Optical chip bottom heat conduction temperature detection device

Abstract

The utility model relates to a kind of light chip bottom heat conduction temperature detection devices, comprising: encapsulation shell, its one end opening;Base, it is connected with the opening end of encapsulation shell, first thermistor is equipped on it;Connecting component, it is set on base;Pad, it is set on base, second thermistor is installed on pad;Light chip, it is installed on pad;Resistance measuring equipment, it is electrically connected with first thermistor and second thermistor by connecting component;Power supply, it is electrically connected with light chip by connecting component.The utility model's light chip bottom heat conduction temperature detection device, in the case where light chip active excitation, the temperature of uppermost pad is obtained to obtain the temperature of light chip bottom, the temperature of base is obtained to obtain the temperature of encapsulation shell, for long-term high temperature life test of light chip, so that the test temperature of high temperature life of same type encapsulation light chip is relatively accurate.

Description

Technical Field

[0001] This utility model relates to the field of optical communication device technology. More specifically, this utility model relates to a device for detecting the thermal conductivity temperature at the bottom of an optical chip. Background Technology

[0002] With the increasing growth of the optical communication, wireless base station, and data center markets, the types and manufacturers of various optical modules are gradually increasing. Among them, the optical chip is the core component inside the optical module. During the introduction and verification process, the reliability of the optical chip needs to be given special attention and verification, especially the high-temperature life test.

[0003] During high-temperature life testing, the excitation current (voltage), test duration, test chamber temperature, and bottom temperature of the optical chip need to be predetermined. While the excitation current (voltage), test duration, and test chamber temperature are relatively easy to set and monitor, the optical chip is typically encapsulated in a sealed, multi-layered metal can (TO-CAN) or metal box (BOX) structure. This makes it difficult to accurately measure the bottom temperature of the optical chip; generally, only the temperature of the outermost casing is measured as an approximation of the chip's bottom temperature. However, inaccurate temperature measurements during long-term life testing of the optical chip can lead to insufficient testing or excessive stress, often resulting in unsound test conclusions. Utility Model Content

[0004] The purpose of this invention is to provide a device for detecting the thermal conductivity temperature at the bottom of an optical chip to solve the above-mentioned problems.

[0005] To achieve these objectives and other advantages according to the present invention, a device for detecting the bottom thermal conductivity temperature of an optical chip is provided, comprising:

[0006] The encapsulation shell has an opening at one end;

[0007] A base, which is connected to the open end of the encapsulation shell, and a first thermistor is provided on it;

[0008] A connecting component, which is disposed on the base;

[0009] A pad is disposed on the base and has a mounting position for mounting an optical chip. A second thermistor is mounted on the pad.

[0010] A resistance measuring device, which is electrically connected to the first thermistor and the second thermistor via the connecting assembly, to measure the resistance of each of the first thermistor and the second thermistor;

[0011] The power supply is electrically connected to the optical chip via the connection component.

[0012] Furthermore, in the aforementioned optical chip bottom heat conduction temperature detection device, the pad is configured as multiple pieces, and the multiple pads are stacked on the base, with the optical chip mounted on the outermost pad.

[0013] Furthermore, in the aforementioned optical chip bottom heat conduction temperature detection device, the pad is configured as three pieces.

[0014] Furthermore, in the aforementioned optical chip bottom thermal conduction temperature detection device, the connecting component includes:

[0015] An optical chip excitation source pin extends through the base; the optical chip is connected to the optical chip excitation source pin via a gold wire; and the optical chip excitation source pin is connected to the power supply.

[0016] A first thermistor pin passes through the base, the first thermistor is connected to the first thermistor pin via a gold wire, and the first thermistor pin is connected to the resistance measuring device.

[0017] The second thermistor pin passes through the base, and the second thermistor is connected to the first thermistor pin via a gold wire. The second thermistor pin is connected to the resistance measuring device.

[0018] Furthermore, in the aforementioned optical chip bottom thermal conduction temperature detection device, the pins are connected to the power supply or resistance measuring device via pin clamps.

[0019] Furthermore, in the aforementioned optical chip bottom thermal conduction temperature detection device, the pad is a ceramic pad.

[0020] Furthermore, in the aforementioned optical chip bottom thermal conduction temperature detection device, the first thermistor, the second thermistor, and the optical chip are fixed by conductive silver paste.

[0021] Furthermore, in the aforementioned optical chip bottom heat conduction temperature detection device, the packaging shell and the base are connected by resistance welding.

