Thermal management system and chiller unit

CN224905341UActive Publication Date: 2026-10-27CHONGQING MIDEA GENERAL REFRIGERATING EQUIP CO LTD +1
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Patent Information

Application Number
CN202522283055.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-10-27
Publication Date
2026-10-27
Estimated Expiration
2035-10-27

AI Technical Summary

Technical Problem

[0002]在热管理系统中,压缩机主要用于压缩制冷剂,其作为系统热交换的关键部件,在工作过程中容易产生热量,在相关技术中设有对压缩机进行散热的换热流路,制冷剂在换热流路中流动,以带走压缩机的部件产生的热量,保障热管理系统的稳定运行,但换热流路内的冷媒在回流过程中容易存在管路压损,导致冷媒回液不畅,进而使冷媒堆积在换热流路内,影响压缩机的使用寿命

Benefits of technology

[0003]本实用新型的另一个目的在于提出一种冷水机组,包括前述的热管理系统。

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to a heat management technical field, specifically disclose a kind of heat management system and water chiller, heat management system includes compressor, condenser, evaporator and buffer device, compressor includes heat exchange flow path;One end of condenser connects the exhaust port of compressor;One end of evaporator connects the other end of condenser, the other end of evaporator connects the air inlet of compressor;The outlet of buffer device communicates evaporator;Wherein, heat management system further includes cooling flow path and back gas flow path, one end of cooling flow path communicates condenser and another end communicates heat exchange flow path, one end of back gas flow path communicates heat exchange flow path and another end communicates buffer device, buffer device has pressure relief cavity in, the flow area of pressure relief cavity is greater than the flow area of back gas flow path.According to the heat management system of the utility model embodiment, buffer device can play the role of pressure relief to the refrigerant of back gas flow path, reduce the impact on evaporator, and avoid that refrigerant is not smooth in backflow process pipe pressure loss and lead to refrigerant back liquid, improve the back liquid smoothness of the refrigerant in the heat dissipation flow path of compressor.
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Description

Technical Field

[0001] This utility model relates to the field of thermal management technology, and in particular to a thermal management system and a chiller unit. Background Technology

[0002] In a thermal management system, the compressor is mainly used to compress the refrigerant. As a key component for heat exchange in the system, it easily generates heat during operation. Related technologies include a heat exchange flow path to dissipate heat from the compressor. The refrigerant flows in the heat exchange flow path to carry away the heat generated by the compressor components, ensuring the stable operation of the thermal management system. However, during the refrigerant return process in the heat exchange flow path, there is a risk of pipeline pressure loss, which can lead to poor refrigerant return and refrigerant accumulation in the heat exchange flow path, affecting the service life of the compressor. Utility Model Content This invention aims to at least partially solve one of the technical problems in the related art. Therefore, one objective of this invention is to provide a thermal management system that improves the smoothness of refrigerant return in the compressor's heat exchange path and reduces the impact on the evaporator.

[0003] Another objective of this invention is to provide a chiller unit that includes the aforementioned thermal management system.

[0004] A thermal management system according to an embodiment of the present invention includes: a compressor, a condenser, an evaporator, and a buffer device. The compressor includes a heat exchange flow path. One end of the condenser is connected to the exhaust port of the compressor. One end of the evaporator is connected to the other end of the condenser, and the other end of the evaporator is connected to the suction port of the compressor. The outlet of the buffer device is connected to the evaporator. The thermal management system further includes a cooling flow path and a return flow path. One end of the cooling flow path is connected to the condenser, and the other end is connected to the heat exchange flow path. One end of the return flow path is connected to the heat exchange flow path, and the other end is connected to the buffer device. The buffer device has a pressure relief chamber, and the flow cross-sectional area of ​​the pressure relief chamber is larger than the flow cross-sectional area of ​​the return flow path.

