Sensor for measuring absolute pressure

Abstract

The present disclosure relates to a sensor for measuring absolute pressure, comprising: a housing; a connector; a pressure detection module comprising a pressure sensing element configured to detect a relative pressure value of a fluid medium with respect to a back pressure of the pressure sensing element, and a back pressure measurement unit configured to detect an absolute pressure value of the back pressure; and an electronic module assembly configured to generate a pressure detection electrical signal based on the relative pressure value and the absolute pressure value.

Description

Technical Field

[0001] This disclosure relates to a sensor for measuring absolute pressure. Background Technology

[0002] Pressure sensors are a commonly used type of sensor and are widely used in various industrial environments.

[0003] Conventionally, the pressure sensing element in a pressure sensor measures the relative pressure of the fluid medium with respect to the back pressure. However, when the sensor's operating environment changes (e.g., changes in altitude or weather conditions), atmospheric pressure changes, and consequently, the back pressure of the pressure sensing element also changes, which adversely affects the pressure detection accuracy of the pressure sensor. Utility Model Content

[0004] To address the problems existing in the prior art, this disclosure provides a sensor for measuring absolute pressure. The sensor can not only measure the relative pressure value of the fluid medium with respect to the back pressure, but also detect the absolute pressure value of the back pressure, thereby avoiding the adverse effects of back pressure fluctuations on the pressure detection accuracy of the sensor.

[0005] According to one aspect of this disclosure, a sensor for measuring absolute pressure is provided, the sensor comprising:

[0006] A housing, the bottom of which defines a sensor port configured to receive a fluid medium;

[0007] A connector is attached to the top of the housing, and the housing, the connector, and the sensor port together define the internal cavity of the sensor;

[0008] A pressure detection module encapsulated within the cavity includes a pressure sensing element and a back pressure measuring unit. The pressure sensing element is configured to detect the relative pressure value of the fluid medium relative to the back pressure of the pressure sensing element, and the back pressure measuring unit is configured to detect the absolute pressure value of the back pressure.

[0009] An electronic module assembly encapsulated in the cavity, the electronic module assembly being configured to generate a pressure detection electrical signal based on the relative pressure value and the absolute pressure value.

[0010] In one embodiment of the sensor, the electronic module assembly generates the pressure detection electrical signal based on the sum of the relative pressure value and the absolute pressure value.

[0011] In one embodiment of the sensor, the back pressure measuring unit is disposed on the electronic module assembly.

[0012] In one embodiment of the sensor, the electronic module assembly includes a printed circuit board and a processing chip, and the back pressure measuring unit is bonded to the processing chip and electrically connected to the processing chip via a first bonding wire.

[0013] In one embodiment of the sensor, the electronic module assembly further includes a protective housing configured to protect the back pressure measuring unit and the first binding wire.

[0014] In one embodiment of the sensor, the back pressure measurement unit is a microelectromechanical system (MEMS) die.

[0015] In one embodiment of the sensor, the pressure sensing element is electrically connected to the electronic module assembly via a second binding wire.

[0016] In one embodiment of the sensor, the sensor further includes a sealing ring configured to seal the internal cavity of the sensor from the external environment.

[0017] In one embodiment of the sensor, the sensor further includes a temperature detection module encapsulated in the cavity, the temperature detection module being configured to detect the temperature of the fluid medium and generate a temperature signal. Attached Figure Description

[0018] The various objectives, features, and advantages of this disclosure will become more apparent from the following description of preferred embodiments of the disclosure, taken in conjunction with the accompanying drawings. The drawings are merely illustrative of the present disclosure and are not necessarily drawn to scale. In the drawings, the same reference numerals always denote the same or similar parts.

[0019] Figure 1 This is a perspective view of a sensor for measuring absolute pressure according to this disclosure.

[0020] Figure 2 This is an exploded view of a sensor for measuring absolute pressure according to this disclosure.

