Refrigerator

Abstract

The application provides a refrigerator, which comprises a cabinet, a first evaporation chamber, a first evaporator, a first compartment, a second compartment and a semiconductor refrigeration device, the first evaporation chamber is arranged in the cabinet, the first evaporator is arranged in the first evaporation chamber, the first compartment is arranged in the cabinet, the first compartment and the first evaporation chamber are communicated, the second compartment is arranged in the cabinet, at least one side of the second compartment is provided with a heat exchange channel, and the second compartment is provided with a heat-conducting side wall on at least the side facing the heat exchange channel, the heat exchange channel and the first compartment are communicated, the semiconductor refrigeration device comprises a cold end and a hot end, the cold end is connected with the heat-conducting side wall, and the hot end is arranged in the heat exchange channel. The refrigerator has the rapid cooling capacity of the second compartment, can meet the rapid refrigeration demand of the user, and has the advantages of system simplicity and energy saving, and greatly improves the use flexibility and practicality of the refrigerator.

Description

Technical Field

[0001] This application falls under the field of household appliances, and more specifically, relates to a refrigerator. Background Technology

[0002] Refrigerators, as common household appliances, are used for storing items at low temperatures. Refrigerators typically have multiple compartments, commonly including a refrigerator compartment and a freezer compartment. In addition to these, some refrigerators also have a quick-cooling compartment, designed to create a colder environment than the refrigerator compartment for rapid cooling or short-term freezing of items. It's clear that the core function of the quick-cooling compartment is to achieve rapid cooling; however, current refrigerators' quick-cooling compartments suffer from slow cooling speeds, failing to meet the demand for rapid cooling. Utility Model Content

[0003] The purpose of this application is to provide a refrigerator to solve the technical problem of slow compartment cooling speed in existing refrigerators.

[0004] To achieve the above objectives, the technical solution adopted in this application is: to provide a refrigerator, the refrigerator comprising: Box; First evaporation chamber; the first evaporation chamber is located inside the chamber; First evaporator; the first evaporator is disposed in the first evaporation chamber; The first chamber; the first chamber is located inside the box, and the first chamber is connected to the first evaporation chamber; The second chamber is located inside the box. At least one side of the second chamber is provided with a heat exchange channel, and the second chamber has a heat-conducting sidewall at least on the side facing the heat exchange channel. The heat exchange channel is connected to the first evaporation chamber. Semiconductor cooling device; The semiconductor cooling device includes a cold end and a hot end, the cold end is connected to the heat-conducting sidewall, and the hot end is located in the heat exchange channel.

[0005] Optionally, the first compartment may be a refrigerator compartment or a freezer compartment.

[0006] Optionally, the first compartment is a refrigerator compartment, and the refrigerator also includes: Second evaporation chamber; the second evaporation chamber is located inside the chamber; Second evaporator; the second evaporator is located in the second evaporation chamber; Freezer compartment; The freezer compartment is located inside the cabinet, and the second evaporator compartment is connected to the freezer compartment; The second chamber is connected to the second evaporation chamber.

[0007] Optionally, the refrigerator also includes a first air supply duct and a first air return duct, and the second evaporation chamber is connected to the second compartment through the first air supply duct and the first air return duct to form a closed airflow circulation loop.

[0008] Optionally, the refrigerator also includes a second air supply duct and a second air return duct, and the first evaporation chamber is connected to the heat exchange duct through the second air supply duct and the second air return duct to form an airflow circulation.

[0009] Optionally, the second compartment includes a back panel, a first side panel, and a second side panel. The first side panel and the second side panel are respectively connected to both sides of the back panel to enclose and form a cavity with an opening located on the opposite side of the back panel. The heat exchange channel includes a first heat exchange channel located outside the first side plate and a second heat exchange channel located outside the second side plate. Both the first heat exchange channel and the second heat exchange channel are provided with semiconductor cooling components. The first side plate and the second side plate form a heat-conducting sidewall.

[0010] Optionally, a connecting channel is provided on the outer side of the back plate, the connecting channel connecting the first heat exchange channel and the second heat exchange channel; The second air supply duct is connected to the first heat exchange duct, and the second return air duct is connected to the second heat exchange duct. A first fan is installed in the connecting channel to drive the airflow from the first heat exchange channel to the second heat exchange channel.

[0011] Optionally, a first partition is provided in the first heat exchange channel along a first direction, the first direction being the direction from the back plate to the opening. The first partition divides the first heat exchange channel into a first air duct and a second air duct. The first air duct is connected to the second air supply channel at the end near the back plate, and the first air duct is connected to the second air duct at the end near the opening. The second air duct is connected to the connecting channel at the end near the back plate. A second partition is provided in the second heat exchange channel along the first direction. The second partition divides the second heat exchange channel into a third air duct and a fourth air duct. The third air duct is connected to the connecting channel at the end near the back plate, and the third air duct is connected to the fourth air duct at the end near the opening. The fourth air duct is connected to the second return air duct at the end near the back plate.

