Electroplating solution treatment system
Patent Information
- Application Number
- CN202522606290.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-09
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2035-12-09
AI Technical Summary
[0003]基于此,有必要针对现有TOC处理技术大多采用离线式处理,需要停机将药水抽出清洗镀槽后,开新药水重新建浴,存在着处理周期长、效率低、成本高等问题,提供一种电镀液处理系统
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Figure CN224901607U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of electroplating process equipment technology, and in particular to an electroplating solution treatment system. Background Technology
[0002] Traditionally, electroplating is used to coat metals, improving their corrosion resistance, increasing hardness, and preventing wear. However, during the electroplating process, organic matter continuously decomposes from the surfaces of workpieces and fixtures, entering the electroplating solution. Therefore, TOC (Total Organic Carbon) treatment is a necessary step in the electroplating process. If the TOC exceeds the production process requirements, it will seriously affect the quality of the electroplated layer. However, traditional TOC treatment technologies mostly use offline methods, requiring shutdown to remove the chemicals, clean the plating tank, and then start a new bath with fresh chemicals. This results in long treatment cycles, low efficiency, and high costs. Utility Model Content
[0003] Therefore, it is necessary to provide an electroplating solution treatment system, which addresses the problem that most existing TOC treatment technologies adopt offline processing, requiring shutdown to extract the chemical solution to clean the plating tank, and then start a new chemical solution to rebuild the bath. This results in problems such as long processing cycles, low efficiency, and high costs.
[0004] An electroplating solution treatment system includes: a mixing and adsorption module, wherein the mixing and adsorption module has a mixing chamber and a feeding port communicating with the mixing chamber, the mixing chamber being used to communicate with the plating solution outlet of the electroplating tank, and the feeding port being used to add adsorbent material; a filtration and purification module, wherein the filtration and purification module includes a filter press and a purification chamber, the inlet of the filter press being communicated with the mixing chamber, the filter press being used to filter the solid-liquid mixture from the mixing chamber, the input end of the purification chamber being communicated with the outlet of the filter press to receive the filtrate obtained by the filter press, and the output end of the purification chamber being communicated with the plating solution inlet of the electroplating tank; an ozone oxidation module, wherein the ozone oxidation module is communicated with the purification chamber to introduce ozone into the filtrate in the purification chamber; and a control component, wherein the control component is electrically connected to the filtration and purification module.
[0005] This application discloses an electroplating solution treatment system, which includes a mixing adsorption module, a filtration and purification module, and an ozone oxidation module. The mixing chamber of the mixing adsorption module is connected to the electroplating tank and a filter press device. When the electroplating solution in the electroplating tank is fed into the mixing chamber, the user adds an adsorbent material such as carbon powder into the mixing chamber through the feeding port to mix with the electroplating solution. The resulting solid-liquid mixture enters the filter press device for filtration treatment, allowing most of the organic matter accumulated in the electroplating solution during the electroplating process to be adsorbed onto the adsorbent material and carried out as a filter block. The filtrate then enters the purification tank, where ozone is further introduced into the filtrate through the ozone oxidation module to oxidize and decompose the residual organic matter in the filtrate. Finally, the purified electroplating solution can be reused in the electroplating tank. By adopting the processing system of this application, it can be connected to the electroplating tank to form a closed loop to achieve rapid online purification of organic matter in the electroplating solution, thereby simplifying the purification operation and providing convenience for production personnel to purify organic matter in the electroplating solution. At the same time, by integrating the mixed adsorption module and the filtration purification module, the space occupied by the equipment can be reduced, greatly saving production space, which is conducive to improving production efficiency and reducing production costs.
