Thermoelectric semiconductor refrigeration heat dissipation structure

Abstract

The utility model provides a kind of thermoelectric semiconductor refrigeration heat dissipation structure, it can reduce deformation, improve refrigeration reliability;Including thermoelectric semiconductor refrigeration piece, the hot end, cold end of thermoelectric semiconductor refrigeration piece is provided with radiator, the radiator is divided into hot end radiator and cold end radiator, any one radiator in the hot end radiator and cold end radiator is cut into at least two cutting sections, gap is set between the cutting section, and heat-conducting material is filled in the gap;The thermoelectric semiconductor refrigeration piece is closely attached between the hot end radiator and cold end radiator, and the hot end radiator and cold end radiator are connected by fastener, the hot end radiator, cold end radiator are all equipped with cover shell, the cover shell and corresponding radiator form heat dissipation channel, and the cover shell is equipped with the heat dissipation fan that communicates the heat dissipation channel.

Description

Technical Field

[0001] This utility model relates to the field of refrigeration technology, specifically a thermoelectric semiconductor refrigeration and heat dissipation structure. Background Technology

[0002] Refrigeration is used in many fields such as daily life, industrial production, and food preservation. Semiconductor refrigerators based on the thermoelectric effect are commonly used. A semiconductor refrigerator generally consists of a thermoelectric cooling chip, a hot-end heat sink, and a cold-end heat sink. Its working principle is that when an external voltage is applied, charge carriers inside the thermoelectric cooling chip migrate from one end to the other under the influence of the electric field, generating a heating or cooling effect. However, since the cooling capacity of a single thermoelectric cooling chip is relatively small, multiple chips are usually connected in parallel or series to increase the cooling effect. When multiple thermoelectric cooling chips are stacked, the size of the hot-end and cold-end heat sinks needs to be increased. However, since the surface of the thermoelectric cooling chip is made of ceramic, the flatness requirements of the contact surface between the ceramic surface and the heat sink surface are very high. Therefore, when the size of the heat sink is increased, the flatness of the heat sink becomes difficult to control. Especially when subjected to external pressure, the deformation of the heat sink plane will increase, which will cause the heat sink to compress and deform the ceramic surface of the thermoelectric cooling chip, damaging the ceramic surface and affecting the overall cooling effect. Utility Model Content

[0003] To address the aforementioned problems, this invention provides a thermoelectric semiconductor cooling and heat dissipation structure that can reduce deformation and improve cooling reliability.

[0004] This utility model adopts the following technical solution: a thermoelectric semiconductor cooling and heat dissipation structure, including a thermoelectric semiconductor cooling chip, wherein a heat sink is provided at both the hot end and the cold end of the thermoelectric semiconductor cooling chip, the heat sink is divided into a hot end heat sink and a cold end heat sink, and any one of the hot end heat sink and the cold end heat sink is cut into at least two segments, with a gap between the segments, and the gap is filled with a thermally conductive material; the thermoelectric semiconductor cooling chip is closely attached between the hot end heat sink and the cold end heat sink, and the hot end heat sink and the cold end heat sink are connected by fasteners; a cover is mounted on both the hot end heat sink and the cold end heat sink, and a heat dissipation channel is formed between the cover and the corresponding heat sink; a cooling fan communicating with the heat dissipation channel is mounted on the cover.

[0005] Furthermore, the thermoelectric semiconductor refrigeration chip is made of thermoelectric material, and there is at least one thermoelectric semiconductor refrigeration chip. When the number of thermoelectric semiconductor refrigeration chips is greater than or equal to two, the thermoelectric semiconductor refrigeration chips are connected in parallel. Furthermore, the gap between the cut segments is 1mm~2mm, and the thermally conductive material used is thermally conductive silicone. Furthermore, any one of the hot-end radiator and the cold-end radiator is cut into four segments, and each segment is provided with bolt holes. The segments are fixedly connected to the uncut radiator through the bolt holes and bolts. Furthermore, a heat insulation plate is provided between the thermoelectric semiconductor cooling chip and the hot end heat sink and / or cold end heat sink, the heat insulation plate is provided with a heat insulation groove, and heat insulation cotton is embedded in the heat insulation groove. The heat insulation cotton is made of PE cotton. Furthermore, the radiator is a finned radiator, and heat dissipation holes are provided on the fins of the radiator; Furthermore, both the hot-end radiator and the cold-end radiator have two covers, with a gap between the two covers.

