Heating disc detection device

Abstract

The application discloses a heating disc detection device, which comprises a base, a cavity with an opening, and a spraying assembly. The spraying assembly comprises a main body which is detachably connected to the base and seals the opening. A cooling flow channel is arranged in the main body, and a liquid inlet interface and a liquid outlet interface are arranged on the main body to enable temperature control fluid to circulate along the cooling flow channel. In the application, the overall temperature of the spraying assembly can be adjusted through the cooling flow channel, so that the spraying assembly can stably spray, the temperature adjustment is more flexible, and the detection is facilitated. The spraying assembly can be rapidly cooled through the cooling flow channel, the spraying assembly can be conveniently taken down by an operator, the detection rhythm is accelerated, and the production efficiency is improved.

Description

Technical Field

[0001] This application relates to the technical field of thin film deposition equipment testing, and more particularly to a heating plate testing device. Background Technology

[0002] The heating plate is a core component in thin film deposition equipment. Thin film deposition equipment typically includes a vacuum chamber with a gas dispersion plate (also known as a spray assembly) at the top. The heating plate is located below the gas dispersion plate in the vacuum chamber. During thin film deposition, deposition gas is sprayed downward from the gas dispersion plate. The wafer is placed on the upper surface of the heating plate, and the deposition gas grows and reacts on the wafer surface to form a thin film.

[0003] The heating uniformity of the heating plate is a core indicator for measuring its performance. Therefore, after the heating plate is manufactured, it is generally necessary to conduct factory performance testing, mainly to verify the heating uniformity performance of the heating plate.

[0004] The testing mainly includes two types: First, the testing of the surface temperature uniformity of the heating plate itself. In this case, no wafer is placed on the surface of the heating plate. The heating plate is placed in the testing device, and the surface temperature of the heating plate is directly measured. Second, the testing of the surface temperature uniformity of the wafer when the heating plate heats the wafer. In this case, a wafer is placed on the heating plate, and the surface temperature uniformity of the wafer is measured.

[0005] In some technologies, such as the Chinese invention patent application with publication number CN119327662A, the spray assembly is made detachable. When testing the first scenario, the spray assembly is not installed, and when testing the second scenario, the spray assembly is installed and tested using two different temperature detection methods. This allows for convenient testing of both methods on a single device, reducing costs.

[0006] However, this testing method still has shortcomings. In the second testing method, in order to simulate the actual use scenario, the temperature inside the vacuum chamber will rise to a very high level. After the test, it is necessary to wait for the spray assembly to cool down before disassembly and assembly can be carried out, which greatly reduces production efficiency. If cold air is introduced, it will cause problems such as oxidation of the heating plate surface and the need to re-evacuate the vacuum chamber. Utility Model Content

[0007] This application provides a heating plate detection device to improve production efficiency and reduce production costs.

[0008] A heating plate detection device includes: a base with an open chamber; a spray assembly including a main body, the main body being detachably connected to the base and sealing the opening; wherein, a cooling channel is provided inside the main body, and an inlet and an outlet are provided on the main body for temperature-controlled fluid to circulate along the cooling channel.

[0009] To achieve the above technical solution, firstly, during the testing process, the vacuum chamber is at a high temperature, and the spray assembly is also at a high temperature due to the introduction of high-temperature gas and the heat radiation from the heating plate. In this application, the overall temperature of the spray assembly can be adjusted through the cooling channel, thereby ensuring a stable spraying state and making temperature adjustment more flexible, which is convenient for testing. Secondly, after the wafer temperature uniformity testing process is completed, the spray assembly needs to be removed, and then the temperature uniformity of the heating plate itself needs to be tested. At this time, the cooling channel can quickly cool down the spray assembly, making it easier for operators to remove the spray assembly, speeding up the testing cycle and improving production efficiency.

[0010] As one of the optional embodiments of this solution, the main body includes a base and a cooling section. The base is detachably connected to the base. The cooling section is provided with an open cooling groove. The cooling section is sealed to the side of the base away from the chamber, so that a cooling channel is formed between the cooling groove and the base.

[0011] The above technical solution simplifies the formation of the cooling channel. If the cooling channel is machined on an integrated main structure, it is difficult to machine an annular curve, which is difficult to match the requirements of smooth fluid flow. This method greatly reduces the processing difficulty and production cost, while ensuring cooling efficiency.