[0006] In one embodiment, the ozone oxidation module includes an ozone generator and an aeration pipe. The ozone generator introduces ozone into the filtrate in the purification chamber through the aeration pipe. By utilizing the multiple microporous structures of the aeration pipe, the ozone generated by the ozone generator is dispersed into a large number of tiny bubbles when it is output to the filter press liquid in the purification chamber through the aeration pipe. Due to the large number of microbubbles, their specific surface area, and slow rising speed, the gas-liquid contact area and contact time are greatly increased, which is beneficial for the continuous dissolution of ozone and its reaction with organic matter in the filter press liquid, thereby improving the purification efficiency.
[0007] In one embodiment, the filtration and purification module further includes a receiving tray disposed below the filter press to receive the filter blocks produced by the filter press. The receiving tray has a return port, which is connected to the mixing chamber via a first return pipe. By placing the receiving tray below the filter press, the filter blocks produced by the filter press can be collected. After processing, the collected filter blocks can be returned to the mixing chamber for further adsorption and purification. Simultaneously, the receiving tray has a return port connected to the mixing chamber, allowing the electroplating solution seeping from the filter blocks to flow back into the mixing chamber for recycling and further adsorption and purification. This effectively reduces resource waste and prevents the seeping electroplating solution from being discharged into the external environment and causing environmental pollution.
[0008] In one embodiment, the horizontal level of the return port is higher than the horizontal level of the mixing chamber. With this design, the electroplating solution seeping from the filter block can be naturally gravity-driven during the return process, achieving smooth return without the need for additional power.
[0009] In one embodiment, the filtration and purification module further includes a first pump body, one end of which is connected to the mixing chamber via an inlet pipe, and the other end of which is connected to the liquid inlet of the filter press via an outlet pipe. It also includes an air supply duct for blowing air into the inner cavity of the first pump body and / or the filter press to dry them. The first pump body provides driving force for the mixing and adsorption module to deliver material to the filter press, thereby increasing the processing efficiency of the electroplating solution treatment system by accelerating the delivery speed. Furthermore, the airflow delivered to the inner cavity of the first pump body and / or the filter press via the air supply duct allows moisture in the inner cavity of the first pump body and / or the filter press to be quickly removed, and the filter blocks on the filter press are easier to dry and fall off for easier handling.
[0010] In one embodiment, a first check valve is also included, which is disposed on the air supply duct. The check valve prevents the accidental entry of a solid-liquid mixture into the air supply duct.
[0011] In one embodiment, the filtration and purification module further includes a precision filter for connecting the purification tank and the electroplating tank. The precision filter filters impurities in the electroplating solution output from the purification tank. By installing a precision filter on the pipeline connecting the purification tank and the electroplating tank, the electroplating solution after oxidation treatment in the purification tank is further filtered and purified, ensuring that the content of residual adsorbent materials and other impurities in the electroplating solution meets design standards, thereby guaranteeing the quality of the electroplated layer.
[0012] In one embodiment, the filtration and purification module further includes a second pump, which is disposed on the pipeline connecting the purification tank and the precision filter. By providing a third pump on the pipeline connecting the purification tank and the precision filter, power is supplied for the electroplating solution from the purification tank to enter the precision filter, thereby improving the processing efficiency of the device.
[0013] In one embodiment, the device further includes a TOC analyzer and a three-way control valve. The first port of the three-way control valve is connected to the output port of the purification chamber, the second port is connected to the inlet port of the precision filter, and the third port is connected to the mixing chamber via a second return line. The TOC analyzer is used to detect the TOC content of the electroplating solution in the purification chamber. The control component is communicatively connected to both the TOC analyzer and the three-way control valve. The three-way control valve is configured to divert the electroplating solution output from the purification chamber based on the detection result of the TOC analyzer. A three-way switching valve can be used to switch the flow direction of the electroplating solution output from the purification chamber. The TOC analyzer detects the TOC content of the oxidized electroplating solution in the purification chamber. If the TOC content meets the standard, the three-way switching valve can be controlled to divert the electroplating solution to the precision filter to remove impurities. If the TOC content does not meet the standard, the three-way switching valve is controlled to divert the electroplating solution to the mixing chamber for further adsorption and purification, thereby ensuring the purification effect of the device. By installing a TOC analyzer on the device, the TOC content of the electroplating solution after treatment by the precision filter can be detected online, and the detection data can be sent to the control component in real time. The control component can then automatically control the three-way switching valve to perform flow diversion operation based on the detection data, thereby simplifying the user's operation steps and greatly improving the working efficiency of the electroplating solution treatment system.
