A device for measuring the profile of a pipe to be processed

Abstract

The utility model provides a kind of equipment for the profile of pipe to be processed is measured, including first light unit, for emitting first emission beam;First receiving unit, for receiving first receiving beam;Second light unit, for emitting second emission beam;Second receiving unit, for receiving second receiving beam;Processor, for obtaining profile data based on first receiving beam and second receiving beam.The optical axis of first emission beam and the optical axis of first receiving beam determine first measurement plane, the optical axis of second emission beam and the optical axis of second receiving beam determine second measurement plane, the mid-perpendicular plane of the connecting line of the exit point of first emission beam and the exit point of second emission beam determines reference plane.First light unit and first receiving unit are located at the first side of reference plane, and second light unit and second receiving unit are located at the second side of reference plane.First measurement plane is inclined towards second side, and second measurement plane is inclined towards first side.

Description

Technical Field

[0001] This utility model relates to the field of machine tool processing, and more specifically to a device for measuring the contour of a pipe to be processed. Background Technology

[0002] In the field of machine tool processing, before the machining head processes the workpiece, it is usually necessary to measure the contour of the surface to be processed on the workpiece so that the machining head can accurately plan the machining trajectory based on the measured real-time contour data, thereby ensuring machining accuracy.

[0003] A laser profilometer is conventionally used to measure the contour of a workpiece's surface to be machined. The measurement principle is as follows: A laser beam is emitted from a laser source onto the surface to be machined. The laser pattern left by this beam is deformed by the surface's contour. An image of this laser pattern is then captured by a camera. Finally, a processor analyzes the deformation of the laser pattern in the image to reconstruct the contour data of the surface to be machined.

[0004] When measuring the contour data of the pipe to be processed, the laser contour measuring instrument mentioned above must rotate the pipe to be processed in order to obtain images of the left and right R angles adjacent to the surface to be processed of the pipe. This will cause a change in the posture of the pipe to be processed, which will seriously affect the measurement accuracy. Utility Model Content

[0005] The present invention aims to overcome the above-mentioned and / or other problems in the prior art. The device provided by the present invention for measuring the contour of a pipe to be processed can measure two adjacent radius angles on the surface to be processed without rotating the pipe, thereby significantly improving measurement accuracy and overall processing efficiency.

[0006] The device for measuring the contour of a pipe to be processed according to this invention includes a first light-emitting unit, a first receiving unit, a second light-emitting unit, a second receiving unit, and a processor. A first emitted light beam is emitted from the first light-emitting unit, and the first receiving unit is used to receive the first received light beam obtained by reflection of the first emitted light beam on the surface of the pipe to be processed. A second emitted light beam is emitted from the second light-emitting unit, and the second receiving unit is used to receive the second received light beam obtained by reflection of the second emitted light beam on the surface to be processed. The processor is used to obtain contour data of the surface to be processed based on the data converted from the first and second received light beams. The optical axes of the first emitted light beam and the first received light beam determine a first measuring plane, the optical axes of the second emitted light beam and the second received light beam determine a second measuring plane, and the perpendicular bisector of the line connecting the emission points of the first and second emitted light beams determines a reference plane. The first light-emitting unit and the first receiving unit are located on a first side of the reference plane, and the second light-emitting unit and the second receiving unit are located on a second side of the reference plane opposite to the first side. The first light-emitting unit, the first receiving unit, the second light-emitting unit, and the second receiving unit are configured such that the first measuring plane is inclined toward the second side and the second measuring plane is inclined toward the first side.

[0007] This invention adjusts the emission direction of the emitted light beam so that the measurement plane formed by the measurement optical paths of the emitted and received light beams has a certain tilt angle relative to the reference plane. This tilt angle allows the emitted light beam to be projected onto the radius (R) angle, enabling the measurement of one R angle without rotating the pipe to be processed, significantly improving measurement accuracy and efficiency. This invention also incorporates two sets of tilted optical paths, with the measurement ranges of the two sets of optical paths intersecting and covering the pipe from the sides of the surface to be processed, thereby achieving the measurement of two R angles without rotation.

[0008] Optionally, the range of the first tilt angle of the first measuring plane relative to the reference plane and the second tilt angle of the second measuring plane relative to the reference plane can be 10° to 60°.