[0022] Furthermore, in the aforementioned optical chip bottom heat conduction temperature detection device, the resistance measuring device is a multimeter.

[0023] Furthermore, the aforementioned optical chip bottom thermal conduction temperature detection device also includes:

[0024] The high-temperature drying oven, wherein the outer casing and the base are both disposed inside the high-temperature drying oven.

[0025] The beneficial effects of this utility model are:

[0026] 1. In the optical chip bottom thermal conductivity temperature detection device of this utility model, under active excitation of the optical chip, the temperature of the bottom of the optical chip is obtained by acquiring the temperature of the uppermost pad, and the temperature of the packaging shell is obtained by acquiring the temperature of the base, which is used for long-term high-temperature life test of the optical chip. The test chamber temperature is adjusted by using the temperature of the bottom of the optical chip and the temperature of the packaging shell, so that the test temperature of the high-temperature life of optical chips of the same type of package is relatively accurate, and the conclusion of the long-term high-temperature life test of the optical chip is relatively reliable.

[0027] 2. In the optical chip bottom heat conduction temperature detection device of this utility model, the temperature difference between adjacent two side pads is calculated by the actual temperature on each layer of pads. It can be used to obtain a typical optical package heat conduction test model and provide a reference for other packages.

[0028] Other advantages, objectives and features of this invention will be partly apparent from the following description, and partly understood by those skilled in the art through study and practice of this invention. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of the optical chip bottom heat conduction temperature detection device described in this utility model;

[0030] Figure 2 This is a bottom view of the base described in this utility model.

[0031] The reference numerals in the attached figures are as follows:

[0032] Package housing 1, base 2, optical chip 3, upper pad 4, middle pad 5, lower pad 6, upper thermistor 7, middle thermistor 8, lower thermistor 9, first thermistor 10, pin 11, optical chip excitation source pin 111, first thermistor pin 112, second thermistor pin 113, power supply 12, multimeter 13. Detailed Implementation

[0033] The principles and features of this utility model are described below with reference to the accompanying drawings. The examples given are for illustrative purposes only and are not intended to limit the scope of this utility model. The utility model is described more specifically in the following paragraphs by way of example with reference to the accompanying drawings. The advantages and features of this utility model will become clearer from the following description and claims. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of this utility model.

[0034] It should be noted that when a component is described as "fixed to" another component, it can be directly on the other component or may have a component in between. When a component is considered "connected to" another component, it can be directly connected to the other component or may have a component in between. When a component is considered "set on" another component, it can be directly set on the other component or may have a component in between. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0036] like Figures 1-2 As shown, an embodiment of this utility model provides a thermal conductivity temperature detection device for the bottom of an optical chip 3, comprising:

[0037] The encapsulation housing 1 has an opening at one end;

[0038] The base 2 is connected to the open end of the encapsulation shell 1, and a first thermistor 10 is provided on it;

[0039] A pad is disposed on the base 2, and a second thermistor is installed on the pad; there are three pads, from bottom to top, namely a lower pad 6, a middle pad 5 and an upper pad 4. The second thermistors on the lower pad 6, the middle pad 5 and the upper pad 4 are respectively the lower thermistor 9, the middle thermistor 8 and the upper thermistor 7. The upper pad 4 is provided with a mounting position for mounting an optical chip, and the optical chip 3 is mounted on the upper pad 4;

[0040] A connecting component is disposed on the base 2; the connecting component includes a plurality of pins 11, specifically including:

[0041] The optical chip excitation source pin 111 passes through the base 2, and the optical chip 3 is connected to the optical chip excitation source pin 111 through a gold wire. The optical chip excitation source pin 111 is connected to the power supply 12.

[0042] The first thermistor pin 112 passes through the base 2. The first thermistor 10 is connected to the first thermistor pin 112 through a gold wire. The first thermistor pin 112 is connected to the resistance measuring device.

[0043] The second thermistor pin 11311 passes through the base 2. The second thermistor is connected to the first thermistor pin 112 via a gold wire. The second thermistor pin 11311 is connected to the resistance measuring device.

[0044] Multimeter 13 is electrically connected to the first thermistor 10 and the second thermistor via the connection assembly to measure the resistance of each of the first thermistor 10 and the second thermistor.

[0045] Power supply 12, which is electrically connected to the optical chip 3 through the connection component, is used to provide current (voltage) to the optical chip 3.

