Single wafer rod automatic detection device

Abstract

The utility model provides a kind of single wafer rod automatic detection device, it is related to polysilicon detection technical field.The detection device includes: conveying component, mounting bracket, appearance detection component, robot, electric performance detection component and controller.Mounting bracket is in the top of conveying component.Appearance detection component is installed on mounting bracket, and the detection end of this appearance detection component is set towards conveying component.When appearance detection component is installed, this appearance detection component can move along the X axis and Z axis direction of mounting bracket.Robot is installed on one side of conveying component.Electric performance detection component is installed on robot by mounting plate.Controller is electrically connected with conveying component, mounting bracket, appearance detection component, robot and electric performance detection component.The utility model can improve its detection efficiency, the accuracy of detection data, reduce missed detection situation and can be traced back, eliminate the security risk in personnel operation process, and avoid single wafer rod to appear damage in conveying process.

Description

Technical Field

[0001] This utility model relates to the field of polycrystalline silicon testing technology, and in particular to an automatic testing device for single crystal wafers. Background Technology

[0002] Currently, the industry's inspection of single crystal wafers mainly relies on manual inspection. The operator holds the BCT400 inspection device against the wafer's end face, presses a button, and the device operates to measure minority carriers and electrical resistance. Simultaneously, the wafer's appearance is assessed manually using a flashlight to search for defects such as edge chipping and microcracks on the end face, which is time-consuming and labor-intensive. Utility Model Content

[0003] To solve the above-mentioned technical problems, this utility model provides an automatic detection device for single crystal wafer rods. The detection system can improve detection efficiency, accuracy of detection data, reduce missed detections, and provide traceability, eliminating safety hazards during personnel operation and preventing damage to single crystal wafer rods during transportation.

[0004] The technical solution adopted in this utility model is:

[0005] An automatic inspection device for single crystal wafers includes:

[0006] Conveying components;

[0007] Mounting bracket, mounted on top of the conveying assembly;

[0008] An appearance inspection component is mounted on the mounting frame, with its inspection end facing the conveying component. After the appearance inspection component is installed, it can move along the X-axis and Z-axis of the mounting frame.

[0009] A robot is mounted on one side of the conveying assembly;

[0010] An electrical performance testing component is mounted on the robot via a mounting plate.

[0011] The controller is electrically connected to the conveying assembly, mounting frame, appearance inspection assembly, robot, and electrical performance testing assembly.

[0012] The conveying assembly includes:

[0013] The conveyor frame is installed on the ground in the factory area;

[0014] Conveying rollers, a plurality of conveying rollers are equidistantly arranged along the conveying direction of the conveying frame;

[0015] The power mechanism is connected to the conveyor roller;

[0016] Each of the conveying rollers is provided with two limiting members, and a placement groove for placing a single crystal rod is formed between the two limiting members.

[0017] Optionally, the conveying component can be added as required, and the added conveying component is equipped with the mounting frame, appearance inspection component, robot, and electrical performance inspection component installed on the robot.

[0018] Optionally, one end of the limiting member has a tapered surface. When the two limiting members are installed, the tapered surfaces are arranged opposite each other, and the single crystal rod comes into contact with the tapered surface during the conveying process.

[0019] Optionally, the mounting bracket includes:

[0020] The frame is installed on top of the conveyor assembly via a gantry or truss within the plant area;

[0021] A slide rail is mounted on the frame, and the mounting direction of the slide rail is the same as the conveying direction of the conveying assembly;

[0022] Two drive components are respectively installed at both ends of the slide rail;

[0023] Two mounting sliders are slidably mounted on the slide rail and are respectively connected to the movable ends of the two driving components;

[0024] Mounting rods are mounted on both of the mounting sliders, and the appearance inspection component is mounted on both of the mounting rods.

[0025] Optionally, the appearance inspection component includes:

[0026] A lifting assembly is mounted on the mounting rod. After installation, the lifting assembly is located above the conveying assembly, and the movable end of the lifting assembly faces the conveying assembly.

