Damping mechanism and chip punching device

Abstract

The utility model provides a kind of chip stamping device and damping mechanism.Damping mechanism includes pedestal, riser and buffer piece.Riser is used to carry stamping mechanism, it is vertically movably connected in pedestal, riser is provided with accommodating groove, the opening of accommodating groove faces downward.Buffer piece is set in accommodating groove, its bottom end protrudes from the opening of accommodating groove, and it is abutted to pedestal, for providing upward elastic force to riser, and make riser and pedestal keep interval arrangement.The chip stamping device includes the above-mentioned damping mechanism.The damping mechanism and chip stamping device of the utility model, when stamping, riser moves along vertical direction and approaches pedestal under the action of stamping mechanism, buffer piece provides elastic force, so that riser moves upward in vertical direction and away from pedestal, so that riser and pedestal keep interval arrangement, play the role of damping.Buffer piece is set in the accommodating groove in the bottom of riser, facilitate assembly, and the gap between riser and pedestal can be smaller, realize damping in small space.

Description

Technical Field

[0001] This utility model relates to the field of chip stamping technology, and in particular to a shock-absorbing mechanism and a chip stamping device. Background Technology

[0002] After the chip is encapsulated, the scrap material needs to be removed. The chip stamping device is integrated with other chip processing devices on a single piece of equipment. Vibration will occur during the stamping process, affecting the operation of other parts of the equipment and also affecting the quality of the chip.

[0003] Therefore, it is necessary to provide a shock-absorbing mechanism and a chip stamping device to solve the above-mentioned technical problems. Utility Model Content

[0004] This invention provides a shock-absorbing mechanism and a chip stamping device, which can achieve shock absorption in a small space.

[0005] The technical solution of this utility model is as follows: A shock absorption mechanism, comprising: Base; A vertical plate, used to support the stamping mechanism, is vertically movably connected to the base. The vertical plate is provided with a receiving groove, the opening of which faces downwards; and... A buffer element is disposed in the receiving groove, with its bottom end protruding from the opening of the receiving groove and abutting against the base, for providing an upward buffering force to the upright plate and keeping the upright plate and the base spaced apart.

[0006] In the shock absorption mechanism described in this utility model, the buffer element is a compression spring, an air bladder, or a single-acting cylinder.

[0007] In the shock absorption mechanism of this utility model, an observation port is provided on the side of the upright plate. The observation port is connected to the inner cavity of the receiving groove. The observation port is a long strip arranged vertically and extends to both ends of the receiving groove.

[0008] In the shock absorption mechanism described in this utility model, the receiving groove is cylindrical, and the width of the observation port is smaller than the diameter of the receiving groove.

[0009] In the shock absorption mechanism described in this utility model, the dimension of the buffer member protruding from the receiving groove in the vertical direction is less than 1 / 10 of the overall dimension of the buffer member.

[0010] In the shock absorption mechanism described in this utility model, the buffer element is configured as a rectangular spring.

[0011] In the shock absorption mechanism of this utility model, the vertical plate is configured as two pieces arranged in a horizontal direction, the two vertical plates are arranged in parallel and fixedly connected, and the observation port is located on the side of the vertical plates that are opposite to each other.

[0012] In the shock absorption mechanism of this utility model, the upright plate is provided with a plurality of receiving grooves, the plurality of receiving grooves are arranged longitudinally, and the buffer is provided in a plurality of locations respectively in the plurality of receiving grooves.

[0013] In the shock absorption mechanism of this utility model, the shock absorption mechanism further includes a bolt and a through hole. The bolt includes a nut, a smooth rod portion and a threaded rod portion. The smooth rod portion is connected between the nut and the threaded rod portion, and the threaded rod portion is threaded to the base. The through hole is arranged vertically, the smooth rod portion is movably inserted through the through hole, and the nut is located at the top of the through hole for limiting the position of the upright plate. The perforation is provided on the upright plate; and / or, The bottom end of the upright plate is fixed with a base plate, the perforation is provided on the base plate, and the base plate and the base are arranged at intervals in the vertical direction.