[0012] Optionally, a thermally conductive bridging plate is provided between the cold end and the thermally conductive sidewall. The cold end is connected to the thermally conductive sidewall through the thermally conductive bridging plate, and the contact area between the thermally conductive bridging plate and the thermally conductive sidewall is larger than the orthogonal projection area of ​​the cold end on the thermally conductive sidewall.

[0013] Optionally, the hot end is connected to heat dissipation fins, which are disposed within the heat exchange channel.

[0014] The beneficial effects of the refrigerator provided in this application are as follows: Compared with the prior art, the second compartment of the refrigerator in this application embodiment is a rapid cooling compartment. A heat exchange channel is provided on its outer side, and a semiconductor refrigeration element is provided in the heat exchange channel. The cold end of the semiconductor refrigeration element is connected to the heat-conducting sidewall of the second compartment for heat conduction, thereby quickly transferring cold energy to the second compartment. The hot end of the semiconductor refrigeration element is located in the heat exchange channel, which is connected to the first evaporation chamber that supplies cooling to the first compartment. The cold air generated by the first evaporator dissipates heat from the hot end and cools it down, thereby improving the cooling efficiency of the semiconductor refrigeration element and the overall cold energy utilization rate of the refrigerator. This allows the second compartment to have rapid cooling capability, which can not only meet the user's need for rapid cooling of items, but also take into account the simplicity and energy efficiency of the refrigerator. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the refrigerator's appearance in an embodiment of this application; Figure 2 This is a schematic diagram of the second room in an embodiment of this application; Figure 3 This is a schematic diagram of the airflow circulation in the heat exchange channel in the embodiments of this application; Figure 4 This is a schematic diagram of the airflow circulation in the second chamber in an embodiment of this application; Figure 5 This is a schematic diagram showing the arrangement of the air supply and return channels at the rear of the refrigerator in an embodiment of this application; Figure 6 This is a floor plan of the second room in an embodiment of this application; Figure 7 This is a three-dimensional schematic diagram of the second room in an embodiment of this application; Figure 8 This is a schematic diagram of a semiconductor cooling device in an embodiment of this application.

[0017] The following are the labeling elements in the figure: 10. Cabinet body; 1. Refrigerated compartment; 2. Quick-cooling compartment; 20. Heat-conducting sidewall; 21. Heat exchange channel; 211. First heat exchange channel; 2111. First air duct; 2112. Second air duct; 2122. Third air duct; 2121. Fourth air duct; 2122. Back panel; 22. First side panel; 23. Second side panel; 24. Opening; 25. Connecting channel; 26. First fan; 27. First partition; 28. Second partition; 29. ​​Freezer compartment; 3. Semiconductor refrigeration component; 4. Cold end; 41. Hot end; 42. Heat-conducting bridge plate; 43. Heat dissipation fins; 44. First evaporation chamber; 51. First evaporator; 51. Second evaporation chamber; 6. Second evaporator; 61. First air supply channel; 71. First air return channel; 72. Second air supply channel; 81. Second air return channel; 82. Detailed Implementation

[0018] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0019] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0020] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0022] Please see Figure 1 , Figure 2 and Figure 3 The refrigerator provided in the embodiments of this application will now be described. The refrigerator includes: Box 10; First evaporation chamber 5; First evaporation chamber 5 is located inside the housing 10; First evaporator 51; First evaporator 51 is disposed inside first evaporation chamber 5; The first chamber is located inside the housing 10 and is connected to the first evaporation chamber 5. The second chamber is located inside the housing 10. At least one side of the second chamber is provided with a heat exchange channel 21, and the second chamber has a heat-conducting sidewall 20 on at least one side facing the heat exchange channel 21. The heat exchange channel 21 is connected to the first evaporation chamber 5. Semiconductor cooling element 4; Semiconductor cooling element 4 includes a cold end 41 and a hot end 42, the cold end 41 is connected to the heat-conducting sidewall 20, and the hot end 42 is disposed in the heat exchange channel 21.

[0023] The refrigerator uses the cabinet 10 as its basic frame, providing space for the fixed installation of all internal components. Simultaneously, an insulation layer prevents external heat from entering the cabinet, reducing internal cold loss and maintaining the necessary insulation conditions for a low-temperature environment inside. The cabinet 10 contains a first evaporator chamber 5, whose first evaporator 51 serves as the main refrigeration component. It absorbs heat through refrigerant phase change to cool the connected first compartment, which serves as the main storage space and can stably maintain refrigeration or freezing temperatures. Figure 2 As shown, the second compartment is the refrigerator's rapid cooling compartment 2, an independent storage space within the cabinet 10 used for precise temperature control or rapid cooling. A heat exchange channel 21 is located on its outer side, directly connected to the first evaporation chamber 5. The side of the second compartment facing the heat exchange channel 21 has a heat-conducting sidewall 20 made of a highly thermally conductive material. A semiconductor cooling element 4 is installed within the heat exchange channel 21, receiving the basic cooling capacity of the first evaporation chamber 5 through the heat exchange channel 21, while simultaneously achieving additional cooling with the help of the semiconductor cooling element 4. Figure 1 As shown, the first compartment can be either a refrigerator compartment 1 or a freezer compartment 3, and the second compartment is... Figure 1 The rapid cooling compartment 2 is also known as a variable temperature compartment. It is used to create a colder environment than the refrigerator compartment to achieve rapid cooling or short-term frozen storage of items.

