Linear scan light source switching mechanism for automated optical inspection apparatus

Abstract

The utility model discloses a linear scanning light source switching mechanism of automatic optical detection equipment mainly is to make a movable wafer carrier and a wafer transposition device each other mutually cooperate with, and set up a linear scanning device at the front or back of wafer carrier, the wafer transposition device has a positioning end and an interface, the positioning end is set up a wafer, the linear scanning device is used for the bright field image acquisition and dark field image acquisition of the wafer of switchable, wherein, when the wafer carrier will the wafer from the positioning end removes and turns to the interface, the linear scanning device is just to the bright field image acquisition of the wafer, and when the wafer carrier will the wafer from the interface removes and turns to the positioning end, the linear scanning device is just to the dark field image acquisition of the wafer. Through the design of special switching mechanism, can promote the detection efficiency and stability.

Description

Technical Field

[0001] This utility model relates to an automatic optical inspection device, and more particularly to a linear scanning light source switching mechanism for an automatic optical inspection device. Background Technology

[0002] In existing Automated Optical Inspection (AOI) equipment, a linear scanning device is often used. For example, Taiwan Invention Patent Certificate No. I853368 describes a linear scanning device for an automated optical inspection equipment. It mainly consists of a linear scanner, a linear mover, and a rotator. The linear scanner is composed of at least two light sources and an image acquisition device, and the image acquisition device is fixed. The whole system must be controlled by the interaction of at least two light sources, the linear mover (servo motor), and the rotator to control the bright field and dark field.

[0003] However, in the prior art, a suction cup is usually used to move a wafer to the linear scanning device. This displacement process affects the detection efficiency. Furthermore, the existing linear scanning device needs to flip the wafer using the rotator to complete the imaging of the bright field on the front side and the dark field on the back side. Errors are prone to occur during the flipping process, and the speed must be slow. Therefore, the two-station architecture of transferring the wafer to the linear scanning device in the prior art has poor overall process efficiency, complex flipping action, and high risk.

[0004] Therefore, it is indeed necessary to propose better solutions to improve the overall mechanical structure in existing technologies. Utility Model Content

[0005] In view of the problems existing in the prior art, the main purpose of this utility model is to provide a linear scanning light source switching mechanism for an automatic optical inspection device, which improves inspection efficiency and safety by utilizing a special hand-changing mechanism design.

[0006] To solve the problems of the prior art, the main technical solution adopted is to make the linear scanning light source switching mechanism of the aforementioned automatic optical inspection equipment include: A movable wafer stage having a first axis for moving a wafer; A linear scanning device is disposed on one front or one back side of the wafer stage and is used to switch between bright-field and dark-field imaging of the wafer. A wafer transposition device having a positioning end and a connecting end, and disposed at both ends of the first axis of the wafer stage; Specifically, when the wafer stage moves the wafer from the positioning end to the junction end, the linear scanning device performs bright-field imaging on the wafer; when the wafer stage moves the wafer from the junction end to the positioning end, the linear scanning device performs dark-field imaging on the wafer.

[0007] Preferably, the wafer stage includes a moving device and a support base, wherein the support base is connected to the moving device.

[0008] Preferably, the support base is in the shape of a hollow disc, and the support base includes an opening on one side and a plurality of supporting members.

[0009] Preferably, most of the support members are detachable and can be repositioned.

[0010] Preferably, the linear scanning device includes a front camera module and a front light source module or a rear camera module and a rear light source module.

[0011] Preferably, the wafer transposition device includes two lifting mechanisms and two receiving parts, the two receiving parts being located on top of the two lifting mechanisms, and the two receiving parts constituting the positioning end and the transfer end.

[0012] Preferably, the lifting mechanism includes a motor, and the receiving part includes a gripper suction cup.

