L20-XMAX type blasting vibration recorder

Abstract

The utility model belongs to the field of blasting vibration measurement technology provides a kind of L20-XMAX type blasting vibration recorder, including main control module, AD conversion module, network module, communication module, storage module being communicated with main control module, and power module for power supply;AD conversion module is connected with difference operational amplifier module, difference operational amplifier module includes difference operational amplifier U11, U21 and U29, and each difference operational amplifier is constituted the four-way signal acquisition channel of same structure;Wherein, each signal acquisition channel includes operational amplifier and bidirectional TVS diode, operational amplifier receives analog signal input, bidirectional TVS diode is connected between the input pin of difference operational amplifier, for overvoltage protection;The difference output end of difference operational amplifier is connected AD conversion module.The utility model passes through using difference operational amplifier module and combining bidirectional TVS diode, common-mode interference is effectively suppressed and overvoltage protection is provided, simultaneously can monitor multiple measuring points on the same section or the same monitoring line.

Description

Technical Field

[0001] This utility model belongs to the field of blasting vibration measurement technology, specifically, it relates to an L20-XMAX type blasting vibration recorder. Background Technology

[0002] In blasting operations such as mining, tunneling, and building demolition, it is essential to monitor the ground vibrations generated by blasting to assess their impact on surrounding buildings and ensure construction safety. Blasting vibration recorders are used to record vibration information and are widely applied in blasting operations.

[0003] In the existing technology, the main unit of a blasting vibration recorder is usually composed of sensors, signal conditioning circuits, data acquisition modules and storage units. It has the following main shortcomings: the blasting site environment is complex and signal transmission is easily interfered with, resulting in data distortion and weak anti-interference ability of vibration measurement; the synchronization of multi-channel data acquisition is difficult to guarantee, which affects the accuracy of vibration waveform analysis. Utility Model Content

[0004] The purpose of this invention is to provide an L20-XMAX type blasting vibration recorder to solve the technical problems existing in the prior art.

[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows: An L20-XMAX type blasting vibration recorder includes a main control module, an AD conversion module, a network module, a communication module, a storage module communicating with the main control module, and a power supply module for power supply. The AD conversion module is connected to a differential operational amplifier module, which includes differential operational amplifiers U11, U21, and U29, and each differential operational amplifier constitutes four signal acquisition channels with identical structure. Each signal acquisition channel includes an operational amplifier and a bidirectional TVS diode. The operational amplifier receives analog signal input, and the bidirectional TVS diode is connected between the input pins of the differential operational amplifier for overvoltage protection. The differential output terminal of the differential operational amplifier is connected to the AD conversion module.

[0006] Preferably, pins 18 and 17 of the differential operational amplifier U11 are connected to bidirectional TVS diode D2, and pin 17 is also connected to operational amplifier U10; pins 13 and 12 of the differential operational amplifier U11 are connected to bidirectional TVS diode D8, and pin 12 is also connected to operational amplifier U1; pins 8 and 7 of the differential operational amplifier U11 are connected to bidirectional TVS diode D9, and pin 7 is also connected to operational amplifier U6; pins 3 and 2 of the differential operational amplifier U11 are connected to bidirectional TVS diode D10, and pin... 1 is also connected to an operational amplifier U8. The pins 1 of the operational amplifiers U10, U1, U6 and U8 are respectively connected to the first analog signal input VIN1, the second analog signal input VIN2, the third analog signal input VIN3 and the fourth analog signal input VIN4. The differential output terminals VOUT1+, VOUT1-, VOUT2+, VOUT2-, VOUT3+, VOUT3-, VOUT4+ and VOUT4- of the differential operational amplifier U11 are connected to the AD conversion module.

[0007] Preferably, the differential operational amplifier module further includes a power reference chip U4, pin 6 of which is connected to a second-order RC low-pass filter, and one end of the second-order RC low-pass filter is connected to an operational amplifier U22.

[0008] Preferably, the main control module includes a main control chip U27. Pins 84, 27, 89, and 91 of the main control chip U27 are connected to the AD conversion module; pins 48, 52, 33, 34, 32, and 16 are connected to the network module; pins 96, 95, 78, 79, 83, 80, 65, and 66 are connected to the storage module; and pins 1, 2, 3, 4, 5, 31, 98, and 97 are connected to the communication module.