[0009] Optionally, the first tilt angle can be equal to the second tilt angle.

[0010] Optionally, the first emitted beam may include multiple first emitted rays, the first received beam may include multiple first received rays corresponding to the multiple first emitted rays, the second emitted beam may include multiple second emitted rays, and the second received beam may include multiple second received rays corresponding to the multiple second emitted rays. The first emission angle of any first emitted ray relative to the normal of the measurement point on the surface to be processed may not be equal to the first reception angle of its corresponding first received ray relative to the normal, and / or the second emission angle of any second emitted ray relative to the normal may not be equal to the second reception angle of its corresponding second received ray relative to the normal.

[0011] The above design ensures that the first received light beam received by the first receiving unit / second receiving unit is not a specularly reflected light beam, thereby avoiding the impact of specularly reflected light beams on subsequent signal processing and improving signal processing quality.

[0012] Optionally, the relative positions of the first light-emitting unit, the first receiving unit, the second light-emitting unit, and the second receiving unit can be fixed. This integrated design avoids the need for tedious fine-tuning and calibration before each measurement, improving measurement efficiency and enhancing the user experience.

[0013] Optionally, at least one of the first and second emission beams can be a line laser, a pulsed laser, or a structured light.

[0014] Optionally, the first light-emitting unit may include a first laser for emitting a first emitted beam. The second light-emitting unit may include a second laser for emitting a second emitted beam.

[0015] Optionally, the wavelengths of the first emitted beam and the second emitted beam may be different.

[0016] Optionally, the device for measuring the contour of the tube to be processed according to the present invention may further include a first filter disposed in the optical path of the first receiving beam and / or a second filter disposed in the optical path of the second receiving beam, wherein the first receiving beam passes through the first filter and reaches the first receiving unit, and the second receiving beam passes through the second filter and reaches the second receiving unit.

[0017] The above design ensures that the first receiving beam will not pass through the second filter and interfere with the second receiving unit receiving the second receiving beam, and the second receiving beam will not pass through the first filter and interfere with the first receiving unit receiving the first receiving beam normally. This allows the first measurement component composed of the first light-emitting unit and the first receiving unit and the second measurement component composed of the second light-emitting unit and the second receiving unit to perform measurements simultaneously without interfering with each other.

[0018] Optionally, the device for measuring the contour of the pipe to be processed according to this invention may further include a third laser and a beam splitter. The third laser emits a primary laser beam, and the beam splitter divides the primary laser beam into two beams, which then pass through the first and second output units to form the first and second emitted beams. Using the same third laser to generate the first and second emitted beams allows for a more compact external structure and a higher level of protection. Furthermore, sharing the third laser and beam splitter between the two beams ensures a more unified reference for both beams, reducing the difficulty of data processing for the processor.

[0019] Optionally, the first receiving unit and the second receiving unit may each include a first image acquisition element and a second image acquisition element. The first image acquisition element is used to convert the first received beam into a first received image, and the second image acquisition element is used to convert the second received beam into a second received image. The processor can process the first received image and the second received image to obtain the contour data of the surface to be processed.

[0020] Optionally, the device for measuring the contour of the pipe to be processed according to the present invention may further include a third image acquisition element, which is used to convert the first receiving beam received by the first receiving unit and the second receiving beam received by the second receiving unit into a first receiving image and a second receiving image, respectively, and the processor processes the first receiving image and the second receiving image to obtain the contour data of the surface to be processed. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0022] Figure 1 This is a schematic diagram of the device of the present invention for measuring the contour of a pipe to be processed;

[0023] Figure 2 A schematic diagram illustrating the principle of measuring the radius (R) of a pipe to be processed using an existing laser profile measuring instrument;

[0024] Figure 3 A schematic diagram illustrating the principle of the device of this utility model for measuring the two radius angles of the pipe to be processed;

[0025] Figure 4 This is a schematic diagram illustrating the principle of the first tilt angle of the first measuring plane relative to the reference plane and the second tilt angle of the second measuring plane relative to the reference plane in the device of this utility model.

