Handheld fan

Abstract

The utility model relates to handheld fan, including shell, fan blade, motor, guide temperature spare, semiconductor refrigeration spare and heat abstractor, be equipped with air cavity in the shell, be equipped with the air outlet that communicates with air cavity on the shell, fan blade is installed in the air cavity, is used for driving the airflow flow direction air outlet, the motor is fixed in the air cavity and is connected with fan blade drive, guide temperature spare is located air outlet outside, semiconductor refrigeration spare and guide temperature spare heat conduction connection, heat abstractor is located between fan blade and air outlet, and heat abstractor includes main part and protruding, the main part includes first heat conduction surface, second heat conduction surface opposite with first heat conduction surface and the circumferential surface between first heat conduction surface and second heat conduction surface, first heat conduction surface and semiconductor refrigeration spare heat conduction connection, second heat conduction surface is towards fan blade, protruding sets up on circumferential surface.

Description

Technical Field

[0001] This utility model relates to the field of small household appliance technology, and in particular to a handheld fan. Background Technology

[0002] Some existing handheld fans include cooling pads that require a heat sink for use. Users can attach the cooling pad to their skin to cool it down. However, in these existing handheld fans, the heat sinks have poor heat dissipation capabilities, affecting the cooling effect. Utility Model Content

[0003] In view of this, the present invention provides a handheld fan to solve the problem of poor heat dissipation in the prior art.

[0004] To achieve one, some, or all of the above objectives, or other objectives, this utility model proposes:

[0005] Handheld fans, including:

[0006] The outer casing has an internal air chamber and an air outlet on the outer casing that communicates with the air chamber.

[0007] Fan blades, installed inside the air cavity, are used to drive airflow toward the air outlet;

[0008] The motor is fixed inside the air cavity and connected to the fan blade drive;

[0009] Temperature-conducting components are located on the outside of the air outlet;

[0010] Semiconductor cooling components are thermally connected to temperature-conducting components;

[0011] A heat sink is located between the fan blades and the air outlet. The heat sink includes a main body and a protrusion. The main body includes a first heat conduction surface, a second heat conduction surface opposite to the first heat conduction surface, and a peripheral side surface located between the first heat conduction surface and the second heat conduction surface. The first heat conduction surface is thermally connected to the semiconductor cooling device, the second heat conduction surface faces the fan blades, and the protrusion is disposed on the peripheral side surface.

[0012] In some embodiments, a plurality of spaced protrusions are provided on the peripheral side surface, and the protrusions extend from the peripheral side surface toward the inner wall of the air cavity.

[0013] In some embodiments, a plurality of protrusions are spaced apart in the circumferential direction around the circumferential side surface.

[0014] In some embodiments, a plurality of first recesses are provided on the peripheral side surface, the first recesses being recessed into the peripheral side surface; and / or, a plurality of first protrusions are provided on the peripheral side surface, the first protrusions being protruded into the peripheral side surface.

[0015] In some embodiments, the first recess and / or the first convex portion extends from the second heat-conducting surface toward the first heat-conducting surface.

[0016] In some embodiments, the raised surface is provided with a plurality of second recesses, the second recesses being recessed into the raised surface; and / or, the raised surface is provided with a plurality of second protrusions, the second protrusions being protruded from the raised surface.

[0017] In some embodiments, the housing includes a cylindrical body and at least one air guide plate, with an air cavity located inside the cylindrical body and the air guide plate located inside the air cavity. The air guide plate is located between the fan blades and the heat sink and directs the airflow generated by the fan blades to the raised surface.

[0018] In some embodiments, the protrusion has a first heat dissipation surface and a second heat dissipation surface, both of which extend from one side of the second heat conduction surface toward the one side of the first heat conduction surface.

[0019] The air guide plate has two air guide surfaces located on opposite sides, and the two air guide surfaces are respectively connected to the first heat dissipation surface and the second heat dissipation surface.

[0020] In some embodiments, the housing further includes an air guide frame fixed within the air cavity, the air guide frame being close to or abutting the second heat conduction surface, an air guide plate being connected to the air guide frame, and a recessed area being formed on the surface of the air guide frame to expose at least a portion of the second heat conduction surface.

[0021] In some embodiments, the housing further includes a cylindrical body, an air guide frame, and a fixed frame. The air cavity is located inside the cylindrical body, the air guide frame is fixed inside the air cavity and abuts against the second heat conduction surface, the air guide plate is connected to the air guide frame, the fixed frame is embedded at the air outlet, and the heat dissipation component is located between the fixed frame and the air guide frame.

