A sputtered copper surface reduction vacuum gas bake-out apparatus

Abstract

The utility model belongs to the precise electronic manufacturing process equipment technical field especially is a kind of sputtering copper surface reduction vacuum gas baking device, including vacuum gas baking machine, the front of vacuum gas baking machine is provided with controller, the inside of vacuum gas baking machine is provided with rack, rotating bearing and clutch motor respectively, the inner wall of vacuum gas baking machine is fixedly connected with two groups of telescopic rods, and the telescopic end of each group of telescopic rods is fixedly connected with the bottom surface of rack, and the bottom surface of rack is fixedly connected with fixed frame, through being provided with clutch motor, threaded rod, threaded sleeve and the cooperative transmission structure of telescopic rod, the accurate adjustable of rack support position is realized, the material adaptation limited problem caused by the internal support fixation of existing device is solved, when sputtering copper material amount increases or decreases, controller can drive clutch motor to drive threaded rod to rotate, drives rack along telescopic rod steady lifting through the thread cooperation of threaded sleeve and threaded rod.

Description

Technical Field

[0001] This utility model belongs to the technical field of precision electronic manufacturing process equipment, specifically relating to a vacuum gas baking device for reducing sputtered copper surfaces. Background Technology

[0002] Vacuum gas baking equipment for sputtered copper surfaces is a core process equipment in the precision manufacturing fields of semiconductors and electronic components. Its core function is to introduce reducing gases such as hydrogen into a closed vacuum environment and achieve multiple process objectives through precise temperature control baking: removing the oxide layer, adsorbing moisture and residual impurities from the sputtered copper surface, while optimizing the copper layer's crystal structure and surface flatness. This type of equipment typically integrates real-time vacuum monitoring, closed-loop gas flow control, and temperature control accuracy calibration functions, which can effectively avoid secondary oxidation in the atmospheric environment, ensure the conductivity of the copper layer and its adhesion to the substrate, and provide a stable surface condition for subsequent key processes such as welding and packaging. It is an important guarantee for improving the reliability of precision electronic components.

[0003] However, existing vacuum gas baking devices for sputtered copper surface reduction have significant structural limitations. Their internal support devices are mostly designed with fixed installation and lack flexible adjustment capabilities. When the amount of sputtered copper material being processed varies, the support position cannot be adjusted according to the actual material volume. This makes it difficult to accurately position the sputtered copper to the central heating area of ​​the baking device. This defect directly causes uneven heating of various parts of the sputtered copper, and some areas are prone to insufficient baking or excessive temperature, which in turn affects the copper layer reduction effect and the overall processing quality, seriously restricting the stability of the process.

[0004] To address the aforementioned issues, this application proposes a vacuum gas baking apparatus for sputtered copper surfaces. Utility Model Content

[0005] To address the aforementioned problems in the existing technology, this utility model provides a vacuum gas baking device for the reduction of sputtered copper surfaces, which has the characteristics of improving the reduction effect of copper layers and the overall processing quality.

[0006] To achieve the above objectives, this utility model provides the following technical solution: a vacuum gas baking device for reducing sputtered copper surfaces, comprising a vacuum gas baking machine, a controller being provided on the front of the vacuum gas baking machine, a placement frame, a rotating bearing, and a brake motor being respectively provided inside the vacuum gas baking machine, two sets of telescopic rods being fixedly connected to the inner wall of the vacuum gas baking machine, the telescopic end of each set of telescopic rods being fixedly connected to the bottom surface of the placement frame, a fixing frame being fixedly connected to the bottom surface of the placement frame, a threaded sleeve being fixedly connected to the inner wall of the fixing frame, a threaded rod being fixedly connected to the output end of the brake motor, the outer surface of the threaded rod being threadedly connected to the inner wall of the threaded sleeve, and the top end of the threaded rod being fixedly connected to the bottom surface of the inner ring of the rotating bearing.

[0007] As a preferred embodiment of this utility model, a fixing plate is fixedly connected to the back of the controller, and the back of the fixing plate is fixedly connected to the front of the vacuum gas baking machine.

[0008] As a preferred embodiment of this utility model, the bottom surface of the placement rack is fixedly connected to two reinforcing plates, each of which is made of oxygen-free copper.

[0009] As a preferred embodiment of this utility model, a fixing ring is fixedly connected to the outer surface of each telescopic rod, and the bottom surface of each fixing ring is fixedly connected to the inner wall of the vacuum gas baking machine.

[0010] As a preferred embodiment of this utility model, a protective shell is fixedly connected to the inner wall of the vacuum gas baking machine, and the protective shell is sleeved on the outside of the brake motor.

[0011] As a preferred embodiment of this utility model, a support base is fixedly connected to the right side of the brake motor, and the bottom surface of the support base is fixedly connected to the inner wall of the vacuum gas baking machine.

