A quick heat dissipation structure for LED filament

Abstract

The utility model discloses a quick heat dissipation structure for LED filament relates to LED filament heat dissipation technical field, the utility model discloses an outer shell is provided with the filament body on the inner wall of outer shell, one end of filament body is provided with metal electrode pin, the surface of outer shell is provided with quick heat dissipation subassembly, quick heat dissipation subassembly includes the heat dissipation groove, the heat dissipation groove is set up in the top of outer shell, the utility model discloses the mutual cooperation between the heat dissipation groove, heat dissipation fin etc. component inside quick heat dissipation subassembly has realized the combination of heat dissipation fin, horizontal heat conduction strip, can quickly conduct the heat of filament body to the outside, reduces the heat stagnation, the ventilation convection of the convection port formation, can take away the heat around filament actively, cooperates the conduction heat dissipation and realizes double heat dissipation acceleration, and the heat dissipation groove of multiple linear array has enlarged the heat dissipation area, avoids partial overheating, guarantees filament long -term stable operation.

Description

Technical Field

[0001] This utility model belongs to the field of LED filament heat dissipation technology, and in particular relates to a rapid heat dissipation structure for LED filaments. Background Technology

[0002] Due to the structural characteristics of LED filaments, which involve multiple chips connected in series and high power density, heat tends to accumulate in the small light-emitting area during operation. Traditional heat dissipation solutions rely on heat conduction through the glass shell or heat dissipation through the pins, which is inefficient and has high thermal resistance. This causes the filament junction temperature to rise rapidly, which not only significantly reduces luminous efficiency and causes color temperature drift, but also accelerates phosphor aging and chip failure, severely restricting the application of LED filament lamps in fields of high luminous efficiency and long lifespan.

[0003] According to a public announcement (publication number: CN211450436U), a rapid heat dissipation structure for LED lamps includes a mounting plate, a connecting plate, a lamp cover, and a lamp source. The lamp cover is connected to a snap-fit ​​mechanism and is connected to the connecting plate through the snap-fit ​​mechanism. The lamp source is located inside the lamp cover. The upper end of the connecting plate is connected to a mounting mechanism and is connected to the mounting plate through the mounting mechanism. The lower end of the connecting plate has a groove corresponding to the position of the lamp cover. A heat-conducting plate is fixedly installed inside the groove.

[0004] In the aforementioned application, the combination of heat dissipation fins and horizontal heat-conducting strips, through the cooperation between components such as mounting plates and connecting plates, makes it difficult to quickly conduct the heat of the filament body to the outside, reduce heat retention, and ensure that the ventilation convection formed by the convection port can actively remove the heat around the filament. This results in increased heat retention, difficulty in forming ventilation convection, and difficulty in actively removing the heat around the filament. It also fails to cooperate with conduction heat dissipation to achieve dual heat dissipation acceleration, reduces the heat dissipation area, and causes local overheating. This makes it difficult to ensure the long-term stable operation of the filament and needs improvement. Utility Model Content

[0005] The purpose of this utility model is to provide a rapid heat dissipation structure for LED filaments. Through the cooperation between components such as heat dissipation grooves and heat dissipation fins inside the rapid heat dissipation component, the existing combination of heat dissipation fins and horizontal heat conduction strips cannot solve the problem. It can quickly conduct the heat of the filament body to the outside, reduce heat retention, and the ventilation convection formed by the convection port can actively remove the heat around the filament.

[0006] To solve the above-mentioned technical problems, this utility model is achieved through the following technical solution: This utility model relates to a rapid heat dissipation structure for LED filaments, comprising a housing, a filament body disposed on the inner wall of the housing, a metal electrode pin disposed at one end of the filament body, a rapid heat dissipation assembly disposed on the surface of the housing, the rapid heat dissipation assembly comprising a heat dissipation groove disposed on the top of the housing, heat dissipation fins fixedly connected to the inner wall of the heat dissipation groove, a transverse heat-conducting strip fixedly connected to the top of the filament body, and convection ports disposed on the side of the housing.

[0007] Furthermore, several heat dissipation slots are provided and arranged in a linear array on the top of the outer casing. One end of the heat dissipation fins is located on the top of the filament body, and several heat dissipation slots are provided on the top of the filament body to quickly dissipate heat from the top of the filament.

