A chip detection device

Abstract

The utility model relates to the field of semiconductor technology discloses a chip detection device, include: frame, frame is equipped with multiple feeding position, material handover position and discharge station side by side, the carrier plate that carries the chip is sent into from the feeding position, and is outputted from the discharge station side after passing material handover position, the frame is equipped with first longitudinal track and second longitudinal track along the arrangement direction of multiple feeding position, first conveying module, visible light imaging system sets up on the frame, and is at the top of first conveying module, is configured to carry out visible light detection to the chip on the carrier plate that first elevating platform supports, second conveying module, infrared light imaging system sets up on the frame, and is at the top of second conveying module, is configured to carry out infrared light detection to the chip on the carrier plate that second elevating platform supports, the utility model's advantage lies in, the detection quality of this chip detection device is high, can effectively reduce the missed detection and the misjudgment situation to take place, and the detection efficiency is high.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a chip testing device. Background Technology

[0002] The automated optical inspection device for chip mounting is specifically designed to detect defects such as positional misalignment, visible cracks, edge chipping, and surface scratches of chip materials on the carrier board. These defects are all detectable under visible light.

[0003] Existing automated optical inspection devices for chip mounting have some of the following problems:

[0004] For microcracks (invisible cracks), they cannot be detected because they cannot be imaged in visible light systems. If microcracks are missed, it can lead to serious consequences. For example, if chip material with microcracks flows into the reflow soldering equipment, after a heating and cooling process that lasts for tens of minutes, it may expand into a visible crack, causing the chip material to be scrapped. This not only wastes production capacity and time, but also delays the necessary adjustments to the FC (flip chip bonding) process equipment to address the defect, resulting in more scrapped materials. In addition, even if chip material with undetected microcracks does not expand into a visible crack after reflow soldering, it may have already damaged the internal circuit area of ​​the chip material. This may only be detected in the electrical testing stage after more subsequent processes, thus delaying more time, wasting more production capacity, and causing the FC equipment to produce more scrapped chips.

[0005] Generally, the side cylinder ejection mechanism is used to hold the carrier plate (which is used to hold multiple chips) in place. The die-bonded chip may be displaced due to external force, which can easily affect the production yield. In addition, the carrier plate is mostly made of flexible material and is relatively thin. The carrier plate is prone to bending and warping due to production quality, which can cause the chip imaging to be blurred or displaced, resulting in false detection.

[0006] The entire testing process takes a long time and cannot fully meet the needs of production line capacity expansion. Utility Model Content

[0007] In view of the above-mentioned shortcomings of the existing technology, the technical problem to be solved by this utility model is to provide a chip detection device with high detection quality, which can effectively reduce the occurrence of missed detection and false detection, and has high detection efficiency.

[0008] The technical solution adopted by this utility model to solve its technical problem is to propose a chip detection device, comprising:

[0009] The frame has multiple feeding positions, material transfer positions and discharging positions arranged side by side; a carrier board carrying a chip is fed in from the feeding position, and output from the discharging position after passing through the material transfer position; the frame has a first longitudinal track and a second longitudinal track along the arrangement direction of the multiple feeding positions.

[0010] A first conveying module is slidably mounted on the first longitudinal track to switch between multiple feeding positions; the first conveying module includes a first lifting platform and a first transverse track, the first transverse track is provided with a first conveying mechanism, the first conveying mechanism can convey the carrier plate from the feeding position along the first transverse track to the material transfer position; the first lifting platform can lift the carrier plate to disengage the carrier plate from the first transverse track.

[0011] A visible light imaging system, mounted on the frame and above the first conveying module, is configured to perform visible light detection on the chip on the carrier supported by the first lifting platform.

[0012] The second conveying module is slidably mounted on the second longitudinal track. The second conveying module includes a second lifting platform and a second transverse track. A second conveying mechanism is provided on the second transverse track. The second conveying mechanism can convey the carrier plate from the material transfer position to the discharge position along the second transverse track. The second lifting platform can lift the carrier plate to disengage it from the second transverse track.

[0013] An infrared imaging system, mounted on the frame and positioned above the second conveying module, is configured to perform infrared light detection on the chips on the carrier plate supported by the second lifting platform.

[0014] Furthermore, it also includes a control module, which is electrically or communicatively connected to the visible light imaging system and the infrared light imaging system;

[0015] The infrared imaging system includes a first light source and an infrared camera. The infrared camera is configured to acquire images of chips on a carrier supported by the second lifting platform and send the acquired images to the control module. The first light source is configured to provide illumination to the infrared camera.

[0016] Furthermore, the infrared light emitted by the infrared camera has an infrared wavelength of 1000 nanometers or 1600 nanometers.

[0017] Furthermore, the visible light imaging system includes a second light source and a line scan camera. The line scan camera is configured to acquire images of the chip on the carrier supported by the first lifting platform and upload the acquired images to the control module. The second light source is configured to provide illumination to the camera. The second light source is configured as a line light source.

[0018] The visible light detection includes one or more of the following: chip position displacement, visible cracks, edge chipping, and surface scratches; the infrared light detection includes hidden crack detection.

[0019] Furthermore, the frame is provided with a support frame, and the support frame is provided with a third transverse track, which is arranged parallel to the first transverse track and the second transverse track;

[0020] The visible light imaging system and the infrared light imaging system are slidably mounted on the third transverse track.