[0027] The light source module is installed on the movable end of the lifting assembly and is positioned facing the end face of the single crystal rod after installation.

[0028] An image acquisition device is installed on the light source module, and after installation, the acquisition end of the image acquisition device is set towards the end face of the single crystal rod.

[0029] Optionally, after the image acquisition device is installed, its acquisition center coincides with the axis of the single wafer rod on the conveying device.

[0030] Optionally, the mounting bracket is covered with a protective cover.

[0031] Optionally, the electrical performance testing component includes:

[0032] The BCT400 testing equipment is mounted on the mounting plate.

[0033] The four-probe resistance tester is mounted on the mounting plate and is located on one side of the BCT400 testing equipment after installation.

[0034] During the testing process, both the BCT400 testing equipment and the four-probe resistance tester come into contact with the cross-section of the single crystal rod.

[0035] Compared with the prior art, the beneficial effects of this utility model are:

[0036] The detection system can improve detection efficiency, accuracy of detection data, reduce missed detections, and provide traceability, eliminating safety hazards during personnel operation and preventing damage to single crystal rods during transportation. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1 This is a schematic diagram of the overall structure of an automatic single-crystal rod testing device.

[0039] Figure 2 This is a schematic diagram of the conveying component of an automatic single-crystal rod inspection device.

[0040] Figure 3 This is a partial structural diagram of the conveying component of an automatic single-crystal rod inspection device.

[0041] Figure 4 This is a schematic diagram of the mounting frame for an automatic single-crystal rod inspection device.

[0042] Figure 5 This is a schematic diagram of the appearance inspection component of an automatic single-crystal wafer rod inspection device.

[0043] Figure 6 This is a schematic diagram of the mounting bracket for an automatic single-crystal rod inspection device, which has a protective cover.

[0044] Figure 7 This is a schematic diagram of the robot and electrical performance testing components of an automated single-wafer rod testing device.

[0045] Figure label:

[0046] 1. Conveying assembly; 11. Conveying frame; 12. Conveying roller; 13. Power mechanism; 14. Limiting component; 15. Placement groove; 16. Conical surface;

[0047] 2. Mounting bracket; 21. Frame; 22. Slide rail; 23. Drive component; 24. Mounting slider; 25. Mounting rod; 26. Protective cover;

[0048] 3. Appearance inspection components; 31. Lifting components; 32. Light source module; 33. Image acquisition device;

[0049] 4. Robots;

[0050] 5. Electrical performance testing components; 51. BCT400 testing equipment; 52. Four-probe resistance tester;

[0051] 6. Controller. Detailed Implementation

[0052] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0053] In the description of this utility model, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "axial", "radial", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used to facilitate the description of this utility model and to simplify the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0054] The terms "connection" and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0055] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0056] The following disclosure provides many different embodiments or examples for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0057] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0058] like Figure 1 As shown, this embodiment of the present invention provides an automatic inspection device for single-wafer rods, including: a conveying assembly 1, a mounting frame 2, an appearance inspection assembly 3, a robot 4, an electrical performance inspection assembly 5, and a controller 6. The mounting frame 2 is located on top of the conveying assembly 1. The appearance inspection assembly 3 is mounted on the mounting frame 2, with its inspection end facing the conveying assembly 1. After installation, the appearance inspection assembly 3 can move along the X and Z axes of the mounting frame 2. The robot 4 is mounted on one side of the conveying assembly 1. The electrical performance inspection assembly 5 is mounted on the robot 4 via a mounting plate. The controller 6 is electrically connected to the conveying assembly 1, the mounting frame 2, the appearance inspection assembly 3, the robot 4, and the electrical performance inspection assembly 5.