[0022] In some embodiments, the fixed frame includes a central support, a connecting rod, and an outer ring. The semiconductor cooling component and the temperature conducting component are both mounted on the central support. The connecting rod connects the cylinder and the outer ring. The outer ring abuts against the inner wall of the air cavity, and the protrusions are provided corresponding to the connecting rod.

[0023] Implementing the embodiments of this utility model will have the following beneficial effects:

[0024] By adopting the aforementioned handheld fan, the heat sink is cooled by forced convection through the fan blades, and the heat exchange efficiency is maximized by the protrusions of the heat sink, ensuring that the semiconductor cooling component works continuously and efficiently, providing users with a long-lasting, low-temperature skin-friendly cooling experience. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of the overall structure of one embodiment;

[0027] Figure 2 This is a schematic diagram of an exploded assembly structure according to one embodiment;

[0028] Figure 3 This is a cross-sectional structural diagram of one embodiment;

[0029] Figure 4 This is a schematic diagram of a heat sink structure according to one embodiment;

[0030] Figure 5 This is a schematic diagram of a heat sink structure according to another embodiment;

[0031] Figure 6 This is a structural schematic diagram of the inner cylinder, air guide frame, and air guide plate in one embodiment;

[0032] in:

[0033] 1-Outer shell; 100-Air cavity; 101-Air outlet; 102-Air inlet; 10-Holding part; 11-Cylinder body; 12-Air guide plate; 13-Air guide frame; 14-Fixing frame; 111-Outer cylinder; 112-Inner cylinder; 121-Air guide surface; 131-Recessed area; 141-Central support; 142-Connecting rod; 143-Outer ring body;

[0034] 2-Fan blade; 21-Blade;

[0035] 200 - Motor;

[0036] 3-Temperature conductive components;

[0037] 4-Semiconductor cooling components;

[0038] 5-Heat dissipation component; 51-Main body; 52-Protrusion; 511-First heat conduction surface; 512-Second heat conduction surface; 513-Peripheral side surface; 522-First recess; 523-First convex part; 524-Second recess; 525-Second convex part; 5211-First heat dissipation surface; 5212-Second heat dissipation surface. Detailed Implementation

[0039] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the terminology used herein in the specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and accompanying drawings of this invention are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or accompanying drawings of this invention are used to distinguish different objects, not to describe a particular order.

[0040] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the present invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0041] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0042] See appendix Figures 1 to 6 This utility model proposes a handheld fan, including a housing 1, fan blades 2, a motor 200, a temperature conducting component 3, a semiconductor cooling component 4, and a heat sink 5. The housing 1 contains a wind chamber 100, which has an air outlet 101 and an air inlet 102. The motor 200 and fan blades 2 are both installed within the wind chamber 100. The motor 200 drives the fan blades 2 to rotate, thereby generating a directional airflow from the air inlet 102 to the air outlet 101.

[0043] The temperature-conducting element 3 is located on the outside of the air outlet 101 and is intended to come into contact with the user's skin.

[0044] The thermoelectric cooling element 4 and the heat-conducting element 3 are thermally connected. When current is applied to the thermoelectric cooling element 4, one side of the thermoelectric cooling element 4 absorbs heat (cold end) and the other side releases heat (hot end), bringing the heat-conducting element 3 into contact with the cold end of the thermoelectric cooling element 4. The high thermal conductivity of the heat-conducting element 3 transfers heat from the skin to the thermoelectric cooling element 4, thus cooling the user's skin. The heat generated at the hot end of the thermoelectric cooling element 4 needs to be dissipated.

[0045] Specifically, the heat sink 5 is used to dissipate heat from the hot end of the semiconductor cooling chip 4. The heat sink 5 is located between the fan blade 2 and the air outlet 101. The fan blade 2 rotates to generate a high-speed airflow. When the airflow flows over the surface of the heat sink 5, it carries away the heat from the heat sink 5, thereby enhancing the heat dissipation efficiency of the heat sink 5.