[0014] In one embodiment, the bottom of the precision filter is equipped with a cleaning wastewater discharge pipe connected to the outside. This enables rapid and targeted discharge of internal rinsing wastewater and concentrated contaminants from the filtration system, and also greatly simplifies the equipment maintenance and cleaning process.
[0015] In one embodiment, the mixing adsorption module includes a mixing container and an exhaust device. The mixing container has a mixing chamber and a feeding port. The air inlet of the exhaust device is connected to the mixing chamber, and the exhaust device is used to extract gas from the mixing chamber to create a negative pressure inside the mixing chamber. By adopting the above structure, the mixing adsorption module creates a stable negative pressure environment in the mixing chamber through the exhaust device, which makes it easier for the adsorbent material to fall into the mixing chamber during feeding and mixing. This effectively prevents dust and harmful gases from escaping during feeding and mixing, significantly improves the working environment and reduces the risk of pollution. In addition, the negative pressure design also enhances the uniformity of material adsorption and mixing, improves process efficiency, and protects the health and safety of operators and production, meeting environmental protection production requirements.
[0016] In one embodiment, the hybrid adsorption module further includes a filter bag, and the outlet of the exhaust device is connected to the filter bag. By adopting the above structure, the dust-laden airflow drawn in by the exhaust device can be efficiently intercepted and filtered by the filter bag, ensuring that the powder is completely captured. This not only ensures that the exhaust gas is clean and meets standards, avoiding secondary pollution, but also allows the adsorbed powder to be recycled, achieving simultaneous optimization of the production process and waste gas treatment.
[0017] In one embodiment, a transfer pump is also included, which connects the mixing chamber to the plating solution outlet of the electroplating tank via a plating solution output pipe. By installing a transfer pump on the connecting pipe between the plating solution outlet of the electroplating tank and the mixing chamber of the mixing adsorption module, power is provided for the plating solution from the electroplating tank to enter the mixing chamber. This not only improves the processing efficiency of the device but also facilitates the flexible arrangement of the mixing adsorption module within the device.
[0018] In one embodiment, the number of the filtration and purification modules is two sets, and the inlet of the pressure filter of the two sets of filtration and purification modules is respectively connected to the mixing chamber.
[0019] In one embodiment, a second check valve is further included, which is disposed on the pipeline connecting the second pump body and the mixing chamber. The second check valve prevents backflow when the liquid level in the mixing chamber is too high.
[0020] In one embodiment, the mixing chamber is provided with a partition, which divides the mixing chamber into a first chamber and a second chamber. One of the liquid inlets of the two sets of filter purification modules is connected to the first chamber, and the other is connected to the second chamber. Attached Figure Description
[0021] Figure 1 A first perspective view of an electroplating solution treatment system according to one embodiment;
[0022] Figure 2 A second perspective view of an electroplating solution treatment system according to one embodiment;
[0023] Figure 3 A third perspective view of an electroplating solution treatment system according to one embodiment;
[0024] Figure 4 This is a schematic diagram showing the connections of the modules of an electroplating solution treatment system according to one embodiment.
[0025] Figure 5 This is a three-dimensional view of the internal structure of a filtration and purification module according to one embodiment.