[0059] During the inspection of single-crystal ingots, the ingots are placed on the conveyor assembly 1. The conveyor assembly 1 transports the ingots to below the mounting rack 2. The position of the appearance inspection assembly 3, mounted on the mounting rack 2, is adjusted according to the ingot's dimensions. The appearance inspection assembly 3 then inspects the ingot's shape. If the ingot meets the subsequent processing requirements after inspection, it is transferred to the electrical performance testing station for electrical performance testing. If it does not meet the subsequent processing requirements after testing, it is recycled.

[0060] The more specific inspection process during the appearance inspection is as follows: After the single crystal wafer is placed on the appearance inspection station, the controller 6 controls the appearance inspection component 3 to move. The appearance inspection component 3 moves along the X and Z axes of the mounting frame 2, so that the inspection end of the appearance inspection component 3 faces the end face of the single crystal wafer directly, collects image information of the end face, and feeds the image information back to the controller 6. The controller 6 determines whether it meets the subsequent processing conditions based on the collected image information.

[0061] During the electrical performance testing process, the electrical performance testing component 5 can be attached to the end face of the single crystal rod.

[0062] This system enables automated inspection of single crystal wafers, effectively improving inspection efficiency. Furthermore, the automated inspection process reduces measurement errors inherent in manual measurements, improves the consistency of inspection locations, and enhances the accuracy of the post-inspection data.

[0063] Meanwhile, machine inspection can effectively prevent missed detections, and the data after inspection is automatically uploaded, which facilitates later traceability.

[0064] It should be noted that the robot 4 in this embodiment is a 6-axis robot 4. Its specific structure and working principle are existing technologies and will not be described in detail here. The mounting plate is installed on the flange of the sixth axis of the robot 4, and the electrical performance testing component 5 installed on the mounting plate is in contact with the end face of the single crystal rod.

[0065] like Figure 1 and Figure 2 As shown, to prevent positional deviation of the single crystal ingot during transport, the transport assembly 1 includes: a transport frame 11, transport rollers 12, a power mechanism 13, and limiting members 14. The transport frame 11 is fixed to the ground of the factory area with screws. Multiple transport pipes are arranged along the transport direction of the transport frame 11. The power mechanism 13 is mounted on the transport frame 11 and connected to the transport rollers 12 to drive the transport rollers 12 to rotate. Each transport roller 12 is equipped with two limiting members 14, and a placement groove 15 for placing the single crystal ingot is formed between the two limiting members 14.

[0066] When conveying the single crystal ingot, it is placed on the conveying roller 12 and positioned within the limiting groove. During conveying, the single crystal ingot is limited by limiting members 14 located on both sides to prevent it from shifting or falling directly from the conveying assembly 1. This improves the safety of the single crystal ingot during the conveying process.

[0067] It should be noted that the power mechanism 13 in this embodiment is the existing power mechanism 13 that can drive the rotation of the rollers in the roller conveyor. Its specific structure and working principle will not be described in detail here.

[0068] In one embodiment, such as Figure 1 As shown, in order to improve the detection efficiency, the conveying component 1 can be added as required. The added conveying component 1 is equipped with an installation frame 21, an appearance inspection component 3, the robot 4, and an electrical performance inspection component 5 installed on the robot 4.

[0069] In one embodiment, such as Figure 3 As shown, in order to avoid scratching the sidewall of the single crystal wafer rod during transportation, one end of the limiting member 14 has a tapered surface 16. When the two limiting members 14 are installed, the tapered surfaces 16 on the limiting members 14 are set opposite to each other, and the single crystal wafer rod comes into contact with the tapered surface 16 during transportation.

[0070] In one embodiment, such as Figure 1 and Figure 4 As shown, the mounting frame 2 includes: a frame 21, a slide rail 22, two drive components 23, two mounting sliders 24, and mounting rods 25. The frame 21 is mounted on top of the conveying assembly 1 via a gantry or truss within the factory area. The slide rail 22 is mounted on the frame 21, and the mounting direction of the slide rail 22 is the same as the conveying direction of the conveying assembly 1. The two drive components 23 are respectively mounted at both ends of the slide rail 22. The two mounting sliders 24 are slidably disposed on the slide rail 22 and are respectively connected to the movable ends of the two drive components 23. Each of the two mounting sliders 24 is provided with a mounting rod 25, and each of the two mounting rods 25 is equipped with an appearance inspection component 3.