[0008] Furthermore, the heat dissipation fins are provided in a plurality of them and are arranged in a linear array on the inner wall of the heat dissipation groove. A plurality of heat dissipation fins are provided on one heat dissipation groove, and one end of the heat dissipation fins is attached to the top of the filament body to conduct heat, so that the heat on the surface of the filament body can be discharged to the outside of the heat dissipation groove through the heat dissipation fins, thereby accelerating the rapid heat dissipation of the filament body.

[0009] Furthermore, several convection ports are provided and are symmetrical to each other along the vertical central axis of the outer shell. The convection ports are located on the side of the filament body. Several convection ports are provided on one side of the outer shell, and convection ports are also provided on the opposite side. The two sets of filament bodies are located in the middle of the convection ports, forming convection ventilation and improving the heat dissipation efficiency of the filament body.

[0010] Furthermore, an auxiliary heat dissipation component is provided on the inner wall of the filament body. The auxiliary heat dissipation component includes a core heat-conducting layer, which is disposed on the inner wall of the filament body. A planar heat-spreading layer is disposed above the core heat-conducting layer, and an encapsulated heat dissipation layer is disposed above the planar heat-spreading layer. The design of the core heat-conducting layer is conducive to directly dissipating the heat of the chip PN junction and eliminating the thermal resistance of the chip-substrate contact. The design of the planar heat-spreading layer is conducive to the rapid diffusion of local hot spots by the filament. The encapsulated heat dissipation layer connects to the external heat dissipation structure, taking into account both insulation protection and passive heat storage.

[0011] Furthermore, the core heat-conducting layer is internally provided with ultra-thin copper foil and graphene nanosheets, and the planar heat-equalizing layer is internally provided with flexible graphite sheets and highly thermally conductive flexible silicone, which have high thermal conductivity and help the filament to dissipate heat better.

[0012] Furthermore, the encapsulated heat dissipation layer is internally provided with a glass fiber skeleton and a thermally conductive phase change material. Through the properties of these materials, support is provided for rapid heat dissipation of the filament body.

[0013] This utility model has the following beneficial effects: 1. This utility model achieves the combination of heat dissipation fins and horizontal heat conduction strips through the cooperation between heat dissipation slots and heat dissipation fins inside the rapid heat dissipation component. This combination can quickly conduct the heat of the filament body to the outside, reducing heat retention. The ventilation convection formed by the convection port can actively remove the heat around the filament. Combined with conduction heat dissipation, it achieves dual heat dissipation acceleration. The heat dissipation slots of multiple linear arrays expand the heat dissipation area, avoid local overheating, and ensure the long-term stable operation of the filament.

[0014] 2. This utility model achieves the following through the cooperation between components such as the core heat-conducting layer and the planar heat-spreading layer inside the auxiliary heat dissipation component: the core heat-conducting layer eliminates the contact thermal resistance between the chip and the substrate, allowing the core heat of the filament to be quickly dissipated and preventing the core from overheating; the planar heat-spreading layer disperses local hot spots, preventing local damage caused by heat accumulation inside the filament; and the encapsulated heat dissipation layer takes into account both insulation protection and passive heat storage, while smoothly connecting to the external heat dissipation component, allowing the internal heat to be stably transferred to the outside.

[0015] Of course, any product implementing this utility model does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a three-dimensional appearance structure diagram of the present utility model; Figure 2 This is a three-dimensional side sectional view of the outer shell of this utility model; Figure 3 This is a three-dimensional side sectional view of the convection port of this utility model; Figure 4 This is a three-dimensional side sectional view of the heat dissipation fins of this utility model; Figure 5 This is a three-dimensional side sectional view of the filament body of this utility model.

[0018] The attached diagram lists the components represented by each number as follows: 1. Outer shell; 2. Filament body; 3. Metal electrode pins; 4. Rapid heat dissipation assembly; 41. Heat dissipation groove; 42. Heat dissipation fins; 43. Horizontal heat conduction strip; 44. Convection port; 5. Auxiliary heat dissipation assembly; 51. Core heat conduction layer; 52. Surface heat dissipation layer; 53. Encapsulation heat dissipation layer. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0020] Please see Figures 1-5 As shown, this utility model is a rapid heat dissipation structure for LED filaments, including a housing 1, a filament body 2 disposed on the inner wall of the housing 1, a metal electrode pin 3 disposed at one end of the filament body 2, a rapid heat dissipation assembly 4 disposed on the surface of the housing 1, the rapid heat dissipation assembly 4 including a heat dissipation groove 41, the heat dissipation groove 41 being opened at the top of the housing 1, heat dissipation fins 42 being fixedly connected to the inner wall of the heat dissipation groove 41, a transverse heat-conducting strip 43 being fixedly connected to the top of the filament body 2, and a convection port 44 being opened on the side of the housing 1.

