A power device thermal resistance testing device suitable for high temperature environment

Abstract

The specification discloses a power device thermal resistance testing device suitable for high-temperature environment, relates to the technical field of thermal resistance testing devices, and the device body of the device has a body cavity, a compression ring is arranged in the body cavity, the compression ring is connected with one end of a lifting column, the end of the lifting column away from the compression ring can pass through the cavity wall of the body cavity and be connected with a hydraulic part, and the lifting column can move up and down along the height direction of itself under the action of the hydraulic part to make the compression ring move up and down; the heat dissipation assembly comprises a heat dissipation ring and a liquid cooling assembly, the heat dissipation ring is arranged at the end of the lifting column close to the hydraulic part, and the heat dissipation ring can cool the lifting column through the liquid cooling assembly. By arranging the hydraulic part outside the body cavity, the heat conduction of the device body to the hydraulic part can be reduced, the heat dissipation ring is arranged at the end of the lifting column close to the hydraulic part, the temperature of the lifting column can be prevented from being transmitted to the hydraulic part, and the hydraulic part can be prevented from being in a high-temperature working condition for a long time.

Description

Technical Field

[0001] This utility model relates to the technical field of thermal resistance testing devices, and more specifically, to a thermal resistance testing device for power devices suitable for high-temperature environments. Background Technology

[0002] With the development of technology, power devices are increasingly used in electronic devices, and are indispensable from everyday electronic devices to high-power industrial systems. However, power devices generate a lot of heat when they are working, and their thermal performance is directly related to the stability and lifespan of the equipment. As a key indicator for measuring the heat dissipation efficiency of power devices, accurate measurement of thermal resistance is extremely important. The thermal resistance tester was born because of this. It can accurately quantify thermal resistance, help engineers evaluate performance and optimize design, and lay a solid foundation for the stable operation of power devices under complex conditions such as high temperature and high load.

[0003] Currently, CN201921746452.9 proposes a blocking thermal resistance tester that can block hot air, reducing its escape and ensuring more accurate test results. However, during the testing process, heat is conducted to the inside of the hydraulic cylinder through the end of the telescopic shaft, causing the hydraulic cylinder to operate at high temperatures for extended periods. This condition accelerates hydraulic oil aging, causes seal deformation, and consequently severely affects the service life and stability of the hydraulic cylinder. Utility Model Content

[0004] The purpose of this invention is to provide a power device thermal resistance testing device suitable for high-temperature environments, which can overcome the above-mentioned defects of existing thermal resistance testers.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] On the one hand, this specification provides a power device thermal resistance testing device suitable for high-temperature environments, including a device body, hydraulic components, lifting column, clamping ring, and heat dissipation components;

[0007] The device body has a body chamber, and the clamping ring is disposed in the body chamber. The clamping ring is connected to one end of the lifting column. The end of the lifting column away from the clamping ring can pass through the cavity wall of the body chamber and be connected to the hydraulic component. Under the action of the hydraulic component, the lifting column can move up and down along its own height direction to make the clamping ring move up and down.

[0008] The heat dissipation assembly includes a heat dissipation ring and a liquid cooling assembly. The heat dissipation ring is disposed at one end of the lifting column near the hydraulic component, and the heat dissipation ring can cool the lifting column through the liquid cooling assembly.

[0009] In some embodiments of this specification, the liquid cooling assembly includes a first pipe, a second pipe, and a liquid cooling tank. The liquid cooling tank can store liquid cooling fluid. A heat dissipation ring is sleeved on one end of the lifting column near the hydraulic component. An annular channel is provided inside the heat dissipation ring. The annular channel is sleeved on the outside of the lifting column. The annular channel, the first pipe, the liquid cooling tank, and the second pipe can cooperate to form a closed-loop link. The lifting column is cooled by the liquid cooling fluid in the closed-loop link.

