A MEMS pressure sensor and electronic device

Abstract

The application relates to a MEMS pressure sensor and an electronic device, which comprise a shell, an insulating liquid, a MEMS sensor assembly and a temperature controller. The shell comprises a shell body and an end cover, the end cover is arranged on the opening side of the shell body, and the end cover and the shell body surround to form a containing cavity. The insulating liquid is filled in the containing cavity, and the end cover is used for transmitting external pressure to the insulating liquid. The MEMS sensor assembly is arranged in the containing cavity, is used for detecting the pressure transmitted in the insulating liquid, and generates a pressure signal, and is also used for detecting the temperature of the insulating liquid and generating a temperature signal. The temperature controller is arranged in the insulating liquid, and is used for adjusting the temperature of the insulating liquid based on the temperature signal. The application dynamically adjusts the temperature of the insulating liquid through the temperature controller, so that the MEMS sensor assembly always works in an optimal thermal stability interval, thereby guaranteeing that the pressure signal is not disturbed by the temperature, and the MEMS pressure sensor outputs more accurately.

Description

Technical Field

[0001] This application relates to the field of sensors, and more particularly to a MEMS pressure sensor and electronic device. Background Technology

[0002] Micro-Electro-Mechanical Systems (MEMS) pressure sensors have been widely used in many fields such as industrial control, consumer electronics, automotive electronics, and medical equipment due to their advantages of small size, low cost, and high integration, and they play an important role, especially in small-range pressure measurement applications.

[0003] Small-range MEMS pressure sensors are highly sensitive to changes in the external environment. Fluctuations in ambient temperature can cause deviations in the pressure signal output by the pressure sensor, thus affecting the accuracy of the measurement results. Utility Model Content

[0004] This application provides a MEMS pressure sensor and electronic device, which aims to reduce the impact of temperature fluctuations on the measurement accuracy of the MEMS pressure sensor and improve the accuracy of the pressure sensor measurement results.

[0005] To achieve the above objectives, according to a first aspect of this application, a MEMS pressure sensor is provided, comprising: The housing includes a shell body and an end cap, wherein the end cap is disposed on the opening side of the shell body and together with the shell body forms an accommodating cavity; An insulating liquid is filled into the accommodating cavity, and the end cap is used to transmit external pressure to the insulating liquid. A MEMS sensor assembly is disposed within the accommodating cavity for detecting the pressure transmitted in the insulating liquid and generating a pressure signal, and also for detecting the temperature of the insulating liquid and generating a temperature signal. A temperature controller is disposed in the insulating liquid and is used to adjust the temperature of the insulating liquid based on the temperature signal.

[0006] Optionally, a circuit board is provided on one side of the housing relative to the end cap, and the MEMS sensor assembly and the temperature controller are both electrically connected to the circuit board.

[0007] Optionally, a main controller is provided on the side of the circuit board away from the accommodating cavity, and the main controller is electrically connected to the circuit board; The main controller is used to receive the pressure signal and the temperature signal, and when the value of the temperature signal is greater than the value of the first threshold signal, it sends a cooling command to the temperature controller, and when the value of the temperature signal is less than the value of the second threshold signal, it sends a heating command to the temperature controller.

[0008] Optionally, the temperature controller includes: A temperature controller, electrically connected to the circuit board, is located on the side of the circuit board away from the accommodating cavity; A temperature control tube is electrically connected to the circuit board and is disposed in the insulating liquid; The temperature controller raises the temperature of the temperature control tube by receiving the heating command and lowers the temperature of the temperature control tube by receiving the cooling command.

[0009] Optionally, the temperature control tube is disposed on the side surface of the circuit board facing the accommodating cavity, and the temperature control tube has a wavy bent structure.

[0010] Optionally, the value of the first threshold signal is 27 degrees Celsius, and the value of the second threshold signal is 23 degrees Celsius.

