Cooling device for semiconductor chip testing

Abstract

The utility model provides a kind of cooling equipment for semiconductor chip test, it includes: support frame;Water tank, water tank is set in the upper portion of support frame, fluoridation liquid is contained in water tank;Shielding pump, the liquid inlet end of shielding pump is connected the liquid outlet end of water tank;Liquid inlet pipeline, the liquid inlet end of liquid inlet pipeline is connected the liquid outlet end of shielding pump;Water distributor, the liquid inlet end of water distributor is connected the liquid outlet end of liquid inlet pipeline, water distributor includes multiple groups of cooling connector, a group of cooling connector connects one semiconductor chip;Liquid outlet pipeline, the liquid inlet end of liquid outlet pipeline is connected the liquid outlet end of water distributor;Heat exchanger, heat exchanger includes first passage and second passage, the liquid inlet end of first passage is connected the liquid inlet end of liquid outlet pipeline, the liquid outlet end of first passage is connected the liquid inlet end of water tank, and second passage is used to be communicated with the cooling tower containing cooling water.The cooling equipment for semiconductor chip test of the utility model can uniformly radiate multiple semiconductor chips, and cooling efficiency is high.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation, and in particular to a cooling device for semiconductor chip testing. Background Technology

[0002] During semiconductor chip testing, the semiconductor chip generates a lot of heat. If the heat cannot be dissipated in time, the temperature of the semiconductor chip will rise, affecting the accuracy of the test results and even damaging the semiconductor chip.

[0003] Existing cooling equipment typically uses cooling water for heat dissipation, but when multiple semiconductor chips are tested simultaneously, the cooling effect is uneven and it is difficult to meet the cooling requirements of each semiconductor chip. In addition, existing equipment directly connects cooling water to each semiconductor chip sequentially, resulting in poor heat dissipation for downstream chips. Utility Model Content

[0004] In view of the above-mentioned problems in the prior art, the purpose of this utility model is to provide a cooling device for semiconductor chip testing, which can uniformly dissipate heat from multiple semiconductor chips and has high cooling efficiency.

[0005] To address the aforementioned problems, this invention provides a cooling device for semiconductor chip testing, the cooling device comprising:

[0006] Support frame;

[0007] A water tank is disposed on the upper part of the support frame, and the water tank contains fluorinated liquid;

[0008] A shielded pump is installed at the lower part of the support frame, and the inlet end of the shielded pump is connected to the outlet end of the water tank.

[0009] The inlet pipe is connected to the outlet of the shielded pump.

[0010] A water distributor, wherein the inlet end of the water distributor is connected to the outlet end of the inlet pipe, and the water distributor includes multiple sets of cooling connectors, each set of cooling connectors including an inlet connector and an outlet connector, and each set of cooling connectors is connected to a semiconductor chip.

[0011] The liquid outlet pipeline has its inlet end connected to the liquid outlet end of the water distributor;

[0012] The heat exchanger includes a first channel and a second channel for heat exchange. The inlet end of the first channel is connected to the inlet end of the outlet pipe, and the outlet end of the first channel is connected to the inlet end of the water tank. The second channel is used to communicate with a cooling tower containing cooling water.

[0013] Furthermore, the cooling device also includes:

[0014] An inlet pressure sensor is installed on the inlet pipeline to detect the first pressure of the fluorinated liquid in the inlet pipeline;

[0015] A liquid outlet pressure sensor is installed on the liquid outlet pipeline to detect the second pressure of the fluorinated liquid in the liquid outlet pipeline.

[0016] Furthermore, the cooling device also includes:

[0017] An industrial control computer is connected to the inlet pressure sensor, the outlet pressure sensor, and the canned pump to control the operation of the canned pump based on the difference between the first pressure and the second pressure.

[0018] Furthermore, the cooling device also includes:

[0019] A liquid inlet temperature sensor is installed on the liquid inlet pipeline to detect the temperature of the fluorinated liquid in the liquid inlet pipeline.

[0020] Furthermore, the cooling device also includes:

[0021] A flow control valve is installed on the pipeline between the liquid inlet end of the second channel and the liquid outlet end of the cooling tower;

[0022] The industrial control computer is also connected to the inlet temperature sensor and the flow control valve to adjust the opening of the flow control valve according to the temperature of the fluorinated liquid.