[0046] Referring to 2 to 5, the heat sink 5 includes a main body 51 and a protrusion 52. The main body 51 includes a first heat conduction surface 511, a second heat conduction surface 512 opposite to the first heat conduction surface 511, and a peripheral side surface 513 located between the first heat conduction surface 511 and the second heat conduction surface 512. The first heat conduction surface 511 is thermally connected to the thermoelectric cooler, specifically, the first heat conduction surface 511 is attached to the hot end of the thermoelectric cooler to increase the contact area. The second heat conduction surface 512 faces the fan blade 2. The airflow generated by the fan blade 2 mainly flows through the peripheral side surface 513 of the main body 51, while the protrusion 52 is disposed on the peripheral side surface 513. The protrusion 52 expands the effective heat dissipation area of ​​the heat sink 5, accelerates the diffusion of heat to the air, and thus improves the heat dissipation efficiency of the heat sink 5. In addition, heat can also be transferred between the thermoelectric cooler 4 and the temperature conductor 3 or the heat sink 5 through a material with high thermal conductivity. For example, a metal block is attached to the first heat conduction surface 511, and heat transfer is achieved through the metal block being attached to the temperature conductor 3.

[0047] Therefore, this handheld fan utilizes the fan blades 2 to force convection to cool the heat sink 5, and combines the protrusions 52 of the heat sink 5 to maximize heat exchange efficiency, ensuring that the semiconductor cooling component 4 continues to work efficiently, providing users with a long-lasting, low-temperature skin-friendly cooling experience.

[0048] Regarding the structure of the heat sink 5, in some embodiments, multiple protrusions 52 are spaced apart on the peripheral side surface 513, extending from the peripheral side surface 513 towards the inner wall of the air cavity 100. The protrusions 52 can be integrally formed with the main body 51 or fixed by welding / riveting. The protrusions 52 significantly increase the effective heat dissipation area of ​​the heat sink 5, directly improving heat exchange efficiency. Multiple protrusions 52 are evenly distributed around the circumference of the peripheral side surface 513, and adjacent protrusions 52 form an air outlet area. That is, the airflow generated by the fan blades 2 passes through the air outlet area before flowing to the outside from the air outlet 101. The presence of these protrusions 52 expands the heat dissipation area of ​​the heat sink 5 from a single plane to three-dimensional space, solving the problem of insufficient heat dissipation area in a compact structure.

[0049] Regarding the heat sink 5, in some embodiments, see the appendix. Figures 4 to 5The heat sink 5 also includes a first recess 522 and / or a first protrusion 523 formed on the peripheral side surface 513, wherein the first recess 522 is recessed into the peripheral side surface 513, and the first protrusion 523 is protruding from the peripheral side surface 513, and the first recess 522 and / or the first protrusion 523 extend from the second heat conduction surface 512 to the first heat conduction surface 511. The first recess 522 is a groove structure, which can be a V-shaped groove, an arc-shaped groove, or a trapezoidal groove, etc.; the first protrusion 523 is a boss structure, which can be a hemispherical protrusion, a V-shaped elongated protrusion, an arc-shaped elongated protrusion, or a prismatic elongated protrusion, etc. Multiple first recesses 522, multiple first protrusions 523, or a combination of multiple first recesses 522 and multiple first protrusions 523 can be provided on the peripheral side surface 513 of the main body 51. The multiple first recesses 522 / first protrusions 523 are distributed around the circumference of the circumferential side surface 513, which greatly increases the area of ​​the entire circumferential side surface 513, that is, increases the effective heat dissipation area.

[0050] Similarly, in some embodiments, see Appendix Figures 4 to 5 The surface of the protrusion 52 is further provided with a second recess 524 and / or a second protrusion 525, wherein the second recess 524 is recessed into the surface of the protrusion 52, and the second recess 524 may have the same structure as the first recess 522; the second protrusion 525 is protruding from the surface of the protrusion 52, and the second protrusion 525 may have the same structure as the first protrusion 523. The second recess 524 / second protrusion 525 is used to increase the effective heat dissipation area of ​​the protrusion 52.

[0051] For example, in some embodiments, a plurality of protrusions 52 and a plurality of first recesses 522 / first protrusions 523 may be provided on the main body 51; in other embodiments, a plurality of protrusions 52 and a plurality of first recesses 522 / first protrusions 523 may be provided on the main body 51, and a plurality of second recesses 524 / second protrusions 525 may be provided on the protrusions 52; in still other embodiments, a plurality of protrusions 52 may be provided on the main body 51, and then a plurality of second recesses 524 / second protrusions 525 may be provided on the protrusions 52. All three embodiments described above increase the effective heat dissipation area of ​​the heat sink 5, and the only difference between these three embodiments is the amount of increase in heat dissipation area.