[0009] Preferably, the AD conversion module includes AD conversion chips U7, U5, and U17. Pins 3 and 4 of AD conversion chip U7 are connected to the differential output terminals VOUT1+ and VOUT1- of the differential operational amplifier U11; pins 1 and 2 are connected to the differential output terminals VOUT2+ and VOUT2- of the differential operational amplifier U11; pins 64 and 63 are connected to the differential output terminals VOUT3+ and VOUT3- of the differential operational amplifier U11; and pins 62 and 61 are connected to the differential output terminals VOUT4+ and VOUT4- of the differential operational amplifier U11. Pins 1, 2, 3, 4, 61, 62, 63, and 64 of AD conversion chip U5 are connected to the differential output terminal of the differential operational amplifier U21. Pin 12 is connected to pin 20 of the conversion chip U7, and pin 20 is connected to pin 12 of the conversion chip U17; pins 1, 2, 3, 4, 61, 62, 63, and 64 of the AD conversion chip U17 are connected to the differential output terminal of the differential operational amplifier U29; pin 12 is connected to pin 20 of the conversion chip U5; pin 33 is connected to pin 84 of the main control chip U27 through resistor R114; pin 20 is connected to pin 90 of the main control chip U27 through resistor R110; pin 27 is connected to pin 67 of the main control chip U27 through resistor R111; pin 28 is connected to pin 89 of the main control chip U27 through resistor R112; and pin 29 is connected to pin 91 of the main control chip U27 through resistor R113.

[0010] Preferably, the network module includes a PHY chip U12, with pin 2 of the PHY chip U12 connected to pin 48 of the main control chip U27, pin 3 connected to pin 51 of the main control chip U27, pin 4 connected to pin 52 of the main control chip U27, pin 43 connected to pin 33 of the main control chip U27, pin 44 connected to pin 34 of the main control chip U27, pin 40 connected to pin 32 of the main control chip U27, and pin 31 connected to pin 16 of the main control chip U27.

[0011] Preferably, the network module further includes a network transformer U24, which is located between the PHY chip U18 and the external network interface to achieve electrical isolation and impedance matching.

[0012] Preferably, the storage module includes a ROM chip U28 and a data channel S1. Pin 5 of the ROM chip U28 is connected to pin 96 of the main control chip U27, and pin 6 is connected to pin 95 of the main control chip U27. Pin 1 of the data channel S1 is connected to pin 78 of the main control chip U27, pin 2 is connected to pin 79 of the main control chip U27, pin 3 is connected to pin 83 of the main control chip U27, pin 5 is connected to pin 80 of the main control chip U27, pin 7 is connected to pin 65 of the main control chip U27, and pin 8 is connected to pin 66 of the main control chip U27.

[0013] Preferably, the communication module is a 4G communication module, and its main chip model is ZX297520V3.

[0014] Compared with the prior art, the present invention has the following beneficial effects: (1) By using a differential operational amplifier module and combining it with a bidirectional TVS diode, this utility model effectively suppresses common-mode interference and provides overvoltage protection, ensuring the purity of the front-end signal conditioning and the safety of the equipment. At the same time, the use of a high-precision ADC and voltage reference chip ensures the accuracy of the signal digitization process.

[0015] (2) This utility model uses multiple high-performance AD ​​conversion chips and connects them in a daisy chain manner to achieve high-precision synchronous acquisition of up to 12 vibration signals, which meets the monitoring needs of complex blasting scenarios.

[0016] (3) This utility model can be equipped with multiple sensors to collect data from multiple measuring points simultaneously, and can monitor multiple measuring points on the same cross section or the same monitoring line at the same time. It is suitable for monitoring the same monitoring cross section or the same monitoring line in tunnels. Attached Figure Description

[0017] Figure 1 This is a partial schematic diagram of the circuit principle of the AD conversion module in this utility model. Figure 1 .

[0018] Figure 2 This is a partial schematic diagram of the circuit principle of the AD conversion module in this utility model. Figure 2 .

[0019] Figure 3 This is a partial schematic diagram of the circuit principle of the AD conversion module in this utility model. Figure 3 .

[0020] Figure 4 This is a partial schematic diagram of the circuit principle of the AD conversion module in this utility model. Figure 4 .