[0071] When inspection of a single-crystal ingot is required, the two drive components 23 move the mounting slider 24 according to the length of the single-crystal ingot, so that the appearance inspection component 3 mounted on the mounting rod 25 is located at both ends of the single-crystal ingot. This orientation is adjusted along the X-axis of the mounting bracket 2.

[0072] The presence of appearance inspection components 3 at both ends of the single crystal wafer can effectively improve inspection efficiency.

[0073] It should be noted that the driving component 23 is a cylinder, hydraulic cylinder, electric telescopic rod, linear motor or other mechanism capable of linear motion.

[0074] In one embodiment, such as Figure 1 , Figure 4 and Figure 5As shown, the appearance inspection component 3 includes: a lifting component 31, a light source module 32, and an image acquisition device 33. The lifting component 31 is mounted on the mounting rod 25, and after installation, it is positioned above the conveying component 1, with its movable end facing the conveying component 1. The light source module 32 is mounted on the movable end of the lifting component 31, and after installation, it faces the end face of the single-crystal rod. The image acquisition device 33 is mounted on the light source module 32, with its acquisition end facing the end face of the single-crystal rod. After installation, the acquisition center of the image acquisition device 33 coincides with the axis of the single-crystal rod on the conveying device.

[0075] When inspecting the appearance of a single crystal wafer, after the X-axis is adjusted, the Z-axis position is adjusted using the lifting assembly 31. After the lifting assembly 31 descends to a preset position, the center of the acquisition end of the image acquisition device 33 mounted on the lifting assembly 31 coincides with the axis of the single crystal wafer. This alignment facilitates the acquisition of QR code information on the end face of the single crystal wafer and image information from the acquisition device's end face. To improve scanning efficiency and image information acquisition, a light source module 32 is mounted on the movable end of the lifting assembly 31, and the image acquisition device 33 is mounted on the light source module 32, providing supplementary lighting to the image acquisition device 33. This improves the quality of image information during acquisition and facilitates rapid determination of whether the single crystal wafer has edge chipping or microcracks.

[0076] It should be noted that the lifting assembly 31 is a mechanism capable of linear motion, such as a cylinder, hydraulic cylinder, or electric telescopic rod. The image acquisition device 33 is an industrial camera. The light source module 32 is a supplementary lighting device used in existing cameras.

[0077] The lifting assembly 31, the image acquisition device 33, and the light source module 32 are all existing designs, and their specific structures and working principles will not be described in detail here.

[0078] In one embodiment, such as Figure 6 As shown, to prevent the light source module 32 from affecting other equipment in the factory area during image information acquisition, a protective cover 26 is installed on the mounting frame 2. The protective cover 26 isolates part of the light source, reducing light pollution in the factory area.

[0079] It should be noted that the protective cover 26 is made of a light-shielding plate.

[0080] In one embodiment, such as Figure 1 and Figure 7As shown, the electrical performance testing assembly 5 includes a BCT400 testing device 51 and a four-probe resistance tester 52. The BCT400 testing device 51 is mounted on a mounting plate. The four-probe resistance tester 52 is mounted on the mounting plate and is located to one side of the BCT400 testing device 51 after installation. During the testing process, both the BCT400 testing device 51 and the four-probe resistance tester 52 are in contact with the cross-section of the single-crystal ingot.