[0021] Furthermore, both the visible light imaging system and the infrared light imaging system include a mounting base, and the two mounting bases are slidably disposed on the third transverse track;

[0022] Both mounting bases are provided with telescopic drive components. One telescopic drive component is configured to drive the first light source and the infrared camera to move up and down, and the other telescopic drive component is configured to drive the second light source and the line scan camera to move up and down.

[0023] Furthermore, the frame is provided with a plurality of material transfer positions, and the second longitudinal track is arranged along the arrangement direction of the plurality of material transfer positions;

[0024] The second conveying module slides along the second longitudinal track to switch between multiple material transfer positions.

[0025] Furthermore, both the first lifting platform and the second lifting platform are equipped with cavities for airflow and airflow interfaces communicating with the cavities. Both are equipped with support planes, and the support planes are provided with multiple rows and columns of adsorption holes, which are communicating with the cavities.

[0026] When the airflow interface is used to evacuate the cavity, the carrier plate is adsorbed onto the support plane.

[0027] Furthermore, the adsorption holes are opened perpendicular to the support plane, and when the carrier plate is adsorbed onto the support plane, the adsorption force is perpendicular to the carrier plate;

[0028] Both the first lifting platform and the second lifting platform include an upper air plate, a lower air plate, and a base plate arranged sequentially from top to bottom. The upper air plate has a groove with an opening facing downwards, and the groove is part of the cavity. The lower air plate seals the opening of the groove and surrounds it to form the cavity. The base plate has an airflow channel that communicates with the cavity, and the airflow interface is located on the base plate.

[0029] Furthermore, both the first lifting platform and the second lifting platform are mounted on the lifting mechanism;

[0030] The lifting mechanism includes a top plate and a lifting cylinder. The top plate is disposed at the output end of the lifting cylinder. The lifting cylinder lifts the first lifting platform or the second lifting platform by pushing against the top plate, so that the carrier plate is disengaged from the first transverse track or the second transverse track.

[0031] Both the first and second conveying mechanisms include a drive motor, a driving pulley, a driven pulley, and a conveyor belt. The conveyor belt is wound between the driving pulley and the driven pulley. The drive motor is connected to the driving pulley and is used to drive the driving pulley.

[0032] Compared with the prior art, the present invention has at least the following beneficial effects:

[0033] In this invention, an infrared imaging system is introduced into the chip inspection device. After the chips on the carrier board undergo visible light inspection using the visible light imaging system, the carrier board carrying the chips flows into a second lifting platform. The second lifting platform lifts the carrier board, bringing it close to the infrared imaging system. The infrared imaging system can then perform infrared inspection on the chips on the carrier board, imaging internal microcracks (hidden cracks) and promptly detecting chips with microcracks, preventing them from flowing into subsequent processes and thus avoiding delays and wasted production capacity. Because the main component of the chip is monocrystalline silicon, and monocrystalline silicon has a transmittance of nearly 100% in the 1000nm and 1600nm infrared bands, infrared light in this band can penetrate the silicon material layer of the chip. This allows the infrared imaging system operating in this band to image microcrack defects on the bottom and inside of the chip. Furthermore, the infrared imaging system operates on the second lifting platform, while the visible light imaging system operates on the first lifting platform; both can be performed independently, effectively improving inspection efficiency.

[0034] In this invention, the optical imaging system can include a second light source and a line scan camera. The second light source is set as a line light source. Using a line light source in conjunction with a line scan camera results in faster speed and higher detection efficiency. Based on fixed incident and exit angles, the imaging is more stable.

[0035] In this invention, both the first and second lifting platforms are equipped with a supporting plane and a cavity for airflow. Multiple rows and columns of suction holes communicating with the cavity are formed on the supporting plane. When the vacuum pump connects to the airflow interface to evacuate the cavity, the carrier plate carrying the chip is suctioned and fixed onto the supporting plane. Fixing the carrier plate with the chip onto the supporting plane through bottom vacuum suction effectively reduces imaging bending and false detections caused by carrier plate warping, thus effectively reducing the false detection rate of visible light imaging systems and infrared imaging systems, thereby ensuring the detection accuracy of the detection device. Furthermore, the suction holes are perpendicular to the supporting plane. When the carrier plate is suctioned onto the supporting plane, the suction force is perpendicular to the carrier plate, with no lateral force, effectively preventing chip placement displacement. Further, both lifting platforms are divided into multiple plates: an upper air plate, a lower air plate, and a bottom plate. The upper and lower air plates together form a cavity, and the airflow channel and airflow interface are located on the bottom plate, ensuring convenient processing. Attached Figure Description

[0036] Figure 1 This is a schematic diagram of the chip detection device of this utility model;

[0037] Figure 2 for Figure 1 A schematic diagram of the structure after removing the outer cover;

[0038] Figure 3 for Figure 2 A structural diagram from another perspective;

[0039] Figure 4 for Figure 3 A magnified view of a section at point A in the middle;

[0040] Figure 5 This is a structural schematic diagram of the first conveying module (showing the carrier plate);

[0041] Figure 6 for Figure 5 A structural diagram from another perspective;

[0042] Figure 7 A schematic diagram of the structure in which the first lifting platform and lifting mechanism support the carrier plate;

[0043] Figure 8 A half-sectional view showing the carrier plate positioned behind the first lifting platform;

[0044] Figure 9 This is an exploded view of the carrier plate and the first lifting platform.