[0021] Figure 5This is a partial schematic diagram of the circuit principle of the differential operational amplifier module in this utility model. Figure 1 .

[0022] Figure 6 This is a partial schematic diagram of the circuit principle of the differential operational amplifier module in this utility model. Figure 2 .

[0023] Figure 7 This is a partial schematic diagram of the circuit principle of the differential operational amplifier module in this utility model. Figure 3 .

[0024] Figure 8 This is a partial schematic diagram of the circuit principle of the differential operational amplifier module in this utility model. Figure 4 .

[0025] Figure 9 This is a partial schematic diagram of the circuit principle of the differential operational amplifier module in this utility model. Figure 5 .

[0026] Figure 10 This is a partial schematic diagram of the circuit principle of the differential operational amplifier module in this utility model. Figure 6 .

[0027] Figure 11 This is a partial schematic diagram of the circuit principle of the differential operational amplifier module in this utility model. Figure 7 .

[0028] Figure 12 This is a partial schematic diagram of the circuit principle of the 4G communication module in this utility model. Figure 1 .

[0029] Figure 13 This is a partial schematic diagram of the circuit principle of the 4G communication module in this utility model. Figure 2 .

[0030] Figure 14 This is a schematic diagram of the circuit principle of the main control module in this utility model.

[0031] Figure 15 This is a schematic diagram of the circuit principle of the network module in this utility model.

[0032] Figure 16 This is a schematic diagram of the circuit principle of the storage module in this utility model.

[0033] Figure 17 This is a partial schematic diagram of the circuit principle of the power supply module in this utility model. Figure 1 .

[0034] Figure 18 This is a partial schematic diagram of the circuit principle of the power supply module in this utility model. Figure 2 . Detailed Implementation

[0035] To enable those skilled in the art to have a clearer understanding of this utility model, the following detailed description is provided in conjunction with embodiments. It should be understood that the specific embodiments described below are merely illustrative of this utility model and facilitate understanding. The technical solutions provided by this utility model are not limited to those provided in the following embodiments, nor should they limit the scope of protection of this utility model.

[0036] Example like Figures 1-18 As shown, this embodiment provides an L20-XMAX type blasting vibration recorder, which is used in conjunction with sensors as the main recorder. For example, one recorder can be equipped with three three-component velocity sensors, and data from three measuring points can be collected simultaneously. It can monitor three measuring points on the same cross section or the same monitoring line at the same time, and is suitable for monitoring the same monitoring cross section or the same monitoring line in tunnels. The data collected by the sensors is transmitted to the L20-XMAX type blasting vibration recorder, where the recorder analyzes and processes the data, achieving the dual advantages of high efficiency and economy for single measuring points.

[0037] In this embodiment, the L20-XMAX blasting vibration recorder includes a main control module, which serves as the core of the recorder and coordinates the operation of all other modules. Modules connected to the main control module include: an AD conversion module, responsible for converting analog signals to digital signals; a network module, providing a wired network interface; a communication module, providing wireless communication functionality; a storage module, storing the acquired data; and a power supply module, providing stable power to the entire system.

[0038] In this embodiment, the front end of the AD conversion module is connected to a differential operational amplifier module for conditioning the original blasting vibration simulation signal. Specifically, the differential operational amplifier module uses three THS4524 differential operational amplifiers (U11, U21, U29), each integrating four identical signal acquisition channels, for a total of twelve signal acquisition channels. Each signal acquisition channel includes an operational amplifier and a bidirectional TVS diode. The operational amplifier receives the analog signal input, and the bidirectional TVS diode is connected between the input pins of the differential operational amplifier for overvoltage protection. The differential output terminal of the differential operational amplifier is connected to the AD conversion module. The connection relationship of one channel of U11 is described in detail below as an example: The first analog signal input, VIN1, is initially buffered and impedance matched by operational amplifier U10 before being connected to pin 17 of differential operational amplifier U11. A bidirectional TVS (Transient Voltage Suppressor) diode D2 is connected in parallel between input pins 18 and 17 of U11 to absorb instantaneous high-voltage pulses from the sensor (such as electrostatic discharge or induced lightning strikes), protecting subsequent precision components from damage. U11 converts the single-ended input signal into a differential signal, outputting it from its differential outputs VOUT1+ and VOUT1-. This differential transmission method greatly enhances the signal's immunity to common-mode interference during transmission.