[0005] According to the thermal management system of this utility model embodiment, the heat exchange flow path can be used to dissipate heat from the compressor components. The refrigerant in the heat exchange flow path flows back to the evaporator through the return flow path. By setting a buffer device between the evaporator and the return flow path, the refrigerant in the return flow path can be depressurized, reducing the impact on the evaporator and preventing excessive pressure loss in the pipeline during the refrigerant return process, which would lead to poor refrigerant return. This improves the smoothness of refrigerant return in the compressor's heat exchange flow path.

[0006] In addition, the thermal management system according to the above embodiments of the present invention may have the following additional technical features: In some embodiments, the flow cross-sectional area of ​​the return air path changes abruptly from the flow cross-sectional area of ​​the pressure relief chamber.

[0007] In some embodiments, the flow cross-sectional area of ​​the return air path gradually changes with the flow cross-sectional area of ​​the pressure relief chamber.

[0008] In some embodiments, the ratio of the maximum flow cross-sectional area S1 of the return air path to the flow cross-sectional area S2 of the pressure relief chamber satisfies S1 / S2≥3.

[0009] In some embodiments, the buffer device is configured as a cylindrical tube, the side wall of the buffer device has an installation port, and the outlet of the return air path passes through the installation port and communicates with the pressure relief chamber.

[0010] In some embodiments, the return air path includes at least two pipe segments connected along the refrigerant flow direction of the return air path, wherein the flow cross-sectional area of ​​the downstream pipe segment is greater than that of the upstream pipe segment.

[0011] In some embodiments, the compressor includes a frequency converter and a motor, and the heat exchange path is configured to dissipate heat from the frequency converter and the motor.

[0012] In some embodiments, the heat exchange path includes a first heat exchange branch for dissipating heat from the frequency converter and a second heat exchange branch for dissipating heat from the motor, and the cooling path includes a first cooling branch connecting the condenser and the first heat exchange branch and a second cooling branch connecting the condenser and the second heat exchange branch.

[0013] In some embodiments, the buffer device is connected to the bottom of the evaporator.

[0014] In some embodiments, the evaporator includes a liquid leveling plate opposite to the outlet of the buffer device.

[0015] The chiller unit according to an embodiment of the present invention includes the aforementioned thermal management system. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the thermal management system according to an embodiment of the present invention.

[0017] Figure 2 This is a schematic diagram of a chiller unit according to an embodiment of the present invention.

[0018] Figure 3 yes Figure 2 Enlarged view of point A in the middle circle.

[0019] Figure 4 This is a partial schematic diagram of the chiller unit according to an embodiment of the present utility model.

[0020] Figure 5 yes Figure 4 A cross-sectional view of the C-section.

[0021] Figure 6 This is a partial schematic diagram of the chiller unit according to an embodiment of the present utility model.

[0022] Figure 7 This is a partial cross-sectional schematic diagram of the chiller unit according to an embodiment of the present utility model.

[0023] Figure 8 This is a schematic diagram of the return airflow path in a thermal management system in related technologies.

[0024] Figure 9 This is a cross-sectional schematic diagram of the return airflow channel in a thermal management system in related technologies.

[0025] Figure label: The chiller unit 1000, thermal management system 100, compressor 10, exhaust port 11, intake port 12, condenser 20, evaporator 30, liquid distribution plate 31, buffer device 40, pressure relief chamber 41, mounting port 42, cooling flow path 51, first cooling branch 511, second cooling branch 512, return flow path 52, first pipe section 521, second pipe section 522, dryer filter 60, and intake baffle 70. Detailed Implementation

[0026] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0027] In a thermal management system, the compressor is primarily used to compress the refrigerant. As a key component for heat exchange in the system, it easily generates heat during operation. Related technologies incorporate heat exchange paths to dissipate heat from the compressor. As the refrigerant flows through these paths, it carries away the heat generated by the compressor components, improving their lifespan and reliability, and ensuring the stable operation of the thermal management system. However, during the refrigerant return process within the heat exchange path, pressure loss can occur, leading to poor refrigerant return and refrigerant accumulation. This is particularly problematic in two-stage compressors, where poor refrigerant return increases the refrigerant pressure within the heat exchange path, making it prone to leaking into the lower-pressure first-stage discharge chamber. This results in liquid carryover during the second-stage suction, impacting the compressor's lifespan. Therefore, this invention proposes a thermal management system that improves the smoothness of refrigerant return in the heat exchange path and reduces the impact on the condenser.