[0045] In the picture:

[0046] 1. Frame; 10. Support frame; 11. First longitudinal track; 12. Second longitudinal track; 13. Third transverse track; 101. Feeding position; 102. Material transfer position; 103. Discharge position;

[0047] 2. First conveying module; 20. First lifting platform; 21. First transverse track; 22. First conveying mechanism; 240. Drive motor; 241. Drive pulley; 242. Driven pulley; 243. Conveyor belt; 244. Stop block; 245. Stop block; 246. Photoelectric sensor; 247. Side-mounted cylinder; 248. Adjusting handwheel;

[0048] 3. Visible light imaging system; 30. Line scan camera; 31. Second light source; 350. Mounting base; 351. Telescopic drive component;

[0049] 4. Second conveying module; 40. Second lifting platform; 41. Second transverse track; 42. Second conveying mechanism; 400. Cavity; 420. Upper air plate; 420A. Adsorption hole; 420B. Support plane; 420C. Groove; 421. Lower air plate; 422. Base plate; 422A. Airflow interface; 422B. Airflow channel; 423. Top plate; 424. Lifting cylinder; 425. Mounting plate; 426. Guide column; 427. Guide sleeve;

[0050] 5. Infrared imaging system; 50. Infrared camera; 51. Primary light source;

[0051] 6. Carrier plate. Detailed Implementation

[0052] The following are specific embodiments of the present invention, which are described in conjunction with the accompanying drawings. However, the present invention is not limited to these embodiments.

[0053] It should be noted that all directional indicators (such as up, down, left, right, front, back, etc.) in this utility model embodiment are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicator will also change accordingly.

[0054] Furthermore, in this utility model, the use of terms such as "first," "second," and "a" is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0055] In this utility model, unless otherwise explicitly specified and limited, the terms "connection," "fixing," etc., should be interpreted broadly. For example, "fixing" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0056] Furthermore, the technical solutions of the various embodiments of this utility model can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0057] like Figures 1-4 As shown, a chip detection device according to this embodiment mainly includes:

[0058] The frame 1 has multiple feeding positions 101, material transfer positions 102 and discharge positions 103 arranged side by side. The carrier board 6 carrying the chip is fed in from the feeding position 101 and output from the discharge position 103 after passing through the material transfer position 102. The frame 1 has a first longitudinal track 11 and a second longitudinal track 12 along the arrangement direction of the multiple feeding positions 101.

[0059] The first conveying module 2 is slidably mounted on the first longitudinal track 11 to switch between multiple feeding positions 101. The first conveying module 2 includes a first lifting platform 20 and a first transverse track 21. A first conveying mechanism 22 is provided on the first transverse track 21. The first conveying mechanism 22 can convey the carrier plate 6 from the feeding position 101 along the first transverse track 21 to the material transfer position 102. The first lifting platform 20 can lift the carrier plate 6 to disengage the carrier plate 6 from the first transverse track 21.

[0060] The visible light imaging system 3 is mounted on the rack 1 and located above the first conveying module 2. It is configured to perform visible light detection on the chip on the carrier plate 6 supported by the first lifting platform 20.

[0061] The second conveying module 4 is slidably mounted on the second longitudinal track 12. The second conveying module 4 includes a second lifting platform 40 and a second transverse track 41. A second conveying mechanism 42 is provided on the second transverse track 41. The second conveying mechanism 42 can convey the carrier plate 6 from the material transfer position 102 to the discharge position 103 along the second transverse track 41. The second lifting platform 40 can lift the carrier plate 6 to disengage the carrier plate 6 from the second transverse track 41.

[0062] Specifically, the frame 1 is provided with multiple material transfer positions 102 and multiple discharge positions 103. The feeding position 101, the material transfer position 102 and the discharge position 103 correspond one to one. The second longitudinal track 12 is arranged along the arrangement direction of the multiple material transfer positions 102. The second conveying module 4 slides along the second longitudinal track 12 to switch between the multiple material transfer positions 102.

[0063] The infrared imaging system 5 is mounted on the frame 1 and located above the second conveying module 4. It is configured to perform infrared light detection on the chip on the carrier plate 6 supported by the second lifting platform 40.

[0064] In practical use, this embodiment introduces an infrared light imaging system 5 into the chip inspection device. After the chip on the carrier board 6 is inspected by the visible light imaging system 3, the carrier board 6 carrying the chip flows into the second lifting platform 40. The second lifting platform 40 lifts the carrier board 6 and brings it close to the infrared light imaging system 5. The infrared light imaging system 5 can perform infrared detection on the chip on the carrier board 6 and image the hidden cracks (invisible cracks) inside the chip. This allows for the timely detection of chips with hidden cracks, preventing them from flowing into subsequent processes and causing delays and wasted production capacity.

[0065] Furthermore, the infrared imaging system 5 operates on the second lifting platform 40, and the visible light imaging system 3 operates on the first lifting platform 20. Both can be operated independently, which can effectively improve detection efficiency.

[0066] Specifically, in this embodiment, the chip detection device further includes a control module (not shown in the figure). The control module is electrically or communicatively connected to the visible light imaging system 3 and the infrared light imaging system 5. The control module can control the visible light imaging system 3 and the infrared light imaging system 5. In addition, each power element in the first conveying module 2 and the second driving module can also be controlled by the control module to ensure that the operation of each module in the chip detection device is carried out in an orderly manner.

[0067] In this embodiment, the infrared imaging system 5 includes a first light source 51 and an infrared camera 50. The infrared camera 50 is configured to acquire images of the chip on the carrier plate 6 supported by the second lifting platform 40 and send the acquired images to the control module. A lens is mounted on the infrared camera 50 to capture images of defects in the chip material. The first light source 51 is configured to provide illumination to the infrared camera 50, i.e., to provide infrared illumination.