[0026] Figure 5 This is a schematic diagram illustrating the principle of the first emission angle of the first emitted ray relative to the normal of the measurement point and the first receiving angle of the first received ray relative to the normal of the measurement point in the device of this invention; and

[0027] Figure 6 This is a schematic diagram of the optical path of the third laser and beam splitter in the device of this utility model. Detailed Implementation

[0028] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0029] It should be understood that the described embodiments are merely some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of the embodiments of this application.

[0030] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to limit the embodiments of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms, unless the context clearly indicates otherwise.

[0031] In the following description, when referring to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims. In the description of this application, it should be understood that the terms "first," "second," "third," etc., are used only to distinguish similar objects and are not necessarily used to describe a specific order or sequence, nor should they be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0032] Furthermore, in the description of this application, unless otherwise stated, "multiple" means two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0033] In the description of the embodiments of this application, the technical terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0034] It should be understood that the embodiments of this application are not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from their scope. The scope of the embodiments of this application is limited only by the appended claims.

[0035] Figure 1 This is a schematic diagram of the device according to this utility model for measuring the contour of a pipe to be processed. Figure 1 As shown, the device 1000 of this invention for measuring the contour of a pipe to be processed includes a first light-emitting unit 100, a first receiving unit 200, a second light-emitting unit 300, a second receiving unit 400, and a processor (not shown). A first emitted light beam L11 is emitted from the first light-emitting unit 100. The first receiving unit 200 is used to receive a first received light beam L12 obtained by reflection of the first emitted light beam L11 on the surface of the pipe to be processed. A second emitted light beam L21 is emitted from the second light-emitting unit 300. The second receiving unit 400 is used to receive a second received light beam L22 obtained by reflection of the second emitted light beam L21 on the surface to be processed. The processor is used to obtain contour data of the surface to be processed based on the data converted from the first received light beam L12 and the second received light beam L22.

[0036] exist Figure 1 In this process, the optical axes of the first emitted beam L11 and the first received beam L12 are defined as the first measurement plane α, the optical axes of the second emitted beam L21 and the second received beam L22 are defined as the second measurement plane β, and the perpendicular bisector of the line connecting the exit points of the first emitted beam L11 and the second emitted beam L21 is defined as the reference plane γ. For example... Figure 1 As shown, the first light-emitting unit 100 and the first receiving unit 200 are located on the first side γ1 of the reference plane γ. The second light-emitting unit 300 and the second receiving unit 400 are located on the second side γ2 of the reference plane γ, opposite to the first side γ1. The first light-emitting unit 100, the first receiving unit 200, the second light-emitting unit 300 and the second receiving unit 400 are configured such that the first measuring plane α is inclined toward the second side γ2 and the second measuring plane β is inclined toward the first side γ1.

[0037] The following is combined Figure 2 This section describes the problems encountered by existing laser profile measuring instruments when measuring the radius (R) of pipes to be processed. For example... Figure 2As shown, the pipe to be processed has four radius (R) angles. The laser profilometer needs to measure the two adjacent radius (R1 and R2) to the surface to be processed on the pipe in order to perform subsequent calculations such as alignment based on the radius data. However, existing laser profilometers only have one set of laser and camera, and the optical axis of the laser beam emitted by the laser and the measurement plane determined by the camera are fixed to a vertical plane. This results in limitations when the pipe is not rotated, such as... Figure 1 As shown in (a), no matter how the laser profile measuring instrument is translated, there is no position where the laser beam can be projected onto the R-angle. Therefore, the existing laser profile measuring instrument cannot directly measure the profile near the R-angle without rotating the pipe to be processed.

[0038] The situation where the pipe to be processed is rotated before measurement is performed, such as Figure 1 As shown in (b), although rotating the pipe can achieve the measurement of the radius (R) angle, the following problems still exist: ① Rotating the pipe will cause changes in the pipe's posture. To ensure measurement accuracy, the pipe's posture must be recalibrated. The addition of rotation and calibration steps greatly prolongs the measurement process, seriously affecting measurement efficiency. ② The pipe to be processed is generally only held by a fixture at one end, while the other end is a free end, which will sag due to gravity. Rotating the pipe may cause changes in the amount of sag, resulting in serious distortion of the measurement data. On the other hand, if the fixture is unstable, the pipe may also fall off unexpectedly, seriously slowing down the production progress and even causing production safety accidents. ③ Measuring the left and right R angles requires rotating the pipe twice. Each rotation of the pipe will lead to a decrease in measurement accuracy and a prolongation of the measurement process, ultimately resulting in a measurement process that is both cumbersome and inefficient, and unable to achieve high measurement accuracy.