[0021] Figures 3 to 5 This is a schematic diagram of the electronic module assembly and back pressure measurement unit in the sensor according to this disclosure. Detailed Implementation

[0022] The present disclosure will now be described with reference to the accompanying drawings, which illustrate preferred embodiments of the present disclosure. However, it should be understood that the present disclosure can be presented in many different ways and is not limited to the embodiments described below; in fact, the embodiments described below are intended to make the disclosure more complete and to fully illustrate the scope of protection of the present disclosure to those skilled in the art. It should also be understood that the technical features in the embodiments disclosed herein can be combined in various ways to provide more additional embodiments. Those skilled in the art can appropriately modify the details without departing from the spirit of the present disclosure.

[0023] It should be understood that the same reference numerals denote the same elements in all the accompanying drawings. For clarity, the dimensions of certain features may be modified in the drawings.

[0024] Unless otherwise stated, the terminology used herein (including technical and scientific terms) should have the meaning that would be normally understood by one of ordinary skill in the art to which this disclosure pertains. Unless otherwise stated, the terms “comprising” and “including” as used in the specification and claims should be interpreted in an open-ended sense, that is, “comprising” and “including” should be interpreted as synonymous with the terms “at least comprising” or “at least comprising”.

[0025] Unless otherwise stated, the terms “upper,” “lower,” “top,” “bottom,” etc., used in this disclosure refer only to the relative orientation of the device and its related components in the state shown in the figure.

[0026] It should be understood that the terminology used in this specification is for describing specific embodiments only and is not intended to limit this disclosure. For the sake of brevity and / or clarity, well-known functions or structures may not be described in detail.

[0027] To address the aforementioned deficiencies in the prior art, this disclosure provides a sensor for measuring absolute pressure. Embodiments for implementing this disclosure will now be described with reference to the accompanying drawings.

[0028] like Figures 1 to 5 As shown, an embodiment of this disclosure provides a sensor for measuring absolute pressure, comprising a connector 1 and a housing 2. The connector 1 is attached to the top of the housing 2 and may be made of plastic. The housing 2 is typically made of metal. A sensor port 3 is defined at the bottom of the housing 2, the sensor port 3 being configured to receive a fluid medium. Thus, the connector 1, the housing 2, and the sensor port 3 together define the internal cavity of the sensor.

[0029] Furthermore, an electronic module assembly (EMA) 4 and a pressure detection module are encapsulated within the sensor's internal cavity. The pressure detection module includes a pressure sensing element 5 and a back pressure measurement unit 9. The pressure sensing element 5 is configured to detect the relative pressure value of the fluid medium in the sensor port 3 relative to the back pressure of the pressure sensing element 5. The pressure sensing element 5 may be a ceramic pressure sensing element. The back pressure measurement unit 9 is configured to detect the absolute pressure value of the back pressure of the pressure sensing element 5. Preferably, the back pressure measurement unit 9 may be a microelectromechanical system module (MEMS die).

[0030] Electronic module 4 is configured to generate a pressure detection electrical signal based on the relative pressure value detected by pressure sensing element 5 and the absolute pressure value detected by back pressure measuring unit 9. For example, electronic module 4 can generate the pressure detection electrical signal based on the sum of the relative pressure value detected by pressure sensing element 5 and the absolute pressure value detected by back pressure measuring unit 9. By measuring the absolute pressure value of the back pressure by back pressure measuring unit 9, and by electronic module 4 generating the pressure detection electrical signal based on the relative pressure value detected by pressure sensing element 5 and the absolute pressure value detected by back pressure measuring unit 9, the adverse effects of back pressure fluctuations on the pressure detection accuracy of the sensor can be avoided.

