A temperature sensor structure optimized from a vacuum environment to an atmospheric environment

Abstract

The utility model relates to temperature measuring equipment technical field, concretely relates to a temperature sensor structure from vacuum environment optimization to atmospheric environment, including reaction cavity, shell, refrigerant waterway, heating tray, heating electric wire, connecting sleeve and sealing mechanism, connecting sleeve is fixedly connected with reaction cavity, and is located inside reaction cavity, heating tray sets up the top of connecting sleeve, sealing mechanism sets up the below of connecting sleeve, heating electric wire sets up inside heating tray, shell is bolted with heating tray, and is cladded in the outside of refrigerant waterway and heating tray, K type thermocouple passes connecting sleeve, and is located inside heating tray, through the setting of above -mentioned structure, solved the problem that traditional full -seal shell is easy to produce irreversible deformation because of pressure difference, leads to the structure damage.

Description

Technical Field

[0001] This utility model relates to the field of temperature measurement equipment technology, and in particular to a temperature sensor structure optimized from a vacuum environment to an atmospheric environment. Background Technology

[0002] In industrial scenarios where the environment transitions from vacuum to atmospheric, temperature sensors must simultaneously meet the dual requirements of "vacuum sealing" and "atmospheric pressure impact".

[0003] In a vacuum state, the sensor is under negative pressure inside. When switching to an atmospheric environment, the instantaneous pressure difference between the inside and outside can reach 101 kPa. Traditional fully sealed shells are prone to irreversible deformation due to pressure difference, which can lead to structural damage. Utility Model Content

[0004] The purpose of this invention is to provide a temperature sensor structure optimized from a vacuum environment to an atmospheric environment, which solves the problem that traditional fully sealed shells are prone to irreversible deformation due to pressure difference, leading to structural damage.

[0005] To achieve the above objectives, this utility model provides a temperature sensor structure optimized from a vacuum environment to an atmospheric environment, including a reaction chamber, a shell, a refrigerant channel, a heating plate, a heating wire, a connecting sleeve, and a sealing mechanism. The connecting sleeve is fixedly connected to the reaction chamber and located inside the reaction chamber. The heating plate is disposed above the connecting sleeve, the sealing mechanism is disposed below the connecting sleeve, the heating wire is disposed inside the heating plate, the shell is bolted to the heating plate and covers the refrigerant channel and the outer side of the heating plate, and the K-type thermocouple passes through the connecting sleeve and is located inside the heating plate.

[0006] The sealing mechanism includes an adapter plate, a first sealing ring, a second sealing ring, and two fixing components. The adapter plate covers the outside of the connecting sleeve and is bolted to the connecting sleeve and the reaction chamber. The surface of the adapter plate is provided with a first groove and a second groove. The first groove is located on one side of the reaction chamber, and the second groove is located on one side of the connecting sleeve. The first sealing ring is located inside the first groove, and the second sealing ring is located outside the second groove. The two fixing components are located on one side of the adapter plate.

[0007] Each of the fixing components includes a connecting rod and a fixing sleeve. One end of the connecting rod passes through the connecting sleeve, and the other end of the connecting rod is fixedly connected to the heating plate. The fixing sleeve is threadedly connected to the connecting rod and is located on one side of the adapter plate.

[0008] The temperature sensor structure optimized from a vacuum environment to an atmospheric environment also includes a connector, which passes through the connecting sleeve and is fixedly connected to the heating wire.

[0009] This invention discloses a temperature sensor structure optimized from a vacuum environment to an atmospheric environment. The connecting sleeve is fixedly connected to the reaction chamber and located inside the reaction chamber. The heating plate is positioned above the connecting sleeve, and the sealing mechanism is positioned below the connecting sleeve. The heating wire is located inside the heating plate. The outer shell is bolted to the heating plate and covers the refrigerant channel and the outer side of the heating plate. A K-type thermocouple passes through the connecting sleeve and is located inside the heating plate. The heating plate is used to support the wafer. The heating wire heats the heating plate. Injecting cooling water into the refrigerant channel allows for further temperature adjustment. The K-type thermocouple accurately detects the temperature of the heating plate. The sealing mechanism places the K-type thermocouple in an atmospheric environment, thus solving the problem of pressure affecting the K-type thermocouple in a vacuum environment and extending its service life. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0011] Figure 1 This is a schematic diagram of the structure of the temperature sensor of this utility model, which is optimized from a vacuum environment to an atmospheric environment.

[0012] Figure 2 This is a front view of the temperature sensor structure of this utility model, which is optimized from a vacuum environment to an atmospheric environment.

[0013] Figure 3 This is a front view of the temperature sensor structure of this utility model, which is optimized from a vacuum environment to an atmospheric environment.

[0014] Figure 4 This is a front view of the temperature sensor structure of this utility model, which is optimized from a vacuum environment to an atmospheric environment.