[0052] In some embodiments, the outer casing 1 includes a grip portion 10, a cylindrical body 11 formed at the top of the grip portion 10, and at least one air guide plate 12. The grip portion 10 is for handheld use by a user. An air cavity 100 is located inside the cylindrical body 11, and the air guide plate 12 is located inside the air cavity 100, between the fan blade 2 and the heat sink 5. The air guide plate 12 extends obliquely from the fan blade 2 toward the protrusion 52. The main function of the air guide plate 12 is to guide the airflow, allowing the airflow generated by the fan blade 2 to flow more smoothly and effectively over the surface of the heat sink 5, especially over the area with the protrusion 52, thereby further improving the heat dissipation efficiency. The tilt angle and shape of the air guide plate 12 can be optimized according to actual heat dissipation requirements; for example, the air guide plate 12 can be arranged in a curved oblique shape. The number of air guide plates 12 is determined according to the number of protrusions 52. Multiple air guide plates 12 are evenly distributed between the fan blade 2 and the heat sink 5, forming a more stable and uniform airflow field, further improving the heat dissipation effect.

[0053] In some embodiments, see Appendix Figure 4 The protrusion 52 is plate-shaped and has a first heat dissipation surface 5211 and a second heat dissipation surface 5212, both of which extend from the second heat conduction surface 512 to the first heat conduction surface 511. The air guide plate 12 has two corresponding air guide surfaces 121, which are respectively connected to the first heat dissipation surface 5211 and the second heat dissipation surface 5212. The air guide surface 121 smoothly transitions to the surface of the protrusion 52, which reduces noise and allows for a higher airflow velocity on the surface of the protrusion 52.

[0054] In some embodiments, the fan blade 2 includes a plurality of inclined blades 21, and the inclination direction of the guide vane 12 is opposite to the inclination direction of the blades 21 of the fan blade 2. This opposite inclination direction arrangement can more effectively guide and organize the airflow. The airflow generated when the fan blade 2 is working is a rotating airflow, and the reverse-inclination guide vane 12 can guide the rotating airflow into a straight airflow.

[0055] Further, see appendix. Figure 2 , 3 In addition to the 6, the outer casing 1 also includes an air guide frame 13, which is close to or abuts the second heat conduction surface 512. The air guide plate 12 is integrally mounted on the air guide frame 13, and a recessed area 131 is formed at the connection between the air guide frame 13 and the air guide plate 12, so that part of the second heat conduction surface 512 is exposed in the recessed area 131. That is, part of the airflow generated by the fan blade 2 can pass through the second heat conduction surface 512, thereby carrying away the heat on the second heat conduction surface 512. The setting of the recessed area 131 is equivalent to further increasing the effective heat dissipation area of ​​the heat sink 5.

[0056] In some embodiments, the outer casing 1 further includes a fixing frame 14, which is located within the air cavity 100 and embedded in the air outlet 101. The fixing frame 14 and the air guide frame 13 together clamp and fix the heat sink 5. The fixing frame 14 includes a central support 141, a connecting rod 142, and an outer ring 143. The central support 141 is used to support the semiconductor cooling component 4 and the temperature conducting component 3. The connecting rod 142 connects the cylinder 11 and the outer ring 143, and the outer ring 143 is embedded in the air outlet 101 of the air cavity 100. The aforementioned protrusion 52 and air guide plate 12 are all correspondingly provided with the connecting rod 142. Specifically, a protrusion 52 is clamped between each connecting rod 142 and an air guide plate 12.

[0057] Furthermore, a structure that facilitates disassembly and assembly can be designed between the fixed frame 14 and the cylinder 11. For example, a hook can be provided on the outer ring 143 of the fixed frame 14, and a corresponding slot can be provided on the cylinder 11. The hook can be elastically engaged in the slot, allowing the user to disassemble the fixed frame 14 for cleaning, maintenance, or replacement of the heat sink 5. Additionally, the cylinder 11 can also be designed with a detachable structure. For example, the cylinder 11 can be divided into an inner cylinder 112 and an outer cylinder 111. The air chamber 100 is located in the inner cylinder 112, and the air guide plate 12 and air guide frame 13 are connected to the inner cylinder 112. The inner cylinder 112 is inserted into the outer cylinder 111 through an interference fit. The user can apply external force to push the inner cylinder 112 to detach it from the outer cylinder 111, facilitating disassembly for cleaning, maintenance, or replacement of internal components.

