A ceramic body chip support tube pressure sensor base

CN224906189UActive Publication Date: 2026-10-27BENGBU CHUANGYE ELECTRONICS
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Patent Information

Application Number
CN202522677686.4
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-12-17
Publication Date
2026-10-27
Estimated Expiration
2035-12-17

AI Technical Summary

Technical Problem

现有技术中,尚未出现通过独立支撑结构隔离芯片与基座壳体的方案,无法兼顾绝缘性、抗干扰性与安装稳定性

Benefits of technology

本实用新型通过在基座壳体的安装槽内设置陶瓷材质的芯片支撑管,实现了传感器芯片与基座壳体的物理隔离,彻底避免了芯片与基座壳体的直接接触,借助陶瓷本身的绝缘、抗电磁干扰特性,大幅降低了基座壳体对传感器芯片的电磁干扰,同时陶瓷材质配合其内壁烧结的第一玻璃绝缘子,进一步提升了传感器芯片所处区域的绝缘性能,有效规避了漏电风险,保障了芯片工作的稳定性;其次,由于芯片支撑管能够对传感器芯片起到稳定的定位支撑作用,相比传统直接粘接于基座壳体的方式,大幅减少了用于固定芯片的胶水用量,从而降低了胶水的理化特性对传感器芯片检测精度、响应速度等核心性能的不利影响,提升了整个基座结构的可靠性,实现了绝缘性提升、抗干扰性增强、胶水影响降低、检测精度提高的多重技术效果,在压力传感器领域具有较高的实用价值。

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Abstract

The utility model discloses a kind of ceramic body chip support pipe pressure sensor pedestals, it is related to sensor technical field, and it includes: pedestal shell, oil filling cavity is provided in the bottom of pedestal shell, installation groove is equipped in oil filling cavity, chip support pipe is provided in installation groove;The material of chip support pipe is ceramic, sensor chip is installed on chip support pipe and does not directly contact with pedestal shell.Affirmative effect: by setting ceramic material chip support pipe in the installation groove of pedestal shell, the physical isolation of sensor chip and pedestal shell is realized, direct contact of chip and pedestal shell is completely avoided, with the insulation, anti-electromagnetic interference characteristics of ceramic itself, the electromagnetic interference of pedestal shell to sensor chip is greatly reduced, while ceramic material cooperates with the first glass insulator sintered in its inner wall, further improve the insulation performance of the area where sensor chip is located, effectively avoid the risk of electric leakage, ensure the stability of chip work.
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Description

Technical Field

[0001] This utility model relates to the field of sensor technology, specifically to a ceramic chip support tube pressure sensor base. Background Technology

[0002] Existing pressure sensors typically use a one-piece metal base, with the sensor chip directly mounted in a mounting slot within the base housing. Because the metal base is in close contact with the chip, it can easily cause electromagnetic interference and insufficient insulation. Furthermore, the chip requires extensive adhesive bonding, and the physicochemical properties of the adhesive can affect the chip's detection accuracy and stability. Currently, there is no solution that uses an independent support structure to isolate the chip from the base housing, making it impossible to simultaneously achieve insulation, interference resistance, and installation stability.

[0003] No effective solutions have yet been proposed to address the problems in the relevant technologies. Utility Model Content

[0004] In view of the problems in related technologies, the purpose of this utility model is to propose a ceramic chip support tube pressure sensor base to overcome the above-mentioned technical problems existing in the existing related technologies.

[0005] The technical solution of this utility model is implemented as follows: A ceramic chip support tube pressure sensor base includes: a base housing, an oil-filled cavity at the bottom of the base housing, an installation groove in the oil-filled cavity, and a chip support tube disposed in the installation groove; The chip support tube is made of ceramic, and the sensor chip is mounted on the chip support tube without directly contacting the base housing.

[0006] Furthermore, a first glass insulator is sintered on the outside of the chip support tube, and the first glass insulator is sintered in the mounting groove.

[0007] Furthermore, the oil-filled cavity and the mounting groove are coaxially arranged.

[0008] Furthermore, several sets of leads arranged in a ring are also inserted inside the base housing, with the ends of the leads penetrating the base housing and extending into the oil-filled cavity.

[0009] Furthermore, a second glass insulator is sintered on the outside of each lead wire.

[0010] Furthermore, the base housing is also provided with a brazing gas pipe, which is connected to the oil filling chamber.

[0011] The beneficial effects of this utility model are: This invention achieves physical isolation between the sensor chip and the base housing by setting a ceramic chip support tube in the mounting groove of the base housing, completely avoiding direct contact between the chip and the base housing. Utilizing the insulating and anti-electromagnetic interference properties of ceramic itself, the electromagnetic interference from the base housing to the sensor chip is significantly reduced. Simultaneously, the ceramic material, combined with the first glass insulator sintered on its inner wall, further enhances the insulation performance of the area where the sensor chip is located, effectively avoiding the risk of leakage and ensuring the stability of chip operation. Secondly, because the chip support tube provides stable positioning and support for the sensor chip, compared to the traditional method of directly bonding it to the base housing, the amount of adhesive used to fix the chip is significantly reduced. This reduces the adverse effects of the adhesive's physicochemical properties on the sensor chip's core performance such as detection accuracy and response speed, improving the reliability of the entire base structure. This invention achieves multiple technical effects, including improved insulation, enhanced anti-interference, reduced adhesive influence, and improved detection accuracy, and has high practical value in the field of pressure sensors.