[0024] The first compartment is cooled by the first evaporator 51. The refrigerator compressor draws in the low-temperature, low-pressure gaseous refrigerant returning from the first evaporator 51 and converts it into a high-temperature, high-pressure gaseous refrigerant through mechanical compression.

[0025] The high-temperature, high-pressure gaseous refrigerant enters the condenser, where it exchanges heat with the outside air, releasing heat and cooling into a medium-temperature, high-pressure liquid refrigerant. This medium-temperature, high-pressure liquid refrigerant then passes through a dryer filter to remove moisture and impurities before entering a capillary tube. The capillary tube's narrow diameter structure throttles and reduces the pressure of the liquid refrigerant, transforming it into a low-temperature, low-pressure gas-liquid two-phase mixture. A low-temperature, low-pressure gas-liquid two-phase mixture enters the first evaporator 51. The liquid refrigerant rapidly evaporates into a gaseous state within the first evaporator 51, absorbing heat from the first evaporation chamber 5 during this process, causing the temperature of the first evaporation chamber 5 to drop. The cold air from the first evaporation chamber 5 enters the first compartment through ventilation holes or ducts, absorbing heat from the first compartment and lowering its temperature to a set value. The evaporated gaseous refrigerant is then drawn back into the compressor, repeating the above cycle to maintain the low-temperature environment in the first compartment.

[0026] Please see Figure 2 and Figure 3 The second chamber achieves cooling through the basic cooling capacity of the first evaporation chamber 5 and the auxiliary cooling capacity of the semiconductor cooling element 4. The low-temperature air from the first evaporation chamber 5 directly enters the heat exchange area of ​​the second chamber through the heat exchange channel 21. The heat-conducting sidewall 20 of the second chamber transfers internal heat to the low-temperature air in the heat exchange channel 21 through heat conduction, thus initially lowering the temperature of the second chamber. This eliminates the need for the cooling capacity to be transferred through the first chamber, resulting in higher cooling capacity transfer efficiency.

[0027] When rapid cooling of the second chamber or reaching a lower temperature is required, the semiconductor cooler 4 is powered on and activated. Current flows through the N-type and P-type semiconductor junction of the semiconductor cooler 4. As electrons move from the N-type semiconductor to the P-type semiconductor, they overcome the potential difference and absorb heat, causing the temperature of the cold end 41 to drop.

[0028] The cold end 41 of the semiconductor cooling element 4 is in contact with the heat-conducting sidewall 20 of the second chamber, continuously absorbing heat from inside the second chamber and causing the temperature of the second chamber to drop rapidly. When electrons move from the P-type semiconductor to the N-type semiconductor, they release energy, causing the temperature of the hot end 42 of the semiconductor cooling element 4 to rise. The hot end 42 is located in the heat exchange channel 21, where the low-temperature air from the first evaporation chamber 5 can quickly carry away the heat generated by the hot end 42, preventing heat from being transferred back to the second chamber and ensuring the semiconductor cooling efficiency.

[0029] The second chamber, as the rapid cooling chamber 2, has a significantly enhanced rapid cooling capacity. The cold end 41 of the semiconductor cooling component 4 is directly connected to the heat-conducting side wall 20 for heat conduction, which can quickly transfer the cooling capacity to the second chamber. Combined with the basic cooling capacity provided by the first evaporation chamber 5 through the heat exchange channel 21, the temperature of the second chamber can be rapidly reduced under the dual effect, efficiently meeting the user's rapid cooling needs for items and completely solving the problem of slow cooling speed of the traditional rapid cooling chamber 2.

[0030] The cooling efficiency of the semiconductor cooling component 4 and the overall cold energy utilization rate of the refrigerator are greatly improved. The heat exchange channel 21 is connected to the first evaporation chamber 5, which supplies cooling to the first compartment. The cold air generated by the first evaporator 51 can directly dissipate heat and cool down the hot end 42 of the semiconductor cooling component 4. This not only avoids the heat from the hot end 42 affecting the cooling of the second compartment, but also makes full use of the cold energy of the first evaporation chamber 5, reduces cold energy waste, and improves the overall energy utilization efficiency.

[0031] This embodiment also simplifies the internal structure design of the refrigerator and reduces manufacturing costs; at the same time, the semiconductor cooling component 4 only starts when rapid cooling is required, and the heat dissipation of the hot end 42 does not require additional energy consumption, effectively reducing the overall energy consumption of the refrigerator and meeting energy-saving requirements.

