A surface mount ultra-low temperature diode temperature sensor

Abstract

The utility model belongs to the technical field of temperature sensor, concretely points to a kind of surface mounting's ultralow temperature diode temperature sensor, including circular copper column carrier, the sidewall of circular copper column carrier is adhered with silicon-based diode by low temperature glue, four lead wires of the silicon-based diode are laser welded respectively enameled wire, the welding place of lead wire and enameled wire is sleeved high temperature heat shrink tube, and the enameled wire is used to lead out signal;Four lead wires of the silicon-based diode of the present application are laser welded respectively enameled wire, temperature measuring element uses silicon-based diode, temperature measuring is accurate, can resist ultralow temperature environment, long-term stability is high, enameled wire line system connection mode eliminates wire resistance error to make temperature measuring more accurate, welding uses laser welding spot welding process, and welding spot is firm, and there is no resistance loss.

Description

Technical Field

[0001] This utility model belongs to the field of temperature sensor technology, specifically referring to a surface-mounted ultra-low temperature diode temperature sensor. Background Technology

[0002] A temperature sensor is a device that converts the physical quantity of temperature into a measurable electrical signal to achieve accurate temperature sensing and monitoring. It plays an indispensable role in many fields with strict temperature requirements, such as industrial control, aerospace, and scientific research experiments.

[0003] In ultra-low temperature measurement scenarios, traditional ultra-low temperature sensors have many shortcomings. Their carriers are mostly made of plastic or ceramic. In ultra-low temperature environments, the molecular chain structure of plastic is destroyed, leading to brittleness and inability to provide stable support for the sensor element, severely affecting the normal operation of the measurement. While ceramics possess a certain strength, their poor thermal conductivity prevents them from quickly and effectively transferring the temperature of the device under test to the sensing element. Furthermore, their poor adhesion to the device surface easily introduces measurement errors.

[0004] Meanwhile, traditional sensor lead connection methods have significant drawbacks. Ordinary welding or crimping in ultra-low temperature environments can cause stress at the weld points due to thermal expansion and contraction, leading to cracking. Crimped structures are also prone to poor contact due to material shrinkage, ultimately causing signal interruption. Furthermore, traditional platinum resistance thermometers and thermocouples exhibit poor linearity of resistance-temperature or electromotive force-temperature under ultra-low temperature conditions, resulting in unstable measurement performance and short lifespans. Frequent replacements not only increase operating costs but also affect the continuity and accuracy of measurements. Utility Model Content

[0005] To address the aforementioned problems, this invention proposes a surface-mounted ultra-low temperature diode temperature sensor.

[0006] The technical solution adopted by this utility model is as follows: This utility model provides a surface-mounted ultra-low temperature diode temperature sensor, including a circular copper pillar carrier. A silicon-based diode is bonded to the side wall of the circular copper pillar carrier by a low-temperature adhesive. The four leads of the silicon-based diode are laser-welded with enameled wire. A high-temperature heat shrink tubing is sleeved at the weld joint between the leads and the enameled wire. The enameled wire is used to lead out signals.

[0007] Furthermore, the high-temperature heat shrink tubing is used for insulation between enameled wires.

[0008] Furthermore, a gold-plated copper sheet is fixedly connected to the end of the circular copper column carrier.

[0009] Furthermore, the enameled wire is wound around the sidewall of the circular copper column carrier.

[0010] Furthermore, the surface of the silicon-based diode is covered with a low-temperature adhesive.

[0011] Furthermore, the circular copper column carrier is made of pure copper.

[0012] The beneficial effects of this utility model by adopting the above structure are as follows: The four leads of the silicon-based diode are laser-welded with enameled wire. The temperature sensing element uses a silicon-based diode, which provides accurate temperature measurement, can withstand ultra-low temperature environments, and has high long-term stability. The enameled wire connection eliminates line resistance errors, making the temperature measurement more accurate. The welding adopts a laser welding spot welding process, which ensures a strong weld point with no resistance loss. The silicon-based diode's own leads and the enameled wire are insulated from each other using high-temperature heat-shrink tubing. A circular copper pillar carrier is used as the carrier, and the silicon-based diode is wound onto the circular copper pillar carrier with low-temperature adhesive. The surface of the silicon-based diode is covered with low-temperature adhesive, and the signal is led out from the enameled wire. It has excellent linearity and small error in the ultra-low temperature range, solving the problem of insufficient accuracy of traditional platinum resistance thermometers and thermocouples at ultra-low temperatures. The circular copper pillar carrier is made of oxygen-free pure copper, which has a high thermal conductivity and can quickly conduct the temperature of the surface of the device under test to the silicon-based diode. The silicon-based diode has a fast temperature response time, ensuring timely detection. Attached Figure Description

[0013] To more clearly illustrate the technical solution of this utility model, the drawings used in the description will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a perspective view of a surface-mounted cryogenic diode temperature sensor according to the present invention.