[0012] As one of the optional embodiments of this solution, a sealing groove is provided on the side of the base part away from the cavity, and a sealing ring is embedded in the sealing groove. The cooling part is bolted to the base part and pressed onto the sealing ring to achieve a seal.

[0013] The above technical solution allows for a detachable connection between the base and the cooling section, which facilitates the removal of the cooling section from the base, making maintenance and repair easier during use, improving the overall service life of the device, and making the processing of structures such as sealing grooves and sealing rings more convenient, thus significantly reducing production costs.

[0014] As one of the optional embodiments of this solution, a partition is provided inside the cooling section, which divides the cooling tank into an inlet area and an outlet area. When the cooling section is installed on the base, the inlet area cooperates with the base to form an inlet channel, and the outlet area cooperates with the base to form an outlet channel.

[0015] As one of the optional embodiments of this solution, the liquid inlet and the liquid outlet are respectively located on both sides of the partition and are close to each other.

[0016] To achieve the above technical solution, only one partition is needed inside the cooling tank to divide it into an inlet channel and an outlet channel. The structure is simple and easy to process, which greatly reduces the processing cost. Furthermore, the inlet and outlet interfaces are set close to each other, which allows the low temperature of the inlet liquid and the high temperature of the outlet liquid to be properly neutralized, reducing the temperature difference near the partition and reducing thermal fatigue damage.

[0017] As one of the optional embodiments of this solution, the spray assembly further includes a spray section, which is detachably connected to the side of the base section near the chamber, and a dispersion cavity is formed between the spray section and the base section.

[0018] As one of the optional embodiments of this solution, the spray assembly further includes a connecting plate and a connector. The connecting plate is detachably connected to the side of the base portion away from the chamber, and the connector is used to connect to the air inlet pipe.

[0019] As one of the optional embodiments of this solution, the connector is threaded onto the connecting disc.

[0020] To achieve the above technical solution, when installing the external pipe, first screw the connector threaded onto the connecting plate, and then snap the external pipe onto the connector. Alternatively, in some other examples, the connector and the external pipe are also threaded. In this case, first screw the connector threaded onto the external pipe, then align it with the threaded hole on the connecting plate, and screw the connector threaded onto the connecting plate. This connection method has a simple structure, is easy to disassemble and maintain, and the connection between the connecting plate and the base is also detachable, further improving the convenience of disassembly and maintenance.

[0021] As one of the optional embodiments of this solution, a snap-fit ​​protrusion is provided on the side of the base near the chamber, and the snap-fit ​​protrusion contacts the inner peripheral sidewall of the chamber.

[0022] To achieve the above technical solution, the base part can be installed more accurately through the snap-fit ​​protrusion. Operators or machines can accurately place the spray assembly without special positioning operations, and the fit between the snap-fit ​​protrusion and the inner wall of the opening can ensure the stability of the spray assembly.

[0023] As one of the optional embodiments of this solution, the base is provided with a positioning groove, the base is provided with a plurality of positioning blocks, one end of the positioning block is bolted to the base, and the other part of the positioning block is embedded in the positioning groove and bolted to the base.

[0024] To achieve the above technical solution, the snap-fit ​​protrusion restricts the displacement of the spray assembly along the plane, while the positioning block further limits the angle of the spray assembly. During installation, the operator can uniquely determine the position of the spray assembly through the restriction of the snap-fit ​​protrusion and the positioning block, which facilitates installation and maintenance, ensures the consistency of the spray assembly before and after maintenance, reduces external influence on the inspection, and improves the accuracy of the inspection.

[0025] One of the above technical solutions has the following advantages or beneficial effects: During the testing process, the vacuum chamber is in a high-temperature state, and the spray assembly is also in a high-temperature state due to the introduction of high-temperature gas and the effect of heat radiation from the heating plate. In this application, the overall temperature of the spray assembly can be adjusted through the cooling channel, thereby ensuring a stable spraying state of the spray assembly and making temperature adjustment more flexible, which is convenient for testing. Furthermore, after the wafer temperature uniformity testing process is completed, the spray assembly needs to be removed, and then the temperature uniformity of the heating plate itself needs to be tested. At this time, the cooling channel can quickly cool down the spray assembly, making it easier for operators to remove the spray assembly, speeding up the testing cycle and improving production efficiency. Attached Figure Description

[0026] The technical solution and other beneficial effects of this application will become apparent from the following detailed description of specific embodiments in conjunction with the accompanying drawings.