[0023] Furthermore, the cooling device also includes:

[0024] A filter connected to the inlet pipe.

[0025] Furthermore, the cooling device also includes:

[0026] A liquid level sensor is installed on the side wall of the water tank. The liquid level sensor includes, from top to bottom, a top connector, a transparent hose, and a bottom connector. Both the top connector and the bottom connector are connected to the water tank.

[0027] Furthermore, the cooling device also includes:

[0028] A conductivity meter is installed on the liquid outlet pipe to detect the conductivity of the fluorinated liquid in the liquid outlet pipe.

[0029] Furthermore, the cooling device also includes:

[0030] A flow sensor is installed on the inlet pipe to detect the flow rate of the fluorinated liquid in the inlet pipe.

[0031] Furthermore, the cooling device also includes:

[0032] A bypass pipeline, the two ends of which are respectively connected to the inlet pipeline and the outlet pipeline;

[0033] A flow control valve is disposed on the bypass line to open / close the bypass line.

[0034] Due to the above technical solution, this utility model has the following beneficial effects:

[0035] The cooling device according to this utility model includes a support frame, a water tank, a shielded pump, an inlet pipe, a distributor, an outlet pipe, and a heat exchanger. The support frame provides stable structural support, the water tank contains the fluorinated liquid, the shielded pump drives the fluorinated liquid to circulate, the distributor distributes the coolant to multiple semiconductor chips, and the heat exchanger works in conjunction with a cooling tower to achieve heat exchange. This structure can provide an independent cooling path for each semiconductor chip, ensuring cooling uniformity, while efficiently dissipating heat through heat exchange, improving testing efficiency and reliability. Attached Figure Description

[0036] To more clearly illustrate the technical solution of this utility model, the drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0037] Figure 1 This is a structural diagram of a cooling device for semiconductor chip testing according to an embodiment of the present invention;

[0038] Figure 2 yes Figure 1 A structural diagram of a cooling device for semiconductor chip testing from another perspective in the embodiment;

[0039] Figure 3 This is a structural diagram of a water distributor according to an embodiment of the present invention;

[0040] Figure 4 This is a schematic diagram of a cooling device for semiconductor chip testing according to an embodiment of the present invention.

[0041] Figure label:

[0042] 100. Liquid storage tank; 200. Water pump; 300. Filter; 410. Inlet temperature sensor; 420. Inlet pressure sensor; 430. Outlet pressure sensor; 500. Water distributor; 510. Inlet connector; 520. Outlet connector; 600. Semiconductor chip; 700. Heat exchanger; 810. Flow control valve; 820. Cooling tower; 900. Industrial computer; 1010. Bypass pipeline; 1020. Solenoid valve; 1100. Flow sensor; 1200. Liquid level sensor; 1300. Conductivity tester; 1400. Flow sensor; 1500. Support frame. Detailed Implementation

[0043] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0044] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this utility model described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0045] The following describes a cooling device for semiconductor chip testing according to an embodiment of the present invention.

[0046] like Figures 1 to 4 As shown, the cooling device for semiconductor chip testing in this embodiment includes a support frame 1500, a water tank 100, a shielded pump 200, an inlet pipe, a water distributor 500, an outlet pipe, a heat exchanger 700, and a cooling tower 820.

[0047] First, let's describe the support frame 1500 and the water tank 100. The water tank 100 is located on the upper part of the support frame 1500, and the water tank 100 contains fluorinated liquid.

[0048] like Figure 1 and Figure 2 As shown, the support frame 1500 supports the various components of the cooling equipment. A water tank 100 is located on top of the support frame 1500 and contains fluorinated liquid as the primary coolant. The fluorinated liquid possesses excellent thermal conductivity and insulation properties, making it suitable for semiconductor chip testing.

[0049] Next, the canned motor pump 200 and the inlet pipeline will be described. The canned motor pump 200 is located at the lower part of the support frame 1500, and the inlet end of the canned motor pump 200 is connected to the outlet end of the water tank 100.

[0050] like Figure 1 and Figure 2 As shown, the canned motor pump 200 is located at the lower part of the support frame 1500, and its inlet end is connected to the outlet end of the water tank 100. The canned motor pump 200 is used to pump fluorinated liquid and features low noise and high efficiency. The inlet end of the inlet pipeline is connected to the outlet end of the canned motor pump 200 for conveying fluorinated liquid.