[0013] With the above-described structure, the wafer stage of the linear scanning light source switching mechanism in the automatic optical inspection equipment of this invention is used to move the wafer, and the linear scanning device can be disposed on the front or back of the corresponding wafer. Since the positioning end and the transfer end of the wafer repositioning device are respectively located at both ends of the first axis of the wafer stage, when the wafer stage moves the wafer from the positioning end to the transfer end, the linear scanning device can perform bright-field imaging on the wafer. Furthermore, when the wafer stage directly returns the wafer to the positioning end in a coaxial manner, the linear scanning device can simultaneously perform dark-field imaging on the wafer. Through the design of the special hand-changing mechanism of this invention, the purpose of improving inspection efficiency and stability can be achieved. Attached Figure Description

[0014] Figure 1 This is a block diagram of the architecture of a preferred embodiment of the present utility model; Figure 2 This is a top plan view of a preferred embodiment of the present invention; Figure 3 This is a perspective view of the preferred embodiment of the present invention; Figure 3A This is another perspective view of a preferred embodiment of the present utility model; Figure 4 This is a partial structural diagram of a preferred embodiment of the present invention; Figure 5 This is a flowchart of a control method for single-sided detection according to a preferred embodiment of the present invention. Figures 6 to 8 This is a schematic diagram of a single-sided detection action according to a preferred embodiment of the present invention. Figure 9 This is a flowchart of the control method for double-sided detection according to a preferred embodiment of the present invention. Figures 10 to 12 This is a schematic diagram of the double-sided detection action of a preferred embodiment of the present invention. Detailed Implementation

[0015] For a preferred embodiment of this utility model, please refer to [link / reference]. Figure 1 and Figure 2 As shown, it provides a linear scanning light source switching mechanism 1 for an automatic optical inspection device. The linear scanning light source switching mechanism 1 includes a movable wafer stage 10, a linear scanning device 20, and a wafer transposition device 30. The wafer stage 10 and the wafer transposition device 30 interact and operate with each other, and the wafer stage 10 is disposed between the linear scanning device 20 and the wafer transposition device 30.

[0016] The wafer stage 10 has a first axial direction (X-axis direction) and moves a wafer along the first axial direction (X-axis direction); the linear scanning device 20 is positioned adjacent to the wafer stage 10 along a second axial direction (Z-axis direction), such that the linear scanning device 20 is disposed on a front or back side of the wafer stage 10, and the linear scanning device 20 is used to switch between bright-field and dark-field imaging of the wafer, wherein the imaging angle and light source angle of the linear scanning device 20 are different when performing bright-field and dark-field imaging, therefore the wafer must be displaced along the first axial direction (X-axis direction); the wafer transposition device 30 has a positioning end 301 and a connecting end 302, and is disposed at both ends of the first axial direction (X-axis direction) of the wafer stage 10.

[0017] Once the automated optical inspection equipment starts operating, the wafer is automatically mounted on the positioning end 301 of the wafer repositioning device 30. In this preferred embodiment, when the wafer stage 10 moves the wafer from the positioning end 301 to the transfer end 302, the linear scanning device 20 performs bright-field imaging on the wafer; and when the wafer stage 10 moves the wafer from the transfer end 302 to the positioning end 301, the linear scanning device 20 performs dark-field imaging on the wafer. Therefore, the special hand-changing mechanism design of this utility model can improve inspection efficiency and stability.

[0018] Please refer to Figure 2 and Figure 3 As shown, the linear scanning light source switching mechanism 1 has a side wall 101, on which one or more slide rails 102 are provided. The side wall 101 and the slide rails 102 are used to mount the wafer stage 10 and the linear scanning device 20. In this preferred embodiment, the wafer stage 10 includes a moving device 11 and a support 12. The support 12 is connected to the moving device 11 and is used to support the wafer. The moving device 11 is movably disposed on the slide rails 102 of the side wall 101. The length direction of the slide rails 102 is parallel to the first axial direction (X-axis direction).

[0019] The linear scanning device 20 includes a front camera module 21, a front light source module 22, a rear camera module 23, and a rear light source module 24. The front camera module 21 and the front light source module 22 are movably mounted on the side wall 101 of the linear scanning light source switching mechanism 1 and located on the upper side of the slide rail 102. The rear camera module 23 and the rear light source module 24 are also movably mounted on the side wall 101 of the linear scanning light source switching mechanism 1 and located on the lower side of the slide rail 102. This allows the linear scanning device 20 to simultaneously or separately acquire images of the front and / or back sides of the wafer when the wafer stage 10 moves along the first axial direction (X-axis direction). It can flexibly provide single-sided or double-sided detection and adjust the image acquisition angle and light source angle by moving the device.