[0010] In some embodiments of this specification, the liquid cooling assembly further includes a pump disposed between the liquid cooling tank and the heat dissipation ring, and the pump is disposed on a pipe. The pump is capable of providing power to the liquid cooling medium within the closed-loop link to make the liquid cooling medium circulate within the closed-loop link.

[0011] In some embodiments of this specification, a bracket is also included, which is disposed on the side of the device body where the lifting column is provided, and the liquid cooling box is disposed on the side of the bracket away from the device body, and the end of the hydraulic component away from the lifting column can pass through the bracket; the pump component is mounted on the side wall of the bracket.

[0012] In some embodiments of this specification, a heat dissipation plate is provided between the liquid cooling tank and the pump component, one side of the heat dissipation plate is connected to the side wall of the bracket, and the pipes provided between the liquid cooling tank and the pump component can be partially embedded in the heat dissipation plate.

[0013] In some embodiments of this specification, a support cylinder is provided on the side of the heat sink away from the bracket, the cylinder channel direction of the support cylinder is from the pump component toward the heat sink ring, and a thermoelectric cooler is provided on the side of the heat sink away from the bracket, the thermoelectric cooler is disposed in the cylinder channel of the support cylinder, and the cooling surface of the thermoelectric cooler faces the side where the heat sink is located.

[0014] In some embodiments of this specification, a cooling fan is also provided inside the cylinder channel of the support cylinder.

[0015] In some embodiments of this specification, the lifting column is provided with several vacuum chambers.

[0016] In some embodiments of this specification, a cross-shaped fixing rod is provided inside the vacuum chamber, and the four ends of the cross-shaped fixing rod are respectively connected to the side wall of the vacuum chamber.

[0017] In some embodiments of this specification, a sealing ring is provided at one end of the lifting column near the clamping ring. The sealing ring is sleeved on the outside of the lifting column. A cylindrical component is provided between the sealing ring and the cavity wall of the main body chamber near the hydraulic component. The cylindrical component is sleeved on the lifting column. The cylindrical component and the sealing ring can cooperate to cover the connection position between the lifting column and the device body.

[0018] Based on the above technical solution, this specification can achieve the following technical effects:

[0019] Compared with existing technologies, the aforementioned power device thermal resistance testing device suitable for high-temperature environments reduces the heat conduction from the device body to the hydraulic components by placing the hydraulic components outside the main body cavity of the device body. Furthermore, by setting a heat dissipation ring at the end of the lifting column near the hydraulic components, the heat generated by the lifting column can be transferred to the liquid cooling components through the heat dissipation ring, thereby preventing the temperature of the lifting column from being transferred to the hydraulic components. This avoids the hydraulic components from being in high-temperature conditions for a long time, and can effectively improve the service life and stability of the hydraulic components. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the structure of a power device thermal resistance testing device suitable for high-temperature environments proposed in this utility model.

[0021] Figure 2 The present utility model proposes Figure 1 The diagram shows the structure of region A.

[0022] Figure 3 The present utility model proposes Figure 1 The diagram shows the structure of region B.

[0023] Icons: 1. Device body; 2. Compression ring; 3. Lifting column; 4. Heat dissipation ring; 5. Bracket; 6. First support ring; 7. First pipe fitting; 8. Hydraulic component; 9. Liquid cooling box; 10. Second pipe fitting; 11. Pump component; 12. Third pipe fitting; 13. Cross-shaped fixing rod; 14. Second support ring; 15. Sealing ring; 16. Cylinder; 17. Cooling fan; 18. Support cylinder; 19. Semiconductor refrigeration chip; 20. Heat dissipation plate. Detailed Implementation

[0024] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description and claims. It should be noted that the drawings are all in a very simplified form and are not to a precise scale, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.

[0025] It should be noted that, in order to clearly illustrate the content of this utility model, several embodiments are provided to further explain the different implementations of this utility model. These embodiments are enumerated rather than exhaustive. Furthermore, for the sake of brevity, content mentioned in the preceding embodiments is often omitted in the following embodiments. Therefore, content not mentioned in the later embodiments can be referred to in the preceding embodiments.