[0032] Please see Figure 1 and Figure 4 In some embodiments of this application, the first compartment is a refrigerator compartment 1, and the refrigerator further includes: Second evaporation chamber 6; Second evaporation chamber 6 is located inside the housing 10; Second evaporator 61; Second evaporator 61 is disposed inside second evaporation chamber 6; Freezing compartment 3; Freezing compartment 3 is located inside the cabinet 10, and the second evaporation chamber 6 is connected to the freezing compartment 3; wherein, the second compartment is connected to the second evaporation chamber 6.

[0033] The second evaporation chamber 6 is located inside the cabinet 10. It is an independent enclosed space that provides cooling capacity to the freezer chamber 3 and the second chamber. The second evaporator 61 is located inside the second evaporation chamber 6. It has a similar function to the first evaporator 51 but serves a different target. It is the main source of cooling capacity for the freezer chamber 3 and the second chamber.

[0034] The freezer compartment 3 is located inside the refrigerator body 10 and is directly connected to the second evaporator compartment 6. It is the functional compartment of the refrigerator used for long-term frozen storage of items. The freezer compartment 3 receives low-temperature cold energy from the second evaporator compartment 6 to maintain a suitable low-temperature environment for freezing. This temperature environment is usually -18°C or below, which meets the long-term storage needs of items such as meat and frozen foods. Together with the first compartment, which serves as the refrigerator compartment 1, it forms a basic dual-temperature zone configuration of refrigeration and freezing.

[0035] The second evaporator 6 and the second evaporator 61, together with the original first evaporator 5 and the first evaporator 51, form two independent cooling capacity generation systems. The first evaporator 5 serves the refrigerator compartment 1. The first system, consisting of the first evaporator 5 and the first evaporator 51, focuses on providing medium-low temperature cooling capacity to the first compartment, typically 2-8°C. The second system, consisting of the second evaporator 6 and the second evaporator 61, focuses on providing low-temperature cooling capacity to the freezer compartment 3. The two systems operate in parallel without temperature interference, ensuring independent protection of the refrigerator's basic refrigeration and freezing functions.

[0036] The second compartment is now connected to the second evaporation chamber 6, meaning that the primary source of cooling for the second compartment changes from the medium-low temperature cooling of the refrigeration compartment 1 to the low temperature cooling of the freezing compartment 3. The low-temperature environment of the second evaporation chamber 6 provides a lower initial cooling capacity for the second compartment. Combined with the auxiliary cooling capacity of the semiconductor cooling element 4, this allows for a lower lower limit for cooling and a faster cooling rate in the second compartment, further enhancing the rapid cooling effect and even enabling the expansion of its short-term frozen storage function.

[0037] Please see Figure 5 In some embodiments of this application, the refrigerator further includes a first air supply channel 71 and a first air return channel 72, and the second evaporation chamber 6 is connected to the second compartment through the first air supply channel 71 and the first air return channel 72 to form a closed airflow circulation loop.

[0038] The first air supply duct 71 is responsible for delivering the cooling capacity of the second evaporation chamber 6 to the second compartment, while the first return air duct 72 is responsible for sending the airflow that has completed heat exchange in the second compartment back to the second evaporation chamber 6. This forms a closed-loop flow path where the airflow starts from the second evaporation chamber 6, enters the second compartment through the air supply duct, and then returns to the second evaporation chamber 6 through the return air duct. This ensures that the airflow circulates within a fixed range and prevents the cooling capacity from being lost to other unrelated areas.

[0039] During the cooling process, the second evaporator 61 in the second evaporator chamber 6 generates a low-temperature cold airflow through phase change heat absorption. This cold airflow is directionally transported to the second chamber along the first air supply channel 71, where it exchanges heat with the air inside the second chamber, absorbing heat from the second chamber to lower the indoor temperature. After heat exchange, the heated airflow flows back to the second evaporator chamber 6 through the first return air channel 72, re-contacts the second evaporator 61, and is cooled. It then enters the second chamber again through the first air supply channel 71, thus forming a continuous closed loop. Simultaneously, this loop works synergistically with the existing semiconductor cooling element 4 and heat-conducting sidewall 20 in the second chamber: the cold end 41 of the semiconductor cooling element 4 directly cools the second chamber, while the closed airflow loop enhances the cooling effect by continuously supplying cold air. Furthermore, the loop can quickly remove the heat transferred from the hot end 42 of the semiconductor cooling element 4 to the heat exchange channel 21, further ensuring cooling efficiency.

[0040] Similarly, please see Figure 5 In some embodiments of this application, the refrigerator further includes a second air supply channel 81 and a second air return channel 82. The first evaporation chamber 5 is connected to the heat exchange channel 21 through the second air supply channel 81 and the second air return channel 82 to form an airflow circulation.