[0011] Optionally, the MEMS sensor assembly includes: an integrated temperature and pressure sensor or independent temperature and pressure sensors.

[0012] Optionally, the end cap is a corrugated sheet.

[0013] Optionally, the insulating liquid is an oil medium.

[0014] According to a second aspect of this application, an electronic device is provided, comprising a MEMS pressure sensor as disclosed in any of the above disclosures.

[0015] In the MEMS pressure sensor of this application embodiment, through the MEMS sensor component and the temperature controller, the MEMS sensor component can synchronously acquire pressure signals and temperature signals, monitor temperature changes in real time, and reflect the current working environment status of the MEMS sensor component. The temperature controller can dynamically adjust the temperature of the insulating liquid according to the temperature signal detected by the MEMS sensor component, so that the MEMS sensor component always works in the optimal thermal stability range, thereby ensuring that the pressure signal is not interfered with by temperature, and the output of the MEMS pressure sensor is more accurate.

[0016] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0018] Figure 1 This is a schematic diagram of the structure of the MEMS pressure sensor disclosed in the embodiments of this application. Figure 1 ; Figure 2 yes Figure 1 Sectional view at point AA; Figure 3 This is a schematic diagram of the structure of the MEMS pressure sensor disclosed in the embodiments of this application. Figure 2 .

[0019] Explanation of reference numerals in the attached figures: 1. Shell; 11. Shell body; 12. End cap; 13. Receiving cavity; 2. MEMS sensor components; 3. Temperature controller; 31. Temperature control unit; 32. Temperature control tube; 4. Circuit board; 5. Main controller; 6. First signal column; 7. Second signal column. Detailed Implementation

[0020] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0021] It should be understood that although the terms first, second, etc., may be used herein to describe various components, these components should not be limited to these terms. These terms are used to distinguish one component from another. For example, a first component may be referred to as a second component, and similarly, a second component may be referred to as a first component, without departing from the scope of this application.

[0022] It should be understood that when a component is said to be "on" or "connected" to another component, it can be directly on or connected to the other component, or there may be an inserted component. Other terms used to describe relationships between components should be interpreted in a similar manner.

[0023] As used herein, the term "layer" refers to a portion of material comprising a region of thickness. A layer may extend over the entirety of an underlying or upper layer structure, or may have a extent smaller than that of the underlying or upper layer structure. Furthermore, a layer may be a region of a uniform or non-uniform continuous structure with a thickness less than the thickness of the continuous structure. For example, a layer may be located between the top and bottom surfaces of a continuous structure or between any set of horizontal planes at the top and bottom surfaces. A layer may extend horizontally, vertically, and / or along a tapered surface. A substrate may be a layer, which may include one or more layers, and / or may have one or more layers on, above, and / or below it. A layer may include multiple layers.

[0024] It should be noted that the illustrations provided in the embodiments of this application are only schematic representations of the basic concept of this application. Although the illustrations only show the components related to this application and are not drawn according to the actual number, shape and size of the components, the form, quantity and proportion of each component in actual implementation can be arbitrarily changed, and the layout of the components may also be more complex.

[0025] As described in the background section, pressure sensors based on Micro-Electro-Mechanical Systems (MEMS) are widely used in industrial control, consumer electronics, automotive electronics, medical devices, and many other fields due to their advantages such as small size, low cost, and high integration. They play a particularly important role in small-range pressure measurement applications. Small-range MEMS pressure sensors are quite sensitive to changes in the external environment. Fluctuations in ambient temperature can cause deviations in the pressure signal output by the pressure sensor, thus affecting the accuracy of the measurement results.

[0026] Therefore, in order to reduce the impact of temperature fluctuations on the measurement accuracy of MEMS pressure sensors and improve the accuracy of pressure sensor measurement results, this application discloses a MEMS pressure sensor.