[0051] Next, the water distributor 500 and the outlet pipe will be described. The inlet end of the water distributor 500 is connected to the outlet end of the inlet pipe. The water distributor 500 includes multiple sets of cooling connectors. Each set of cooling connectors includes an inlet connector 510 and an outlet connector 520. Each set of cooling connectors is connected to a semiconductor chip 600. The inlet end of the outlet pipe is connected to the outlet end of the water distributor 500.

[0052] like Figure 2 , Figure 3 and Figure 4 As shown, the inlet end of the water distributor 500 is connected to the outlet end of the inlet pipe. The water distributor 500 includes multiple sets of cooling connectors, each set including an inlet connector 510 and an outlet connector 520. One set of cooling connectors is used to connect a semiconductor chip 600. When the semiconductor chip 600 is connected to the cooling connector, the fluorinated liquid flows through the heat dissipation structure of the semiconductor chip 600 for heat exchange, absorbing the heat generated by the semiconductor chip 600. The inlet end of the outlet pipe is connected to the outlet end of the water distributor 500 and is used to collect the fluorinated liquid flowing back from the semiconductor chip 600.

[0053] Finally, the heat exchanger 700 is described. The heat exchanger 700 includes a first channel and a second channel for heat exchange. The inlet end of the first channel is connected to the inlet end of the outlet pipe, and the outlet end of the first channel is connected to the inlet end of the water tank 100. The second channel is used to communicate with the cooling tower 820 containing cooling water.

[0054] like Figure 2 and Figure 3 As shown, the heat exchanger 700 includes a first channel and a second channel for heat exchange. The inlet end of the first channel is connected to the inlet end of the outlet pipe, and the outlet end of the first channel is connected to the inlet end of the water tank 100, forming a circulation loop for the fluorinated liquid. The second channel is used to communicate with a cooling tower 820 containing cooling water. The cooling tower 820 provides cooling water at a predetermined temperature, which flows in the second channel and exchanges heat with the fluorinated liquid in the first channel, thereby reducing the temperature of the fluorinated liquid.

[0055] The dual cooling circuit of fluorinated liquid and cooling water can efficiently remove the heat generated during semiconductor chip testing, ensuring that each semiconductor chip 600 receives uniform cooling and improving testing accuracy.

[0056] The cooling equipment described above includes a support frame 1500, a water tank 100, a shielded pump 200, an inlet pipe, a distributor 500, an outlet pipe, and a heat exchanger 700. The support frame 1500 provides stable structural support, the water tank 100 holds the fluorinated liquid, the shielded pump 200 drives the fluorinated liquid circulation, the distributor 500 distributes the coolant to multiple semiconductor chips 600, and the heat exchanger 700 works in conjunction with a cooling tower 820 to achieve heat exchange. This structure provides an independent cooling path for each semiconductor chip 600, ensuring cooling uniformity, while simultaneously improving testing efficiency and reliability through efficient heat dissipation via heat exchange.

[0057] In some embodiments of this utility model, such as Figure 2 and Figure 3 As shown, the cooling device also includes an inlet pressure sensor 420 and an outlet pressure sensor 430. The inlet pressure sensor 420 is installed on the inlet pipe to detect the first pressure of the fluorinated liquid in the inlet pipe. The outlet pressure sensor 430 is installed on the outlet pipe to detect the second pressure of the fluorinated liquid in the outlet pipe.

[0058] The inlet pressure sensor 420 is installed on the inlet pipe to detect the initial pressure of the fluorinated liquid. The outlet pressure sensor 430 is installed on the outlet pipe to detect the secondary pressure of the fluorinated liquid. By monitoring the inlet and outlet pressures, the flow status of the fluorinated liquid within the equipment can be understood in real time, allowing for timely detection of problems such as pipe blockage or leakage, ensuring stable equipment operation.

[0059] Furthermore, such as Figure 1 As shown, the cooling equipment also includes an industrial computer 900. The industrial computer 900 is connected to the inlet pressure sensor 420, the outlet pressure sensor 430, and the canned pump 200 to control the operation of the canned pump 200 based on the difference between the first pressure and the second pressure.