[0068] Understandably, in this embodiment, infrared detection can utilize the speckle analysis method. Severe microcracks appear significantly darker than normal areas in infrared images. Therefore, when performing speckle analysis, a maximum value is preset to be less than the gray value of the standard defect-free area, thereby enabling the detection of significantly darker microcracks.

[0069] The infrared light emitted by the infrared camera 50 has an infrared wavelength of 1000 nanometers or 1600 nanometers.

[0070] Because the main component of the chip is monocrystalline silicon, and monocrystalline silicon has a transmittance of nearly 100% in the infrared bands of 1000 nm and 1600 nm, infrared light in this band can penetrate the silicon material layer of the chip, thus enabling the infrared imaging system 5 operating in this band to image the microcracks and defects on the bottom and inside of the chip.

[0071] In existing chip inspection equipment, due to improper parameter adjustment or improper transport module adjustment, there is a possibility of introducing a type of crack existing inside and on the bottom of the chip, called a microcrack. This defect cannot be imaged in a visible light imaging system, so existing chip inspection equipment cannot detect microcracks, resulting in missed detection (i.e., misclassifying NG (non-compliant) products as OK). Missing this microcrack defect can have serious consequences, such as:

[0072] On the one hand, after the tested chip materials flow into the subsequent reflow soldering equipment, after a heating and cooling process that lasts for tens of minutes, the microcracks may expand into open cracks, causing the chip materials to be scrapped. This not only wastes production capacity and time, but also delays the adjustment of the flip chip bonding process (FC) equipment required to address the defect because the defect was not detected in time, resulting in more scrapped materials.

[0073] On the other hand, if a hidden crack is missed and does not expand into an open crack after reflow soldering, it may have actually damaged the circuit area inside the chip material. As a result, it may not be detected until the electrical testing stage after more subsequent processes, thus delaying more time, wasting more production capacity, and causing more scrap chips to be generated by the flip chip bonding process equipment.

[0074] In this embodiment, an infrared imaging system 5 is introduced into the chip detection device. After the chip on the carrier board 6 is detected by the visible light imaging system 3, the carrier board 6 carrying the chip flows into the second lifting platform 40. The second lifting platform 40 lifts the carrier board 6 and brings it close to the infrared imaging system 5. The infrared imaging system 5 can perform infrared detection on the chip on the carrier board 6 and image the hidden cracks (invisible cracks) inside the chip. Chips with hidden cracks can be detected in time and prevented from flowing into subsequent processes, thus delaying time and wasting production capacity.

[0075] More specifically, in this embodiment, the visible light imaging system 3 includes a second light source 31 and a line scan camera 30. The line scan camera 30 is configured to acquire images of the chip on the carrier plate 6 supported by the first lifting platform 20 and upload the acquired images to the control module. The second light source 31 is configured to provide illumination to the camera. The second light source 31 is set as a line light source.

[0076] Visible light detection includes detecting one or more of the following defects: chip position displacement, visible cracks, edge chipping, and surface scratches. Preferably, in this embodiment, the visible light imaging system 3 is used to detect multiple defects in the chip on the carrier board 6, including position displacement, visible cracks, edge chipping, and surface scratches. These defects are all detectable under visible light, preventing unqualified chips from flowing into the next process. Infrared light detection includes detecting hidden cracks.

[0077] Existing chip inspection devices all rely on visible light area array imaging for defect detection. This method uses a common white light coaxial light source, and the lens and area array camera are also selected for white light. During operation, the imaging system, consisting of the camera and light source, moves step-by-step under motor control, aligning with and inspecting all chips on the carrier board 6. This process can be understood as follows: before inspecting each chip, the entire imaging system needs to decelerate and stop, align with the chip to be inspected, and wait for stabilization before taking a picture. After taking the picture, the defect detection algorithm is executed, and simultaneously, the system accelerates to move to the location of the next chip. This process must traverse all chips on the carrier board 6 to complete the inspection. The entire inspection process is time-consuming and inefficient, making it difficult to meet the production capacity increase requirements of production lines.

[0078] In this embodiment, the optical imaging system can include a second light source 31 and a line scan camera 30. The second light source 31 is configured as a line light source. Using a line light source in conjunction with the line scan camera 30 results in faster speed and higher detection efficiency. Based on fixed incident and exit angles, the imaging is more stable. It should be explained that in this embodiment, it is not necessary to perform start-stop operations for each chip on the carrier board 6 during the detection process. Multiple chip materials can be scanned simultaneously without interruption, significantly improving work efficiency and shortening the total imaging time.

[0079] A support frame 10 is provided on the frame 1. The main function of the support frame 10 is to support the visible light imaging system 3 and the infrared light imaging system 5, so as to facilitate visible light detection and infrared light detection of the chip materials on the carrier plate 6 conveyed by the first conveying module 2 and the carrier plate 6 conveyed by the second conveying module 4, respectively. Specifically, the support frame 10 is provided with a third transverse track 13, which is parallel to the first transverse track 21 and the second transverse track 41, that is, the third transverse track 13 is also set along the material conveying direction. The visible light imaging system 3 and the infrared light imaging system 5 can be slidably mounted on the third transverse track 13 to facilitate the position adjustment of the visible light imaging system 3 and the infrared light imaging system 5. A trailing chain (not shown in the figure) is provided on the support frame 10 near the top of the visible light imaging system 3 and the infrared light imaging system 5. When the visible light imaging system 3 and the infrared light imaging system 5 slide along the third transverse track 13, the trailing chain moves accordingly.