[0041] The first evaporation chamber 5 is connected to the heat exchange channel 21 through the second air supply channel 81 and the second return air channel 82, forming an airflow circulation. After the first evaporator 51 generates low-temperature cold air in the first evaporation chamber 5, the low-temperature cold air enters the heat exchange channel 21 through the second air supply channel 81 and absorbs the heat in the heat exchange channel 21. The heat in the heat exchange channel 21 includes the heat released by the hot end 42 of the semiconductor cooling element 4. The air with the increased temperature returns to the first evaporation chamber 5 through the second return air channel 82 and is cooled again by the first evaporator 51 to low-temperature cold air. Then, the low-temperature cold air re-enters the heat exchange channel 21 through the second air supply channel 81, repeating the above process to achieve continuous cold air delivery and airflow circulation.

[0042] The low-temperature cold air in the first evaporation chamber 5 continuously enters the heat exchange channel 21, quickly removing heat from the hot end 42 of the semiconductor refrigeration component 4, thus preventing heat accumulation at the hot end 42 of the semiconductor refrigeration component 4 from affecting its cooling efficiency. Simultaneously, the circulating airflow only flows between the first evaporation chamber 5 and the heat exchange channel 21, reducing the exchange loss of cold energy with the external environment and improving cold energy utilization. Furthermore, there is no need to install additional independent cooling or heat dissipation components for the heat exchange channel 21; the existing cold energy of the first evaporation chamber 5 is sufficient to meet the heat dissipation requirements of the heat exchange channel 21, simplifying the refrigerator structure while reducing additional energy consumption.

[0043] Please see Figure 6 In some embodiments of this application, the second chamber includes a back plate 22, a first side plate 23, and a second side plate 24. The first side plate 23 and the second side plate 24 are respectively connected to both sides of the back plate 22 to enclose and form a cavity with an opening 25. The opening 25 is located on the opposite side of the back plate 22. The heat exchange channel 21 includes a first heat exchange channel 211 located outside the first side plate 23 and a second heat exchange channel 212 located outside the second side plate 24. Both the first heat exchange channel 211 and the second heat exchange channel 212 are provided with a semiconductor cooling element 4. The first side plate 23 and the second side plate 24 form a heat-conducting sidewall 20.

[0044] The second compartment includes a back panel 22, a first side panel 23, and a second side panel 24. The first side panel 23 and the second side panel 24 are respectively connected to both sides of the back panel 22, and together they enclose a cavity with an opening 25 located on the opposite side of the back panel 22. This cavity provides space for storing items, and the opening 25 facilitates the user's access to items. The back panel 22, the first side panel 23, and the second side panel 24 together constitute the enclosure structure of the second compartment, maintaining a stable internal temperature. The first side panel 23 and the second side panel 24 are made of thermally conductive material, enabling heat transfer with the external heat exchange channel 21. For example, in some embodiments, the first side panel 23 and the second side panel 24 are made of metal plates such as aluminum plates, allowing them to better function as the thermally conductive sidewall 20. Even the back panel 22 can be made of metal plates for ease of processing.

[0045] The heat exchange channel 21 includes a first heat exchange channel 211 and a second heat exchange channel 212. The first heat exchange channel 211 is located outside the first side plate 23, and the second heat exchange channel 212 is located outside the second side plate 24, with both correspondingly attached to the first side plate 23 and the second side plate 24, respectively. Both the first heat exchange channel 211 and the second heat exchange channel 212 are equipped with semiconductor cooling elements 4. The cold end 41 of each semiconductor cooling element 4 is connected to the corresponding first side plate 23 or second side plate 24, while the hot end 42 is located inside the corresponding first heat exchange channel 211 or second heat exchange channel 212, forming a symmetrical cooling and heat dissipation structure on both sides.

[0046] Both the first heat exchange channel 211 and the second heat exchange channel 212 on both sides are equipped with semiconductor cooling elements 4, which can absorb heat from both sides of the second chamber simultaneously. Compared with single-sided heat exchange, the heat absorption area and heat absorption efficiency are doubled, which can reduce the internal temperature of the cavity more quickly and further enhance the rapid cooling effect of the second chamber. The symmetrical layout of the heat exchange channels 211 and the semiconductor cooling elements 4 makes the internal temperature distribution of the second chamber more uniform, avoids the local temperature difference caused by single-sided cooling, and ensures that items in different positions in the cavity can be cooled evenly, thus improving the storage effect.

[0047] Please see Figure 6 In some embodiments of this application, a connecting channel 26 is provided on the outer side of the back plate 22, the connecting channel 26 connecting the first heat exchange channel 211 and the second heat exchange channel 212; the second air supply channel 81 is connected to the first heat exchange channel 211, and the second return air channel 82 is connected to the second heat exchange channel 212; a first fan 27 for driving airflow from the first heat exchange channel 211 to the second heat exchange channel 212 is provided in the connecting channel 26.