[0039] To address the aforementioned problems, this invention adjusts the emission direction of the emitted beam so that the measuring plane formed by the optical paths of the emitted and received beams has a certain tilt angle relative to the reference plane. This tilt angle allows the emitted beam to be projected onto the R-angle, thus enabling the measurement of the R-angle without rotating the pipe to be processed.

[0040] The following example illustrates how a first measuring plane α, a second measuring plane β, and a reference plane γ are all parallel to the same straight line. Figure 3 This invention will explain in more detail how the device of this invention measures the radius (R).

[0041] exist Figure 3 In the illustrated embodiment, the first measurement plane α, the second measurement plane β, and the reference plane γ are all parallel to the same straight line. Figure 3This is a schematic diagram of the light path obtained by the line of sight along this straight line. According to mathematical principles, the line of sight being parallel to the first measurement plane α, the second measurement plane β, and the reference plane γ means that the paper is perpendicular to the first measurement plane α, the second measurement plane β, and the reference plane γ. Therefore, the first measurement plane α, the second measurement plane β, and the reference plane γ... Figure 3 It appears as a straight line on the paper.

[0042] The two radius (R) angles to be measured are the first R angle and the second R angle. When measuring the first R angle, the first emitted beam L11 is projected onto the first R angle using the translation device 1000, as shown below. Figure 3 As shown in (a), the first measuring plane α passes through the first R-angle to be measured. At this time, the first emitted beam L11 is projected onto the first R-angle, and the first received beam L12 reflected from it is received by the first receiving unit 200. The processor can complete the measurement of the first R-angle profile by processing the data converted from the first received beam L12. When measuring the second R-angle, the translation device 1000 projects the second emitted beam L21 onto the second R-angle, as shown in (a). Figure 3 As shown in (b), the second measuring plane β is made to pass through the second R-angle to be measured. At this time, the second emitted beam L21 is projected onto the second R-angle, and the second received beam L22 reflected on the second R-angle is received by the second receiving unit 400. The processor can complete the measurement of the profile of the second R-angle by processing the data converted by the second received beam L22.

[0043] In a specific machine tool processing scenario, the device 1000 of this invention can be arranged on both sides of the processing head. The processing head is located on the reference plane γ. The first measuring assembly, composed of the first light-emitting unit 100 and the first receiving unit 200, can be arranged on one side of the processing head, and the second measuring assembly, composed of the second light-emitting unit 300 and the second receiving unit 400, can be arranged on the opposite side of the processing head. The first measuring plane α and the second measuring plane β of this invention are inclined relative to the reference plane γ, so the processing head will not block the first measuring optical path composed of the first emitted beam L11 and the first received beam L12, or the second measuring optical path composed of the second emitted beam L21 and the second received beam L22. In the prior art, the equipment used to measure pipes is generally a general-purpose device, and its line of sight is not optimized according to the specific processing scenario. In order to adapt to the line of sight of general-purpose equipment, existing measuring equipment usually needs to be arranged on one side above the processing head, which is relatively far away from the pipe. At this time, if the measuring optical path is tilted, the processing head will block the measuring optical path, resulting in measurement failure. The device 1000 of this invention can use a smaller viewing distance compared to general-purpose equipment, thus allowing the device 1000 to be positioned on both sides of the lower part of the processing head. In this case, tilting the first and second measuring optical paths avoids the problem of the processing head obstructing the measuring optical paths. Because the device 1000 of this invention is lower in height, its distance to the surface of the pipe to be processed is closer, and its measurement accuracy is significantly improved compared to general-purpose equipment.