[0028] Combination Figure 1 According to an embodiment of the present invention, the thermal management system 100 includes a compressor 10, a condenser 20, and an evaporator 30. One end of the condenser 20 is connected to the exhaust port 11 of the compressor 10; one end of the evaporator 30 is connected to the other end of the condenser 20, and the other end of the evaporator 30 is connected to the suction port 12 of the compressor 10. Specifically, the compressor 10, the condenser 20, and the evaporator 30 can be connected to form a refrigerant circulation loop. The refrigerant enters the compressor 10 from the suction port 12, and after being compressed by the compressor 10, the refrigerant enters the condenser 20 from the exhaust port 11. After heat exchange in the condenser 20, the refrigerant enters the evaporator 30 and evaporates and absorbs heat in the evaporator 30. The refrigerant then re-enters the compressor 10 from the suction port 12 for compression, thereby realizing the circulation of the refrigerant. The compressor 10 includes a heat exchange flow path in which the refrigerant flows to remove heat from the components of the compressor 10, thereby dissipating heat from the components of the compressor 10, improving the service life and reliability of the components of the compressor 10, and ensuring the stable operation of the thermal management system 100.

[0029] Combination Figures 1 to 6 The thermal management system 100 also includes a buffer device 40, the outlet of which is connected to the evaporator 30; wherein, the thermal management system 100 also includes a cooling flow path 51 and a return flow path 52, one end of the cooling flow path 51 is connected to the condenser 20 and the other end is connected to the heat exchange flow path, one end of the return flow path 52 is connected to the heat exchange flow path and the other end is connected to the buffer device 40, the buffer device 40 has a pressure relief chamber 41, the flow cross-sectional area of ​​the pressure relief chamber 41 is larger than the flow cross-sectional area of ​​the return flow path 52. Specifically, after the liquid refrigerant flows out of the condenser 20, it can enter the heat exchange flow path to dissipate heat from the components of the compressor 10. After the refrigerant flows out of the heat exchange flow path, it can enter the evaporator 30 through the return flow path 52. A buffer device 40 is provided between the evaporator 30 and the return flow path 52. When the refrigerant enters the evaporator 30 from the return flow path 52, the pressure relief chamber 41 can play a role in relieving pressure. On the one hand, it prevents the high-speed refrigerant flowing back from the heat exchange flow path to the evaporator 30 from impacting the heat exchange tubes inside the evaporator 30. On the other hand, it can improve the smoothness of the refrigerant return flow. Understandably, refrigerant pressure loss occurs during the refrigerant return process, which can easily lead to poor refrigerant return in the heat exchange path. Refrigerant accumulates in the heat exchange path, and when there is excessive refrigerant accumulation, the excessive refrigerant pressure can easily cause refrigerant to leak into the inner cavity of the compressor 10, resulting in liquid being drawn into the compressor 10. By setting up the buffer device 40, the pressure loss in the pipeline can be reduced, the smoothness of refrigerant return can be improved, thereby reducing the failure rate of the compressor 10 and extending the service life of the compressor 10.

[0030] For example, a return gas pipe is typically provided between the heat exchange flow path of the compressor 10 and the evaporator 30, and the return gas pipe defines a return gas flow path 52, combined with Figure 8 and Figure 9In related technologies, to prevent high-speed airflow from impacting the heat exchange pipes of the evaporator 30 during refrigerant recirculation, an inlet baffle 70 is added to the return airflow path 52, with a notch at the end of the pipe serving as the outlet of the return airflow path 52. This prevents high-speed refrigerant returning from the compressor 10 side from impacting the condenser 20. However, this can easily lead to a narrowing of the flow path, resulting in poor refrigerant return in the heat exchange path. Furthermore, during the processing of the return air pipe, there are factors such as errors in the processing technology. For example, differences in the inner diameter of the return air pipe can easily lead to excessive pressure loss in the pipe. Also, the return air pipe is usually connected by welding; excessively large weld beads at the weld joint can easily obstruct the refrigerant flow, increasing the compression of the pipe and ultimately causing poor refrigerant return in the return airflow path 52. Liquid refrigerant accumulates in the heat exchange path, and when excessive accumulation occurs, it can easily seep into the lower-pressure suction chamber, causing liquid to be drawn into the compressor 10, affecting the reliability of the compressor 10.