[0026] Please refer to Figures 1 to 3 An embodiment of this specification provides a power device thermal resistance testing device suitable for high-temperature environments, including a device body 1, a hydraulic component 8, a lifting column 3, a clamping ring 2, and a heat dissipation assembly.

[0027] The device body 1 has a body chamber, and the clamping ring 2 is disposed in the body chamber. The clamping ring 2 is connected to one end of the lifting column 3. The end of the lifting column 3 away from the clamping ring 2 can pass through the cavity wall of the body chamber and be connected to the hydraulic component 8. Under the action of the hydraulic component 8, the lifting column 3 can move up and down along its own height direction to make the clamping ring 2 move up and down.

[0028] The heat dissipation component includes a heat dissipation ring 4 and a liquid cooling component. The heat dissipation ring 4 is disposed at one end of the lifting column 3 near the hydraulic component 8. The heat dissipation ring 4 can cool the lifting column 3 through the liquid cooling component.

[0029] In this embodiment, the heat dissipation ring 4 and the liquid cooling component can cool the heat generated by the lifting column 3 during the lifting process, thereby preventing the heat of the lifting column 3 from being transferred to the hydraulic component 8, and thus preventing the hydraulic component 8 from being in a high-temperature condition for a long time, which can effectively improve the service life and stability of the hydraulic component 8.

[0030] In this embodiment, the hydraulic component 8 is preferably a hydraulic cylinder.

[0031] In this embodiment, the end of the lifting column 3 away from the clamping ring 2 is fixedly connected to the telescopic end of the hydraulic component 8, and the heat dissipation ring 4 is disposed between the device body 1 and the hydraulic component 8.

[0032] In this embodiment, the heat from the lifting column 3 can be transferred to the liquid cooling component through the heat dissipation ring 4 to achieve a cooling effect.

[0033] Specifically, the aforementioned power device thermal resistance testing device suitable for high-temperature environments can transfer the heat generated by the lifting column 3 to the liquid cooling component by setting a heat dissipation ring 4 at one end of the lifting column 3 near the hydraulic component 8. This avoids the temperature of the lifting column 3 being transferred to the hydraulic component 8, thereby preventing the hydraulic component 8 from being in a high-temperature condition for a long time and effectively improving the service life and stability of the hydraulic component 8.

[0034] In this embodiment, by placing the hydraulic component 8 outside the body cavity of the device body 1, the heat conduction from the device body 1 to the hydraulic component 8 can be further reduced.

[0035] In this embodiment, the liquid cooling assembly includes a first pipe 7, a second pipe 10, and a liquid cooling tank 9. The liquid cooling tank 9 can store liquid cooling fluid. The heat dissipation ring 4 is sleeved on one end of the lifting column 3 near the hydraulic component 8. The heat dissipation ring 4 is provided with an annular channel, which is sleeved on the outside of the lifting column 3. The annular channel, the first pipe 7, the liquid cooling tank 9, and the second pipe 10 can cooperate to form a closed-loop link. The lifting column 3 is cooled by the liquid cooling fluid in the closed-loop link.

[0036] In this embodiment, the heat dissipation ring 4 is provided with an annular channel along its own annular direction, and the heat of the lifting column 3 can be transferred to the liquid cooling medium in the annular channel through the side wall of the heat dissipation ring 4.

[0037] In this embodiment, the closed-loop link is specifically as follows: one end of the liquid cooling box 9 is connected to the first pipe 7, the end of the first pipe 7 away from the liquid cooling box 9 is connected to the annular channel, the side of the annular channel away from the first pipe 7 is connected to the second pipe 10, and the end of the second pipe 10 away from the heat dissipation ring 4 is connected to the liquid cooling box 9.

[0038] In this embodiment, the liquid cooling tank 9 is provided with a water inlet for filling the liquid cooling working medium into the liquid cooling tank 9. The liquid cooling working medium is preferably water.