[0027] Figure 1 This is an overall structural diagram provided in the embodiments of this application; Figure 2 This is an overall cross-sectional view provided in the embodiments of this application; Figure 3 This is a cross-sectional view provided in an embodiment of this application, primarily used to illustrate the spray assembly; Figure 4 This is a structural diagram provided in an embodiment of this application to illustrate the cooling section.

[0028] Reference numerals: 1. Base; 10. Chamber; 2. Spray assembly; 21. Main body; 21a. Liquid inlet; 21b. Liquid outlet; 211. Base; 2111. Sealing groove; 2112. Engraving protrusion; 212. Cooling section; 2121. Cooling tank; 2122. Partition; 210. Cooling channel; 23. Spray section; 230. Dispersion chamber; 24. Connecting plate; 25. Connector; 31. Positioning groove; 32. Positioning block. Detailed Implementation

[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0030] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the term "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Furthermore, the character " / " in this document, unless otherwise specified, generally indicates that the preceding and following related objects have an "or" relationship.

[0031] Background Analysis The heating plate is a core component in thin film deposition equipment. Thin film deposition equipment typically includes a vacuum chamber 10, with a gas dispersion plate (also called a spray assembly 2) installed at the top of the vacuum chamber 10. The heating plate is located below the gas dispersion plate in the vacuum chamber 10. During thin film deposition, deposition gas is sprayed downward from the gas dispersion plate, and the wafer is placed on the upper surface of the heating plate. The deposition gas grows and reacts on the wafer surface to form a thin film.

[0032] The heating uniformity of the heating plate is a core indicator for measuring its performance. Therefore, after the heating plate is manufactured, it is generally necessary to conduct factory performance testing, mainly to verify the heating uniformity performance of the heating plate.

[0033] The testing mainly includes two types: First, the testing of the surface temperature uniformity of the heating plate itself. In this case, no wafer is placed on the surface of the heating plate. The heating plate is placed in the testing device, and the surface temperature of the heating plate is directly measured. Second, the testing of the surface temperature uniformity of the wafer when the heating plate heats the wafer. In this case, a wafer is placed on the heating plate, and the surface temperature uniformity of the wafer is measured.

[0034] In some technologies, such as the Chinese invention patent application with publication number CN119327662A, the spray assembly 2 is made detachable. When detecting the first scenario, the spray assembly 2 is not installed. When detecting the second scenario, the spray assembly 2 is installed and the detection is carried out by two different temperature detection methods. This allows for convenient detection of two methods on one device, reducing costs.

[0035] However, this testing method still has shortcomings. In the second testing method, in order to simulate the actual use scenario, the temperature inside the vacuum chamber 10 will rise to a very high level. After the test is completed, it is necessary to wait for the spray assembly 2 to cool down before disassembly and assembly can be carried out, which greatly reduces production efficiency. If cold air is introduced, it will cause problems such as oxidation of the heating plate surface and the need to re-evacuate the vacuum chamber 10.

[0036] It should be understood that the patent documents published above already show a flip-top structure above the base 1. The heating plate detection device involved in this application also has a flip-top structure, which will not be elaborated here.

[0037] The following is in conjunction with the appendix Figure 1-4 This application will be further described below.

[0038] Reference Figures 1-3 A heating plate detection device includes: a base 1 and a chamber 10 with an opening; a spray assembly 2 including a main body 21, the main body 21 being detachably connected to the base 1 and sealing the opening; wherein, a cooling channel 210 is provided inside the main body 21, and a liquid inlet 21a and a liquid outlet 21b are provided on the main body 21 for temperature-controlled fluid to circulate along the cooling channel 210.

[0039] To achieve the above technical solution, firstly, during the testing process, the vacuum chamber 10 is in a high-temperature state, and the spray assembly 2 is also in a high-temperature state due to the introduction of high-temperature gas and the heat radiation from the heating plate. In this application, the overall temperature of the spray assembly 2 can be adjusted through the cooling channel 210, thereby ensuring a stable spraying state of the spray assembly 2 and making temperature adjustment more flexible and convenient for testing. Secondly, after the wafer temperature uniformity testing process is completed, the spray assembly 2 needs to be removed, and then the temperature uniformity of the heating plate itself needs to be tested. At this time, the cooling channel 210 can quickly cool down the spray assembly 2, making it easier for operators to remove the spray assembly 2, speeding up the testing cycle and improving production efficiency.