[0015] Among them, 1. silicon-based diode, 2. circular copper pillar carrier, 3. gold-plated copper sheet, and 4. enameled wire. Detailed Implementation

[0016] To make the objectives, features, and advantages of this utility model more apparent and understandable, the technical solutions of this utility model will be clearly and completely described below with reference to the accompanying drawings of the specific embodiments. Obviously, the embodiments described below are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this patent, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this patent.

[0017] like Figure 1As shown, this utility model proposes a surface-mounted ultra-low temperature diode temperature sensor, including a circular copper pillar carrier 2, which is made of pure copper. A gold-plated copper sheet 3 is fixedly connected to the end of the circular copper pillar carrier 2. A silicon-based diode 1 is bonded to the side wall of the circular copper pillar carrier 2 with low-temperature adhesive. The surface of the silicon-based diode 1 is covered with low-temperature adhesive. The four leads of the silicon-based diode 1 are laser-welded with enameled wire 4. The enameled wire 4 is wound around the side wall of the circular copper pillar carrier 2. A high-temperature heat-shrink tubing is sleeved at the weld between the leads and the enameled wire 4. The high-temperature heat-shrink tubing is used for insulation between the enameled wire 4. The enameled wire 4 is used to lead out signals.

[0018] In practical use, the four leads of the silicon-based diode 1 are laser-welded with enameled wire 4. The temperature sensing element uses the silicon-based diode 1, which provides accurate temperature measurement, can withstand ultra-low temperature environments, and has high long-term stability. The wire connection method of the enameled wire 4 eliminates line resistance errors, making the temperature measurement more accurate. The welding adopts laser welding spot welding process, which ensures a strong weld point with no resistance loss. The silicon-based diode 1's own leads and the enameled wire 4 are insulated with high-temperature heat shrink tubing. The circular copper pillar carrier 2 serves as the carrier, and the silicon-based diode 1 is wound onto the circular copper pillar carrier 2 with low-temperature adhesive. The surface of the silicon-based diode 1 is covered with low-temperature adhesive, and the enameled wire 4 leads out the signal. It has excellent linearity and small error in the ultra-low temperature range, solving the problem of insufficient accuracy of traditional platinum resistance thermometers and thermocouples at ultra-low temperatures. The circular copper pillar carrier 2 is made of oxygen-free pure copper, which has a high thermal conductivity and can quickly conduct the temperature of the surface of the device under test to the silicon-based diode 1. The silicon-based diode 1 has a fast temperature response time, ensuring timely detection. The above is the overall workflow of this utility model. This step can be repeated for the next use.

[0019] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A surface-mounted ultra-low temperature diode temperature sensor, characterized in that: The device includes a circular copper pillar carrier (2), on which a silicon-based diode (1) is bonded by low-temperature adhesive. The four leads of the silicon-based diode (1) are laser-welded with enameled wire (4). A high-temperature heat shrink tubing is sleeved at the weld joint between the leads and the enameled wire (4). The enameled wire (4) is used to lead out signals.

2. The surface-mounted ultra-low temperature diode temperature sensor according to claim 1, characterized in that: The high-temperature heat shrink tubing is used for insulation between enameled wires (4).

3. The surface-mounted ultra-low temperature diode temperature sensor according to claim 2, characterized in that: The end of the circular copper column carrier (2) is fixedly connected to a gold-plated copper sheet (3).

4. The surface-mounted cryogenic diode temperature sensor according to claim 3, characterized in that: The enameled wire (4) is wound around the side wall of the circular copper column carrier (2).

5. A surface-mounted ultra-low temperature diode temperature sensor according to claim 4, characterized in that: The surface of the silicon-based diode (1) is covered with a low-temperature adhesive.

6. A surface-mounted ultra-low temperature diode temperature sensor according to claim 5, characterized in that: The circular copper column carrier (2) is made of pure copper.

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