[0044] In summary, this invention, by configuring the emission directions of the first emitted beam L11 / second emitted beam L21 and the positions of the first receiving unit 200 / second receiving unit 400, ensures that the first measuring plane α / second measuring plane β formed by the optical paths of the first emitted beam L11 / second emitted beam L21 and the first receiving beam L12 / second receiving beam L22 has a certain tilt angle relative to the reference plane γ. This tilt angle allows the first emitted beam L11 / second emitted beam L21 to be projected onto the R-angle, enabling the measurement of the R-angle without rotating the tube to be processed. Furthermore, this invention allows the first measuring plane α and the second measuring plane β to tilt towards opposite directions, so that the measurement ranges of the two measuring optical paths intersect and cover the tube from the side of the surface to be processed, thereby achieving the measurement of the two R-angles without rotation.

[0045] It should be clarified that the measurement of the two radius angles (R-angles) can still be achieved without rotating the pipe being processed, even if the first measuring plane α, the second measuring plane β, and the reference plane γ are not parallel to the same straight line. As long as both the first measuring plane α and the second reference plane β are tilted towards the opposite side of the reference plane γ, there is a possibility that by shifting the position of the translation device 1000, either the first emission beam L11 or the second emission beam L21 can be projected onto the first R-angle or the second R-angle. Figure 3The fact that the first measuring plane α, the second measuring plane β, and the reference plane γ are all parallel to the same straight line is only for illustrative purposes, but this utility model is not limited to this.

[0046] In one embodiment, the first light-emitting unit 100 and the first receiving unit 200 are configured such that the first measurement optical path formed by the first emitted beam L11 and the first received beam L12 conforms to Scherm's law. The second light-emitting unit 300 and the second receiving unit 400 are configured such that the second measurement optical path formed by the second emitted beam L21 and the second received beam L22 conforms to Scherm's law. Scherm's law states that the extended planes of the object plane to be measured, the lens plane of the camera, and the image plane where the image sensor is located intersect by a straight line. When the measurement optical path conforms to Scherm's law, the entire object plane to be measured is located exactly on the focal plane of the camera, thereby enabling the capture of a complete and clear image of the object plane.

[0047] In one embodiment, the range of the first tilt angle θ1 of the first measuring plane α relative to the reference plane γ and the second tilt angle θ2 of the second measuring plane β relative to the reference plane γ can be 10°~60°, thereby achieving better results in actual measurement of the radius (R). Figure 4 As shown, if the first tilt angle θ1 and the second tilt angle θ2 are equal to 45°, there is a possibility that the measuring plane passes exactly through the normal to the vertex of the radius (R), which yields the best measurement results. However, in actual measurements, due to space constraints and coordination requirements with other components, the first tilt angle θ1 and the second tilt angle θ2 may not be set to 45°. The first tilt angle θ1 and the second tilt angle θ2 can be adjusted to specific values ​​between 10° and 60° according to actual needs.

[0048] In one embodiment, the first tilt angle θ1 can be equal to the second tilt angle θ2.

[0049] In one embodiment, the first transmitting beam L11 may include multiple first transmitting rays, the first receiving beam L12 may include multiple first receiving rays corresponding to the multiple first transmitting rays, the second transmitting beam L21 may include multiple second transmitting rays, and the second receiving beam L22 may include multiple second receiving rays corresponding to the multiple second transmitting rays. In one embodiment, as... Figure 5 As shown, the first emission angle φ11 of any first emitted ray relative to the normal l of the measurement point P on the surface to be processed may not be equal to the first receiving angle φ12 of the corresponding first received ray relative to the normal l. In one embodiment, such as Figure 5As shown, the second emission angle of any second emitted ray relative to the normal l and the second reception angle of its corresponding second received ray relative to the normal l may not be equal. For example, the difference between the first emission angle φ11 and the first reception angle φ12 may be greater than 5°, and the difference between the second emission angle and the second reception angle may be greater than 5°.