[0046] In this embodiment, the power supply 12 provides excitation current (voltage) to the optical chip 3. The bottom of the optical chip 3 is in contact with the topmost pad 4. The heat generated by the optical chip 3 after being powered on is transferred to the top pad 4, and then sequentially from top to bottom to the middle pad 5, the bottom pad 6, and the base 2. The resistance of the first thermistor 10, the top thermistor 7, the middle thermistor 8, and the bottom thermistor 9 are measured by a multimeter 13. Then, the temperature of each thermistor is obtained by looking up the resistance versus temperature information of each thermistor. Thus, the temperatures of the top pad 4, the middle pad 5, the bottom pad 6, and the base 2 can be obtained. The temperature of the top pad 4 is approximately the temperature of the bottom of the optical chip 3, and the temperature of the base 2 is approximately the surface temperature of the package shell 1. This can be used for long-term high-temperature life test of the optical chip 3, making the long-term high-temperature life test data of the optical chip 3 more accurate.

[0047] In addition, in this application, multiple pads are stacked on the base 2. By calculating the temperature difference between the upper pad 4, the middle pad 5, the lower pad 6 and the base 2, a typical thermal conductivity measurement model of optical packaging can be obtained, providing a reference for other packages.

[0048] Furthermore, in this embodiment, pin 11 is connected to the power supply 12 or a resistance measuring device via a pin clamp. The pad is a ceramic pad. The first thermistor 10, the second thermistor, and the optical chip 3 are fixed with conductive silver paste. The package shell 1 and the base 2 are connected by resistance welding to form an airtight structure.

[0049] Preferably, as another embodiment of the present invention, it further includes:

[0050] The high-temperature drying oven, wherein the outer casing 1 and the base 2 are both disposed inside the high-temperature drying oven.

[0051] In this embodiment, the packaging shell 1 and the base 2 are placed in a high-temperature drying oven to provide a high-temperature testing environment.

[0052] Although the embodiments of this utility model have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for this utility model. For those skilled in the art, other modifications can be easily made. Therefore, without departing from the general concept defined by the claims and their equivalents, this utility model is not limited to the specific details and embodiments shown and described herein.

Claims

1. A device for detecting the bottom thermal conductivity temperature of an optical chip, characterized in that, include: The encapsulation shell has an opening at one end; A base, which is connected to the open end of the encapsulation shell, and a first thermistor is provided on it; A connecting component, which is disposed on the base; A pad is disposed on the base and has a mounting position for mounting an optical chip. A second thermistor is mounted on the pad. A resistance measuring device, which is electrically connected to the first thermistor and the second thermistor via the connecting assembly, to measure the resistance of each of the first thermistor and the second thermistor; The power supply is electrically connected to the optical chip via the connection component.

2. The optical chip bottom thermal conduction temperature detection device as described in claim 1, characterized in that, The pad is configured as multiple blocks, which are stacked on the base, and the optical chip is mounted on the outermost pad.

3. The optical chip bottom thermal conduction temperature detection device as described in claim 2, characterized in that, The pad is configured as three pieces.

4. The optical chip bottom thermal conduction temperature detection device as described in claim 2, characterized in that, The connection component includes: An optical chip excitation source pin extends through the base; the optical chip is connected to the optical chip excitation source pin via a gold wire; and the optical chip excitation source pin is connected to the power supply. A first thermistor pin passes through the base, the first thermistor is connected to the first thermistor pin via a gold wire, and the first thermistor pin is connected to the resistance measuring device. The second thermistor pin passes through the base, and the second thermistor is connected to the first thermistor pin via a gold wire. The second thermistor pin is connected to the resistance measuring device.

5. The optical chip bottom thermal conduction temperature detection device as described in claim 4, characterized in that, The pins are connected to the power supply or resistance measuring device via pin clamps.

6. The optical chip bottom thermal conduction temperature detection device as described in claim 1, characterized in that, The pad is a ceramic pad.

7. The optical chip bottom thermal conduction temperature detection device as described in claim 1, characterized in that, The first thermistor, the second thermistor, and the optical chip are fixed together by conductive silver paste.

8. The optical chip bottom thermal conduction temperature detection device as described in claim 1, characterized in that, The outer casing and the base are connected by resistance welding.

9. The optical chip bottom thermal conduction temperature detection device as described in claim 1, characterized in that, The resistance measuring device is a multimeter.

10. The optical chip bottom thermal conduction temperature detection device as described in claim 1, characterized in that, Also includes: The high-temperature drying oven, wherein the outer casing and the base are both disposed inside the high-temperature drying oven.

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