[0012] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention are realized and obtained through the structures particularly pointed out in the description and the accompanying drawings.

[0013] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the structure of the ceramic chip support tube pressure sensor base according to an embodiment of the present invention; Figure 2 This is a top view schematic diagram of the ceramic chip support tube pressure sensor base according to an embodiment of the present utility model; Figure 3 yes Figure 2 AA section view diagram.

[0016] In the picture: 1. Base housing; 2. Oil-filled cavity; 3. Mounting groove; 4. Chip support tube; 5. First glass insulator; 6. Lead wire; 7. Brazing gas pipe; 8. Second glass insulator. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model are within the protection scope of the present utility model.

[0018] According to an embodiment of the present invention, a ceramic chip support tube pressure sensor base is provided.

[0019] like Figures 1-3 As shown, a ceramic chip support tube pressure sensor base includes: a base housing 1, an oil-filled cavity 2 at the bottom of the base housing, an installation groove 3 inside the oil-filled cavity 2, and a chip support tube 4 inside the installation groove 3. The chip support tube 4 is made of ceramic, and the sensor chip is mounted on the chip support tube 4 without directly contacting the base housing 1.

[0020] In addition, a first glass insulator 5 is sintered on the outside of the chip support tube 4, and the first glass insulator 5 is sintered in the mounting groove 3. Several sets of leads 6 arranged in a ring are also inserted in the base housing 1, and the ends of the leads 6 pass through the base housing 1 and extend into the oil filling cavity 2.

[0021] In addition, a second glass insulator 8 is sintered on the outside of each lead wire 6.

[0022] Meanwhile, a brazing gas pipe 7 is also provided inside the base housing 1, and the brazing gas pipe 7 is connected to the oil filling chamber 2.

[0023] Using the above scheme, the base housing 1 is made of metal, and an oil-filling cavity 2 and an installation groove 3 are sequentially opened, with each groove being coaxially arranged; a ceramic chip support tube 4 is embedded in the installation groove 3, and a first glass insulator 5 is fixed in the installation groove 3 by sintering to fix the chip support tube 4; the sensor chip is installed on the chip support tube 4 and fixed with a small amount of glue to ensure that the chip does not contact the base housing 1; the oil-filling cavity 2 is filled with pressure medium through a brazing gas pipe, and the lead wire 6 passes through the base housing 1 and is electrically connected to the chip.

[0024] In summary, by utilizing the above-described technical solution of this utility model, the following effects can be achieved: This invention achieves physical isolation between the sensor chip and the base housing by setting a ceramic chip support tube in the mounting groove of the base housing, completely avoiding direct contact between the chip and the base housing. Utilizing the insulating and anti-electromagnetic interference properties of ceramic itself, the electromagnetic interference from the base housing to the sensor chip is significantly reduced. Simultaneously, the ceramic material, combined with the first glass insulator sintered on its inner wall, further enhances the insulation performance of the area where the sensor chip is located, effectively avoiding the risk of leakage and ensuring the stability of chip operation. Secondly, because the chip support tube provides stable positioning and support for the sensor chip, compared to the traditional method of directly bonding it to the base housing, the amount of adhesive used to fix the chip is significantly reduced. This reduces the adverse effects of the adhesive's physicochemical properties on the sensor chip's core performance such as detection accuracy and response speed, improving the reliability of the entire base structure. This invention achieves multiple technical effects, including improved insulation, enhanced anti-interference, reduced adhesive influence, and improved detection accuracy, and has high practical value in the field of pressure sensors.

[0025] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A ceramic chip support tube pressure sensor base, characterized in that, include: The base housing (1) has an oil-filled cavity (2) at the bottom, an installation groove (3) is provided in the oil-filled cavity (2), and a chip support tube (4) is provided in the installation groove (3). The chip support tube (4) is made of ceramic, and the sensor chip is mounted on the chip support tube (4) without directly contacting the base housing (1).

2. The ceramic chip support tube pressure sensor base according to claim 1, characterized in that, The chip support tube (4) has a first glass insulator (5) sintered on its exterior, and the first glass insulator (5) is sintered in the mounting groove (3).

3. The ceramic chip support tube pressure sensor base according to claim 2, characterized in that, The oil filling chamber (2) and the mounting groove (3) are coaxially arranged.

4. The ceramic chip support tube pressure sensor base according to claim 1, characterized in that, Several sets of lead wires (6) arranged in a ring are also inserted inside the base housing (1). The ends of the lead wires (6) pass through the base housing (1) and extend into the oil filling cavity (2).

5. The ceramic chip support tube pressure sensor base according to claim 4, characterized in that, The lead wire (6) is sintered with a second glass insulator (8) on its exterior.

6. The ceramic chip support tube pressure sensor base according to claim 1, characterized in that, The base housing (1) is also provided with a brazing gas pipe (7), which is connected to the oil filling chamber (2).