[0058] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A handheld fan, characterized in that, include: The outer shell (1) has an air cavity (100) inside, and the outer shell (1) has an air outlet (101) communicating with the air cavity (100); Fan blades (2) are installed inside the air cavity (100) to drive airflow toward the air outlet (101); The motor (200) is fixed inside the air cavity (100) and drivenly connected to the fan blade (2); Temperature-conducting component (3) is located outside the air outlet (101); The semiconductor cooling component (4) is thermally connected to the temperature-conducting component (3); A heat sink (5) is located between the fan blade (2) and the air outlet (101). The heat sink (5) includes a main body (51) and a protrusion (52). The main body (51) includes a first heat conduction surface (511), a second heat conduction surface (512) opposite to the first heat conduction surface (511), and a peripheral side surface (513) located between the first heat conduction surface (511) and the second heat conduction surface (512). The first heat conduction surface (511) is thermally connected to the semiconductor cooling device (4). The second heat conduction surface (512) faces the fan blade (2). The protrusion (52) is disposed on the peripheral side surface (513).

2. The handheld fan according to claim 1, characterized in that, The peripheral side surface (513) is provided with a plurality of protrusions (52) spaced apart, and the protrusions (52) extend from the peripheral side surface (513) toward the inner wall of the air cavity (100).

3. The handheld fan according to claim 2, characterized in that, The plurality of protrusions (52) are distributed at intervals around the circumferential side surface (513).

4. The handheld fan according to any one of claims 1 to 3, characterized in that, The peripheral side surface (513) is provided with a plurality of first recesses (522), the first recesses (522) being recessed into the peripheral side surface (513); and / or, the peripheral side surface (513) is provided with a plurality of first protrusions (523), the first protrusions (523) being protruded into the peripheral side surface (513).

5. The handheld fan according to claim 4, characterized in that, The first recess (522) and / or the first protrusion (523) extend from the second heat conduction surface (512) toward the first heat conduction surface (511).

6. The handheld fan according to any one of claims 1 to 3, characterized in that, The surface of the protrusion (52) is provided with a plurality of second recesses (524), the second recesses (524) being recessed into the surface of the protrusion (52); and / or, the surface of the protrusion (52) is provided with a plurality of second protrusions (525), the second protrusions (525) being protruded into the surface of the protrusion (52).

7. The handheld fan according to any one of claims 1 to 3, characterized in that, The outer casing (1) includes a cylindrical body (11) and at least one air guide plate (12). The air cavity (100) is located inside the cylindrical body (11), and the air guide plate (12) is located inside the air cavity (100). The air guide plate (12) is located between the fan blade (2) and the heat sink (5) and guides the airflow generated by the fan blade (2) to the surface of the protrusion (52).

8. The handheld fan according to claim 7, characterized in that, The protrusion (52) has a first heat dissipation surface (5211) and a second heat dissipation surface (5212) opposite to each other. The first heat dissipation surface (5211) and the second heat dissipation surface (5212) both extend from the second heat conduction surface (512) side to the first heat conduction surface (511) side. The air guide plate (12) has two air guide surfaces (121) located on opposite sides, and the two air guide surfaces (121) are respectively connected to the first heat dissipation surface (5211) and the second heat dissipation surface (5212).

9. The handheld fan according to claim 7, characterized in that, The outer casing (1) also includes an air guide frame (13) fixed in the air cavity (100), the air guide frame (13) being close to or abutting the second heat conduction surface (512), the air guide plate (12) being connected to the air guide frame (13), and a recessed area (131) being formed on the surface of the air guide frame (13) to expose at least a portion of the second heat conduction surface (512).

10. The handheld fan according to claim 9, characterized in that, The outer casing (1) also includes a cylindrical body (11), an air guide frame (13), and a fixed frame (14). The air cavity (100) is located inside the cylindrical body (11). The air guide frame (13) is fixed inside the air cavity (100) and abuts against the second heat conduction surface (512). The air guide plate (12) is connected to the air guide frame (13). The fixed frame (14) is embedded in the air outlet (101). The heat sink (5) is located between the fixed frame (14) and the air guide frame (13).

11. The handheld fan according to claim 10, characterized in that, The fixed frame (14) includes a central support (141), a connecting rod (142), and an outer ring (143). The semiconductor cooling component (4) and the temperature conducting component (3) are both mounted on the central support (141). The connecting rod (142) connects the cylinder (11) and the outer ring (143). The outer ring (143) abuts against the inner wall of the air cavity (100). The protrusion (52) is correspondingly provided with the connecting rod (142).

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