[0050] A first emitted light beam L11 is projected onto the surface to be processed, thereby forming a pattern on the surface. The first emitted light beam L11 comprises multiple first emitted rays, each of which is projected onto the surface to be processed, forming individual light spots. All the light spots corresponding to the first emitted rays collectively form the pattern corresponding to the first emitted light beam L11. The measurement point P refers to the position of any light spot formed by any first emitted ray projected onto the surface to be processed. According to the law of reflection, if the first emitted ray undergoes specular reflection at the measurement point P, then the angle between the resulting specularly reflected ray and the normal l of the measurement point P is equal to the first emission angle φ11. Excessive intensity of the specularly reflected ray can negatively impact subsequent signal processing; therefore, the first receiving unit 200 should avoid receiving specularly reflected ray. This invention ensures that the first received ray received by the first receiving unit 200 is not a specularly reflected ray by making the first receiving angle φ12 of the first received ray relative to the normal l not equal to the first emission angle φ11, thus avoiding the influence of specularly reflected ray on subsequent signal processing and improving signal processing quality. Similarly, this invention can also make the second receiving angle of the second receiving ray relative to the normal l not equal to the second emission angle. The principle and effect are the same as those of the first receiving ray, and will not be repeated here.

[0051] In one embodiment, the relative positions of the first light-emitting unit 100, the first receiving unit 200, the second light-emitting unit 300, and the second receiving unit 400 can be fixed.

[0052] The measurement accuracy of this device 1000 depends on the precise path of the light. If the position of any one of the first light-emitting unit 100, the first receiving unit 200, the second light-emitting unit 300, and the second receiving unit 400 is offset, it will lead to a significant decrease in the imaging quality of the device or a significant increase in the difficulty of data processing. By pre-fixing and calibrating the positions of the first light-emitting unit 100, the first receiving unit 200, the second light-emitting unit 300, and the second receiving unit 400 before the device leaves the factory, the tedious fine-tuning and calibration required before each measurement is avoided, improving measurement efficiency and enhancing the user experience.

[0053] Optionally, the relative positions of the first light-emitting unit 100, the first receiving unit 200, the second light-emitting unit 300, and the second receiving unit 400 can be fixed by any fixing component such as a jig, clamp, bracket, or housing.

[0054] In one embodiment, at least one of the first emitted beam L11 and the second emitted beam L21 can be a line laser, a pulsed laser, or a structured light. Line lasers have significant advantages in high-precision measurement due to their small spot size, enabling sub-micron level measurement accuracy, making them particularly suitable for measuring small, high-precision components. Structured light typically offers micron-level accuracy, making it suitable for scenarios requiring both measurement speed and overall topographic data acquisition. Pulsed lasers are suitable for long-distance scenarios where absolute accuracy requirements are not extremely stringent. Through temporal or spatial domain encoding, pulsed lasers or structured light can further suppress ambient light interference, improve the signal-to-noise ratio of the received signal, and enhance the robustness of measurement performance in complex lighting environments.

[0055] In one embodiment, the first light-emitting unit 100 may include a first laser for emitting a first emission beam L11; the second light-emitting unit 300 may include a second laser for emitting a second emission beam L21.

[0056] In one embodiment, the wavelengths of the first emitted beam L11 and the second emitted beam L21 may be different. For example, the wavelength of the first emitted beam L11 may be 450 nm, and the wavelength of the second emitted beam L21 may be 405 nm or 650 nm. In this case, the device 1000 of the present invention may further include a first filter disposed in the optical path of the first received beam L12 and a second filter disposed in the optical path of the second received beam L22. The first received beam L12 passes through the first filter and reaches the first receiving unit 200, and the second received beam L22 passes through the second filter and reaches the second receiving unit 400. For example, the first wavelength of the first emitted beam L11 and the second wavelength of the second emitted beam L21 may be different by adjusting the operating parameters of the first laser and the second laser. Both the first filter and the second filter may be narrowband filters. The passband range of the first filter includes the first wavelength, such that light with wavelengths near the first wavelength can pass through the first filter and reach the first receiving unit 200. The passband of the second filter includes the second wavelength, so that light with a wavelength near the second wavelength can pass through the second filter and reach the second receiving unit 400.

[0057] With the above configuration, the first receiving beam L12 will not pass through the second filter and interfere with the second receiving unit 400's normal reception of the second receiving beam L22, and the second receiving beam L22 will not pass through the first filter and interfere with the first receiving unit 200's normal reception of the first receiving beam L12. The first measurement assembly composed of the first light-emitting unit 100 and the first receiving unit 200 and the second measurement assembly composed of the second light-emitting unit 300 and the second receiving unit 400 can perform measurements simultaneously without interfering with each other.