[0031] For example, the thermal management system 100 can be a two-stage compressed air-cooled magnetic levitation system. The compressor 10, condenser 20, throttling element, and evaporator 30 are connected to form the main refrigerant flow path. The thermal management system 100 also includes a compressor motor / inverter cooling flow path 51 and a return flow path 52. The return flow path 52 of the motor / inverter starts at the bottom (motor cavity) of the magnetic levitation compressor 10 and flows back to the bottom of the evaporator 30 through a pipeline. When there are errors in the manufacturing process or the inner diameter of the pipe in the return flow path 52, it is easy to cause poor refrigerant return in the heat exchange flow path, causing refrigerant to accumulate in the heat exchange flow path. When the pressure of the accumulated refrigerant is too high, it is easy to cross into the exhaust cavity of the lower-pressure stage, causing liquid to be carried in the second stage suction of the compressor 10, affecting the reliability of the thermal management system 100.

[0032] In this application, the flow cross-sectional area refers to the cross-sectional area of ​​the flow channel perpendicular to the flow direction of the fluid when the fluid flows in the return flow path 52 or the pressure relief chamber 41. For example, a return pipe can be connected between the heat exchange flow path and the evaporator 30. The return pipe can define the return flow path 52. The return pipe can be a square pipe, a round pipe, etc. The flow cross-sectional area of ​​the return flow path 52 is the cross-sectional area inside the pipe perpendicular to the flow direction of the refrigerant. The buffer device 40 can also be a square pipe, a round pipe, etc. The flow cross-sectional area of ​​the pressure relief chamber 41 is the cross-sectional area inside the pressure relief chamber 41 perpendicular to the flow direction of the refrigerant.

[0033] According to the thermal management system 100 of this utility model embodiment, the heat exchange flow path can be used to dissipate heat from the components of the compressor 10. The refrigerant in the heat exchange flow path flows back to the evaporator 30 via the return flow path 52. By setting a buffer device 40 between the evaporator 30 and the return flow path 52, the refrigerant in the return flow path 52 can be depressurized, reducing the impact on the evaporator 30 and preventing excessive pressure loss in the pipeline during the refrigerant return process, thus improving the smoothness of refrigerant return in the heat exchange flow path of the compressor 10.

[0034] For example, the compressor 10 may be a magnetic levitation compressor. The compressor 10 includes a motor and a frequency converter. The frequency converter can be used to adjust the power supply frequency and voltage of the motor, thereby controlling the motor speed to improve the working efficiency of the thermal management system 100 under different operating conditions. The heat exchange path can be used to dissipate heat from the motor; or, the heat exchange path can be used to dissipate heat from the frequency converter; or, the heat exchange path can be used to dissipate heat from both the motor and the frequency converter. Furthermore, the condenser 20 may be a finned heat exchanger or a microchannel heat exchanger.

[0035] In some embodiments of this invention, the flow cross-sectional area of ​​the return airflow path 52 and the flow cross-sectional area of ​​the pressure relief chamber 41 change abruptly. Specifically, the abrupt change in flow cross-sectional area refers to a sudden increase in the flow cross-sectional area of ​​the return airflow path 52 and the flow cross-sectional area of ​​the pressure relief chamber 41, so that the pressure relief chamber 41 can release pressure on the refrigerant, effectively reducing the impact of the refrigerant on the heat exchange tubes of the evaporator 30, and improving the smoothness of refrigerant return, thus preventing refrigerant from accumulating in the heat exchange path.