[0026] The correspondence between the reference numerals and the component names is as follows:
[0027] 1. Mixing and adsorption module, 101. Feeding port, 11. Mixing container, 12. Exhaust device;
[0028] 2 Filtration and purification module, 21 Filter press device, 22 Purification box, 23 Receiving plate, 24 First return liquid pipeline, 25 First pump body, 26 Feed pipe, 27 Precision filter, 28 Second pump body, 29 Second return liquid pipeline;
[0029] 3. Ozone oxidation module;
[0030] 4. Air supply ducts;
[0031] 5TOC analyzer;
[0032] 6. Clean the wastewater discharge pipe;
[0033] 7. Transfer pump;
[0034] 8. Plating solution output pipe. Detailed Implementation
[0035] To better understand the above-mentioned objectives, features, and advantages of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.
[0036] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and therefore the scope of protection of the invention is not limited to the specific embodiments disclosed below.
[0037] The electroplating solution treatment system of some embodiments of the present invention is described below with reference to the accompanying drawings.
[0038] like Figures 1 to 5 As shown, this embodiment discloses an electroplating solution treatment system, including: a mixing and adsorption module 1, which has a mixing chamber and a feeding port 101 connected to the mixing chamber. The mixing chamber is used to connect to the plating solution outlet of the electroplating tank, and the feeding port 101 is used to add adsorbent material; a filtration and purification module 2, which includes a filter press 21 and a purification tank 22. The inlet of the filter press 21 is connected to the mixing chamber and is used to filter the solid-liquid mixture from the mixing chamber. The input end of the purification tank 22 is connected to the outlet of the filter press 21 to receive the filtrate obtained by the filter press, and the output port of the purification tank 22 is used to connect to the plating solution inlet of the electroplating tank; an ozone oxidation module 3, which is connected to the purification tank 22 to introduce ozone into the filtrate in the purification tank 22; and a control component, which is electrically connected to the filtration and purification module 2.
[0039] This application discloses an electroplating solution treatment system, which includes a mixing adsorption module 1, a filtration and purification module 2, and an ozone oxidation module 3. The mixing chamber of the mixing adsorption module 1 is connected to the electroplating tank and the pressure filter device 21. When the electroplating solution in the electroplating tank is fed into the mixing chamber, the user feeds an adsorbent material such as carbon powder into the mixing chamber through the feeding port 101 to mix with the electroplating solution. The resulting solid-liquid mixture enters the pressure filter device 21 for pressure filtration, so that most of the organic matter accumulated in the electroplating solution during the electroplating process is adsorbed on the adsorbent material and carried out as a filter block. The filtrate enters the purification tank 22, and ozone is further introduced into the filtrate in the purification tank 22 through the ozone oxidation module 3 to oxidize and decompose the residual organic matter in the filtrate. Finally, the electroplating solution is purified to the standard and can be flowed back into the electroplating tank for reuse. By adopting the processing system of this application, it can be connected to the electroplating tank to form a closed loop to achieve rapid online purification of organic matter in the electroplating solution, thereby simplifying the purification operation and providing convenience for production personnel to purify organic matter in the electroplating solution. At the same time, by integrating the mixed adsorption module 1 and the filtration purification module 2, the space occupied by the equipment can be reduced, greatly saving production space, which is conducive to improving production efficiency and reducing production costs.
[0040] In addition to the features of the above embodiments, this embodiment further specifies that: the ozone oxidation module 3 includes an ozone generator and an aeration pipe, and the ozone generator introduces ozone into the filtrate in the purification tank 22 through the aeration pipe. By utilizing the multiple microporous structures of the aeration pipe, the ozone generated by the ozone generator is dispersed into a large number of tiny bubbles when it is output to the filter press liquid in the purification tank 22 through the aeration pipe. Due to the large number of microbubbles, their specific surface area, and slow rising speed, the gas-liquid contact area and contact time are greatly increased, which is conducive to the continuous dissolution of ozone and its reaction with organic matter in the filter press liquid, thereby improving the purification efficiency.