[0020] like Figure 2 , Figure 3 and Figure 3A As shown, the wafer transposition device 30 includes two lifting mechanisms 31 and two receiving parts 32. The two receiving parts 32 are respectively disposed on the top of the lifting platform of the two lifting mechanisms 31, and the two receiving parts 32 constitute the positioning end 301 and the transfer end 302 to receive the wafer. In this preferred embodiment, the lifting mechanism 31 includes a motor, and the receiving part 32 includes a gripper suction cup. When performing the single-sided inspection, only the positioning end 301 can move up and down to match the height of the wafer stage 10, while the transfer end 302 remains fixed. In another preferred embodiment, the wafer transposition device 30 may further include two lifting and rotating mechanisms 33 and the aforementioned two receiving parts 32. The connection method and function are the same as in the above embodiment, so they will not be described again. However, when performing the double-sided inspection, the wafer can rotate through the two lifting and rotating mechanisms 33 to avoid the support shield of the carrier 12.

[0021] Please see Figure 4As shown, the wafer stage 10 has a support 12 shaped like a hollow disk. The support 12 includes a side opening 121 and a plurality of support members 122. The side opening 121 is formed on the side of the support 12 and communicates with the interior of the support 12. This allows the support 12 to pass smoothly under the receiving part 32 when it wants to obtain the wafer, and move directly under the wafer without obstruction. The plurality of support members 122 are detachably disposed inside the support 12. In this preferred embodiment, the plurality of support members 122 can be in the shape of a plate or a tooth, and the position of the wafer supported by the plurality of support members 122 can be changed to avoid supporting the obstructed area. The material of the plurality of support members 122 can be a semi-transparent (e.g., translucent or partially transparent) material to help overcome the problem of avoiding obstruction. When the aforementioned wafer rotates through the two lifting and rotating mechanisms 33 to avoid being blocked by the majority of support members 122, a better avoidance and blocking effect can be achieved.

[0022] Please refer to Figure 5 and Figures 6 to 8 As shown, based on the specific application methods of the above-mentioned preferred embodiments, this utility model further summarizes a control method for a linear scanning light source switching mechanism of an automatic optical inspection device, such as... Figures 6 to 8 As shown, this is an application state for single-sided inspection provided in this preferred embodiment. During single-sided inspection, the method is mainly executed on the aforementioned wafer stage 10, linear scanning device 20, and wafer transposition device 30, as follows: Figure 5 As shown, the method includes the following steps: A wafer is moved from the positioning end 301 to the transfer end 302 by the wafer stage 10 along the first axial direction (X-axis direction) (S10). When the wafer passes through the linear scanning device 20, a bright field imaging mode is executed. The linear scanning device 20 first automatically adjusts the bright field imaging angle and the bright field light source angle, and then moves the wafer from the positioning end 301 to the transfer end 302 to complete the bright field imaging of the front side of the wafer (S20). The linear scanning device 20 executes a dark field imaging mode. The linear scanning device 20 first automatically adjusts a dark field imaging angle and a dark field light source angle, and sends the wafer from the transfer end 302 back to the positioning end 301 to complete a dark field imaging of the front side of the wafer and return to the positioning state (S30).