[0080] More specifically, both the visible light imaging system 3 and the infrared imaging system 5 include a mounting base 350. The two mounting bases 350 are slidably mounted on the third transverse track 13, and the sliding of the mounting bases 350 drives the overall movement of the visible light imaging system 3 or the infrared imaging system 5.

[0081] In this embodiment, both the visible light imaging system 3 and the infrared imaging system 5 are provided with a telescopic drive component 351 on their mounting bases 350. This telescopic drive component 351 is preferably a telescopic drive cylinder, but it can also be a telescopic hydraulic cylinder, telescopic spring, or other drive component. One telescopic drive component 351 is configured to drive the first light source 51 and the infrared camera 50 to move up and down, while the other telescopic drive component 351 is configured to drive the second light source 31 and the line scan camera 30 to move up and down. By driving the first light source 51 and the infrared camera 50 to move up and down, or by driving the second light source 31 and the line scan camera 30 to move up and down, the imaging positions of the infrared camera 50 and the line scan camera 30 can be adjusted.

[0082] Understandably, such as Figures 3-4 As shown, in this embodiment, the structures of the first conveying module 2 and the second conveying module 4 are basically the same. Therefore, the structures of the first lifting platform 20 in the first conveying module 2 and the second lifting platform 40 in the second conveying module 4 are the same. The structures of the first conveying mechanism 22 in the first conveying module 2 and the second conveying mechanism 42 in the second conveying module 4 are the same. Therefore, in this embodiment, only one of them will be described in detail, and the structure of the other is the same as that of the first conveying module 2 and will not be described in detail.

[0083] In the first conveying module 2, there are multiple feeding positions 101 equipped with baffle blocks 244. The baffle blocks 244 are set on the output shaft of the cylinder. The cylinder drives the baffle blocks to move up and down. In use, the baffle blocks 244 block the feeding position 101. After passing through the previous process, the carrier board 6 carrying multiple chip materials flows into the feeding position 101. The control module controls the cylinder of the corresponding baffle block 244 to work. The cylinder drives the baffle block 244 to descend, so that the carrier board 6 carrying multiple chip materials flows from the corresponding feeding position 101 into the first conveying module 2.

[0084] On the first conveying module 2, a stop block 245 and a photoelectric sensor 246 are provided at the end away from the feed position 101. Specifically, a stop block 245 and a photoelectric sensor 246 are provided at the end near the first transverse track 21. The stop block 245 is used to limit the movement position of the carrier plate 6. When the first conveying mechanism 22 drives the carrier plate 6 to abut against the stop block 245, the stop block 245 abuts against the carrier plate 6, limiting the carrier plate 6 from continuing to feed. That is, the carrier plate 6 has reached the limit position of this station. After the carrier plate 6 moves to abut against the stop block 245, the photoelectric sensor 246 can detect whether there is a carrier plate 6 on the first lifting platform 20. When the photoelectric sensor 246 detects that there is a carrier plate 6 on the first lifting platform 20, the chip detection device can proceed to the next step.

[0085] Specifically, such as Figures 5-9 As shown, both the first lifting platform 20 and the second lifting platform 40 are equipped with a cavity 400 for airflow and an airflow interface 422A connected to the cavity 400. Both the first lifting platform 20 and the second lifting platform 40 are equipped with a support plane 420B, and the support plane 420B is provided with multiple rows and columns of adsorption holes 420A. The adsorption holes 420A are connected to the cavity 400. In actual use, when the cavity 400 is evacuated by the connecting airflow interface 422A, the carrier plate 6 is adsorbed on the support plane 420B.

[0086] In this embodiment, the two lifting platforms are equipped with cavities 400 for airflow and airflow interfaces 422A. The support plane 420B is provided with multiple rows and columns of adsorption holes 420A communicating with the cavities 400, which can effectively increase the adsorption range of the lifting platform and thus adapt to more types of carrier plates 6. Furthermore, when the vacuuming equipment is connected to the airflow interface 422A to perform vacuuming, the carrier plate 6 is adsorbed onto the support plane 420B of the lifting platform. That is, the carrier plate 6 carrying the chip material is fixed onto the support plane 420B of the lifting platform by bottom vacuum adsorption, which can effectively reduce imaging bending and false detection caused by the warping of the carrier plate 6, thereby ensuring the detection accuracy of the detection device.

[0087] In this design, the adsorption holes 420A on the support plane 420B are perpendicular to the support plane 420B. When the carrier plate 6 is adsorbed onto the support plane 420B, the adsorption force is perpendicular to the carrier plate 6. It should be explained that when the carrier plate 6 is adsorbed onto the support plane 420B, because the adsorption holes 420A are perpendicular to the support plane 420B, the adsorption force is perpendicular to the carrier plate 6, and there is no lateral force. Therefore, it can be ensured that the chip mounting position will not shift.

[0088] More specifically, in this embodiment, both the first lifting platform 20 and the second lifting platform 40 include an upper air plate 420, a lower air plate 421, and a base plate 422 arranged sequentially from top to bottom. The upper air plate 420 has a downward-facing groove 420C, and the groove 420C is part of the cavity 400. The lower air plate 421 seals the opening of the groove 420C and surrounds it to form the cavity 400. That is, both lifting platforms are configured as separate units. For ease of processing, the lifting platform can be divided into multiple stacked plates. If the lifting platform is a single unit, the cavity 400 is difficult to process. In this embodiment, the cavity 400 is formed by the upper air plate 420 and the lower air plate 421. The groove 420C can be provided on the upper air plate 420, and the corresponding groove can be not provided on the lower air plate 421, or the corresponding groove can be provided on the lower air plate 421, making the cavity 400 easy to process. For example, it can be processed by milling.