[0039] The other three channels of U11 (corresponding to VIN2, VIN3, and VIN4) have the same structure, consisting of operational amplifiers U1, U6, and U8, and TVS diodes D8, D9, and D10, respectively, so they will not be described in detail here.

[0040] In a further preferred embodiment, the differential operational amplifier module also includes a power reference chip U4, model REF5025, which generates an extremely stable 2.5V reference voltage. This voltage is filtered for noise by a second-order RC low-pass filter composed of U22, providing a clean reference voltage for the differential operational amplifier and ensuring amplification accuracy.

[0041] In this embodiment, the core of the main control module is a microcontroller U27 with the model number STM32F407. It is a high-performance MCU based on the ARM Cortex-M4 core, with strong computing power and rich peripheral interfaces.

[0042] The AD conversion module includes three high-precision ADC chips (U7, U5, U17) of model ADS1274. Each ADS1274 can simultaneously acquire four channels of differential signals. In one specific implementation, U7 is responsible for acquiring four differential outputs (VOUT1± to VOUT4±) from U11, U5 is responsible for acquiring four differential outputs (VOUT5± to VOUT8±) from U21, and U17 is responsible for acquiring four differential outputs (VOUT9± to VOUT12±) from U29.

[0043] The pin connections between the AD conversion module, differential operational amplifier module, and main control module are as follows: Pins 3 and 4 of AD conversion chip U7 are connected to the differential output terminals VOUT1+ and VOUT1- of differential operational amplifier U11; pins 1 and 2 are connected to the differential output terminals VOUT2+ and VOUT2- of differential operational amplifier U11; pins 64 and 63 are connected to the differential output terminals VOUT3+ and VOUT3- of differential operational amplifier U11; and pins 62 and 61 are connected to the differential output terminals VOUT4+ and VOUT4- of differential operational amplifier U11. Pins 1, 2, 3, 4, 61, 62, 63, and 64 of AD conversion chip U5 are connected to the differential output terminals of differential operational amplifier U21. Pin 12 is connected to pin 20 of converter chip U7, and pin 20 is connected to pin 12 of converter chip U17. Pins 1, 2, 3, 4, 61, 62, 63, and 64 of AD converter chip U17 are connected to the differential output of differential operational amplifier U29. Pin 12 is connected to pin 20 of converter chip U5. Pin 33 is connected to pin 84 of main control chip U27 through resistor R114. Pin 20 is connected to pin 90 of main control chip U27 through resistor R110. Pin 27 is connected to pin 67 of main control chip U27 through resistor R111. Pin 28 is connected to pin 89 of main control chip U27 through resistor R112. Pin 29 is connected to pin 91 of main control chip U27 through resistor R113.

[0044] With the above setup, the three ADC chips are connected in a daisy-chain configuration: pin 20 (DRDY / SCLK) of U7 is connected to pin 12 (SYNC) of U5, and pin 20 of U5 is connected to pin 12 of U17. This allows the main control chip U27 to sequentially read all 12 channels of data from the three ADCs through only one SPI interface (connected to U17), achieving synchronous data acquisition in hardware. Communication between the main control chip U27 and the AD conversion module is achieved through specific pins. For example, pins 84, 89, and 91 of U27 are connected to the corresponding control pins of U17 (e.g., through resistors R114, R112, and R113) for synchronous triggering, data reading, and clock control.

[0045] In this embodiment, the network module includes a PHY chip U12 (model DP83848VVVBI) and a network transformer U24 (model HR681616E). Pin 2 of the PHY chip U12 is connected to pin 48 of the main control chip U27, pin 3 is connected to pin 51 of the main control chip U27, pin 4 is connected to pin 52 of the main control chip U27, pin 43 is connected to pin 33 of the main control chip U27, pin 44 is connected to pin 34 of the main control chip U27, pin 40 is connected to pin 32 of the main control chip U27, and pin 31 is connected to pin 16 of the main control chip U27. Network transformer U24 serves to couple signals, provide electrical isolation, and suppress interference. The transmit differential signal output of PHY chip U18 is connected to the corresponding pin on the primary side of network transformer U24, and the receive differential signal input of PHY chip U18 is connected to the corresponding pin on the primary side of network transformer U24. Specifically, pin 1 of network transformer U24 is connected to the internal TD+ signal, pin 3 to the internal TD- signal, pin 6 to the internal RD+ signal, and pin 8 to the internal RD- signal. The corresponding pins on the secondary side of network transformer U24 constitute the differential signal lines of the external network interface. Specifically, pin 16 is the TD0- pin, pin 14 is the TD0+ pin, pin 11 is the RD0- pin, and pin 9 is the RD0+ pin. This structure can effectively suppress damage to the internal circuitry caused by lightning strikes, surges, and ground potential differences.