[0021] Several heat dissipation slots 41 are provided and arranged in a linear array on the top of the outer casing 1. One end of the heat dissipation fins 42 is located on the top of the filament body 2. Several heat dissipation slots 41 are provided on the top of the filament body 2 to quickly dissipate heat from the top of the filament.

[0022] Several heat dissipation fins 42 are arranged in a linear array on the inner wall of the heat dissipation slot 41. Several heat dissipation fins 42 are arranged on one heat dissipation slot 41, and one end of the heat dissipation fin 42 is attached to the top of the filament body 2 to conduct heat, so that the heat on the surface of the filament body 2 can be discharged to the outside of the heat dissipation slot 41 through the heat dissipation fins 42, thereby accelerating the rapid heat dissipation of the filament body 2.

[0023] Several convection ports 44 are provided and are symmetrical to each other along the vertical central axis of the outer shell 1. The convection ports 44 are located on the side of the filament body 2. Several convection ports 44 are provided on one side of the outer shell 1 and the same convection port 44 is provided on the opposite side. The two sets of filament bodies 2 are located in the middle of the convection ports 44, forming convection ventilation and improving the heat dissipation efficiency of the filament body 2.

[0024] An auxiliary heat dissipation component 5 is provided on the inner wall of the filament body 2. The auxiliary heat dissipation component 5 includes a core heat-conducting layer 51, which is disposed on the inner wall of the filament body 2. A planar heat-spreading layer 52 is disposed above the core heat-conducting layer 51, and an encapsulated heat dissipation layer 53 is disposed above the planar heat-spreading layer 52. The design of the core heat-conducting layer 51 is conducive to directly dissipating the heat of the chip PN junction and eliminating the thermal resistance of the chip-substrate contact. The design of the planar heat-spreading layer 52 is conducive to the rapid diffusion of local hot spots in the filament. The encapsulated heat dissipation layer 53 connects to the external heat dissipation structure, taking into account both insulation protection and passive heat storage.

[0025] The core heat-conducting layer 51 contains ultra-thin copper foil and graphene nanosheets, while the planar heat-equalizing layer 52 contains flexible graphite sheets and highly thermally conductive flexible silicone, which have high thermal conductivity and help the filament to dissipate heat better.

[0026] The encapsulated heat dissipation layer 53 is internally equipped with a glass fiber skeleton and a thermally conductive phase change material. Through the properties of these materials, it provides support for the rapid heat dissipation of the filament body 2.

[0027] A specific application of this embodiment is as follows: When the LED filament is working, the heat generated by the filament body 2 is first transferred to the heat dissipation groove 41 area on the top of the housing 1 through the horizontal heat conduction strip 43 on its top. The heat dissipation fins 42 arranged linearly on the inner wall of the heat dissipation groove 41, because one end is attached to the top of the filament body 2, can quickly conduct the heat from the surface of the filament body 2 into the heat dissipation groove 41, and then dissipate it outward along the space of the heat dissipation groove 41. At the same time, a number of convection ports 44 symmetrically opened on the side of the housing 1 along the vertical central axis allow air to enter from one side of the convection port 44, pass around the filament body 2 located in the middle of the convection port 44, and flow out from the other side of the convection port 44 with heat, forming a ventilation channel. The air convection, with the heat dissipation of the heat sink 42 through conduction and the air convection of the convection port 44 working together, and the multiple heat dissipation slots 41 on the surface of the outer shell 1 increasing the heat dissipation area, allows the heat of the filament body 2 to be quickly dissipated, ensuring the normal operation of the entire LED filament using a rapid heat dissipation structure. The combination of heat sink 42 and horizontal heat conduction strip 43 can quickly conduct the heat of the filament body 2 to the outside, reducing heat retention. The ventilation convection formed by the convection port 44 can actively remove the heat around the filament, achieving dual heat dissipation acceleration in conjunction with conduction heat dissipation. The multiple linear array heat dissipation slots 41 increase the heat dissipation area, avoid local overheating, and ensure the long-term stable operation of the filament.