[0023] Please refer to Figure 9 and Figures 10 to 12As shown, based on the specific application methods of the above-mentioned preferred embodiments, this utility model further summarizes another control method for the linear scanning light source switching mechanism of an automatic optical inspection device, such as... Figures 10 to 12 The diagram illustrates an application state for double-sided inspection in this preferred embodiment. During double-sided inspection, the method is primarily executed using the aforementioned wafer stage 10, linear scanning device 20, and wafer transposition device 30, as shown below. Figure 9 As shown, the method includes the following steps: A wafer is moved from the positioning end 301 to the transfer end 302 by the wafer stage 10 along the first axial direction (X-axis direction) (S10). When the wafer passes through the linear scanning device 20, an upper bright field imaging mode and a lower bright field imaging mode are executed. The linear scanning device 20 first automatically adjusts an upper bright field imaging angle, an upper bright field light source angle, a lower bright field imaging angle, and a lower bright field light source angle, and then simultaneously completes upper bright field imaging and lower bright field imaging on the front and back sides of the wafer (S20A). The wafer is lifted and rotated by the junction end 302 of the wafer repositioning device 30 to complete the rotation avoidance or support repositioning, leaving the wafer behind. Only the support seat 12 of the wafer stage 10 is displaced back to the positioning end 301, and the lower bright field image (i.e. bright field reshoot) is performed again (S21A). The linear scanning device 20 executes an upper dark field imaging mode and a lower dark field imaging mode. The linear scanning device 20 first automatically adjusts an upper dark field imaging angle, an upper dark field light source angle, a lower dark field imaging angle, and a lower dark field light source angle. The wafer stage 10 then moves to the junction end 302 to carry the wafer and simultaneously performs an upper dark field imaging and a lower dark field imaging (S30A). The wafer is lifted and rotated by the junction end 302 of the wafer repositioning device 30 to complete the rotation avoidance or support repositioning. Then the wafer is sent back from the junction end 302 to the positioning end 301, and the dark field imaging (i.e. dark field reshoot) is performed again to return to the positioning state (S31A).

[0024] Although the preferred embodiment of this utility model provides the application process for single-sided inspection and double-sided inspection, in reality, the lifting, rotation, avoidance, and hand-changing can all be flexibly configured or adjusted in sequence as needed. The above steps are merely examples and are not intended to limit the scope. This utility model completes the aforementioned lifting, rotation, avoidance, and hand-changing control steps between the wafer repositioning device 30 and the positioning end 301, the transfer end 302, and the linear scanning device 20. In particular, the design of the special hand-changing method and the simplified yet stable control process can indeed improve inspection efficiency and stability.

Claims

1. A linear scanning light source switching mechanism for an automatic optical inspection device, characterized in that, The linear scanning light source switching mechanism of the automatic optical inspection equipment includes: A movable wafer stage having a first axis for moving a wafer; A linear scanning device is disposed on one front or one back side of the wafer stage and is used to switch between bright-field and dark-field imaging of the wafer. A wafer transposition device having a positioning end and a connecting end, and disposed at both ends of the first axis of the wafer stage; Specifically, when the wafer stage moves the wafer from the positioning end to the junction end, the linear scanning device performs bright-field imaging on the wafer; when the wafer stage moves the wafer from the junction end to the positioning end, the linear scanning device performs dark-field imaging on the wafer.

2. The linear scanning light source switching mechanism of the automatic optical inspection equipment according to claim 1, characterized in that, The wafer stage includes a moving device and a support base, and the support base is connected to the moving device.

3. The linear scanning light source switching mechanism of the automatic optical inspection equipment according to claim 2, characterized in that, The support base is in the shape of a hollow disc, and includes an opening on one side and a plurality of supporting members.

4. The linear scanning light source switching mechanism of the automatic optical inspection equipment according to claim 3, characterized in that, Most of the support components are detachable and can be repositioned.

5. The linear scanning light source switching mechanism of the automatic optical inspection equipment according to claim 1, characterized in that, The linear scanning device includes a front camera module and a front light source module or a rear camera module and a rear light source module.

6. The linear scanning light source switching mechanism of the automatic optical inspection equipment according to any one of claims 1 to 5, characterized in that, The wafer transposition device includes two lifting mechanisms and two receiving parts. The two receiving parts are located on top of the two lifting mechanisms and constitute the positioning end and the transfer end.

7. The linear scanning light source switching mechanism of the automatic optical inspection equipment according to claim 6, characterized in that, The lifting mechanism includes a motor, and the receiving part includes a gripper suction cup.

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