[0046] In this embodiment, the storage module includes a ROM chip U28 (model ATMLH424, used to store firmware programs or key parameters) and a data channel S1 (SD card interface, used to insert an SD card and store the collected vibration waveform data). Pin 5 of the ROM chip U28 is connected to pin 96 of the main control chip U27, and pin 6 is connected to pin 95 of the main control chip U27. Pin 1 of the data channel S1 is connected to pin 78 of the main control chip U27, pin 2 is connected to pin 79 of the main control chip U27, pin 3 is connected to pin 83 of the main control chip U27, pin 5 is connected to pin 80 of the main control chip U27, pin 7 is connected to pin 65 of the main control chip U27, and pin 8 is connected to pin 66 of the main control chip U27.

[0047] In this embodiment, the communication module is a 4G communication module, with its main chip model being ZX297520V3. This module connects to the pins (such as pins 1-5, 31, 97, 98) of the main control chip U27 via a UART or USB interface, enabling the recorder to wirelessly transmit the collected data to a remote server via the 4G network for remote real-time monitoring. The power module provides a stable power supply for the entire recorder system. Existing mature power modules can be used; for example, a power module may include a switching power supply, a DC-DC boost converter circuit, a 4G module power control circuit, and a power voltage monitoring circuit, etc., which will not be elaborated upon here.

[0048] The working principle of this invention is as follows: The analog signals generated by the vibration sensor (such as a speedometer or accelerometer) are respectively connected to the differential operational amplifier module; after amplification, anti-interference and overvoltage protection processing, they are converted into differential signals and sent to the AD conversion module; under the control of the main control chip, the three ADCs synchronously convert 12 analog signals into digital signals with high precision; the digital signals are read and processed by the main control chip; the processed data can be stored in the local SD card, and can also be uploaded to the background monitoring center via Ethernet or 4G wireless network as needed.

[0049] It should be noted that, apart from the connection relationships described in detail above, the other necessary pins of the various chips involved in this utility model (such as the main control chip U27, the AD conversion chips U7 / U5 / U17, the PHY chip U12, etc.), including but not limited to power supply pins, ground pins, reset pins, external clock pins, blank pins (NC), and unused functional pins, are connected in ways that are common knowledge in the field or typical applications recommended by the chip datasheets. These will not be described again in the text of the specification. Those skilled in the art can completely and accurately reproduce the technical solution of this utility model by reading the entire specification and referring to the complete set of drawings.

[0050] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. An L20-XMAX type blasting vibration recorder, characterized in that, The system includes a main control module, an AD conversion module, a network module, a communication module, a storage module that communicate with the main control module, and a power supply module for power supply. The AD conversion module is connected to a differential operational amplifier module, which includes AD conversion chips U7, U5, and U17. The differential operational amplifier module includes differential operational amplifiers U11, U21, and U29, and each differential operational amplifier constitutes four identical signal acquisition channels. Each signal acquisition channel includes an operational amplifier and a bidirectional TVS diode. The operational amplifier receives analog signal input, and the bidirectional TVS diode is connected between the input pins of the differential operational amplifier for overvoltage protection. The differential output terminal of the differential operational amplifier is connected to the AD conversion module.

2. The L20-XMAX type blasting vibration recorder according to claim 1, characterized in that: The differential operational amplifier U11 has bidirectional TVS diode D2 connected to pins 18 and 17, and operational amplifier U10 connected to pin 17. The differential operational amplifier U11 has bidirectional TVS diode D8 connected to pins 13 and 12, and operational amplifier U1 connected to pin 12. The differential operational amplifier U11 has bidirectional TVS diode D9 connected to pins 8 and 7, and operational amplifier U6 connected to pin 7. The differential operational amplifier U11 has bidirectional TVS diode D10 connected to pins 3 and 2, and pin 1 is also connected to pin 1. An operational amplifier U8 is connected. Pin 1 of operational amplifiers U10, U1, U6, and U8 is connected to the first analog signal input VIN1, the second analog signal input VIN2, the third analog signal input VIN3, and the fourth analog signal input VIN4, respectively. The differential output terminals VOUT1+, VOUT1-, VOUT2+, VOUT2-, VOUT3+, VOUT3-, VOUT4+, and VOUT4- of the differential operational amplifier U11 are connected to the AD conversion module.