[0048] A connecting channel 26 is provided on the outer side of the back plate 22, which connects the first heat exchange channel 211 and the second heat exchange channel 212 to form a through airflow channel. The second air supply channel 81 is connected to the first heat exchange channel 211 and is used to transport the low-temperature cold air from the first evaporation chamber 5 to the first heat exchange channel 211; the second air return channel 82 is connected to the second heat exchange channel 212 and is used to return the air that has absorbed heat in the second heat exchange channel 212 back to the first evaporation chamber 5. The connecting channel 26 serves as an airflow transfer point between the first heat exchange channel 211 and the second heat exchange channel 212, and together with the second air supply channel 81 and the second air return channel 82, it constructs a complete airflow path.

[0049] A first fan 27 is installed in the connecting channel 26. The first fan 27 drives the airflow from the first heat exchange channel 211 to the second heat exchange channel 212. The low-temperature cold air in the first evaporation chamber 5 enters the first heat exchange channel 211 through the second air supply channel 81. Driven by the first fan 27, the airflow flows from the first heat exchange channel 211 through the connecting channel 26 to the second heat exchange channel 212. During this process, the airflow absorbs the heat released by the hot end 42 of the semiconductor refrigeration element 4 in the first heat exchange channel 211 and the second heat exchange channel 212, and the temperature rises. Finally, the heated air returns to the first evaporation chamber 5 through the second return air channel 82, is cooled by the first evaporator 51, and becomes low-temperature cold air again. Then, it enters the first heat exchange channel 211 through the second air supply channel 81, completing the entire airflow cycle.

[0050] The drive of the first fan 27 accelerates the airflow speed, allowing the low-temperature cold air to circulate more quickly within the first heat exchange channel 211 and the second heat exchange channel 212. This efficiently removes heat from the hot end 42 of the semiconductor cooling element 4 within the two heat exchange channels 21, preventing heat accumulation within the heat exchange channels 21 and further improving the cooling efficiency of the semiconductor cooling element 4, thus ensuring the rapid cooling effect of the second compartment. Furthermore, relying on the directional airflow path constructed by the connecting channel 26 and the first fan 27, there is no need to add multiple additional drive components; airflow circulation in both heat exchange channels 21 can be achieved with just the first fan 27. This improves heat dissipation efficiency while simplifying the structural design and reducing energy consumption and manufacturing costs.

[0051] Please see Figure 7 In some embodiments of this application, a first partition 28 is provided inside the first heat exchange channel 211 along a first direction, the first direction being the direction from the back plate 22 to the opening 25. The first partition 28 divides the first heat exchange channel 211 into a first air duct 2111 and a second air duct 2112. The first air duct 2111 is connected to the second air supply channel 81 at one end near the back plate 22, and the first air duct 2111 is connected to the second air supply channel 81 at one end near the opening 25. The second air duct 2112 is connected to the second air supply channel 81 at one end near the opening 25. One end of the back plate 22 is connected to the connecting channel 26; a second partition 29 is provided in the second heat exchange channel 212 along the first direction. The second partition 29 divides the second heat exchange channel 212 into a third air duct 2121 and a fourth air duct 2122. The third air duct 2121 is connected to the connecting channel 26 at the end near the back plate 22. The third air duct 2121 is connected to the fourth air duct 2122 at the end near the opening 25. The fourth air duct 2122 is connected to the second return air channel 82 at the end near the back plate 22.

[0052] A first partition 28 is provided inside the first heat exchange channel 211 along a first direction, which is the direction from the back plate 22 to the opening 25. Figure 7The direction of the hollow arrow. The first partition 28 divides the first heat exchange channel 211 into a first air duct 2111 and a second air duct 2112, forming two independent and connected airflow channels. The first air duct 2111 is connected to the second air supply channel 81 at one end near the back plate 22, and can receive the low-temperature cold air from the first evaporation chamber 5 supplied by the second air supply channel 81; the first air duct 2111 is connected to the second air duct 2112 at one end near the opening 25, so that the airflow in the first air duct 2111 can flow to the second air duct 2112; the second air duct 2112 is connected to the connecting channel 26 at one end near the back plate 22, and can transport the airflow to the connecting channel 26, realizing the airflow connection between the first heat exchange channel 211 and the connecting channel 26.

[0053] A second partition 29 is provided inside the second heat exchange channel 212 along the first direction, dividing the second heat exchange channel 212 into a third air duct 2121 and a fourth air duct 2122, thus forming two independent and connected airflow channels. The third air duct 2121 is connected to the connecting channel 26 at the end near the back plate 22, and can receive the airflow delivered by the connecting channel 26; the third air duct 2121 is connected to the fourth air duct 2122 at the end near the opening 25, so that the airflow in the third air duct 2121 can flow to the fourth air duct 2122; the fourth air duct 2122 is connected to the second return air duct 82 at the end near the back plate 22, and can deliver the airflow to the second return air duct 82, realizing the airflow connection between the second heat exchange channel 212 and the second return air duct 82.