[0012] As a preferred embodiment of this utility model, the outer surface of the threaded sleeve is fixedly connected with two reinforcing rings, and the two reinforcing rings are respectively fixedly connected to the upper surface and the bottom surface of the fixing frame on their sides that are close to each other.

[0013] As a preferred embodiment of this utility model, a connecting ring is fixedly connected to the upper surface of the outer ring of the rotating bearing, and the upper surface of the connecting ring is fixedly connected to the inner wall of the vacuum gas baking machine.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: By setting up a coordinated transmission structure with a brake motor, a threaded rod, a threaded sleeve, and a telescopic rod, the support position of the placement frame can be precisely adjusted, solving the problem of material compatibility limitations caused by the fixed internal support of existing devices. When the amount of sputtered copper material increases or decreases, the controller can drive the brake motor to rotate the threaded rod. Through the threaded engagement between the threaded sleeve and the threaded rod, the placement frame is driven to rise and fall stably along the telescopic rod, ensuring that sputtered copper of different volumes can be accurately positioned in the central heating area of ​​the vacuum gas baking machine, ensuring uniform heating of all parts of the material, effectively avoiding insufficient baking or local high temperature phenomena, significantly improving the copper layer reduction effect and overall processing quality. At the same time, the brake motor has a reliable braking and self-locking function, which can prevent the placement frame from shifting due to equipment vibration or minor force during the baking process, further improving the operational stability and load-bearing capacity of the device, and adapting to the process requirements of precision manufacturing scenarios such as semiconductors and electronic components. Attached Figure Description

[0015] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a cross-sectional view of the placement rack in this utility model; Figure 3 This is a schematic diagram of the telescopic rod in this utility model; Figure 4 This is a schematic diagram of the structure of the fixing frame in this utility model; Figure 5 This is a schematic diagram of the structure of the brake motor in this utility model; Figure 6 This is a schematic diagram of the threaded sleeve in this utility model; Figure 7 This is a schematic diagram of the rotating bearing in this utility model; In the diagram: 1. Vacuum gas baking machine; 2. Controller; 3. Fixing plate; 4. Placement rack; 5. Telescopic rod; 6. Reinforcing plate; 7. Fixing ring; 8. Threaded rod; 9. Fixing frame; 10. Protective shell; 11. Threaded sleeve; 12. Brake motor; 13. Support base; 14. Connecting ring; 15. Rotary bearing; 16. Reinforcing ring. Detailed Implementation

[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model. Example

[0017] Please see Figure 1-7 The present invention provides the following technical solution: a vacuum gas baking device for reducing sputtered copper surface, comprising a vacuum gas baking machine 1, a controller 2 on the front of the vacuum gas baking machine 1, a placement frame 4, a rotating bearing 15 and a brake motor 12 respectively disposed inside the vacuum gas baking machine 1, two sets of telescopic rods 5 fixedly connected to the inner wall of the vacuum gas baking machine 1, the telescopic end of each set of telescopic rods 5 being fixedly connected to the bottom surface of the placement frame 4, a fixing frame 9 fixedly connected to the bottom surface of the placement frame 4, a threaded sleeve 11 fixedly connected to the inner wall of the fixing frame 9, a threaded rod 8 fixedly connected to the output end of the brake motor 12, the outer surface of the threaded rod 8 being threadedly connected to the inner wall of the threaded sleeve 11, and the top end of the threaded rod 8 being fixedly connected to the bottom surface of the inner ring of the rotating bearing 15; In this embodiment, the vacuum gas baking machine 1 integrates multiple core functional modules to form a complete precision processing system: its main process chamber adopts an all-metal sealed design and is equipped with a loading locking chamber, which can effectively isolate the atmospheric environment, realize batch sample injection operation, and ensure the airtightness of the processing process; the gas supply system adopts a laminar flow distribution structure combining annular manifold and bottom exhaust, which can accurately deliver and stably maintain a nitrogen-hydrogen mixed atmosphere containing hydrogen, providing a controllable reducing environment for the reduction of sputtered copper layers; the heating system is equipped with a heat conduction heating plate with an integrated electrostatic chuck, which can accurately control the wafer temperature within the range required by the process and has excellent temperature uniformity, ensuring the consistency of the baking effect; in addition, the device is also equipped with an integrated control system, which can automatically complete the entire process management of vacuuming, gas filling, constant temperature treatment and cooling, providing a basic guarantee for the electrical performance and yield of the product; Controller 2 is a small PLC controller, which is solely responsible for the operation control of the brake motor 12. Specifically, it includes functions such as motor start / stop, forward / reverse adjustment, and brake locking. It achieves precise control of the lifting position of the placement rack 4 through precise signal output. The brake motor 12 is a high-temperature vacuum-adaptive servo brake motor, which adopts a stainless steel laser-welded sealing structure and has undergone vacuum degassing treatment. It can perfectly adapt to the vacuum and high-temperature working conditions inside the device, avoiding sealing failure or gas contamination problems. The motor has a fast braking response capability, which enables the placement rack 4 to lock quickly after reaching the target position, effectively preventing displacement caused by equipment vibration or minor force during the baking process, and further ensuring the uniform heating of the sputtered copper material.