[0039] In this embodiment, the liquid cooling medium in the liquid cooling box 9 can flow sequentially to the second pipe 10 and the annular channel. After the liquid cooling medium in the annular channel exchanges heat with the lifting column 3, it flows back to the liquid cooling box 9 through the first pipe 7, thereby achieving a cooling effect.

[0040] In this embodiment, the liquid cooling assembly further includes a pump 11, which is disposed between the liquid cooling tank 9 and the heat dissipation ring 4, and is also disposed on the second pipe 10. The pump 11 can provide power to the liquid cooling working fluid in the closed loop to make the liquid cooling working fluid circulate in the closed loop.

[0041] In this embodiment, the pump 11 is preferably a water pump, the pipe between the water pump and the liquid cooling tank 9 is a second pipe 10, and the pipe between the water pump and the heat dissipation ring 4 is a third pipe 12. By setting the water pump, the liquid cooling medium in the liquid cooling tank 9 can be drawn to the second pipe 10 and the third pipe 12, so that the liquid cooling medium can enter the annular channel for heat exchange.

[0042] In other embodiments, the pump 11 can be a peristaltic pump. That is, when it is a peristaltic pump, the second pipe 10 can preferably be a complete pipe. The second pipe 10 can pass through the installation position of the peristaltic pump and its two ends are respectively connected to the liquid cooling box 9 and the heat dissipation ring 4. The peristaltic pump can provide the power for the liquid cooling working fluid to flow in the closed loop.

[0043] In this embodiment, a bracket 5 is also included. The bracket 5 is disposed on the side of the device body 1 where the lifting column 3 is disposed. The liquid cooling box 9 is disposed on the side of the bracket 5 away from the device body 1, and the end of the hydraulic component 8 away from the lifting column 3 can pass through the bracket 5. The pump component 11 is installed on the side wall of the bracket 5.

[0044] In this embodiment, the bracket 5 is U-shaped with two ends. Both ends of the bracket 5 are connected to the side of the device body 1 where the lifting column 3 is located. The lifting column 3 and the heat dissipation ring 4 are arranged within the U-shaped area formed by the bracket 5 itself. The bracket 5 has a top arm, a left arm, and a right arm (as shown in the figure). Figure 1 The directions shown are top, left, and right. The liquid cooling box 9 is installed on the side of the top arm away from the device body 1, and the pump 11 is installed on the side of the left arm away from the lifting column 3.

[0045] By setting up the bracket 5, the stability of the hydraulic components 8 and the lifting column 3 during the lifting process can be effectively improved, and the pump 11 and the liquid cooling box 9 can be reasonably set up.

[0046] In this embodiment, a heat dissipation plate 20 is provided between the liquid cooling box 9 and the pump component 11. One side of the heat dissipation plate 20 is connected to the side wall of the bracket 5. The pipes provided between the liquid cooling box 9 and the pump component 11 can be partially embedded in the heat dissipation plate 20.

[0047] In this embodiment, the second pipe 10 can penetrate the heat sink 20 to cool the liquid cooling medium inside the second pipe 10 and improve the installation stability of the second pipe 10.

[0048] In this embodiment, a support cylinder 18 is provided on the side of the heat sink 20 away from the bracket 5. The cylinder channel of the support cylinder 18 is oriented from the pump component 11 toward the heat sink ring 4. A semiconductor cooling chip 19 is provided on the side of the heat sink 20 away from the bracket 5. The semiconductor cooling chip 19 is disposed in the cylinder channel of the support cylinder 18, and the cooling surface of the semiconductor cooling chip 19 faces the side where the heat sink 20 is located.

[0049] In this embodiment, the cylinder channel of the support cylinder 18 is perpendicular to the height direction of the lifting column 3. A semiconductor cooling chip 19 is provided inside the support cylinder 18. The cooling side of the semiconductor cooling chip 19 abuts against the heat sink 20, which can cool the heat sink 20.

[0050] In this embodiment, a cooling fan 17 is also provided inside the cylindrical channel of the support cylinder 18. By providing a cooling fan 17 inside the cylindrical channel of the support cylinder 18, the semiconductor cooling chip 19 can be further cooled.