[0054] Based on the airflow direction indicated by the solid arrows in Figure 7, the complete airflow circulation path is as follows: The low-temperature cold air in the first evaporation chamber 5 enters the first air duct 2111 from the end near the back plate 22 through the second air supply channel 81; the airflow flows along the first air duct 2111 towards the opening 25, and after reaching the end of the first air duct 2111 near the opening 25, it turns and flows into the connected second air duct 2112; subsequently, the airflow flows along the second air duct 2112 towards the back plate 22, and after reaching the end of the second air duct 2112 near the back plate 22, it passes through the connecting channel 26. The airflow enters the third air duct 2121 near the back plate 22 in the second heat exchange channel 212; the airflow flows along the third air duct 2121 towards the opening 25, and after reaching the end of the third air duct 2121 near the opening 25, it turns and flows into the connected fourth air duct 2122; finally, the airflow flows along the fourth air duct 2122 towards the back plate 22, and after reaching the end of the fourth air duct 2122 near the back plate 22, it returns to the first evaporation chamber 5 through the second return air duct 82, and after being cooled by the first evaporator 51, it becomes low-temperature cold air again, completing the entire cycle.

[0055] like Figure 7As shown, since there are dead corners in the airflow within the connecting channel 26 on the outer side of the back panel 22, the first air supply channel 71 and the first return air channel 72 can be set at the corresponding dead corners on the back panel 22 so that the setting of the first air supply channel 71 and the first return air channel 72 will not affect the airflow of the connecting channel 26.

[0056] Please see Figure 8 In some embodiments of this application, a thermally conductive bridging plate 43 is provided between the cold end 41 and the thermally conductive sidewall 20. The cold end 41 is connected to the thermally conductive sidewall 20 through the thermally conductive bridging plate 43. The contact area between the thermally conductive bridging plate 43 and the thermally conductive sidewall 20 is greater than the orthogonal projection area of ​​the cold end 41 on the thermally conductive sidewall 20.

[0057] A thermally conductive bridging plate 43 is provided between the cold end 41 of the thermoelectric cooler 4 and the thermally conductive sidewall 20 of the second chamber. The thermally conductive bridging plate 43 is in close contact with both the cold end 41 of the thermoelectric cooler 4 and the thermally conductive sidewall 20 of the second chamber, thus indirectly connecting the cold end 41 of the thermoelectric cooler 4 to the thermally conductive sidewall 20 of the second chamber via the thermally conductive bridging plate 43. The thermally conductive bridging plate 43 is made of a material with high thermal conductivity, and the contact area between the thermally conductive bridging plate 43 and the thermally conductive sidewall 20 of the second chamber is larger than the projected area of ​​the cold end 41 of the thermoelectric cooler 4 on the thermally conductive sidewall 20 of the second chamber, forming a heat transfer path from the cold end 41 of the thermoelectric cooler 4 to the thermally conductive bridging plate 43, and then to the thermally conductive sidewall 20 of the second chamber. The thermally conductive bridging plate 43 is typically made of a metal with good thermal conductivity, but a heat spreader or other similar components can also be used.

[0058] After the thermoelectric cooler 4 is powered on, the cooling energy generated by the cold end 41 of the thermoelectric cooler 4 is first transferred to the thermally conductive bridge plate 43 that is attached to it. Because the thermally conductive bridge plate 43 has a larger contact area with the thermally conductive sidewall 20 of the second chamber, the cooling energy can quickly diffuse to a larger area of ​​the thermally conductive sidewall 20 of the second chamber through the thermally conductive bridge plate 43, rather than being limited to a localized area of ​​the thermally conductive sidewall 20 of the second chamber corresponding to the orthographic projection of the cold end 41 of the thermoelectric cooler 4. The larger contact area reduces the thermal resistance between the cold end 41 of the thermoelectric cooler 4 and the thermally conductive sidewall 20 of the second chamber, allowing the cooling energy generated by the cold end 41 of the thermoelectric cooler 4 to be transferred to the thermally conductive sidewall 20 of the second chamber more quickly and fully. Simultaneously, the heat absorbed by the thermally conductive sidewall 20 of the second chamber can also be transferred to the cold end 41 of the thermoelectric cooler 4 more efficiently, preventing heat accumulation at the contact interface and further accelerating the cooling rate of the second chamber, thus enhancing the rapid cooling effect of the second chamber. The thermal bridging plate 43 allows the cold energy to be evenly diffused on the thermally conductive sidewall 20 of the second compartment, avoiding uneven heating and cooling of the thermally conductive sidewall 20 of the second compartment caused by local contact of the cold end 41 of the semiconductor cooling component 4. This makes the temperature of different locations inside the second compartment more consistent, ensuring that the items stored inside the second compartment can be cooled evenly and improving the quality of item storage.

[0059] Please see Figure 8 In some embodiments of this application, the hot end 42 is connected to a heat dissipation fin 44, which is disposed within the heat exchange channel 21.

[0060] The hot end 42 of the semiconductor cooling device 4 is connected to a heat dissipation fin 44, which is made of a material with high thermal conductivity and is in close contact with the hot end 42 of the semiconductor cooling device 4. The heat dissipation fin 44 is entirely disposed within the heat exchange channel 21 and is completely within the airflow area of ​​the heat exchange channel 21, ensuring that the low-temperature cold air in the heat exchange channel 21 can fully contact the heat dissipation fin 44.