[0041] like Figures 2 to 5 As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the filtration and purification module 2 also includes a receiving tray 23, which is disposed below the filter press 21 to receive the filter blocks obtained by the filter press 21. The receiving tray 23 is provided with a return port, which is connected to the mixing chamber through a first return pipe 24. By providing the receiving tray 23 below the filter press 21, the filter blocks produced by the filter press 21 can be collected. After processing, the collected filter blocks can be put back into the mixing chamber for adsorption and purification again. At the same time, the receiving tray 23 is provided with a return port that can be connected to the mixing chamber, so that the electroplating solution seeping out of the filter blocks can flow back to the mixing chamber for recycling through the return port and the first return pipe 24, and be adsorbed and purified again. This effectively reduces resource waste and also prevents the seeping electroplating solution from being discharged into the external environment and causing environmental pollution.
[0042] like Figure 3As shown, in addition to the features of the above embodiments, this embodiment further specifies that the horizontal height of the return port is higher than the horizontal height of the mixing chamber. By adopting the above design, the electroplating solution seeping from the filter block can form a natural gravity-driven flow during the return process, achieving smooth return without additional power.
[0043] like Figure 2 and Figure 5 As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the filtration and purification module 2 also includes a first pump body 25, one end of which is connected to the mixing chamber through the feed pipe 26, and the other end of which is connected to the liquid inlet of the filter press device 21 through the discharge pipe. It also includes an air supply pipe 4, which is used to blow air into the inner cavity of the first pump body 25 and / or the filter press device 21 to dry the inner cavity of the first pump body 25 and / or the filter press device 21. The first pump body 25 can provide driving force for the mixing and adsorption module 1 to convey materials to the filter press device 21, thereby improving the processing efficiency of the electroplating solution treatment system by accelerating the conveying speed. Furthermore, by supplying airflow into the inner cavity of the first pump body 25 and / or the filter press device 21 through the air supply pipe 4, the moisture in the inner cavity of the first pump body 25 and / or the filter press device 21 can be quickly removed, and the filter blocks on the filter press device 21 are easier to dry and fall off, facilitating processing.
[0044] In addition to the features of the above embodiments, this embodiment further includes a first check valve, which is disposed on the air supply duct 4. The check valve prevents the solid-liquid mixture from accidentally entering the air supply duct 4.
[0045] like Figures 2 to 5 As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the filtration and purification module 2 also includes a precision filter 27, which is used to connect the purification tank 22 and the electroplating tank, and is used to filter impurities in the electroplating solution output from the purification tank 22. By installing a precision filter 27 on the pipeline connecting the purification tank 22 and the electroplating tank, the precision filter 27 further filters and purifies the electroplating solution after oxidation treatment in the purification tank 22, ensuring that the content of impurities such as residual adsorbent materials in the electroplating solution meets the design standards, thereby guaranteeing the quality of the electroplating layer.
[0046] like Figures 2 to 5 As shown, in addition to the features of the above embodiments, this embodiment further specifies that the filtration and purification module 2 also includes a second pump body 28, which is disposed on the pipeline connecting the purification box 22 and the precision filter 27. By providing a third pump body on the pipeline connecting the purification box 22 and the precision filter 27, power is provided for the electroplating solution in the purification box 22 to enter the precision filter 27, which helps to improve the processing efficiency of the device.
[0047] like Figure 3 and Figure 4 As shown, in addition to the features of the above embodiments, this embodiment further includes: a TOC analyzer 5 and a three-way control valve. The first port of the three-way control valve is connected to the output port of the purification tank 22, the second port of the three-way control valve is connected to the inlet port of the precision filter 27, and the third port of the three-way control valve is connected to the mixing chamber through the second return pipeline 29. The TOC analyzer 5 is used to detect the TOC content of the electroplating solution in the purification tank 22. The control components are communicatively connected to the TOC analyzer 5 and the three-way control valve, respectively. The three-way control valve is configured to divert the electroplating solution output from the purification tank 22 according to the detection result of the TOC analyzer 5. A three-way switching valve can be used to switch the flow direction of the electroplating solution output from the purification tank 22. A TOC analyzer 5 is used to detect the TOC content of the oxidized electroplating solution in the purification tank 22. If the TOC content meets the standard, the three-way switching valve can be controlled to divert the electroplating solution to the precision filter 27 to remove impurities. If the TOC content does not meet the standard, the three-way switching valve is controlled to divert the electroplating solution to the mixing chamber for further adsorption and purification, thus ensuring the purification effect of the device. The TOC analyzer 5 installed on the device can be used to detect the TOC content of the electroplating solution after treatment by the precision filter 27 online and can send the detection data to the control component in real time. The control component can then automatically control the three-way switching valve to perform the diversion operation based on the detection data, thereby simplifying the user's operation steps and greatly improving the working efficiency of the electroplating solution treatment system.