[0081] Once the single crystal ingot reaches the electrical performance testing station, robot 4 drives electrical performance testing component 5 to perform testing. More specifically, the BCT400 testing device 51 and four four-probe resistance testers 52 are fixed to the mounting plate on robot 4. Robot 4 drives electrical performance testing component 5 to automatically move to the corresponding testing position according to different ingot diameters. During testing, the BCT400 testing device 51 and four four-probe resistance testers 52 are brought into contact with the single crystal ingot. After contact, the BCT400 testing device 51 and four four-probe resistance testers 52 are automatically triggered to detect the minority carriers and resistance on the end face of the single crystal ingot, and automatically uploaded to controller 6 for storage.

[0082] After the test is completed, the data is automatically entered into the controller 6. The controller 6 judges the data. If the data of the single wafer rod is qualified, it will be automatically transferred to the processing station. If the data of the single wafer rod is unqualified, it will be transferred to the reverse cutting station.

[0083] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An automatic detection device for single crystal wafers, characterized in that, include: Conveying components; Mounting bracket, mounted on top of the conveying assembly; An appearance inspection component is mounted on the mounting frame, with its inspection end facing the conveying component. After the appearance inspection component is installed, it can move along the X-axis and Z-axis of the mounting frame. A robot is mounted on one side of the conveying assembly; An electrical performance testing component is mounted on the robot via a mounting plate. The controller is electrically connected to the conveying assembly, mounting frame, appearance inspection assembly, robot, and electrical performance testing assembly. The conveying assembly includes: The conveyor frame is installed on the ground in the factory area; Conveyor rollers, a plurality of conveyor rollers are equidistantly arranged along the conveying direction of the conveyor frame; The power mechanism is connected to the conveyor roller; Each of the conveying rollers is provided with two limiting members, and a placement groove for placing a single crystal rod is formed between the two limiting members.

2. The automatic detection device for single-crystal wafers according to claim 1, characterized in that, The conveying assembly can be added as required, and the added conveying assembly is equipped with the mounting frame, appearance inspection assembly, robot, and electrical performance inspection assembly installed on the robot.

3. The automatic detection device for single-crystal rods according to claim 1 or 2, characterized in that, One end of the limiting member has a tapered surface. When the two limiting members are installed, the tapered surfaces are positioned opposite each other, and the single crystal rod comes into contact with the tapered surface during the conveying process.

4. The automatic detection device for single-crystal wafers according to claim 1, characterized in that, The mounting bracket includes: The frame is installed on top of the conveyor assembly via a gantry or truss within the plant area; A slide rail is mounted on the frame, and the mounting direction of the slide rail is the same as the conveying direction of the conveying assembly; Two drive components are respectively installed at both ends of the slide rail; Two mounting sliders are slidably mounted on the slide rail and are respectively connected to the movable ends of the two driving components; Mounting rods are mounted on both of the mounting sliders, and the appearance inspection component is mounted on both of the mounting rods.

5. The automatic detection device for single crystal wafers according to claim 3, characterized in that, The appearance inspection component includes: A lifting assembly is mounted on the mounting rod. After installation, the lifting assembly is located above the conveying assembly, and the movable end of the lifting assembly faces the conveying assembly. The light source module is installed on the movable end of the lifting assembly and is positioned facing the end face of the single crystal rod after installation. An image acquisition device is installed on the light source module, and after installation, the acquisition end of the image acquisition device is positioned facing the end face of the single crystal rod.

6. The automatic detection device for single-crystal wafers according to claim 5, characterized in that, After the image acquisition device is installed, its acquisition center coincides with the axis of the single-crystal rod on the conveying device.

7. The automatic detection device for single-crystal wafers according to claim 3, characterized in that, The mounting bracket is covered with a protective cover.

8. The automatic detection device for single-crystal wafers according to claim 1, characterized in that, The electrical performance testing component includes: The BCT400 testing equipment is mounted on the mounting plate. The four-probe resistance tester is mounted on the mounting plate and is located on one side of the BCT400 testing equipment after installation. During the testing process, both the BCT400 testing equipment and the four-probe resistance tester come into contact with the cross-section of the single crystal rod.

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