[0006] The beneficial effects of this utility model are that it divides the heat sink of the hot or cold end of the thermoelectric semiconductor cooling chip into multiple segments, thereby reducing the overall size of the heat sink and increasing its strength. When subjected to external pressure, it can reduce deformation. Furthermore, the segments are filled with thermally conductive material, which can reduce the risk of heat and air leakage. This solves the problem of heat sink deformation causing damage to the thermoelectric semiconductor cooling chip and improves the reliability of cooling. Attached Figure Description

[0007] Figure 1 This is a schematic diagram of the overall assembly structure of this utility model; Figure 2 This is an exploded structural diagram of the present invention before cutting. Figure 3 This is a schematic diagram of the assembly structure of the cold end heat sink after cutting in this embodiment of the utility model; Figure 4 This is a front view of the assembly of the cold-end heat sink after it has been cut in this embodiment of the present invention. Figure 5 This is a top view of the cold-end heat sink after it has been cut in this embodiment of the present invention; Figure 6 This is a schematic diagram of the assembly structure of the hot-end heat sink after cutting in an embodiment of this utility model. Detailed Implementation

[0008] like Figure 1 , Figure 2As shown, this utility model discloses a thermoelectric semiconductor cooling and heat dissipation structure, including a thermoelectric semiconductor cooling chip 1. Both the hot and cold ends of the thermoelectric semiconductor cooling chip 1 are equipped with heat sinks, which are divided into a hot-end heat sink 2 and a cold-end heat sink 3. Either the hot-end heat sink 2 or the cold-end heat sink 3 is cut into at least two segments 4, with a gap between the segments 4, and the gap is filled with thermally conductive material. The thermoelectric semiconductor cooling chip 1 is tightly attached between the hot-end heat sink 2 and the cold-end heat sink 3, and the hot-end heat sink 2 and the cold-end heat sink 3 are connected by fasteners. Each of the hot-end heat sink 2 and the cold-end heat sink 3 is equipped with a cover 5, forming a heat dissipation channel 6 between the cover 5 and the corresponding heat sink. A cooling fan 7 connected to the heat dissipation channel 6 is mounted on the cover 5. Specifically, each of the hot-end heat sink 2 and the cold-end heat sink 3 has two covers 5, with a gap between the two covers 5, so that the cooling fan 7 blows air onto the heat sink, improving the heat dissipation effect.

[0009] The thermoelectric semiconductor refrigeration element 1 is made of thermoelectric material. There is at least one thermoelectric semiconductor refrigeration element 1. When the number of thermoelectric semiconductor refrigeration elements 1 is greater than or equal to two, the thermoelectric semiconductor refrigeration elements 1 are connected in parallel.

[0010] The gap between the cut segments 4 is 1mm. Thermally conductive silicone is used as the thermally conductive material. Liquid silicone with good flowability can be selected to facilitate filling the gaps and reduce heat transfer between the cold and hot ends, thus avoiding affecting the cooling effect of the thermoelectric semiconductor cooling chip 1. Either the hot-end heat sink 2 or the cold-end heat sink 3 is cut into four segments 4. Each segment 4 has bolt holes 8. The cut segments 4 are fixedly connected to the uncut heat sink via the bolt holes 8 and bolts 9. Figures 3-5 As shown, the cold-end radiator 3 is cut into four segments 4, and the four segments 4 are fixedly connected to the hot-end radiator 2 through bolt holes 8 and bolts 9; as Figure 6 As shown, the hot end radiator 2 is cut into four segments 4. The four segments 4 are fixedly connected to the cold end radiator 3 through bolt holes 8 and bolts 9. The radiator can be cut into segments according to the actual situation. If the cold end radiator 3 cannot be divided for some reason, the same measures can be taken to divide the hot end radiator 2 while keeping the cold end radiator 3 intact, which can achieve the same effect.