[0048] like Figure 3 As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the bottom of the precision filter 27 is provided with a cleaning wastewater discharge pipe 6 that connects to the outside. This enables rapid and targeted discharge of internal rinsing wastewater and concentrated pollutants from the filtration system, and also greatly simplifies the equipment maintenance and cleaning process.
[0049] like Figure 2 and Figure 3 As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the mixing adsorption module 1 includes a mixing container 11 and an exhaust device 12. The mixing container 11 is provided with a mixing chamber and a feeding port 101. The air inlet of the exhaust device 12 is connected to the mixing chamber. The exhaust device 12 is used to extract the gas in the mixing chamber to create a negative pressure inside the mixing chamber. By adopting the above structure, the mixing adsorption module 1 forms a stable negative pressure environment in the mixing chamber through the exhaust device 12, which makes it easier for the adsorbent material to fall into the mixing chamber when it is added. This effectively prevents dust and harmful gases from escaping during the feeding and mixing process, greatly improves the working environment and reduces the risk of pollution. In addition, the negative pressure design also enhances the uniformity of material adsorption and mixing, improves process efficiency, and at the same time protects the health and safety of operators and production, meeting the requirements of environmental protection production.
[0050] In addition to the features of the above embodiments, this embodiment further specifies that the hybrid adsorption module 1 also includes a filter bag, and the air outlet of the exhaust device 12 is connected to the filter bag. By adopting the above structure, the dust-laden airflow drawn in by the exhaust device 12 can be efficiently intercepted and filtered by the filter bag, so that the powder is completely captured. This ensures that the exhaust gas is clean and meets the standards, avoids secondary pollution, and allows the adsorbed powder to be recycled, thus achieving simultaneous optimization of the production process and waste gas treatment.
[0051] like Figures 2 to 4 As shown, in addition to the features of the above embodiments, this embodiment further includes a transfer pump 7, which is used to connect the mixing chamber and the plating solution outlet of the electroplating tank through the plating solution output pipe 8. By installing the transfer pump 7 on the connecting pipe between the plating solution outlet of the electroplating tank and the mixing chamber of the mixing adsorption module 1, power is provided for the electroplating solution from the electroplating tank to enter the mixing chamber. This not only improves the processing efficiency of the device but also facilitates the flexible arrangement of the mixing adsorption module 1 within the device.
[0052] like Figures 1 to 4 As shown, in addition to the features of the above embodiments, this embodiment further specifies that: the number of filtration and purification modules 2 is two sets, and the inlet of the pressure filter device 21 of the two sets of filtration and purification modules 2 is respectively connected to the mixing chamber.
[0053] In addition to the features of the above embodiments, this embodiment further includes a second check valve, which is disposed on the pipeline connecting the second pump body 28 and the mixing chamber. The second check valve prevents backflow when the liquid level in the mixing chamber is too high.
[0054] In addition to the features of the above embodiments, this embodiment further specifies that: a partition is provided in the mixing chamber, the partition divides the mixing chamber into a first chamber and a second chamber, and one of the liquid inlets of the pressure filter device 21 of the two sets of filtration and purification modules 2 is connected to the first chamber and the other is connected to the second chamber.