[0061] When the thermoelectric cooler 4 is powered on, its hot end 42 continuously generates heat. This heat is first transferred to the heat dissipation fins 44 connected to it via thermal conduction. Because the heat dissipation fins 44 have a multi-plate or multi-tooth structure, the contact area with the air in the heat exchange channel 21 is significantly increased. When the low-temperature air in the heat exchange channel 21 flows through the heat dissipation fins 44, it quickly absorbs the heat from the fins, causing the temperature of the fins 44 to decrease. The air temperature rises after absorbing heat, and then it returns to the first evaporation chamber 5 through the second return air channel 82. After being cooled by the first evaporator 51, it becomes low-temperature air again and re-enters the heat exchange channel 21 to contact the heat dissipation fins 44, continuously carrying away the heat from the hot end 42 of the thermoelectric cooler 4.

[0062] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A refrigerator, characterized in that, The refrigerator includes: Box; The first evaporation chamber is disposed within the box body; First evaporator; the first evaporator is disposed in the first evaporation chamber; The first chamber; the first chamber is disposed inside the box, and the first chamber is connected to the first evaporation chamber; The second chamber is disposed within the box body, and a heat exchange channel is provided on at least one side of the second chamber. The second chamber has a heat-conducting sidewall on at least one side facing the heat exchange channel, and the heat exchange channel is connected to the first evaporation chamber. A semiconductor cooling device; the semiconductor cooling device includes a cold end and a hot end, the cold end being connected to the heat-conducting sidewall, and the hot end being disposed within the heat exchange channel.

2. The refrigerator as described in claim 1, characterized in that, The first compartment is a refrigerated compartment or a frozen compartment.

3. The refrigerator as described in claim 2, characterized in that, The first compartment is a refrigerator compartment, and the refrigerator further includes: The second evaporation chamber is disposed within the casing. A second evaporator; the second evaporator is disposed in the second evaporation chamber; A freezer compartment; the freezer compartment is located inside the cabinet, and the second evaporation chamber is connected to the freezer compartment; The second chamber and the second evaporation chamber are connected.

4. The refrigerator as described in claim 3, characterized in that, The refrigerator also includes a first air supply duct and a first air return duct. The second evaporation chamber is connected to the second compartment through the first air supply duct and the first air return duct to form a closed airflow circulation loop.

5. The refrigerator as described in claim 1, characterized in that, The refrigerator also includes a second air supply duct and a second air return duct. The first evaporation chamber is connected to the heat exchange duct through the second air supply duct and the second air return duct to form an airflow circulation.

6. The refrigerator as described in claim 5, characterized in that, The second compartment includes a back panel, a first side panel, and a second side panel. The first side panel and the second side panel are respectively connected to both sides of the back panel to enclose and form a cavity with an opening, the opening being located on the opposite side of the back panel. The heat exchange channel includes a first heat exchange channel located outside the first side plate and a second heat exchange channel located outside the second side plate. Both the first heat exchange channel and the second heat exchange channel are provided with the semiconductor cooling element. The first side plate and the second side plate form the heat-conducting sidewall.

7. The refrigerator as described in claim 6, characterized in that, A connecting channel is provided on the outer side of the back plate, and the connecting channel connects the first heat exchange channel and the second heat exchange channel; The second air supply duct is connected to the first heat exchange duct, and the second return air duct is connected to the second heat exchange duct; The connecting channel is equipped with a first fan for driving airflow from the first heat exchange channel to the second heat exchange channel.

8. The refrigerator as described in claim 7, characterized in that, A first partition is provided in the first heat exchange channel along a first direction, the first direction being the direction from the back plate to the opening. The first partition divides the first heat exchange channel into a first air duct and a second air duct. The first air duct is connected to the second air supply channel at one end near the back plate, and the first air duct is connected to the second air duct at one end near the opening. The second air duct is connected to the connecting channel at one end near the back plate. A second partition is provided in the second heat exchange channel along the first direction. The second partition divides the second heat exchange channel into a third air duct and a fourth air duct. The third air duct is connected to the connecting channel at the end near the back plate, and the third air duct is connected to the fourth air duct at the end near the opening. The fourth air duct is connected to the second return air channel at the end near the back plate.

9. The refrigerator as described in any one of claims 1-8, characterized in that, A thermally conductive bridging plate is provided between the cold end and the thermally conductive sidewall. The cold end is connected to the thermally conductive sidewall through the thermally conductive bridging plate. The contact area between the thermally conductive bridging plate and the thermally conductive sidewall is larger than the orthogonal projection area of ​​the cold end on the thermally conductive sidewall.

10. The refrigerator according to any one of claims 1-8, characterized in that, The hot end is connected to heat dissipation fins, which are disposed within the heat exchange channel.

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