[0089] The lower air plate 421 and the upper air plate 420 are fixed together by multiple bolts arranged circumferentially. The two are detachably fixed by bolt locking, ensuring convenient assembly and disassembly while maintaining reliable fixation. One or both of the upper air plate 420 and the lower air plate 421 have a sealing groove along the circumference of the cavity 400. A sealing ring is provided in the sealing groove. Specifically, the sealing groove can be provided only on the upper air plate 420, only on the lower air plate 421, or both on both the upper and lower air plates 420 and 421. The sealing grooves, with sealing rings within them, ensure the airtightness of the cavity 400, preventing air leakage between the upper air plate 420 and the lower air plate 421 when the cavity 400 is evacuated.

[0090] An airflow channel 422B is provided in the base plate 422, which is arranged horizontally and communicates with the cavity 400. The airflow interface 422A is provided on the base plate 422. The horizontally arranged airflow channel 422B is provided on the base plate 422 to ensure convenient processing.

[0091] More specifically, in this embodiment, both the first lifting platform 20 and the second lifting platform 40 are configured on the lifting mechanism, and the first lifting platform 20 or the second lifting platform 40 is driven to move up and down by the corresponding lifting mechanism.

[0092] The lifting mechanism includes a top plate 423 and a lifting cylinder 424. The top plate 423 is located at the output end of the lifting cylinder 424. The lifting cylinder 424 lifts the first lifting platform 20 or the second lifting platform 40 by pushing against the top plate 423, so that the carrier plate 6 is disengaged from the first transverse track 21 or the second transverse track 41. In actual use, the force exerted by the lifting mechanism on the lifting platform is perpendicular to the support plane 420B, ensuring that the carrier plate 6, which carries the chip material on the support platform, is not subjected to lateral external forces, thereby ensuring that the chip material's mounting position does not shift.

[0093] The lifting mechanism also includes a mounting plate 425, on which the lifting cylinder 424 is mounted to ensure convenient installation. Multiple guide posts 426 are provided on the top plate 423. Specifically, the top plate 423 is rectangular, with one guide post 426 near each of its four corners. The multiple guide posts 426 are perpendicular to the support plane 420B. Because the movement direction of the top plate 423 is vertical, the multiple guide posts 426 are arranged vertically and perpendicular to the support plane 420B. Multiple guide sleeves 427, corresponding to the multiple guide posts 426, are provided on the mounting plate 425. Specifically, the mounting plate 425 is also rectangular, with one guide sleeve 427 near each of its four corners. The four guide posts 426 pass through the four guide sleeves 427 for movement guidance, ensuring reliable lifting movement of the top plate 423.

[0094] At least two side-mounted cylinders 247 are provided on the sides of both the first transverse track 21 and the second transverse track 41. The side-mounted cylinders 247 extend synchronously from the same side of the first transverse track 21 and the second transverse track 41 towards the carrier plate 6 on the first lifting platform 20 or the second lifting platform 40 to correct the attitude of the carrier plate 6. The first transverse track 21 and the second transverse track 41 each consist of two tracks arranged side by side. The side-mounted cylinders 247 extend synchronously towards the carrier plate 6 on the lifting platform, causing the carrier plate 6 to move to the other side. By using at least two side-mounted cylinders 247 to push against the carrier plate 6, the attitude of the carrier plate 6 is corrected, ensuring the positional accuracy of the carrier plate 6.

[0095] Furthermore, the spacing between the two tracks of the first transverse track 21 and the two tracks of the second transverse track 41 is adjustable. The lifting platform is movably positioned between the two tracks. Therefore, both the first conveying module 2 and the second conveying module 4 in this embodiment can be used to convey carrier plates 6 of different specifications. Understandably, one of the two tracks in this embodiment is mounted on a slide table and is equipped with a screw and nut mechanism (not shown in the figure). The end of the screw is equipped with an adjusting handwheel 248. The user can rotate the adjusting handwheel 248 to rotate the screw, thereby causing one track to move closer to or further away from the other track, thus adjusting the spacing between the two tracks.

[0096] In this embodiment, both the first conveying mechanism 22 and the second conveying mechanism 42 include a drive motor 240, a drive pulley 241, a driven pulley 242, and a conveyor belt 243. The conveyor belt 243 is wound between the drive pulley 241 and the driven pulley 242. The drive motor 240 is connected to the drive pulley 241 and is used to drive the drive pulley 241.

[0097] Specifically, the drive pulley 241 can be directly mounted on the output shaft of the drive motor 240, or it can be connected to the drive pulley 241 after being reduced in speed by a gear mechanism, belt drive mechanism, or chain drive mechanism. When the carrier plate 6 is mounted on the conveyor belt 243, a conveyor belt 243 is provided on each side of the carrier plate 6. The drive motor 240 drives the drive pulley 241 to rotate, and the drive pulley 241 drives the driven pulley 242 to rotate through the conveyor belt 243. At this time, the conveyor belt 243 drives the carrier plate 6 on it to move. That is, in this embodiment, the first conveying mechanism 22 and the second conveying mechanism 42 adopt a belt drive mechanism. Of course, a chain drive mechanism can also be used instead, that is, the carrier plate 6 is driven to move through a transmission chain. Since the existing method can be implemented in many ways, it will not be described in detail here.