[0051] In detail, a support rod is provided in the cylinder channel of the support cylinder 18 along the height direction of the lifting column 3. The two ends of the support rod are respectively connected to the cylinder wall of the support cylinder 18. A cooling fan 17 is installed on the support rod, and the cooling fan 17 can provide air cooling to the semiconductor refrigeration chip 19.

[0052] In this embodiment, the lifting column 3 has several vacuum chambers.

[0053] In this embodiment, the lifting column 3 is provided with two or more vacuum chambers along its height direction. While ensuring the structural strength of the lifting column 3, it can further reduce heat conduction, that is, it can further reduce the heat transfer from the inside of the lifting column 3 to the hydraulic component 8.

[0054] In this embodiment, a cross-shaped fixing rod 13 is provided in the vacuum chamber, and the four ends of the cross-shaped fixing rod 13 are respectively connected to the side wall of the vacuum chamber.

[0055] In this embodiment, by providing a cross-shaped fixing rod 13 inside the vacuum chamber, the vacuum chamber can be further supported and fixed, and the structural stability of the lifting column 3 can be further improved.

[0056] In this embodiment, a sealing ring 15 is provided at one end of the lifting column 3 near the pressing ring 2. The sealing ring 15 is sleeved on the outside of the lifting column 3. A cylindrical component 16 is provided between the sealing ring 15 and the cavity wall of the main body chamber near the hydraulic component 8. The cylindrical component 16 is sleeved on the lifting column 3. The cylindrical component 16 and the sealing ring 15 can cooperate to cover the connection position between the lifting column 3 and the device body 1.

[0057] In this embodiment, by setting the sealing ring 15 and the above-mentioned cylindrical component 16, the connection position between the above-mentioned lifting column 3 and the above-mentioned device body 1 can be sealed, preventing the air in the body cavity from leaking out through the connection position, thereby further reducing the heat loss from the body cavity.

[0058] In this embodiment, a second support ring 14 is provided on the side of the sealing member away from the cylindrical member 16, which can further support, fix and stabilize the sealing ring 15.

[0059] In this embodiment, a first support ring 6 is provided on the side of the hydraulic component 8 near the bracket 5, which can further support, fix and stabilize the hydraulic component 8.

[0060] In this embodiment, the first pipe 7, the third pipe 12, and the cylindrical component 16 can all be preferably telescopic hoses.

[0061] In this embodiment, the heat dissipation ring 4 and the heat dissipation plate 20 are preferably made of copper, which can further improve the heat conduction and heat dissipation effect.

[0062] In this embodiment, the aforementioned lifting column 3 is preferably made of chromium-nickel-iron alloy, which can both ensure the structural strength of the lifting column 3 and further reduce the heat conduction effect.

[0063] Specifically, during use, the telescopic end of the hydraulic component 8 extends and retracts, driving the lifting column 3 to move up and down, thereby driving the clamping ring 2 to move up and down. When the lifting column 3 moves up and down, it can slide along the inner ring wall of the heat dissipation ring 4 and along the inner ring wall of the sealing ring 15. When the lifting column 3 is in the lifting motion, the pump 11 can be activated to draw liquid cooling medium from the liquid cooling tank 9 through the second pipe 10. When the liquid cooling medium flows through the second pipe 10, the cooling fan 17 can be turned on to accelerate the air flow in the support cylinder 18 to cool the semiconductor refrigeration chip 19. At the same time, the semiconductor refrigeration chip 19 is activated to cool the heat sink 20. The heat sink 20 can cool the liquid cooling medium in the second pipe 10. The cooled liquid cooling medium enters the annular channel of the heat sink 4 through the third pipe 12 to cool the heat sink 4. The cooled heat sink 4 cools the lifting column 3, thereby reducing the heat conducted to the hydraulic component 8. The liquid cooling medium flowing out of the annular channel flows back to the liquid cooling tank 9 through the first pipe 7 to achieve circulating cooling.