[0060] An industrial control computer 900 connects to an inlet pressure sensor 420, an outlet pressure sensor 430, and a canned motor pump 200 to control the operation of the canned motor pump 200 based on the difference between a first pressure and a second pressure. The industrial control computer 900 calculates the actual pressure difference and compares it with a predetermined pressure difference, dynamically adjusting the frequency of the canned motor pump 200 to keep the pressure difference within a predetermined range. This ensures that each semiconductor chip 600 receives sufficient coolant flow, preventing excessively high or low pressure from affecting cooling performance, while also optimizing energy consumption.

[0061] Furthermore, such as Figure 2 and Figure 3As shown, the cooling device also includes an inlet temperature sensor 410. The inlet temperature sensor 410 is installed on the inlet pipe to detect the temperature of the fluorinated liquid in the inlet pipe.

[0062] like Figure 2 and Figure 3 As shown, the inlet temperature sensor 410 is installed on the inlet pipe to detect the temperature of the fluorinated liquid. By monitoring the temperature of the fluorinated liquid in real time, the heat load of the cooling equipment can be understood, providing data support for control strategies and ensuring that the coolant temperature remains within a safe range.

[0063] Furthermore, such as Figure 2 and Figure 4 As shown, the cooling equipment also includes a flow control valve 810. The flow control valve 810 is installed on the pipeline between the liquid inlet of the second channel and the liquid outlet of the cooling tower 820. The industrial control computer 900 is also connected to the liquid inlet temperature sensor 410 and the flow control valve 810 to adjust the opening of the flow control valve 810 according to the temperature of the fluorinated liquid.

[0064] A flow control valve 810 is installed on the pipeline between the inlet end of the second channel and the outlet end of the cooling tower 820. An industrial control computer 900 is connected to the inlet temperature sensor 410 and the flow control valve 810, adjusting the opening of the flow control valve 810 according to the temperature of the fluorinated liquid, thereby controlling the flow rate of the cooling water. This allows for precise adjustment of heat exchange efficiency, maintaining the fluorinated liquid temperature at a predetermined level, and improving the response speed and stability of the cooling equipment.

[0065] In some embodiments of this invention, the cooling device further includes a filter 300. The filter 300 is connected to the liquid inlet pipe.

[0066] like Figure 1 and Figure 4 As shown, filter 300 is connected to the inlet pipe. Filter 300 is used to remove impurities and particulate matter from the fluorinated fluid, preventing blockage of pipes or damage to components, extending equipment life, and maintaining the purity of the coolant.

[0067] In some embodiments of this utility model, the cooling device further includes a liquid level sensor 1200. The liquid level sensor 1200 is disposed on the side wall of the water tank 100, and the liquid level sensor 1200 includes, from top to bottom, a top connector, a transparent hose and a bottom connector, both of which are connected to the water tank 100.

[0068] like Figure 1As shown, the level sensor 1200 is mounted on the side wall of the water tank 100. From top to bottom, the level sensor 1200 includes a top connector, a transparent flexible tube, and a bottom connector, both of which are connected to the water tank 100. The transparent flexible tube allows for direct observation of the fluorinated fluid level within the water tank 100, while the top and bottom connectors ensure accurate level detection. This facilitates real-time monitoring of the fluid level by maintenance personnel, allowing for timely replenishment of coolant and preventing equipment malfunctions due to low fluid levels.

[0069] In some embodiments of this invention, the cooling device further includes a flow sensor 1100. The flow sensor 1100 is disposed on the liquid outlet pipe to detect the flow rate of the fluorinated liquid in the liquid outlet pipe.

[0070] like Figure 1 and Figure 4 As shown, the conductivity meter 1300 is installed on the outlet pipe to detect the conductivity of the fluorinated liquid. The conductivity meter 1300 can monitor changes in the purity of the fluorinated liquid. If the conductivity is abnormal, it may indicate that the coolant is contaminated or degraded, reminding maintenance personnel to replace or treat the coolant to ensure long-term stable operation of the equipment.

[0071] In some embodiments of this utility model, the cooling device further includes a flow sensor 1400, which is disposed on the liquid inlet pipe to detect the flow rate of the fluorinated liquid in the liquid inlet pipe.

[0072] like Figure 1 and Figure 4 As shown, the flow sensor 1400 is installed on the inlet pipe to detect the flow rate of the fluorinated liquid. The flow sensor 1400 provides real-time flow data to help the industrial control computer 900 evaluate the equipment's operating status, optimize the control strategy of the canned pump 200, and ensure that each semiconductor chip 600 receives sufficient coolant flow.