[0098] In practical use, both the first lifting platform 20 and the second lifting platform 40 of this embodiment are equipped with a support plane 420B and a cavity 400 for airflow. The support plane 420B has multiple rows and columns of adsorption holes 420A that communicate with the cavity 400. When the vacuum pump connects to the airflow interface 422A to evacuate the cavity 400, the carrier plate 6 carrying the chip is adsorbed and fixed on the support plane 420B. By fixing the carrier plate 6 carrying the chip on the support plane 420B through bottom vacuum adsorption, the imaging bending and false detection caused by the warping of the carrier plate 6 can be effectively reduced, and the false detection rate of the visible light imaging system 3 and the infrared light imaging system 5 can be effectively reduced, thereby ensuring the detection accuracy of the detection device.

[0099] Furthermore, the adsorption hole 420A is opened perpendicular to the support plane 420B. When the carrier plate 6 is adsorbed on the support plane 420B, the adsorption force is perpendicular to the carrier plate 6 and there is no lateral force, which can effectively ensure that the chip mounting position will not shift.

[0100] Furthermore, both lifting platforms are divided into multiple plates: an upper air plate 420, a lower air plate 421, and a base plate 422. The upper air plate 420 and the lower air plate 421 together form a cavity 400. The airflow channel 422B and the airflow interface 422A are set on the base plate 422 to ensure convenient processing.

[0101] Combination Figures 1-9 As shown, in this embodiment, the working principle of the chip detection device is as follows:

[0102] After passing through the previous process, the carrier board 6 carrying multiple chips to be inspected is transported to one of the feeding positions 101. After the chip detection device receives the signal, the baffle block 244 at the feeding position 101 will descend, and the carrier board 6 carrying multiple chips will flow into the first transverse track 21.

[0103] The drive motor 240 in the first conveying mechanism 22 of the first conveying module 2 rotates, driving the active pulley 241. The active pulley 241 drives the driven pulley 242 through the conveyor belt 243. The carrier plate 6 carrying multiple chip materials is conveyed by the conveyor belt 243 along the first transverse track 21. When it is conveyed to the end of the first transverse track 21, the carrier plate 6 abuts against the stop block 245. The carrier plate 6 can no longer be fed in. At the same time, the photoelectric sensor 246 at this location senses that there are chip materials in the inspection station. The side top cylinder 247 pushes out to correct the posture of the carrier plate 6.

[0104] The lifting cylinder 424 below the first lifting platform 20 pushes the top plate 423 upward, causing the top plate 423 to push the first lifting platform 20. The first lifting platform 20 lifts the carrier plate 6 carrying multiple chip materials. The carrier plate 6 is separated from the first transverse track 21 and moves closer to the visible light imaging system 3. At this time, the vacuum pump connected to the airflow interface 422A of the first lifting platform 20 is also in the open state, adsorbing and fixing the carrier plate 6 on the support plane 420B of the first lifting platform 20.

[0105] The visible light imaging system 3 performs visible light detection on the chip on the carrier 6;

[0106] After the visible light detection is completed, the vacuum pump at the first lifting platform 20 is turned off, and the lifting cylinder 424 below it drives the top plate 423 to descend, thereby causing the first lifting platform 20 to descend, and the carrier plate 6 returns to the first transverse track 21 and is transported to the material transfer position 102.

[0107] The carrier plate 6 enters the second transverse track 41. The drive motor 240 in the second conveying mechanism 42 of the second conveying module 4 rotates, driving the active pulley 241. The active pulley 241 drives the driven pulley 242 through the conveyor belt 243. The carrier plate 6 carrying multiple chip materials is conveyed by the conveyor belt 243 along the second transverse track 41. When it is conveyed to the end of the second transverse track 41, the carrier plate 6 abuts against the stop block 245 at the end of the second transverse track 41. The carrier plate 6 can no longer be fed in. At the same time, the photoelectric sensor 246 at this location senses that there are chip materials in the inspection station. The side top cylinder 247 pushes out to correct the posture of the carrier plate 6.

[0108] The lifting cylinder 424 below the second lifting platform 40 pushes the top plate 423 upward, causing the top plate 423 to push the second lifting platform 40. The second lifting platform 40 lifts the carrier plate 6 carrying multiple chip materials. The carrier plate 6 is separated from the second transverse track 41 and moves closer to the infrared light imaging system 5. At this time, the vacuum pump connected to the airflow interface 422A of the second lifting platform 40 is also in the open state, adsorbing and fixing the carrier plate 6 on the support plane 420B of the second lifting platform 40.

[0109] Infrared imaging system 5 performs infrared light detection on the chip on carrier board 6;

[0110] After infrared light detection is completed, the vacuum pump at the second lifting platform 40 is turned off, and the lifting cylinder 424 below it drives the top plate 423 to descend, which in turn causes the second lifting platform 40 to descend. The carrier plate 6 returns to the second transverse track 41 and is transported to the discharge position 103 to flow to the next process.

[0111] In this solution, the carrier plate 6 carrying the chip material is fixed on the support plane 420B of the lifting platform by bottom vacuum adsorption, which can effectively reduce the imaging bending and false detection caused by the warping of the carrier plate 6, thereby ensuring the detection accuracy of the chip detection device.

[0112] By introducing an infrared imaging system 5, the chip material on the carrier board 6 supported by the second lifting platform 40 is subjected to infrared detection. The system can image the hidden cracks (invisible cracks) inside the chip, detect the chip with hidden cracks in time, and prevent it from flowing into the subsequent process, thus avoiding delays and wasted production capacity.