[0055] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0056] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. An electroplating solution treatment system, characterized in that, include: The mixed adsorption module (1) is provided with a mixing chamber and a feeding port (101) connected to the mixing chamber. The mixing chamber is used to connect to the plating solution outlet of the electroplating tank, and the feeding port (101) is used to feed in the adsorption material. The filtration and purification module (2) includes a filter press (21) and a purification chamber (22). The inlet of the filter press (21) is connected to the mixing chamber. The filter press (21) is used to filter the solid-liquid mixture from the mixing chamber. The input end of the purification chamber (22) is connected to the outlet of the filter press (21) to receive the filtrate obtained by the filter press. The output end of the purification chamber (22) is connected to the plating solution inlet of the electroplating tank. Ozone oxidation module (3), which is connected to the purification box (22) to introduce ozone into the filtrate in the purification box (22); A control component, which is electrically connected to the filtration and purification module (2).
2. The electroplating solution treatment system according to claim 1, characterized in that, The ozone oxidation module (3) includes an ozone generator and an aeration pipe. The ozone generator fills the filtrate in the purification box (22) with ozone through the aeration pipe.
3. The electroplating solution treatment system according to claim 1, characterized in that, The filtration and purification module (2) also includes a receiving plate (23), which is located below the filter press (21) to receive the filter block obtained by the filter press (21). The receiving plate (23) is provided with a return port, which is connected to the mixing chamber through a first return pipe (24).
4. The electroplating solution treatment system according to claim 3, characterized in that, The horizontal height of the return port is higher than the horizontal height of the mixing chamber.
5. The electroplating solution treatment system according to claim 1, characterized in that, The filtration and purification module (2) further includes a first pump body (25), one end of which is connected to the mixing chamber via a feed pipe (26), and the other end of which is connected to the liquid inlet of the filter press (21) via a discharge pipe. It also includes an air supply pipe (4), which is used to blow air into the inner cavity of the first pump body (25) and / or the filter press (21) to dry the inner cavity of the first pump body (25) and / or the filter press (21).
6. The electroplating solution treatment system according to claim 1, characterized in that, The filtration and purification module (2) further includes a precision filter (27), which is used to connect the purification box (22) and the electroplating tank. The precision filter (27) is used to filter impurities in the electroplating solution output by the purification box (22).
7. The electroplating solution treatment system according to claim 6, characterized in that, It also includes a TOC analyzer (5) and a three-way control valve. The first port of the three-way control valve is connected to the output port of the purification tank (22), the second port of the three-way control valve is connected to the inlet port of the precision filter (27), and the third port of the three-way control valve is connected to the mixing chamber through the second return pipeline (29). The TOC analyzer (5) is used to detect the TOC content of the electroplating solution in the purification tank (22). The control components are communicatively connected to the TOC analyzer (5) and the three-way control valve, respectively. The three-way control valve is configured to divert the electroplating solution output from the purification tank (22) according to the detection result of the TOC analyzer (5); and / or The bottom of the precision filter (27) is provided with a cleaning wastewater discharge pipe (6) that connects to the outside.
8. The electroplating solution treatment system according to claim 1, characterized in that, The mixing adsorption module (1) includes a mixing container (11) and an exhaust device (12). The mixing container (11) is provided with a mixing chamber and a feeding port (101). The air inlet of the exhaust device (12) is connected to the mixing chamber. The exhaust device (12) is used to extract the gas in the mixing chamber so that a negative pressure is formed inside the mixing chamber.
9. The electroplating solution treatment system according to claim 8, characterized in that, The hybrid adsorption module (1) also includes a filter bag, and the air outlet of the exhaust device (12) is connected to the filter bag.
10. The electroplating solution treatment system according to any one of claims 1 to 9, characterized in that, It also includes a transfer pump (7) for connecting the mixing chamber to the plating bath outlet via a plating solution outlet pipe (8); and / or The number of the filtration and purification modules (2) is two sets, and the inlet of the filter press device (21) of the two sets of filtration and purification modules (2) is connected to the mixing chamber respectively.