[0014] In the shock absorption mechanism described in this utility model, when the perforation is provided on the upright plate, the upright plate is provided with a clearance hole, the clearance hole connects the two surfaces of the upright plate, the top end of the perforation is connected to the clearance hole, and the nut is located in the clearance hole.

[0015] Another technical solution of this utility model is: A chip stamping apparatus includes a stamping mechanism and the aforementioned shock-absorbing mechanism, wherein the stamping mechanism is mounted on a vertical plate.

[0016] Compared with the prior art, the advantages of this utility model are as follows: During stamping, the shock-absorbing mechanism and chip stamping device of this utility model allow the upright plate to move vertically downwards towards the base under the action of the stamping mechanism. The buffer provides a buffering force, causing the upright plate to move vertically upwards away from the base, thus maintaining a gap between the upright plate and the base and achieving shock absorption. The buffer is located in a receiving groove at the bottom of the upright plate, facilitating assembly and minimizing the gap between the upright plate and the base, achieving shock absorption in a small space. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments are briefly introduced below. The drawings described below are only the corresponding drawings of some embodiments of this utility model.

[0018] Figure 1 This is a partial structural schematic diagram of the chip stamping device provided in a preferred embodiment of the present invention.

[0019] Figure 2 This is a schematic diagram of the structure of the vertical plate of the shock absorption mechanism provided in a preferred embodiment of the present invention.

[0020] Figure 3 This is a schematic diagram of the substrate of the shock absorption mechanism provided in a preferred embodiment of the present invention.

[0021] Figure 4 A schematic diagram of the bolt structure of the shock absorption mechanism provided in a preferred embodiment of this utility model.

[0022] in, 1. Vibration damping mechanism, 11. Vertical plate; 111. Receiving groove; 112. Observation port; 113. Clearance hole. 12. Buffer components 13. Bolt; 131. Nut; 132. Smooth rod section; 133. Threaded rod section. 14. Substrate, 15. Perforation, 2. Stamping mechanism.

[0023] In the diagram, units with similar structures are represented by the same labels. Detailed Implementation

[0024] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0025] The directional terms mentioned in this utility model, such as "up", "down", "front", "back", "left", "right", "inner", "outer", "side", "top" and "bottom", are only for reference to the orientation of the accompanying drawings. The directional terms used are for the purpose of explaining and understanding this utility model, and are not intended to limit this utility model.

[0026] The terms "first" and "second" in this utility model are used for descriptive purposes only and should not be construed as indicating or implying relative importance, nor as a restriction on the order of events.

[0027] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0028] After the chip is encapsulated, the scrap material needs to be punched off. The punching process will generate vibration, which will affect the operation of other parts of the equipment.

[0029] The following is a preferred embodiment of a chip stamping device provided by this utility model that can solve the above-mentioned technical problems.

[0030] A preferred embodiment of this utility model provides a chip stamping apparatus. Please refer to... Figure 1 The chip stamping device includes a stamping mechanism 2 (only part of the support structure of the stamping mechanism 2 is shown in the figure) and a shock absorption mechanism 1. The stamping mechanism 2 is mounted on the upright plate 11.

[0031] Please refer to Figure 1 and Figure 2 The shock absorption mechanism 1 includes a base (not shown in the figure), a vertical plate 11, and a buffer member 12. The vertical plate 11 supports the stamping mechanism 2 and is vertically movably connected to the base. The vertical plate 11 is provided with a receiving groove 111, the opening of which faces downward. The buffer member 12 is disposed in the receiving groove 111, its bottom end protruding from the opening of the receiving groove 111 and abutting against the base, for providing an upward buffering force to the vertical plate 11 and maintaining a distance between the vertical plate 11 and the base. Figure 1 In the diagram, the x-direction is horizontal, the y-direction is vertical, and the z-direction is vertical.