[0040] As one of the optional embodiments of this solution, the main body 21 includes a base part 211 and a cooling part 212. The base part 211 is detachably connected to the base 1. The cooling part 212 is provided with an open cooling groove 2121. The cooling part 212 and the side of the base part 211 away from the chamber 10 are sealed together so that a cooling channel 210 is formed between the cooling groove 2121 and the base part 211.

[0041] To achieve the above technical solution, the formation of this cooling channel 210 is simpler. If the cooling channel 210 is processed on the integrated main body 21 structure, it is difficult to process an annular curve, which is difficult to match the requirements of smooth fluid flow. This method greatly reduces the processing difficulty and production cost, while ensuring cooling efficiency.

[0042] Understandably, in some alternative examples, if the main body 21 is also feasible as an integrated structure, the cooling channel 210 can be formed inside the main body 21. For example, the main body 21 includes upper and lower layers welded together, with a cavity in the middle forming the cooling channel 210. Alternatively, the cooling channel 210 can be formed by drilling holes from the side wall of the main body 21 inwards, with holes drilled from multiple directions. In this case, the cooling channel 210 is composed of rectangles or other straight channels, and the ends of the drilled holes can be blocked.

[0043] As one of the optional embodiments of this solution, a sealing groove 2111 is provided on the side of the base part 211 away from the chamber 10. A sealing ring is embedded in the sealing groove 2111. The cooling part 212 is bolted to the base part 211 and pressed onto the sealing ring to achieve sealing.

[0044] To achieve the above technical solution, the base part 211 and the cooling part 212 are detachably connected, which makes it easy to remove the cooling part 212 from the base part 211, facilitating maintenance and repair during use, improving the overall service life of the device, and making the processing of structures such as the sealing groove 2111 and the sealing ring more convenient, significantly reducing production costs.

[0045] Reference Figure 3 and Figure 4 As one of the optional embodiments of this solution, a partition 2122 is provided inside the cooling section 212. The partition 2122 divides the cooling tank 2121 into an inlet area and an outlet area. When the cooling section 212 is installed on the base section 211, the inlet area and the base section 211 cooperate to form an inlet channel, and the outlet area and the base section 211 form an outlet channel.

[0046] It should be noted that the inlet channel and the outlet channel are interconnected in this embodiment of the application. The inlet channel refers to the portion of the cooling channel near the inlet port 21a, and the outlet channel refers to the portion of the cooling channel near the outlet port 21b. In some examples, "partial length" refers to half of the cooling channel.

[0047] As one of the optional embodiments of this solution, the cooling section 212 is provided with an inlet port 21a that communicates with the liquid inlet channel, and an outlet port 21b that communicates with the liquid outlet channel. The inlet port 21a and the outlet port 21b are respectively located on both sides of the partition 2122 and are arranged close to each other.

[0048] To achieve the above technical solution, the cooling tank 2121 only needs to be divided into an inlet channel and an outlet channel by a partition 2122. The structure is simple and easy to process, which greatly reduces the processing cost. Furthermore, the inlet interface 21a and the outlet interface 21b are set close to each other, which allows the low temperature of the inlet liquid and the high temperature of the outlet liquid to be properly neutralized, reducing the temperature difference near the partition 2122 and reducing thermal fatigue damage.

[0049] As one of the optional embodiments of this solution, the spray assembly 2 further includes a spray section 23, which is detachably connected to the side of the base section 211 near the chamber 10, and a dispersion cavity 230 is formed between the spray section 23 and the base section 211.

[0050] As one of the optional embodiments of this solution, the spray assembly 2 also includes a connecting plate 24 and a connector 25. The connecting plate 24 is detachably connected to the side of the base 211 away from the chamber 10, and the connector 25 is used to connect to the air inlet pipe.

[0051] As one of the optional embodiments of this solution, the connector 25 is threaded onto the connecting disc 24.

[0052] To achieve the above technical solution, when installing the external connector, first screw the connector 25 onto the connecting plate 24, and then snap the external connector onto the connector 25. Alternatively, in some other examples, the connector 25 and the external connector are also threaded. In this case, first screw the connector 25 onto the external connector, then align it with the threaded hole on the connecting plate 24, and screw the connector 25 onto the connecting plate 24. This connection method has a simple structure, is easy to disassemble and maintain, and the connection between the connecting plate 24 and the base 211 is also detachable, further improving the convenience of disassembly and maintenance.

