertical immersion plating: After the blowing is completed, the lifting drive component 24 drives the PCB board to descend vertically, so that the PCB board is completely immersed in the plating solution of the copper plating tank 1. The liquid level sensor 6 monitors in real time to ensure that the liquid level is higher than the area to be plated. Electroplating is carried out according to the preset current and time. During this period, the plating solution is continuously filtered and circulated through the circulation interface.

[0043] 4. Blowing after exiting the tank: After electroplating is completed, the lifting component drives the PCB board to rise to the blowing channel on the exit side. The PLC controls the blowing unit to start, blowing off the residual plating solution on the board surface. The plating solution flows back to the copper plating tank 1 along the guide plate.

[0044] 5. Multi-tank continuous processing: The overhead crane body 19 transfers the PCB board to the nickel plating tank 1, repeats steps 2-4 (adjusting the corresponding process parameters), and after completing the nickel plating, it is transferred to the tin plating tank 1 to finally complete all electroplating processes.

[0045] 6. Unloading and maintenance: The electroplated PCB boards are transferred to the unloading area, where the operator removes them and sends them to the water washing tank. After the equipment is stopped, the air blowing pipe 8 is rinsed through the cleaning interface 32, and the filter element of the drying filter assembly is replaced regularly.

[0046] Beneficial effects of this device Electroplating quality improvement: High-pressure blowing is used to thoroughly remove water from the holes before the plating tank to avoid water column blockage that could lead to missed plating or uneven plating.

[0047] Environmental protection and cost optimization: After the plating solution is removed from the tank, the blowing and guide plate are used to recover the plating solution, which reduces the amount of plating solution carried out and the amount of water used for washing, thereby reducing wastewater treatment costs.

[0048] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An electroplating equipment for PCB board production, comprising multiple plating tanks (1) and a gantry-type transmission module, characterized in that, It also includes a high-pressure clean air blowing system module and a PLC control system module; The high-pressure clean air blowing system module is provided in two sets, which are respectively installed on the inlet station side and the outlet station side of each plating tank (1) arranged along the horizontal transfer path of the gantry line; each high-pressure clean air blowing system module includes two sets of independently operating blowing units corresponding to the front and back of the PCB board respectively. The gantry transmission module is used to drive the PCB board to move horizontally along the gantry line and achieve vertical lifting, so as to complete the different processes of multiple plating tanks (1) in sequence. The PLC control system module is electrically connected to the high-pressure clean air blowing system module and the gantry transmission module, respectively. The plating tank (1) is equipped with photoelectric sensors (2) that are connected to the PLC control system module.

2. The electroplating equipment for PCB board production according to claim 1, characterized in that, The plating tank (1) is provided with an inlet station side and an outlet station side along the horizontal transfer direction of the gantry line. The inside of the plating tank (1) is provided with two sides corresponding to the inlet station side and the outlet station side, which are protruding outward to form an installation area (3). The installation area (3) is integrally connected with the edge of the tank opening and is used to install the blowing unit of the high-pressure clean air blowing system module on the corresponding side.

3. The electroplating equipment for PCB board production according to claim 1, characterized in that, The edge of the plating tank (1) extends inward to form a liquid guiding slope (4), which smoothly transitions with the tank wall; a plating solution circulation interface (5) is provided through the bottom of the plating tank (1), which is connected to an external collection device; a liquid level sensor (6) is fixed on the outside of the tank wall of the plating tank (1), and the detection end of the liquid level sensor (6) extends through the tank wall into the tank and the signal end is electrically connected to the PLC control system module.

4. The electroplating equipment for PCB board production according to claim 2, characterized in that, Two sets of blowing units of each of the high-pressure clean air blowing system modules are installed in the corresponding installation area (3), and a channel for the PCB board to be vertically lifted and lowered is formed between the two sets of blowing units; each set of blowing units includes an air supply component (7), a drying filter component, and a blowing pipe (8) connected in sequence; the air outlet of the air supply component (7) and the air inlet of the drying filter component are connected through a sealed pipe, and the drying filter component is provided with an oil removal filter layer (9), a water removal filter layer (10), and a dust removal filter layer (11) in series along the airflow direction; multiple sets of nozzles are provided on the blowing pipe (8), and the nozzles are spaced apart along the length of the blowing pipe (8), and the spray direction of the nozzles (14) is towards the surface of the PCB board in the channel.

5. The electroplating equipment for PCB board production according to claim 4, characterized in that, Each blower unit is equipped with a precision pressure regulating valve (16) and a flow meter (17) connected in series with the PLC control system module on its blower pipe (8); the adjustment range of the precision pressure regulating valve (16) of the blower unit on the inlet station side is greater than the adjustment range of the precision pressure regulating valve (16) of the blower unit on the outlet station side.

6. The electroplating equipment for PCB board production according to claim 1, characterized in that, The gantry transmission module includes a gantry frame (18), a trolley body (19), a lifting drive assembly (24), and a titanium alloy bracket (20). The two gantry frames (18) are horizontally positioned above the plating tank (1). The trolley body (19) can move horizontally along the guide rail (21) of the gantry frame (18). The lifting drive assembly (24) is fixed below the trolley body (19). The bracket (20) is connected to the output end of the lifting drive assembly (24) and can be vertically lifted and lowered with the lifting drive assembly (24). The bracket (20) adopts an L-shaped suspension arm. One end of the bracket is vertically fixed to the lifting drive assembly (24), and the other end is clamped by an elastic gripper (25) to hold the non-plating area of ​​the PCB board edge. The vertical length of the bracket (20) is adapted to the liquid depth in the plating tank (1).

7. The electroplating equipment for PCB board production according to claim 1, characterized in that, The PLC control system module includes a PLC controller and a touch screen. The touch screen is bidirectionally connected to the PLC controller via a communication line. The PLC controller has a parameter storage unit.

8. The electroplating equipment for PCB board production according to claim 7, characterized in that, The signal input terminal of the PLC controller is also electrically connected to the air source pressure sensor (28), the dryer filter assembly differential pressure sensor (29), and the crane position sensor (30), respectively. The air source pressure sensor (28) is installed at the air outlet of the air source supply assembly (7). The two ends of the dryer filter assembly differential pressure sensor (29) are connected to the air inlet and air outlet of the dryer filter assembly, respectively. The crane position sensor (30) is installed at the inlet and outlet positions of the gantry frame (18).

9. The electroplating equipment for PCB board production according to claim 1, characterized in that, It also includes an auxiliary protection module, which includes a protective cover (31) and a cleaning interface (32); the protective cover (31) is a semi-enclosed shell structure, which is respectively installed under the two sets of blowing units; the cleaning interface (32) is opened at the end of the blowing pipe (8) and sealed by a plug (33).

Images