[0031] like Figures 3 to 5 As shown, the back pressure measurement unit 9 can be disposed on the electronic module assembly 4. For example, the electronic module assembly 4 includes a printed circuit board and a processing chip 11 (see...). Figure 5 The back pressure measuring unit 9 can be bonded to the processing chip 11 and electrically connected to the processing chip 11 via a first bonding wire. The electronic module assembly 4 may also include a protective housing 10. The protective housing 10 is typically made of plastic and can be glued to the printed circuit board. It has an opening in the center and is configured to protect the back pressure measuring unit 9 and the first bonding wire. Additionally, the pressure sensing element 5 can be electrically connected to the electronic module assembly 4 via a second bonding wire.

[0032] like Figure 1 and Figure 2 As shown, the sensor according to this disclosure may further include components such as a spring 6, a sealing ring 7, and a support ring 8. The sealing ring 7 is configured to seal the internal cavity of the sensor from the external environment. The spring 6 and the support ring 8 are configured to support the relevant components.

[0033] The sensor according to this disclosure can be not only a pressure sensor for measuring absolute pressure, but also an integrated pressure and temperature sensor. That is, the sensor according to this disclosure can include a temperature detection module encapsulated in an internal cavity, the temperature detection module being configured to detect the temperature of the fluid medium and generate a temperature signal. The electronic module assembly 4 is capable of generating a temperature detection electrical signal based on the temperature signal.

[0034] The pressure detection electrical signal and / or temperature detection electrical signal generated by the electronic module component 4 can be output to the client host computer (e.g., ECU) for subsequent processing.

[0035] Compared with existing sensors, the sensor described in this disclosure measures the absolute pressure value of the back pressure through a back pressure measurement unit, and generates a pressure detection electrical signal based on the relative pressure value detected by the pressure sensing element and the absolute pressure value detected by the back pressure measurement unit, thereby avoiding adverse effects on the pressure detection accuracy of the sensor due to back pressure fluctuations.

[0036] Although this disclosure has been described with reference to exemplary embodiments, it should be understood that this disclosure is not limited to the exemplary embodiments described above. Various variations and modifications can be made to the exemplary embodiments described above without departing from the scope and definition of this disclosure. The appended claims should be interpreted in the broadest possible sense to include all such variations and equivalent structures and functions.

Claims

1. A sensor for measuring absolute pressure, characterized in that, The sensor includes: A housing, the bottom of which defines a sensor port configured to receive a fluid medium; A connector is attached to the top of the housing, and the housing, the connector, and the sensor port together define the internal cavity of the sensor; A pressure detection module encapsulated within the cavity includes a pressure sensing element and a back pressure measuring unit. The pressure sensing element is configured to detect the relative pressure value of the fluid medium relative to the back pressure of the pressure sensing element, and the back pressure measuring unit is configured to detect the absolute pressure value of the back pressure. An electronic module assembly encapsulated in the cavity, the electronic module assembly being configured to generate a pressure detection electrical signal based on the relative pressure value and the absolute pressure value.

2. The sensor according to claim 1, characterized in that, The electronic module generates the pressure detection electrical signal based on the sum of the relative pressure value and the absolute pressure value.

3. The sensor according to claim 2, characterized in that, The back pressure measurement unit is mounted on the electronic module assembly.

4. The sensor according to claim 3, characterized in that, The electronic module assembly includes a printed circuit board and a processing chip, and the back pressure measurement unit is bonded to the processing chip and electrically connected to the processing chip via a first bonding wire.

5. The sensor according to claim 4, characterized in that, The electronic module assembly also includes a protective housing configured to protect the back pressure measuring unit and the first binding wire.

6. The sensor according to any one of claims 1 to 5, characterized in that, The back pressure measurement unit is a microelectromechanical system module.

7. The sensor according to claim 6, characterized in that, The pressure sensing element is electrically connected to the electronic module assembly via a second binding wire.

8. The sensor according to any one of claims 1 to 5, characterized in that, The sensor also includes a sealing ring configured to seal the internal cavity of the sensor from the external environment.

9. The sensor according to any one of claims 1 to 5, characterized in that, The sensor also includes a temperature detection module encapsulated in the cavity, the temperature detection module being configured to detect the temperature of the fluid medium and generate a temperature signal.

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