[0032] The shock-absorbing mechanism 1 and chip stamping device of this utility model, during stamping, the upright plate 11 moves vertically downward toward the base under the action of the stamping mechanism 2. The buffer member 12 provides a buffering force, causing the upright plate 11 to move vertically away from the base and upward, thereby maintaining a gap between the upright plate 11 and the base, which plays a role in shock absorption. The buffer member 12 is set in the receiving groove 111 at the bottom of the upright plate 11, which is convenient for assembly and can make the gap between the upright plate 11 and the base smaller, achieving shock absorption in a small space.

[0033] The buffer 12 is a compression spring, which facilitates assembly. In other embodiments, the buffer 12 can be an airbag or a single-acting cylinder.

[0034] Please refer to Figure 2 An observation port 112 is provided on the side of the upright plate 11. The observation port 112 is connected to the inner cavity of the receiving groove 111. The observation port 112 is a long strip arranged vertically and extends to both ends of the receiving groove 111. Whether the buffer 12 is in normal working condition can be observed completely through the observation port 112.

[0035] Please refer to Figure 2 The receiving groove 111 is cylindrical, and the width of the observation port 112 is smaller than the diameter of the receiving groove 111, which can prevent the buffer 12 from falling out of the receiving groove 111.

[0036] Please refer to Figure 1 The size of the buffer 12 protruding from the receiving groove 111 is less than 1 / 10 of the overall size of the buffer 12, so that the overall size of the buffer 12 is larger, which is conducive to the shock absorption function.

[0037] The buffer 12 is set as a rectangular spring, which can make the buffer 12 more rigid and stronger in load capacity.

[0038] Please refer to Figure 1 The uprights 11 are configured as two pieces arranged horizontally, parallel to each other and fixedly connected. The observation port 112 is located on the opposite side of the uprights 11. The two uprights 11 are connected as a whole, which can improve the vibration reduction effect. The observation port 112 is located on the opposite side of the uprights 11 for easy observation.

[0039] Please refer to Figure 1 The upright plate 11 is provided with multiple receiving grooves 111, which are arranged longitudinally. Multiple buffer members 12 are provided, which are located in the multiple receiving grooves 111 respectively, which can further improve the shock absorption effect.

[0040] Please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 The shock absorption mechanism 1 also includes a bolt 13 and a through hole 15. The bolt 13 includes a nut 131, a smooth rod portion 132, and a screw portion 133. The smooth rod portion 132 is connected between the nut 131 and the screw portion 133, and the screw portion 133 is threaded to the base. The through hole 15 is arranged vertically, and the smooth rod portion 132 is movably inserted through the through hole 15. The nut 131 is located at the top of the through hole 15 and is used to limit the position of the upright plate 11. The through hole 15 is provided on the upright plate 11. A base plate 14 is fixed to the bottom end of the upright plate 11, and the through hole 15 is provided on the base plate 14. The base plate 14 and the base are vertically spaced apart. The smooth rod portion 132 stabilizes the vertical movement of the upright plate 11, and the nut 131 can limit the position of the upright plate 11 to prevent the upright plate 11 from detaching from the smooth rod portion 132. The base plate 14 may or may not be fixed to the bottom end of the upright plate 11. The perforation 15 can be provided on the upright plate 11, on the base plate 14, or on both. In this embodiment, the base plate 14 is fixed to the bottom of the upright plate 11, and both the upright plate 11 and the base plate 14 are provided with perforations 15, and multiple bolts 13 are provided accordingly.

[0041] Please refer to Figure 2 When the perforation 15 is provided in the upright plate 11, the upright plate 11 is provided with a clearance hole 113, which connects the two surfaces of the upright plate 11. The top end of the perforation 15 is connected to the clearance hole 113, and the nut 131 is located in the clearance hole 113. With the above structure, the structure can be made compact.