[0073] In some embodiments of this utility model, the cooling device further includes a bypass pipe 1010 and a solenoid valve 1020. The two ends of the bypass pipe 1010 are respectively connected to an inlet pipe and an outlet pipe. The solenoid valve 1020 is disposed on the bypass pipe 1010 to open or close the bypass pipe 1010.

[0074] like Figure 4 As shown, the two ends of the bypass pipe 1010 are connected to the inlet pipe and the outlet pipe, respectively. A solenoid valve 1020 is installed on the bypass pipe 1010 to open or close it. When all semiconductor chips 600 are not connected or the equipment pressure is too high, the industrial control computer 900 can open or manually open the solenoid valve 1020 to allow the fluorinated liquid to flow back through the bypass pipe 1010, preventing excessive equipment pressure from causing pipe rupture or component damage, thus improving equipment safety.

[0075] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A cooling device for semiconductor chip testing, characterized in that, The cooling device includes: Support frame; A water tank is disposed on the upper part of the support frame, and the water tank contains fluorinated liquid; A shielded pump is installed at the lower part of the support frame, and the inlet end of the shielded pump is connected to the outlet end of the water tank. The inlet pipe is connected to the outlet of the shielded pump. A water distributor, wherein the inlet end of the water distributor is connected to the outlet end of the inlet pipe, and the water distributor includes multiple sets of cooling connectors, each set of cooling connectors including an inlet connector and an outlet connector, and each set of cooling connectors is connected to a semiconductor chip. The liquid outlet pipeline has its inlet end connected to the liquid outlet end of the water distributor; The heat exchanger includes a first channel and a second channel for heat exchange. The inlet end of the first channel is connected to the inlet end of the outlet pipe, and the outlet end of the first channel is connected to the inlet end of the water tank. The second channel is used to communicate with a cooling tower containing cooling water.

2. The cooling device for semiconductor chip testing according to claim 1, characterized in that, The cooling device also includes: An inlet pressure sensor is installed on the inlet pipeline to detect the first pressure of the fluorinated liquid in the inlet pipeline; A liquid outlet pressure sensor is installed on the liquid outlet pipeline to detect the second pressure of the fluorinated liquid in the liquid outlet pipeline.

3. The cooling device for semiconductor chip testing according to claim 2, characterized in that, The cooling device also includes: An industrial control computer is connected to the inlet pressure sensor, the outlet pressure sensor, and the canned pump to control the operation of the canned pump based on the difference between the first pressure and the second pressure.

4. The cooling device for semiconductor chip testing according to claim 3, characterized in that, The cooling device also includes: A liquid inlet temperature sensor is installed on the liquid inlet pipeline to detect the temperature of the fluorinated liquid in the liquid inlet pipeline.

5. The cooling device for semiconductor chip testing according to claim 4, characterized in that, The cooling device also includes: A flow control valve is installed on the pipeline between the liquid inlet end of the second channel and the liquid outlet end of the cooling tower; The industrial control computer is also connected to the inlet temperature sensor and the flow control valve to adjust the opening of the flow control valve according to the temperature of the fluorinated liquid.

6. The cooling device for semiconductor chip testing according to claim 1, characterized in that, The cooling device also includes: A filter connected to the inlet pipe.

7. The cooling device for semiconductor chip testing according to claim 1, characterized in that, The cooling device also includes: A liquid level sensor is installed on the side wall of the water tank. The liquid level sensor includes, from top to bottom, a top connector, a transparent hose, and a bottom connector. Both the top connector and the bottom connector are connected to the water tank.

8. The cooling device for semiconductor chip testing according to claim 1, characterized in that, The cooling device also includes: A conductivity meter is installed on the liquid outlet pipe to detect the conductivity of the fluorinated liquid in the liquid outlet pipe.

9. The cooling device for semiconductor chip testing according to claim 1, characterized in that, The cooling device also includes: A flow sensor is installed on the inlet pipe to detect the flow rate of the fluorinated liquid in the inlet pipe.

10. The cooling device for semiconductor chip testing according to claim 1, characterized in that, The cooling device also includes: A bypass pipeline, the two ends of which are respectively connected to the inlet pipeline and the outlet pipeline; A flow control valve is disposed on the bypass line to open / close the bypass line.

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