[0027] Reference Figure 1 and Figure 2 The MEMS pressure sensor disclosed in this application includes: a housing 1, a MEMS sensor assembly 2, and a temperature controller 3. The housing 1 includes a body 11 and an end cap 12. The end cap 12 covers the opening side of the body 11, forming a receiving cavity 13. An insulating liquid fills the receiving cavity 13, and the end cap 12 is used to transmit external pressure to the insulating liquid. The MEMS sensor assembly 2 is disposed within the receiving cavity 13 and is used to detect the pressure transmitted in the insulating liquid and generate a pressure signal, and also to detect the temperature of the insulating liquid and generate a temperature signal. The temperature controller 3 is disposed in the insulating liquid and is used to adjust the temperature of the insulating liquid based on the temperature signal.

[0028] Reference Figure 3In this embodiment, the end cap 12 is a corrugated sheet. The corrugated sheet can withstand external pressure and also has good elastic deformation capability. Under the action of external pressure, the corrugated sheet undergoes elastic deformation, and the pressure is evenly transmitted to the MEMS sensor assembly 2 inside the accommodating cavity 13 through the insulating liquid, avoiding direct contact between the external medium and the sensitive element, thereby improving the overall sealing and corrosion resistance of the sensor.

[0029] In this embodiment, the insulating liquid is an oil medium. The oil medium may include, but is not limited to, silicone oil or fluorinated oil. The oil medium can efficiently transmit external pressure without conducting electricity.

[0030] Specifically, in the embodiments disclosed in this application, the housing 11 is through the middle, with a circuit board 4 provided on one side of the housing 11 and an end cap 12 covering the other side of the opening. The circuit board 4, the housing 11, and the end cap 12 together form a closed accommodating cavity 13. The MEMS sensor assembly 2 and the temperature controller 3 are both electrically connected to the circuit board 4.

[0031] Furthermore, a main controller 5 is also provided on the side of the circuit board 4 away from the accommodating cavity 13, and the main controller 5 is electrically connected to the circuit board 4. The main controller 5 and the MEMS sensor assembly 2 are electrically connected through the circuit board 4, and the main controller 5 and the temperature controller 3 are electrically connected through the circuit board 4.

[0032] Specifically, the main controller 5 is used to receive pressure signals and temperature signals, and when the value of the temperature signal is greater than the value of the first threshold signal, it sends a cooling command to the temperature controller 3, and when the value of the temperature signal is less than the value of the second threshold signal, it sends a heating command to the temperature controller 3.

[0033] In this embodiment, the temperature controller 3 includes a temperature controller 31 and a temperature control tube 32. The temperature controller 31 is electrically connected to the circuit board 4 and is located on the side of the circuit board 4 opposite to the accommodating cavity 13. The temperature control tube 32 is electrically connected to the circuit board 4 and is disposed in an insulating liquid. The temperature control tube 32 and the temperature controller 31 are electrically connected through the circuit board 4. The temperature controller 31 raises the temperature of the temperature control tube 32 by receiving a heating command and lowers the temperature of the temperature control tube 32 by receiving a cooling command.

[0034] The temperature control tube 32 is located on the surface of the circuit board 4 facing the accommodating cavity 13. The temperature control tube 32 has a wavy bend structure or an S-shaped bend structure. The bend structure of the temperature control tube 32 can increase the heat dissipation area and heat conduction efficiency.

[0035] In some embodiments, the temperature control range of the temperature control tube 32 is [23, 27] degrees Celsius. That is, in this embodiment, the first threshold signal is a temperature value of 27 degrees Celsius, and the second threshold signal is a temperature value of 23 degrees Celsius. When the main controller 5 receives a temperature signal higher than the set 27 degrees Celsius, it sends a cooling command to the temperature controller 31, and the temperature controller 31 controls the temperature control tube 32 to reduce heat output or start the cooling function; when the main controller 5 receives a temperature signal lower than 23 degrees Celsius, it sends a heating command to the temperature controller 31, and the temperature controller 31 controls the temperature control tube 32 to increase heat output or start the heating function.