[0042] Working principle of the chip stamping device of the preferred embodiment of this utility model: The shock-absorbing mechanism 1 and chip stamping device of this utility model, during stamping, the upright plate 11 moves vertically downward toward the base under the action of the stamping mechanism 2. The buffer 12 provides elastic force, causing the upright plate 11 to move vertically away from the base and upward, thereby maintaining a distance between the upright plate 11 and the base, which plays a role in shock absorption. The smooth rod part 132 is used to move the upright plate 11 vertically, and the nut 131 can limit the upright plate 11 to prevent the upright plate 11 from disengaging from the bolt 13.

[0043] This is the working principle of the chip stamping device in this preferred embodiment.

[0044] This utility model discloses a shock-absorbing mechanism and a chip stamping device. During stamping, the upright plate moves vertically downwards towards the base under the action of the stamping mechanism. The buffer component provides a buffering force, causing the upright plate to move vertically upwards away from the base, thereby maintaining a gap between the upright plate and the base and achieving a shock-absorbing effect. The buffer component is set in a receiving groove at the bottom of the upright plate, which facilitates assembly and allows for a smaller gap between the upright plate and the base, achieving shock absorption in a small space.

[0045] In summary, although the present invention has been disclosed above with reference to preferred embodiments, the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the concept of the technical solution of the present invention, should be included within the scope of protection of the present invention.

Claims

1. A shock absorption mechanism, characterized in that, include: Base; A vertical plate, used to support the stamping mechanism, is vertically movably connected to the base. The vertical plate is provided with a receiving groove, the opening of which faces downward. as well as, A buffer element is disposed in the receiving groove, with its bottom end protruding from the opening of the receiving groove and abutting against the base, for providing an upward buffering force to the upright plate and keeping the upright plate and the base spaced apart.

2. The shock absorption mechanism according to claim 1, characterized in that, The buffer is a compression spring, an airbag, or a single-acting cylinder.

3. The shock absorption mechanism according to claim 1, characterized in that, The side of the upright plate is provided with an observation port, which is connected to the inner cavity of the receiving groove. The observation port is a long strip that is set vertically and extends to both ends of the receiving groove.

4. The shock absorption mechanism according to claim 3, characterized in that, The receiving groove is cylindrical, and the width of the observation port is smaller than the diameter of the receiving groove.

5. The shock absorption mechanism according to claim 1, characterized in that, In the vertical direction, the size of the buffer protruding from the receiving groove is less than 1 / 10 of the overall size of the buffer.

6. The shock absorption mechanism according to claim 3, characterized in that, The upright plate is configured as two pieces arranged horizontally, the two upright plates are parallel and fixedly connected, and the observation port is located on the opposite side of the upright plates.

7. The shock absorption mechanism according to claim 6, characterized in that, The upright plate is provided with a plurality of receiving slots, which are arranged longitudinally, and the buffer is provided in a plurality of slots, each located in one of the plurality of receiving slots.

8. The shock absorption mechanism according to claim 1, characterized in that, The shock absorption mechanism also includes bolts and through holes. The bolts include a nut, a smooth rod, and a threaded rod. The smooth rod is connected between the nut and the threaded rod, and the threaded rod is threaded to the base. The through holes are arranged vertically, and the smooth rod is movably inserted through the through holes. The nut is located at the top of the through holes and is used to limit the position of the upright plate. The perforation is provided on the upright plate; and / or, The bottom end of the upright plate is fixed with a base plate, the perforation is provided on the base plate, and the base plate and the base are arranged at intervals in the vertical direction.

9. The shock absorption mechanism according to claim 8, characterized in that, When the perforation is provided on the upright plate, the upright plate is provided with a clearance hole, the clearance hole connects the two surfaces of the upright plate, the top of the perforation is connected to the clearance hole, and the nut is located in the clearance hole.

10. A chip stamping apparatus, characterized in that, It includes a stamping mechanism and a shock-absorbing mechanism as described in any one of claims 1-9, wherein the stamping mechanism is disposed on the upright plate.

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