[0028] When the LED filament body 2 generates heat during operation, the core heat-conducting layer 51, attached to the inner wall of the filament body 2, first plays a role. The ultra-thin copper foil and graphene nanosheets inside it can directly conduct heat from the PN junction of the core chip of the filament, eliminating the contact thermal resistance between the chip and the substrate, allowing the heat to quickly "run away" from the core. Next, the planar heat dissipation layer 52 above the core heat-conducting layer 51 starts to work. The flexible graphite sheets and highly thermally conductive flexible silicone inside it will quickly dissipate the heat concentrated in a localized area, avoiding the formation of "hot spots" where heat accumulates, and allowing the heat to be distributed more evenly inside the filament. Afterwards, the encapsulation heat dissipation layer 53 above the planar heat dissipation layer 52 connects to the external heat dissipation structure. The glass fiber skeleton inside it can not only play a role in insulation and protection, but also temporarily store some heat with the thermally conductive phase change material, while transferring the evenly distributed heat to the outside. In the heat dissipation component, the core heat-conducting layer 51, the planar heat-spreading layer 52, and the encapsulated heat dissipation layer 53 in the auxiliary heat dissipation component 5 work together to efficiently conduct and evenly distribute the heat inside the filament, and then connect to the external structure to transfer heat, laying a solid internal foundation for the rapid heat dissipation of the entire LED filament. The core heat-conducting layer 51 eliminates the contact thermal resistance between the chip and the substrate, allowing the core heat of the filament to be quickly conducted out, avoiding overheating of the core. The planar heat-spreading layer 52 disperses local hot spots, preventing local damage caused by heat accumulation inside the filament. The encapsulated heat dissipation layer 53 takes into account both insulation protection and passive heat storage, while smoothly connecting to the external heat dissipation component, allowing the internal heat to be stably transferred to the outside.

[0029] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0030] The preferred embodiments of this utility model disclosed above are merely illustrative of the present utility model. These preferred embodiments do not exhaustively describe all details, nor do they limit the utility model to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of this utility model, thereby enabling those skilled in the art to better understand and utilize it. This utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A rapid heat dissipation structure for LED filaments, comprising a housing (1), characterized in that: The inner wall of the outer shell (1) is provided with a filament body (2), one end of the filament body (2) is provided with a metal electrode pin (3), and the surface of the outer shell (1) is provided with a fast heat dissipation component (4). The rapid heat dissipation component (4) includes a heat dissipation groove (41), which is located on the top of the outer shell (1). Heat dissipation fins (42) are fixedly connected to the inner wall of the heat dissipation groove (41). A transverse heat-conducting strip (43) is fixedly connected to the top of the filament body (2). A convection port (44) is provided on the side of the outer shell (1).

2. The rapid heat dissipation structure for LED filaments according to claim 1, characterized in that, The heat dissipation slots (41) are provided in a plurality of them and are arranged in a linear array on the top of the outer shell (1), and one end of the heat dissipation fins (42) is located on the top of the filament body (2).

3. The rapid heat dissipation structure for LED filaments according to claim 2, characterized in that, The heat dissipation fins (42) are provided in a plurality of units and are arranged in a linear array on the inner wall of the heat dissipation groove (41).

4. The rapid heat dissipation structure for LED filaments according to claim 3, characterized in that, The convection port (44) is provided in several ways and is symmetrical to each other along the vertical central axis of the outer shell (1). The convection port (44) is located on the side of the filament body (2).

5. The rapid heat dissipation structure for LED filaments according to claim 4, characterized in that, An auxiliary heat dissipation component (5) is provided on the inner wall of the filament body (2). The auxiliary heat dissipation component (5) includes a core heat-conducting layer (51). The core heat-conducting layer (51) is provided on the inner wall of the filament body (2). A planar heat-equalizing layer (52) is provided above the core heat-conducting layer (51). An encapsulated heat dissipation layer (53) is provided above the planar heat-equalizing layer (52).

6. The rapid heat dissipation structure for LED filaments according to claim 5, characterized in that, The core heat-conducting layer (51) is provided with ultra-thin copper foil and graphene nanosheets, and the planar heat-equalizing layer (52) is provided with flexible graphite sheets and highly thermally conductive flexible silicone.

7. The rapid heat dissipation structure for LED filaments according to claim 6, characterized in that, The encapsulated heat dissipation layer (53) is internally provided with a glass fiber skeleton and a thermally conductive phase change material.

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