[0015] 1-Reaction chamber, 2-Outer shell, 3-Refrigerant water channel, 4-Heating plate, 5-Heating wire, 6-Connecting sleeve, 7-K-type thermocouple, 8-Adapter plate, 9-First sealing ring, 10-Second sealing ring, 11-First groove, 12-Second groove, 13-Connecting rod, 14-Fixing sleeve, 15-Connector. Detailed Implementation

[0016] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0017] Please see Figures 1 to 4 This utility model provides a temperature sensor structure optimized from a vacuum environment to an atmospheric environment, including a reaction chamber 1, a housing 2, a refrigerant channel 3, a heating plate 4, a heating wire 5, a connecting sleeve 6, and a sealing mechanism. The connecting sleeve 6 is fixedly connected to the reaction chamber 1 and is located inside the reaction chamber 1. The heating plate 4 is located above the connecting sleeve 6, and the sealing mechanism is located below the connecting sleeve 6. The heating wire 5 is located inside the heating plate 4. The housing 2 is bolted to the heating plate 4 and covers the refrigerant channel 3 and the outer side of the heating plate 4. The K-type thermocouple 7 passes through the connecting sleeve 6 and is located inside the heating plate 4.

[0018] In this embodiment, the heating plate 4 is used to support the wafer, the heating wire 5 heats the heating plate 4, and the temperature can be further adjusted by injecting cooling water into the cooling water channel. The temperature of the heating plate 4 is accurately detected by the K-type thermocouple 7, and the K-type thermocouple 7 is placed in the atmospheric environment by the sealing mechanism, thereby solving the problem of pressure affecting the K-type thermocouple 7 in a vacuum environment and improving the service life of the K-type thermocouple 7.

[0019] Furthermore, the sealing mechanism includes an adapter plate 8, a first sealing ring 9, a second sealing ring 10, and two fixing components. The adapter plate 8 covers the outside of the connecting sleeve 6 and is bolted to the connecting sleeve 6 and the reaction chamber 1. The surface of the adapter plate 8 is provided with a first groove 11 and a second groove 12. The first groove 11 is located on one side of the reaction chamber 1, and the second groove 12 is located on one side of the connecting sleeve 6. The first sealing ring 9 is located inside the first groove 11, and the second sealing ring 10 is located outside the second groove 12. The two fixing components are located on one side of the adapter plate 8.

[0020] In this embodiment, the first sealing ring 9 and the second sealing ring 10 are respectively disposed on one side of the adapter sleeve and the reaction chamber 1, thereby improving the sealing effect between the adapter plate 8 and the reaction chamber 1.

[0021] Furthermore, each of the fixing components includes a connecting rod 13 and a fixing sleeve 14. One end of the connecting rod 13 passes through the connecting sleeve 6, and the other end of the connecting rod 13 is fixedly connected to the heating plate 4. The fixing sleeve 14 is threadedly connected to the connecting rod 13 and is located on one side of the adapter plate 8.

[0022] In this embodiment, after the heating plate 4 is installed, the connecting rod 13 passes through the adapter plate 8 and the connecting sleeve 6, and the heating plate 4 is fixed by the fixing sleeve 14.

[0023] Furthermore, the temperature sensor structure optimized from a vacuum environment to an atmospheric environment also includes a connector 15, which passes through the connecting sleeve 6 and is fixedly connected to the heating wire 5.

[0024] In this embodiment, the connector 15 is configured to provide energy to the heating wire 5.

[0025] The above-disclosed embodiments are merely preferred embodiments of the present utility model and should not be construed as limiting the scope of the present utility model. Those skilled in the art can understand that implementing all or part of the above-described embodiments and making equivalent changes in accordance with the claims of the present utility model are still within the scope of the utility model.

Claims

1. A temperature sensor structure optimized from a vacuum environment to an atmospheric environment, characterized in that, The device includes a reaction chamber, a shell, a refrigerant channel, a heating plate, a heating wire, a connecting sleeve, a K-type thermocouple, and a sealing mechanism. The connecting sleeve is fixedly connected to the reaction chamber and located inside the reaction chamber. The heating plate is located above the connecting sleeve, and the sealing mechanism is located below the connecting sleeve. The heating wire is located inside the heating plate. The shell is bolted to the heating plate and covers the refrigerant channel and the outside of the heating plate. The K-type thermocouple passes through the connecting sleeve and is located inside the heating plate.

2. The temperature sensor structure optimized from a vacuum environment to an atmospheric environment as described in claim 1, characterized in that, The sealing mechanism includes an adapter plate, a first sealing ring, a second sealing ring, and two fixing components. The adapter plate covers the outside of the connecting sleeve and is bolted to the connecting sleeve and the reaction chamber. The surface of the adapter plate is provided with a first groove and a second groove. The first groove is located on one side of the reaction chamber, and the second groove is located on one side of the connecting sleeve. The first sealing ring is located inside the first groove, and the second sealing ring is located outside the second groove. The two fixing components are located on one side of the adapter plate.

3. The temperature sensor structure optimized from a vacuum environment to an atmospheric environment as described in claim 2, characterized in that, Each of the fixing components includes a connecting rod and a fixing sleeve, one end of the connecting rod passing through the connecting sleeve and the other end of the connecting rod being fixedly connected to the heating plate, and the fixing sleeve being threadedly connected to the connecting rod and located on one side of the adapter plate.

4. The temperature sensor structure optimized from a vacuum environment to an atmospheric environment as described in claim 3, characterized in that, The temperature sensor structure optimized from a vacuum environment to an atmospheric environment also includes a connector, which passes through the connecting sleeve and is fixedly connected to the heating wire.

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