[0011] A heat insulation plate 9 is provided between the thermoelectric semiconductor cooling chip 1 and the hot end heat sink 2 and / or the cold end heat sink 3. The heat insulation plate 9 is provided with a heat insulation groove 10, and the heat insulation groove 10 is embedded with heat insulation cotton (illustrated in the figure). The heat insulation cotton is made of PE cotton or rubber material with good heat insulation performance, so as to prevent heat transfer between the cold end and the hot end of the thermoelectric semiconductor cooling chip 1, so as to ensure the cooling effect.

[0012] The radiator uses a finned radiator with ventilation holes on the fins (illustrated in the figure), which can further improve the heat dissipation effect.

[0013] In this invention, the cut heat sink is assembled with the uncut heat sink, as well as with the cover 5, cooling fan 7, etc., which not only improves the overall strength, but also prevents the deformation of the entire heat sink from affecting the flatness of local positions of the thermoelectric semiconductor cooling chip 1. It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0014] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A thermoelectric semiconductor cooling and heat dissipation structure, comprising a thermoelectric semiconductor cooling chip, wherein a heat sink is provided at both the hot end and the cold end of the thermoelectric semiconductor cooling chip, and the heat sink is divided into a hot end heat sink and a cold end heat sink, characterized in that: Either the hot-end heat sink or the cold-end heat sink is cut into at least two segments with a gap between them, and the gap is filled with thermally conductive material. The thermoelectric semiconductor cooling chip is attached to the hot-end heat sink and the cold-end heat sink, and the hot-end heat sink and the cold-end heat sink are connected by fasteners. Both the hot-end heat sink and the cold-end heat sink are equipped with a cover, and a heat dissipation channel is formed between the cover and the corresponding heat sink. A cooling fan communicating with the heat dissipation channel is installed on the cover.

2. The thermoelectric semiconductor cooling and heat dissipation structure according to claim 1, characterized in that: The thermoelectric semiconductor refrigeration chip is made of thermoelectric material, and there is at least one thermoelectric semiconductor refrigeration chip. When the number of thermoelectric semiconductor refrigeration chips is greater than or equal to two, the thermoelectric semiconductor refrigeration chips are connected in parallel.

3. The thermoelectric semiconductor cooling and heat dissipation structure according to claim 1, characterized in that: The gap between the cut segments is 1mm to 2mm, and the thermally conductive material used is thermally conductive silicone.

4. The thermoelectric semiconductor cooling and heat dissipation structure according to claim 1, characterized in that: Either the hot-end radiator or the cold-end radiator is cut into four segments, and each segment has bolt holes. The segments are fixedly connected to the uncut radiator through the bolt holes and bolts.

5. The thermoelectric semiconductor cooling and heat dissipation structure according to claim 1, characterized in that: A heat insulation plate is provided between the thermoelectric semiconductor cooling chip and the hot end heat sink and / or cold end heat sink. The heat insulation plate is provided with a heat insulation groove, and heat insulation cotton is embedded in the heat insulation groove. The heat insulation cotton is made of PE cotton.

6. The thermoelectric semiconductor cooling and heat dissipation structure according to claim 1, characterized in that: The radiator is a finned radiator, and heat dissipation holes are provided on the fins of the radiator.

7. The thermoelectric semiconductor cooling and heat dissipation structure according to claim 1, characterized in that: The hot-end radiator and the cold-end radiator each have two covers, with a gap between the two covers.

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