[0018] Specifically, a fixing plate 3 is fixedly connected to the back of the controller 2. The back of the fixing plate 3 is fixedly connected to the front of the vacuum gas baking machine 1. In this embodiment, the fixing plate 3 acts as a transitional connection to increase the connection contact area between the controller 2 and the vacuum gas baking machine 1. This avoids the controller 2 from becoming loose due to concentrated force when it is fixed directly by the back. At the same time, it improves the overall stability of the controller 2 after installation and prevents the vibration of the equipment from affecting the internal components of the controller 2.

[0019] Specifically, the bottom surface of the placement rack 4 is fixedly connected to two reinforcing plates 6, each of which is made of oxygen-free copper. In this embodiment, the placement rack 4 is structurally reinforced by the reinforcing plates 6 made of oxygen-free copper. Oxygen-free copper has both mechanical strength and excellent thermal conductivity, which not only enhances the resistance to deformation of the placement rack 4 when it carries sputtered copper materials, but also quickly conducts the local heat accumulation on the placement rack 4, thereby helping to improve the uniformity of heating of sputtered copper and adapting to the baking process requirements of the device.

[0020] Specifically, each telescopic rod 5 has a fixed ring 7 fixedly connected to its outer surface, and the bottom surface of each fixed ring 7 is fixedly connected to the inner wall of the vacuum gas baking machine 1. In this embodiment, the fixed ring 7 is used to fix and limit the middle position of the telescopic rod 5, so as to avoid the telescopic rod 5 from shaking or tilting due to force when it is connected only at both ends, and to ensure that the telescopic rod 5 always remains vertical, providing reliable guidance for the stable lifting and lowering of the placement rack 4.

[0021] Specifically, a protective shell 10 is fixedly connected to the inner wall of the vacuum gas baking machine 1. The protective shell 10 is fitted over the outside of the brake motor 12. In this embodiment, the protective shell 10 isolates the brake motor 12 from the high-temperature baking area and reducing gas environment inside the device, preventing high-temperature radiation from directly acting on the brake motor 12 and causing its insulation performance to decline. At the same time, it avoids the reducing gas from corroding the internal metal parts of the motor, ensuring the operational stability and service life of the brake motor 12.

[0022] Specifically, a support base 13 is fixedly connected to the right side of the brake motor 12. The bottom surface of the support base 13 is fixedly connected to the inner wall of the vacuum gas baking machine 1. In this embodiment, the support base 13 supports the side of the brake motor 12, effectively dispersing the vibration load generated by the brake motor 12 during operation, ensuring the coaxiality of the threaded rod 8 when rotating, and avoiding jamming of the threaded fit.

[0023] Specifically, two reinforcing rings 16 are fixedly connected to the outer surface of the threaded sleeve 11. The two reinforcing rings 16 are fixedly connected to the upper and lower surfaces of the fixed frame 9 respectively on their side that are close to each other. In this embodiment, the two reinforcing rings 16 are used to reinforce the upper and lower connection nodes of the threaded sleeve 11 and the fixed frame 9 respectively, thereby increasing the connection strength between the threaded sleeve 11 and the fixed frame 9 and preventing cracking or loosening at the connection due to the torque generated by the rotation of the threaded rod 8, thus ensuring the stable operation of the threaded transmission structure.

[0024] Specifically, a connecting ring 14 is fixedly connected to the upper surface of the outer ring of the rotating bearing 15. The upper surface of the connecting ring 14 is fixedly connected to the inner wall of the vacuum gas baking machine 1. In this embodiment, the connecting ring 14 achieves a stable connection between the rotating bearing 15 and the inner wall of the vacuum gas baking machine 1. By utilizing the structural adaptability of the connecting ring 14, the rotating bearing 15 can be accurately positioned and fixed in the preset installation position. At the same time, it provides a stable support foundation for the rotating bearing 15, ensuring the normal working condition where the outer ring of the bearing remains fixed and the inner ring rotates synchronously with the threaded rod 8 when the threaded rod 8 rotates.