[0064] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of the claims of this application.

Claims

1. A power device thermal resistance testing device suitable for high-temperature environments, characterized in that, Includes the device body, hydraulic components, lifting column, clamping ring, and heat dissipation components; The device body has a body chamber, and the clamping ring is disposed in the body chamber. The clamping ring is connected to one end of the lifting column. The end of the lifting column away from the clamping ring can pass through the cavity wall of the body chamber and be connected to the hydraulic component. Under the action of the hydraulic component, the lifting column can move up and down along its own height direction to make the clamping ring move up and down. The heat dissipation assembly includes a heat dissipation ring and a liquid cooling assembly. The heat dissipation ring is disposed at one end of the lifting column near the hydraulic component, and the heat dissipation ring can cool the lifting column through the liquid cooling assembly.

2. The power device thermal resistance testing device suitable for high-temperature environments according to claim 1, characterized in that, The liquid cooling assembly includes a first pipe, a second pipe, and a liquid cooling tank. The liquid cooling tank can store liquid cooling fluid. The heat dissipation ring is sleeved on the end of the lifting column near the hydraulic component. An annular channel is provided inside the heat dissipation ring. The annular channel is sleeved on the outside of the lifting column. The annular channel, the first pipe, the liquid cooling tank, and the second pipe can cooperate to form a closed-loop link. The lifting column is cooled by the liquid cooling fluid in the closed-loop link.

3. The power device thermal resistance testing device suitable for high-temperature environments according to claim 2, characterized in that, The liquid cooling assembly also includes a pump, which is disposed between the liquid cooling tank and the heat dissipation ring and is mounted on a second pipe. The pump can provide power to the liquid cooling medium in the closed-loop link to make the liquid cooling medium circulate in the closed-loop link.

4. The power device thermal resistance testing device suitable for high-temperature environments according to claim 3, characterized in that, It also includes a bracket, which is located on the side of the device body where the lifting column is located. The liquid cooling box is located on the side of the bracket away from the device body, and the end of the hydraulic component away from the lifting column can pass through the bracket; the pump component is installed on the side wall of the bracket.

5. The power device thermal resistance testing device suitable for high-temperature environments according to claim 4, characterized in that, A heat dissipation plate is provided between the liquid cooling tank and the pump component. One side of the heat dissipation plate is connected to the side wall of the bracket. The pipes provided between the liquid cooling tank and the pump component can be partially embedded in the heat dissipation plate.

6. The power device thermal resistance testing device suitable for high-temperature environments according to claim 5, characterized in that, A support cylinder is provided on the side of the heat sink away from the bracket. The cylinder channel of the support cylinder is oriented from the pump component toward the heat sink ring. A thermoelectric cooler is provided on the side of the heat sink away from the bracket. The thermoelectric cooler is disposed in the cylinder channel of the support cylinder, and the cooling surface of the thermoelectric cooler faces the side where the heat sink is located.

7. The power device thermal resistance testing device suitable for high-temperature environments according to claim 6, characterized in that, A cooling fan is also installed inside the cylinder channel of the support cylinder.

8. The power device thermal resistance testing device suitable for high-temperature environments according to claim 1, characterized in that, The lifting column has several vacuum chambers inside.

9. The power device thermal resistance testing device suitable for high-temperature environments according to claim 8, characterized in that, A cross-shaped fixing rod is provided inside the vacuum chamber, and the four ends of the cross-shaped fixing rod are respectively connected to the side wall of the vacuum chamber.

10. The power device thermal resistance testing device suitable for high-temperature environments according to claim 1, characterized in that, A sealing ring is provided at one end of the lifting column near the pressing ring. The sealing ring is sleeved on the outside of the lifting column. A cylindrical component is provided between the sealing ring and the cavity wall of the main body chamber near the hydraulic component. The cylindrical component is sleeved on the lifting column. The cylindrical component and the sealing ring can cooperate to cover the connection position between the lifting column and the device body.

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