3. The L20-XMAX type blasting vibration recorder according to claim 2, characterized in that: The differential operational amplifier module also includes a power reference chip U4, pin 6 of which is connected to a second-order RC low-pass filter, and one end of the second-order RC low-pass filter is connected to an operational amplifier U22.

4. The L20-XMAX type blasting vibration recorder according to claim 3, characterized in that: The main control module includes a main control chip U27. Pins 84, 27, 89, and 91 of the main control chip U27 are connected to the AD conversion module; pins 48, 52, 33, 34, 32, and 16 are connected to the network module; pins 96, 95, 78, 79, 83, 80, 65, and 66 are connected to the storage module; and pins 1, 2, 3, 4, 5, 31, 98, and 97 are connected to the communication module.

5. The L20-XMAX type blasting vibration recorder according to claim 4, characterized in that: Pins 3 and 4 of the AD converter chip U7 are connected to the differential output terminals VOUT1+ and VOUT1- of the differential operational amplifier U11; pins 1 and 2 are connected to the differential output terminals VOUT2+ and VOUT2- of the differential operational amplifier U11; pins 64 and 63 are connected to the differential output terminals VOUT3+ and VOUT3- of the differential operational amplifier U11; and pins 62 and 61 are connected to the differential output terminals VOUT4+ and VOUT4- of the differential operational amplifier U11. Pins 1, 2, 3, 4, 61, 62, 63, and 64 of the AD converter chip U5 are connected to the differential output terminal of the differential operational amplifier U21, and pin 12 is connected to the pin of the converter chip U7. Pin 20 is connected to pin 12 of the conversion chip U17; pins 1, 2, 3, 4, 61, 62, 63, and 64 of the AD conversion chip U17 are connected to the differential output terminal of the differential operational amplifier U29; pin 12 is connected to pin 20 of the conversion chip U5; pin 33 is connected to pin 84 of the main control chip U27 through resistor R114; pin 20 is connected to pin 90 of the main control chip U27 through resistor R110; pin 27 is connected to pin 67 of the main control chip U27 through resistor R111; pin 28 is connected to pin 89 of the main control chip U27 through resistor R112; and pin 29 is connected to pin 91 of the main control chip U27 through resistor R113.

6. The L20-XMAX type blasting vibration recorder according to claim 5, characterized in that: The network module includes a PHY chip U12. Pin 2 of the PHY chip U12 is connected to pin 48 of the main control chip U27, pin 3 is connected to pin 51 of the main control chip U27, pin 4 is connected to pin 52 of the main control chip U27, pin 43 is connected to pin 33 of the main control chip U27, pin 44 is connected to pin 34 of the main control chip U27, pin 40 is connected to pin 32 of the main control chip U27, and pin 31 is connected to pin 16 of the main control chip U27.

7. The L20-XMAX type blasting vibration recorder according to claim 6, characterized in that: The network module also includes a network transformer U24, which is located between the PHY chip U18 and the external network interface to achieve electrical isolation and impedance matching.

8. The L20-XMAX type blasting vibration recorder according to claim 7, characterized in that: The storage module includes a ROM chip U28 and a data channel S1. Pin 5 of the ROM chip U28 is connected to pin 96 of the main control chip U27, and pin 6 is connected to pin 95 of the main control chip U27. Pin 1 of the data channel S1 is connected to pin 78 of the main control chip U27, pin 2 is connected to pin 79 of the main control chip U27, pin 3 is connected to pin 83 of the main control chip U27, pin 5 is connected to pin 80 of the main control chip U27, pin 7 is connected to pin 65 of the main control chip U27, and pin 8 is connected to pin 66 of the main control chip U27.

9. The L20-XMAX type blasting vibration recorder according to claim 8, characterized in that: The communication module is a 4G communication module.

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