[0058] In embodiments where the wavelengths of the first emitted beam L11 and the second emitted beam L21 are the same, interference between the first and second measurement components can be avoided through time-division measurement or software algorithms. When using time-division measurement, at most one set of measurement components is performing measurements at any given time, and the processor can distinguish the two data streams converted from the first and second received beams based on the data acquisition time. When using software algorithms, the processor internally runs a contour analysis algorithm, which distinguishes the two data streams converted from the first and second received beams by comparing the differences in their contour shapes. Those skilled in the art can determine whether the first emitted beam L11 and the second emitted beam L21 have the same wavelength and what method to use to distinguish the two data streams according to actual needs; this invention does not impose specific limitations.

[0059] In one embodiment, the device 1000 of this invention may further include a third laser 500 and a beam splitter 600, such as Figure 6 As shown in the diagram, the third laser 500 is used to emit the original laser L00. A beam splitter 600 splits the original laser L00 into two laser beams, L01 and L02. These two laser beams, L01 and L02, pass through the first light-emitting unit 100 and the second light-emitting unit 300, respectively, forming the first emitted beam L11 and the second emitted beam L21. Using the same third laser 500 to generate the first emitted beam L11 and the second emitted beam L21 allows for a more compact external structure and a higher level of protection for the device 1000. Furthermore, sharing the third laser 500 and the beam splitter 600 between the two beams ensures a more unified reference for the two beams, reducing the difficulty of data processing for the processor.

[0060] It should be noted that the first light-emitting unit 100 and the second light-emitting unit 300 of this invention only need to be able to emit the first emitted beam L11 and the second emitted beam L21 as described above, respectively. The first light-emitting unit 100 and the second light-emitting unit 300 can either include a light source themselves to generate the first emitted beam L11 and the second emitted beam L21 as described above, or they can obtain the first emitted beam L11 and the second emitted beam L21 as described above by adjusting the beams generated by other light sources. For example, when the first emitted beam L11 and the second emitted beam L21 are generated by the first laser included in the first light-emitting unit 100 and the second laser included in the second light-emitting unit 300, respectively, the emission direction of the first emitted beam L11 and the second emitted beam L21 can be adjusted by adjusting the pose of the first laser and the second laser. When the first emitted beam L11 and the second emitted beam L21 are generated by the third laser 500 and the beam splitter 600, the first light-emitting unit 100 and the second light-emitting unit 300 can be optical path adjustment components such as mirrors or lenses. They adjust the direction of the lasers L01 and L02 from the beam splitter 600 so that the first emitted beam L11 and the second emitted beam L21 are emitted in the desired direction.

[0061] It should be noted that the first receiving unit 200 and the second receiving unit 400 only need to be able to receive the first receiving beam L12 and the second receiving beam L22. The first receiving unit 200 and the second receiving unit 400 can either include a first image acquisition element and a second image acquisition element themselves to convert the first receiving beam L12 and the second receiving beam L22 into a first received image and a second received image, or they can transmit the first receiving beam L12 and the second receiving beam L22 to other image acquisition elements for image conversion.

[0062] In one embodiment, the first receiving unit 200 and the second receiving unit 400 respectively include a first image acquisition element and a second image acquisition element. The first image acquisition element is used to convert the first received beam L12 into a first received image. The second image acquisition element is used to convert the second received beam L22 into a second received image. The processor processes the first and second received images to obtain the contour data of the surface to be processed. The first and second image acquisition elements can be any sensor with imaging function, such as a CMOS image sensor or a CCD image sensor.

[0063] In one embodiment, the device 1000 of this invention may further include a third image acquisition element (not shown), which is used to convert the first received beam L12 received by the first receiving unit and the second received beam L22 received by the second receiving unit into a first received image and a second received image, respectively. The processor processes the first received image and the second received image to obtain the contour data of the surface to be processed. The third image acquisition element can be any sensor with imaging function, such as a CMOS image sensor or a CCD image sensor.