[0025] The working principle and usage process of this utility model are as follows: In use, the feeding channel is first opened through the loading and locking chamber of the vacuum gas baking machine 1. Based on the volume of the copper to be sputtered, a lifting command is input through the controller 2. The controller 2 drives the brake motor 12 to start, causing the threaded rod 8 to rotate around the inner ring of the rotating bearing 15. Under the threaded transmission of the threaded rod 8, the threaded sleeve 11 drives the fixed frame 9 to rise and fall synchronously. The placement frame 4 moves smoothly along the guide direction of the telescopic rod 5 until the placement frame 4 precisely reaches the corresponding height of the central heating area. Then, the controller 2 controls the brake motor 12 to brake and lock itself, completing the position locking of the placement frame 4. Subsequently, the sputtered copper material is smoothly placed on the placement frame 4. The loading and locking chamber is closed, and the integrated control system of the device is activated. First, the main process chamber is evacuated through the vacuum system until the preset vacuum level is reached. The supply system introduces a nitrogen-hydrogen mixture containing hydrogen into the cavity through a ring manifold. Simultaneously, the heat conduction heating plate begins to heat up. The material is adsorbed and fixed by an electrostatic chuck, achieving uniform heating. During the baking process, the oxygen-free copper reinforcing plate 6 assists in heat conduction, preventing localized heat accumulation in the material. The protective shell 10 and support base 13 ensure the stable standby of the brake motor 12 in a high-temperature vacuum environment. After the baking process is completed, the integrated control system first cuts off the heating and introduces inert gas for cooling. After the temperature drops to a safe range, the pressure is released, and then the controller 2 unlocks the brake motor 12, driving the placement rack 4 to descend to the feeding height. Finally, the loading locking cavity is opened to remove the material, completing a single processing cycle. Throughout the process, the fixing ring 7 and the reinforcing ring 16 respectively ensure the guiding stability of the telescopic rod 5 and the strength of the threaded transmission structure, ensuring the long-term reliability of the device.

[0026] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A vacuum gas baking apparatus for reducing sputtered copper surfaces, characterized in that: The device includes a vacuum gas baking machine (1), with a controller (2) on the front. Inside the vacuum gas baking machine (1), there are a placement rack (4), a rotating bearing (15), and a brake motor (12). Two sets of telescopic rods (5) are fixedly connected to the inner wall of the vacuum gas baking machine (1). The telescopic end of each set of telescopic rods (5) is fixedly connected to the bottom surface of the placement rack (4). A fixing frame (9) is fixedly connected to the bottom surface of the placement rack (4). A threaded sleeve (11) is fixedly connected to the inner wall of the fixing frame (9). A threaded rod (8) is fixedly connected to the output end of the brake motor (12). The outer surface of the threaded rod (8) is threadedly connected to the inner wall of the threaded sleeve (11). The top end of the threaded rod (8) is fixedly connected to the bottom surface of the inner ring of the rotating bearing (15).

2. The vacuum gas baking apparatus for sputtered copper surface reduction according to claim 1, characterized in that: The back of the controller (2) is fixedly connected to a fixing plate (3), and the back of the fixing plate (3) is fixedly connected to the front of the vacuum gas baking machine (1).

3. The vacuum gas baking apparatus for sputtered copper surface reduction according to claim 1, characterized in that: The bottom surface of the placement rack (4) is fixedly connected to two reinforcing plates (6), each of which is made of oxygen-free copper.

4. The vacuum gas baking apparatus for sputtered copper surface reduction according to claim 1, characterized in that: Each of the telescopic rods (5) has a fixed ring (7) fixedly connected to its outer surface, and the bottom surface of each fixed ring (7) is fixedly connected to the inner wall of the vacuum gas baking machine (1).

5. The vacuum gas baking apparatus for sputtered copper surface reduction according to claim 1, characterized in that: The inner wall of the vacuum gas baking machine (1) is fixedly connected to a protective shell (10), which is fitted over the outside of the brake motor (12).

6. The vacuum gas baking apparatus for reducing sputtered copper surfaces according to claim 1, characterized in that: The right side of the brake motor (12) is fixedly connected to a support base (13), and the bottom surface of the support base (13) is fixedly connected to the inner wall of the vacuum gas baking machine (1).

7. The vacuum gas baking apparatus for sputtered copper surface reduction according to claim 1, characterized in that: Two reinforcing rings (16) are fixedly connected to the outer surface of the threaded sleeve (11). The two reinforcing rings (16) are fixedly connected to the upper and lower surfaces of the fixing frame (9) respectively on their sides that are close to each other.

8. The vacuum gas baking apparatus for sputtered copper surface reduction according to claim 1, characterized in that: A connecting ring (14) is fixedly connected to the upper surface of the outer ring of the rotating bearing (15), and the upper surface of the connecting ring (14) is fixedly connected to the inner wall of the vacuum gas baking machine (1).

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