[0036] For example, the thermal management system 100 may include a return pipe, which may be a cylindrical pipe. The buffer device 40 is also a cylindrical pipe. The abrupt change between the flow cross-sectional area of ​​the return air path 52 and the flow cross-sectional area of ​​the pressure relief chamber 41 is that the inner diameter of the return pipe is much larger than the inner diameter of the buffer device 40. For example, the flow cross-sectional area of ​​the pressure relief chamber 41 may be more than three times the flow cross-sectional area of ​​the return air path 52, so as to relieve the pressure of the refrigerant through the pressure relief chamber 41, reduce the impact of the refrigerant on the heat exchange tube of the evaporator 30, improve the smoothness of the refrigerant return, and prevent the refrigerant from accumulating in the heat exchange flow path.

[0037] Furthermore, since the flow cross-sectional area of ​​the return air path 52 and the flow cross-sectional area of ​​the pressure relief chamber 41 change abruptly, for example, the buffer device 40 may be provided with an installation port 42, and the return air pipe may be welded to the installation port 42; or, the buffer device 40 and the return air pipe may be connected through a pipe joint.

[0038] In some embodiments of this invention, the flow cross-sectional area of ​​the return airflow path 52 and the flow cross-sectional area of ​​the pressure relief chamber 41 gradually change. Specifically, the gradual change in flow cross-sectional area means that the flow cross-sectional areas of the return airflow path 52 and the pressure relief chamber 41 continuously increase, making the refrigerant flow more stable during the return process and reducing eddies. For example, a transition pipe may be provided between the return airflow path 52 and the buffer device 40. The transition pipe is configured as a gradually expanding pipe in the refrigerant flow direction to smoothly guide the refrigerant in the return airflow path 52 to the buffer device 40, and then relieve pressure through the buffer device 40.

[0039] In some embodiments of this invention, the ratio of the maximum flow cross-sectional area S1 of the return airflow path 52 to the flow cross-sectional area S2 of the pressure relief chamber 41 satisfies S1 / S2≥3. Specifically, the flow cross-sectional area of ​​the pressure relief chamber 41 is three times or more the maximum flow cross-sectional area of ​​the return airflow path 52, allowing the refrigerant in the return airflow path 52 to enter an expanded space and quickly release pressure, ensuring smooth return airflow while reducing the impact of return airflow on the liquid inlet distribution of the evaporator 30.

[0040] Optionally, S1 / S2 ≤ 5 to avoid the buffer device 40 being too large, which would increase the processing difficulty and cost of the thermal management system 100. By setting S1 / S2 within a reasonable range, the buffer device 40 can easily depressurize the refrigerant in the return airflow path 52, reduce the impact on the evaporator 30, and facilitate the processing and molding of the system.

[0041] For example, the return airflow path 52 may include multiple pipe segments with different inner diameters, wherein S1 refers to the flow cross-sectional area of ​​the pipe segment with the largest inner diameter among the multiple pipe segments.

[0042] Combination Figure 4 and Figure 5 In some embodiments of this utility model, the buffer device 40 is configured as a cylindrical tube, and the side wall of the buffer device 40 has an installation port 42. The outlet of the return air passage 52 passes through the installation port 42 and connects to the pressure relief chamber 41. By configuring the buffer device 40 as a cylindrical tube, the turbulence of the refrigerant in the pressure relief chamber 41 is reduced, and it is easier to process and manufacture. For example, the buffer device 40 is welded to the shell of the evaporator 30. By configuring it as a cylindrical tube, the welding process between the buffer device 40 and the evaporator 30 is facilitated. The return air pipe can define the return air passage 52, and the return air pipe and the buffer device 40 can be connected by welding.