[0053] As one of the optional embodiments of this solution, the base portion 211 is provided with a snap-fit ​​protrusion 2112 on the side near the chamber 10, and the snap-fit ​​protrusion 2112 contacts the inner peripheral sidewall of the chamber 10.

[0054] To achieve the above technical solution, the base part 211 can be installed more accurately through the snap-fit ​​protrusion 2112. Operators or machines can accurately place the spray assembly 2 without special positioning operations. Furthermore, the fit between the snap-fit ​​protrusion 2112 and the inner wall of the opening can ensure the stability of the spray assembly 2.

[0055] As one of the optional embodiments of this solution, the base part 211 is provided with a positioning groove 31, the base 1 is provided with a plurality of positioning blocks 32, one end of the positioning block 32 is bolted to the base 1, and the other part of the positioning block 32 is embedded in the positioning groove 31 and bolted to the base part 211.

[0056] To achieve the above technical solution, the snap-fit ​​protrusion 2112 restricts the displacement of the spray assembly 2 along the plane direction, while the positioning block 32 further limits the angle of the spray assembly 2. During installation, the operator can uniquely determine the position of the spray assembly 2 through the restriction of the snap-fit ​​protrusion 2112 and the positioning block 32, which facilitates installation and maintenance, ensures the consistency of the spray assembly 2 before and after maintenance, reduces the external influence on the detection, and improves the detection accuracy.

[0057] The above description is only a partial implementation of the embodiments of this application and is not intended to limit the application in any way. The protection scope of the embodiments of this application is not limited thereto. Any simple modifications, equivalent changes and alterations that can be easily conceived by those skilled in the art within the technical scope disclosed in the embodiments of this application should be included within the protection scope of the embodiments of this application.

Claims

1. A heating plate detection device, characterized in that, include: The base (1) has an open chamber (10); The spray assembly (2) includes a body (21) which is detachably connected to the base (1) and seals the opening; The main body (21) is provided with a cooling channel (210), and the main body (21) is provided with a liquid inlet (21a) and a liquid outlet (21b) for temperature-controlled fluid to circulate along the cooling channel (210).

2. The heating plate detection device as described in claim 1, characterized in that, The main body (21) includes a base part (211) and a cooling part (212). The base part (211) is detachably connected to the base (1). The cooling part (212) is provided with an open cooling groove (2121). The cooling part (212) is sealed to the side of the base part (211) away from the chamber (10) so that a cooling channel (210) is formed between the cooling groove (2121) and the base part (211).

3. The heating plate detection device as described in claim 2, characterized in that, The base part (211) has a sealing groove (2111) on one side away from the chamber (10). A sealing ring is embedded in the sealing groove (2111). The cooling part (212) is bolted to the base part (211) and pressed onto the sealing ring to achieve a seal.

4. The heating plate detection device as described in claim 3, characterized in that, The cooling section (212) is provided with a partition (2122), which divides the cooling tank (2121) into an inlet area and an outlet area. When the cooling section (212) is installed on the base (211), the inlet area and the base (211) cooperate to form an inlet channel, and the outlet area and the base (211) form an outlet channel.

5. The heating plate detection device as described in claim 4, characterized in that, The liquid inlet (21a) and the liquid outlet (21b) are respectively located on both sides of the partition (2122) and are close to each other.

6. The heating plate detection device as described in claim 2, characterized in that, The spray assembly (2) further includes a spray section (23), which is detachably connected to the side of the base section (211) near the chamber (10), and a dispersion chamber (230) is formed between the spray section (23) and the base section (211).

7. The heating plate detection device as described in claim 6, characterized in that, The spray assembly (2) also includes a connecting plate (24) and a connector (25). The connecting plate (24) is detachably connected to the side of the base (211) away from the chamber (10), and the connector (25) is used to connect to the air intake pipe.

8. The heating plate detection device as described in claim 7, characterized in that, The connector (25) is threaded onto the connector (24).

9. The heating plate detection device as described in claim 2, characterized in that, The base portion (211) is provided with a snap-fit ​​protrusion (2112) on the side near the chamber (10), and the snap-fit ​​protrusion (2112) contacts the inner peripheral sidewall of the chamber (10).

10. The heating plate detection device as described in claim 9, characterized in that, The base part (211) is provided with a positioning groove (31), and the base (1) is provided with a plurality of positioning blocks (32). One end of the positioning block (32) is bolted to the base (1), and the other part of the positioning block (32) is inserted into the positioning groove (31) and bolted to the base part (211).

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