[0113] By having the infrared imaging system 5 operate on the second lifting platform 40 and the visible light imaging system 3 operate on the first lifting platform 20, and by setting up multiple feeding positions 101 and multiple material transfer positions 102, the detection efficiency can be effectively improved.

[0114] By setting the second light source 31 in the optical imaging system as a line light source and its camera as a line scanning camera 30, the use of a line light source in conjunction with the line scanning camera 30 results in faster speed, higher detection efficiency, and more stable imaging based on fixed incident and exit angles.

Claims

1. A chip detection device, characterized in that, include: The frame has multiple feeding positions, material transfer positions and discharging positions arranged side by side; a carrier board carrying a chip is fed in from the feeding position, and output from the discharging position after passing through the material transfer position; the frame has a first longitudinal track and a second longitudinal track along the arrangement direction of the multiple feeding positions. A first conveying module is slidably mounted on the first longitudinal track to switch between multiple feeding positions; the first conveying module includes a first lifting platform and a first transverse track, the first transverse track is provided with a first conveying mechanism, the first conveying mechanism can convey the carrier plate from the feeding position along the first transverse track to the material transfer position; the first lifting platform can lift the carrier plate to disengage the carrier plate from the first transverse track. A visible light imaging system, mounted on the frame and above the first conveying module, is configured to perform visible light detection on the chip on the carrier supported by the first lifting platform. The second conveying module is slidably mounted on the second longitudinal track. The second conveying module includes a second lifting platform and a second transverse track. A second conveying mechanism is provided on the second transverse track. The second conveying mechanism can convey the carrier plate from the material transfer position to the discharge position along the second transverse track. The second lifting platform can lift the carrier plate to disengage it from the second transverse track. An infrared imaging system, mounted on the frame and positioned above the second conveying module, is configured to perform infrared light detection on the chips on the carrier plate supported by the second lifting platform.

2. The chip testing device according to claim 1, characterized in that, It also includes a control module, which is electrically or communicatively connected to the visible light imaging system and the infrared light imaging system. The infrared imaging system includes a first light source and an infrared camera. The infrared camera is configured to acquire images of chips on a carrier supported by the second lifting platform and send the acquired images to the control module. The first light source is configured to provide illumination to the infrared camera.

3. The chip testing device according to claim 2, characterized in that, The infrared camera emits infrared light in the 1000 nm or 1600 nm band.

4. The chip testing device according to claim 2, characterized in that, The visible light imaging system includes a second light source and a line scan camera. The line scan camera is configured to acquire images of chips on a carrier supported by the first lifting platform and upload the acquired images to the control module. The second light source is configured to provide illumination to the camera. The second light source is configured as a line light source. The visible light detection includes one or more of the following: chip position displacement, visible cracks, edge chipping, and surface scratches; the infrared light detection includes hidden crack detection.

5. The chip testing device according to claim 4, characterized in that, The frame is provided with a support frame, and the support frame is provided with a third transverse track, which is arranged parallel to the first transverse track and the second transverse track; The visible light imaging system and the infrared light imaging system are slidably mounted on the third transverse track.

6. The chip detection device according to claim 5, characterized in that, Both the visible light imaging system and the infrared light imaging system include a mounting base, and the two mounting bases are slidably mounted on the third transverse track; Both mounting bases are provided with telescopic drive components. One telescopic drive component is configured to drive the first light source and the infrared camera to move up and down, and the other telescopic drive component is configured to drive the second light source and the line scan camera to move up and down.

7. The chip testing device according to claim 1, characterized in that, The frame is provided with multiple material transfer positions, and the second longitudinal track is arranged along the arrangement direction of the multiple material transfer positions; The second conveying module slides along the second longitudinal track to switch between multiple material transfer positions.

8. The chip detection device according to claim 1, characterized in that, Both the first lifting platform and the second lifting platform are equipped with cavities for airflow and airflow interfaces communicating with the cavities. Both are equipped with support planes, and the support planes are provided with multiple rows and columns of adsorption holes, which are communicating with the cavities. When the airflow interface is used to evacuate the cavity, the carrier plate is adsorbed onto the support plane.

9. The chip testing device according to claim 8, characterized in that, The adsorption holes are opened perpendicular to the support plane, and when the carrier plate is adsorbed onto the support plane, the adsorption force is perpendicular to the carrier plate. Both the first lifting platform and the second lifting platform include an upper air plate, a lower air plate, and a base plate arranged sequentially from top to bottom. The upper air plate has a groove with an opening facing downwards, and the groove is part of the cavity. The lower air plate seals the opening of the groove and surrounds it to form the cavity. The base plate has an airflow channel that communicates with the cavity, and the airflow interface is located on the base plate.

10. The chip detection device according to claim 9, characterized in that, Both the first lifting platform and the second lifting platform are mounted on the lifting mechanism; The lifting mechanism includes a top plate and a lifting cylinder. The top plate is disposed at the output end of the lifting cylinder. The lifting cylinder lifts the first lifting platform or the second lifting platform by pushing against the top plate, so that the carrier plate is disengaged from the first transverse track or the second transverse track. Both the first and second conveying mechanisms include a drive motor, a driving pulley, a driven pulley, and a conveyor belt. The conveyor belt is wound between the driving pulley and the driven pulley. The drive motor is connected to the driving pulley and is used to drive the driving pulley.

Images