[0043] Combination Figure 3In some embodiments of this utility model, the return airflow path 52 includes at least two pipe sections, which are connected along the refrigerant flow direction of the return airflow path 52, and the flow cross-sectional area of ​​the downstream pipe section is greater than that of the upstream pipe section. For example, the refrigerant flows in the heat exchange path, carrying away the heat from the internal components of the compressor 10, and then flows back to the evaporator 30 via the return flow path 52. The return flow path 52 may include a first pipe section 521 and a second pipe section 522. The first pipe section 521 connects the heat exchange path and the second pipe section 522, and the second pipe section 522 connects to the buffer device 40. The first pipe section 521 is located upstream, and the second pipe section 522 is located downstream. The flow cross-sectional area of ​​the second pipe section 522 is larger than that of the first pipe section 521 to avoid excessive pressure loss in the return flow path 52, which would lead to poor refrigerant return. By setting at least two pipe sections, the pressure loss of the refrigerant during its flow from the return flow path 52 is reduced, thereby improving the smoothness of the refrigerant return and ensuring the working stability of the compressor 10.

[0044] Of course, the return airflow path 52 may also include three pipe sections, four pipe sections, etc. This utility model does not limit the number of pipe sections for the return airflow.

[0045] In some embodiments of this utility model, the compressor 10 includes a frequency converter and a motor, and the heat exchange flow path is configured to dissipate heat from the frequency converter and the motor. Specifically, the motor can drive the compressor 10 to complete the refrigerant cycle of intake, compression and exhaust, the frequency converter can adjust the frequency and voltage of the power supply and control the speed of the motor, and by setting up a heat exchange flow path to dissipate heat from the frequency converter and the motor, the service life and stable operation of the compressor 10 are improved.

[0046] The heat exchange path includes a first heat exchange branch for cooling the frequency converter and a second heat exchange branch for cooling the motor. The cooling path 51 includes a first cooling branch 511 connecting the condenser 20 and the first heat exchange branch, and a second cooling branch 512 connecting the condenser 20 and the second heat exchange branch. Figure 1 For example, after the refrigerant flows out of the condenser 20, it first passes through the dryer filter 60. After passing through the dryer filter 60, the refrigerant is divided into two branches. One branch passes through the first cooling branch 511 and enters the first heat exchange branch to dissipate heat from the frequency converter. The other branch passes through the second cooling branch 512 and enters the second heat exchange branch to dissipate heat from the motor. The refrigerant from the first heat exchange branch and the second heat exchange branch can merge in the return flow path 52 and then be depressurized by the buffer device 40 before entering the evaporator 30. By setting two branches to dissipate heat from the frequency converter and the motor respectively, the heat dissipation efficiency of the frequency converter and the motor is improved.

[0047] Combination Figure 2 and Figure 3In some embodiments of this utility model, the buffer device 40 is connected to the bottom of the evaporator 30. In other words, the refrigerant in the return flow path 52 is depressurized by the buffer device 40 and then enters the evaporator 30 from the bottom. It is understood that the refrigerant in the return flow path 52 may be in a gas-liquid mixture. Placing the buffer device 40 in the middle or upper part of the evaporator 30 may easily cause the compressor 10 to suck in liquid. The refrigerant in the return flow path 52 is introduced into the evaporator 30 from the bottom, which facilitates the refrigerant to fully vaporize in the evaporator 30 and reduces the risk of the compressor 10 sucking in liquid.

[0048] Combination Figure 7 In some embodiments of this utility model, the evaporator 30 includes a liquid distribution plate 31, which is opposite to the outlet of the buffer device 40. For example, in the refrigerant circulation loop of the thermal management system 100, a throttling element may be provided between the condenser 20 and the evaporator 30. By providing the liquid distribution plate 31, the refrigerant flowing out through the throttling element can be evenly distributed to the heat exchange tubes of the evaporator 30, improving heat exchange efficiency. The liquid distribution plate 31 is opposite to the outlet of the buffer device 40. For example, the liquid distribution plate 31 can be placed above the outlet of the buffer device 40. On the one hand, the liquid distribution plate 31 can further buffer the refrigerant flowing out of the outlet of the buffer device 40, preventing the refrigerant from impacting the heat exchange tubes; on the other hand, it facilitates the even distribution of refrigerant to the heat exchange tubes of the evaporator 30, avoiding uneven heat exchange.