[0036] It is worth mentioning that the MEMS sensor assembly 2 includes: an integrated temperature and pressure sensor or independent temperature and pressure sensors. The circuit board 4 has multiple signal transmission posts; pressure signals are transmitted to the main controller 5 via the first signal post 6, and temperature signals are transmitted to the main controller 5 via the second signal post 7.

[0037] The MEMS pressure sensor in this embodiment includes a MEMS sensor component 2 and a temperature controller 3. The MEMS sensor component 2 can simultaneously acquire pressure and temperature signals, monitor temperature changes in real time, and reflect the current working environment of the MEMS sensor component 2. The temperature controller 3 can dynamically adjust the temperature of the insulating liquid according to the temperature signal detected by the MEMS sensor component 2, so that the MEMS sensor component 2 always works in the optimal thermal stability range, thereby ensuring that the pressure signal is not interfered with by temperature and the output of the MEMS pressure sensor is more accurate.

[0038] This application also discloses an electronic device that includes any of the MEMS pressure sensors disclosed above.

[0039] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0040] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0041] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A MEMS pressure sensor, characterized in that, include: The housing (1) includes a shell body (11) and an end cap (12), wherein the end cap (12) is disposed on the opening side of the shell body (11) and together with the shell body (11) forms an accommodating cavity (13); An insulating liquid is filled in the accommodating cavity (13), and the end cap (12) is used to transmit external pressure to the insulating liquid; The MEMS sensor assembly (2) is disposed in the cavity (13) for detecting the pressure transmitted in the insulating liquid and generating a pressure signal, and also for detecting the temperature of the insulating liquid and generating a temperature signal; A temperature controller (3) is disposed in the insulating liquid and is used to adjust the temperature of the insulating liquid based on the temperature signal.

2. The MEMS pressure sensor according to claim 1, characterized in that, The housing (11) has a circuit board (4) on one side relative to the end cap (12), and the MEMS sensor assembly (2) and the temperature controller (3) are both electrically connected to the circuit board (4).

3. The MEMS pressure sensor according to claim 2, characterized in that, The circuit board (4) has a main controller (5) on the side opposite to the accommodating cavity (13), and the main controller (5) is electrically connected to the circuit board (4); The main controller (5) is used to receive the pressure signal and the temperature signal, and when the value of the temperature signal is greater than the value of the first threshold signal, it sends a cooling command to the temperature controller (3), and when the value of the temperature signal is less than the value of the second threshold signal, it sends a heating command to the temperature controller (3).

4. The MEMS pressure sensor according to claim 3, characterized in that, The temperature controller (3) includes: Temperature controller (31), electrically connected to the circuit board (4), is located on the side of the circuit board (4) away from the accommodating cavity (13); The temperature control tube (32) is electrically connected to the circuit board (4) and is disposed in the insulating liquid; The temperature controller (31) raises the temperature of the temperature control tube (32) by receiving the heating command, and lowers the temperature of the temperature control tube (32) by receiving the cooling command.

5. The MEMS pressure sensor according to claim 4, characterized in that, The temperature control tube (32) is located on the side surface of the circuit board (4) facing the accommodating cavity (13), and the temperature control tube (32) has a wavy bent structure.

6. The MEMS pressure sensor according to claim 4, characterized in that, The value of the first threshold signal is 27 degrees Celsius, and the value of the second threshold signal is 23 degrees Celsius.

7. The MEMS pressure sensor according to claim 1, characterized in that, MEMS sensor assembly (2) includes: an integrated temperature and pressure sensor or independent temperature and pressure sensors.

8. The MEMS pressure sensor according to claim 1, characterized in that, The end cap (12) is a corrugated sheet.

9. The MEMS pressure sensor according to claim 1, characterized in that, The insulating liquid is an oil medium.

10. An electronic device, characterized in that, Includes the MEMS pressure sensor as described in any one of claims 1 to 9.

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