[0064] Exemplary embodiments have been described above. However, it should be understood that various modifications can be made to the above exemplary embodiments without departing from the spirit and scope of this invention. For example, if suitable results can be achieved if the described techniques are performed in a different order and / or if components in the described system, architecture, device, or circuit are combined in different ways and / or replaced or supplemented by other components or their equivalents, then correspondingly, these other modified embodiments also fall within the scope of protection of the claims.

Claims

1. An apparatus for measuring the profile of a pipe to be processed, comprising: The first light-emitting unit emits a first light beam. The first receiving unit is used to receive the first received beam obtained by the reflection of the first emitted beam on the surface of the pipe to be processed; The second light-emitting unit emits a second light beam. The second receiving unit is used to receive the second received beam obtained by the reflection of the second emitted beam on the surface to be processed. as well as The processor is configured to obtain contour data of the surface to be processed based on the data converted from the first received beam and the second received beam. Wherein, the optical axis of the first emitted beam and the optical axis of the first received beam define a first measurement plane, the optical axis of the second emitted beam and the optical axis of the second received beam define a second measurement plane, the perpendicular bisector of the line connecting the exit point of the first emitted beam and the exit point of the second emitted beam defines a reference plane, the first emitting unit and the first receiving unit are located on a first side of the reference plane, the second emitting unit and the second receiving unit are located on a second side of the reference plane opposite to the first side, and the first emitting unit, the first receiving unit, the second emitting unit and the second receiving unit are configured such that the first measurement plane is inclined toward the second side and the second measurement plane is inclined toward the first side.

2. The device according to claim 1, characterized in that, The range of the first tilt angle of the first measuring plane relative to the reference plane and the second tilt angle of the second measuring plane relative to the reference plane is 10° to 60°.

3. The device according to claim 2, characterized in that, The first tilt angle is equal to the second tilt angle.

4. The device according to claim 1, characterized in that: The first emitted beam includes multiple first emitted rays, the first received beam includes multiple first received rays corresponding to the multiple first emitted rays, the second emitted beam includes multiple second emitted rays, and the second received beam includes multiple second received rays corresponding to the multiple second emitted rays. The first emission angle of any first emitted ray relative to the normal of the measurement point on the surface to be processed is not equal to the first receiving angle of the corresponding first received ray relative to the normal. and / or The second emission angle of any second emitted ray relative to the normal is not equal to the second reception angle of the corresponding second received ray relative to the normal.

5. The device according to claim 1, characterized in that, The relative positions of the first light-emitting unit, the first receiving unit, the second light-emitting unit, and the second receiving unit are fixed.

6. The device according to claim 1, characterized in that, At least one of the first emitted beam and the second emitted beam is a line laser, a pulsed laser, or a structured light.

7. The device according to any one of claims 1-6, characterized in that, The first light-emitting unit includes a first laser for emitting the first emitted beam, and the second light-emitting unit includes a second laser for emitting the second emitted beam.

8. The device according to claim 7, characterized in that, The first emitted beam and the second emitted beam have different wavelengths.

9. The device according to claim 8, characterized in that, Also includes: A first filter is disposed in the optical path of the first received beam, and the first received beam reaches the first receiving unit after passing through the first filter; and / or A second filter is disposed in the optical path of the second received beam, and the second received beam reaches the second receiving unit after passing through the second filter.

10. The device according to any one of claims 1-6, characterized in that, It also includes a third laser and a beam splitter. The third laser is used to emit the original laser, and the beam splitter splits the original laser into two laser beams, which then pass through the first light-emitting unit and the second light-emitting unit to form the first emitted beam and the second emitted beam.

11. The device according to any one of claims 1-6, characterized in that, The first receiving unit and the second receiving unit respectively include a first image acquisition element and a second image acquisition element. The first image acquisition element is used to convert the first received beam into a first received image, and the second image acquisition element is used to convert the second received beam into a second received image. The processor processes the first received image and the second received image to obtain the contour data of the surface to be processed.

12. The device according to any one of claims 1-6, characterized in that, It also includes a third image acquisition element, which is used to convert the first received beam received by the first receiving unit and the second received beam received by the second receiving unit into a first received image and a second received image, respectively. The processor processes the first received image and the second received image to obtain the contour data of the surface to be processed.

Images