[0049] This utility model also proposes a chiller unit 1000, which includes the aforementioned thermal management system 100.

[0050] For example, the chiller unit 1000 can be an air-cooled magnetic levitation chiller unit. The chiller unit 1000 can be used in scenarios such as data centers, commercial buildings, hotels and energy-saving renovation of public facilities. The compressor 10 is a magnetic levitation compressor. The compressor 10 and the evaporator 30 can be arranged on the same horizontal line of the base component. The cooling circuit of the motor and the frequency converter can achieve refrigerant circulation by relying on pressure difference. By setting the aforementioned thermal management system 100, the buffer device 40 can play a role in depressurization, preventing the refrigerant liquid in the heat exchange flow path from accumulating in the compressor 10, causing the compressor 10 to suck up liquid. The buffer device 40 can also reduce the impact of the refrigerant on the heat exchange pipeline of the evaporator 30 during the refrigerant return process, thereby reducing the failure rate of the evaporator 30.

[0051] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0052] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0053] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0054] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0055] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0056] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A thermal management system (100), characterized in that, include: A compressor (10) includes a heat exchange flow path; A condenser (20), one end of which is connected to the exhaust port (11) of the compressor (10); An evaporator (30) is provided, one end of which is connected to the other end of the condenser (20), and the other end of which is connected to the suction port (12) of the compressor (10). A buffer device (40) is provided, the outlet of which is connected to the evaporator (30); The thermal management system (100) further includes a cooling flow path (51) and a return flow path (52). One end of the cooling flow path (51) is connected to the condenser (20) and the other end is connected to the heat exchange flow path. One end of the return flow path (52) is connected to the heat exchange flow path and the other end is connected to the buffer device (40). The buffer device (40) has a pressure relief chamber (41), and the flow cross-sectional area of ​​the pressure relief chamber (41) is larger than the flow cross-sectional area of ​​the return flow path (52).

2. The thermal management system (100) according to claim 1, characterized in that, The flow cross-sectional area of ​​the return air path (52) changes abruptly with the flow cross-sectional area of ​​the pressure relief chamber (41).

3. The thermal management system (100) according to claim 1, characterized in that, The flow cross-sectional area of ​​the return air path (52) gradually changes with the flow cross-sectional area of ​​the pressure relief chamber (41).

4. The thermal management system (100) according to claim 1, characterized in that, The ratio of the maximum flow cross-sectional area S1 of the return air path (52) to the flow cross-sectional area S2 of the pressure relief chamber (41) satisfies S1 / S2≥3.

5. The thermal management system (100) according to claim 1, characterized in that, The buffer device (40) is cylindrical and has a mounting port (42) on its side wall. The outlet of the return air path (52) passes through the mounting port (42) and is connected to the pressure relief chamber (41).

6. The thermal management system (100) according to any one of claims 1-5, characterized in that, The return airflow path (52) includes at least two pipe sections connected along the refrigerant flow direction of the return airflow path (52), wherein the flow cross-sectional area of ​​the downstream pipe section is greater than that of the upstream pipe section.

7. The thermal management system (100) according to claim 1, characterized in that, The compressor (10) includes a frequency converter and a motor, and the heat exchange flow path is configured to dissipate heat from the frequency converter and the motor.

8. The thermal management system (100) according to claim 7, characterized in that, The heat exchange path includes a first heat exchange branch for dissipating heat from the frequency converter and a second heat exchange branch for dissipating heat from the motor. The cooling path (51) includes a first cooling branch connecting the condenser (20) and the first heat exchange branch and a second cooling branch (512) connecting the condenser (20) and the second heat exchange branch.

9. The thermal management system (100) according to claim 1, characterized in that, The buffer device (40) is connected to the bottom of the evaporator (30).

10. The thermal management system (100) according to claim 1, characterized in that, The evaporator (30) includes a liquid leveling plate (31) which is opposite to the outlet of the buffer device (40).

11. A water chiller unit, characterized in that, The thermal management system (100) includes any one of claims 1-10.