A device for measuring the resistance of silver dots

Abstract

A kind of device for measuring silver dot resistance, including resistance measurement component, A test access module, B test access module;Resistance measurement component includes A port, B port;A port is connected with A test access module by wire Electric signal;B port is connected with B test access module by wire Electric signal;A test access module includes FPC connection module;FPC connection module is used to connect the COM electrode in the FPC of test EPD product;B test access module includes ITO connection module;ITO connection module includes test probe, and the test probe is used to contact the ITO electrode of test EPD product;Test probe is connected with the B port by wire Electric signal communication.A test access module and B test access module are separately arranged, and can each have independent connection, avoid the problem of inaccurate resistance measurement caused by ITO film surface stretching due to FPL bending.

Description

Technical Field

[0001] This application belongs to the field of electronic paper production testing tools, specifically relating to a device for measuring the resistance of silver dots. Background Technology

[0002] Electronic paper is a display screen made using electrophoretic display technology. It achieves image display by continuously applying voltage waveforms to each pixel through a driving IC chip. Electronic paper ink displays feature ultra-low power consumption, low-frequency display, and energy saving, making them widely used in price tags, advertising signs, and bus stop signs.

[0003] When testing the silver point resistance of the ITO surface of the TFT backplane and the FPL using the existing EPD (Electronic Paper Display), the FPL needs to be bent in reverse and tested using a probe. This causes the ITO film surface of the FPL to be stretched during the test, affecting the accuracy of the silver point resistance test.

[0004] FPL: Front Plane Layer. Functional positioning: The core display medium layer of the electronic paper display module, which directly contains electronic ink microcapsules (electrophoretic particles) and determines the final imaging effect.

[0005] Flexible printed circuit (FPC) is a type of circuit board that displays typically incorporate, along with external electrical connections.

[0006] ITO, short for Indium Tin Oxide, is a transparent conductive material widely used in the electronics industry. Summary of the Invention

[0007] The technical problem to be solved by this invention is to avoid the problem in the prior art where the ITO film surface of the FPL side is stretched during electronic paper testing, affecting the accuracy of the measured silver point resistance value. The invention proposes a device for measuring the silver point resistance value, in which test access module A and test access module B are respectively set above and below the support plate and electrically connected to avoid the problem of inaccurate resistance measurement caused by the stretching of the ITO film surface due to the bending of the FPL.

[0008] The technical solution of this application to solve the above-mentioned technical problems is a device for measuring the resistance of silver points, used to test the resistance of silver points of EPD products, including: a resistance measuring component, an A test access module, and a B test access module; the resistance measuring component includes an A port and a B port; the A port is electrically connected to the A test access module via a wire; the B port is electrically connected to the B test access module via a wire; the A test access module includes an FPC connection module; the FPC connection module is used to connect the COM electrode in the FPC of the EPD product being tested; the B test access module includes an ITO connection module; the ITO connection module includes a test probe, which is used to contact the ITO electrode of the EPD product being tested; the test probe is electrically connected to the B port via a wire.

[0009] The resistance measurement component is a multimeter.

[0010] The ITO connection module includes a crimping device, which includes a conductive adhesive strip used to press the test probe into contact with the ITO electrode.

[0011] It also includes a support plate and a guide rail; the crimping device is installed on the guide rail, and the support plate is used to support the EPD product under test.

[0012] Test access module A is located above the support plate; test access module B is located below the support plate.

[0013] It also includes a switch connected in series in the wire.

[0014] The wire is used for electrical signal connection between port B and the B test access module.

[0015] The connecting wire between port A and the A test access module includes a section of multi-bonded wire.

[0016] It also includes a power interface, which is mounted on the support plate and is electrically connected to the resistance measuring component via a power cable to supply power to the resistance measuring component.

[0017] One of the beneficial effects of the technical solution in this application is that the A test access module and the B test access module are set up separately, and each can have an independent connection, which avoids the problem of inaccurate resistance measurement caused by the stretching of the ITO film surface due to FPL bending.

[0018] One of the beneficial effects of the technical solution in this application is that the ITO connection module includes a crimping device, in which a conductive adhesive strip presses the test probe into contact with the ITO electrode. The crimping ensures the reliability of the connection and guarantees the accuracy of the test results.

[0019] One of the beneficial effects of the technical solution in this application is that the crimping device is installed on the guide rail, which facilitates movement and adapts to test products of different sizes.

[0020] One of the beneficial effects of the technical solution in this application is that the support plate provides a supporting foundation, which facilitates the bearing and connection of various components.

[0021] One of the beneficial effects of the technical solution in this application is that test module A is above the support plate and test module B is below the support plate, which avoids the problem of inaccurate resistance measurement caused by the stretching of the ITO film surface due to the bending of FPL.

[0022] One of the beneficial effects of the technical solution in this application is that the switch is connected in series in the wire, which facilitates measurement and control.

[0023] One of the beneficial effects of the technical solution in this application is that the support plate is provided with through holes, which facilitates the passage of wires and makes connection convenient. Attached Figure Description

[0024] Figure 1 This is one of the schematic block diagrams of a device for measuring the resistance of a silver point; Figure 2 This is one of the schematic block diagrams of a device for measuring the resistance of a silver point; Figure 3 This is a top view schematic diagram of the device for measuring the resistance of a silver point; Figure 4 This is a side view schematic diagram of the device for measuring the resistance of a silver point; Figure 5 This is a three-dimensional schematic diagram of the device for measuring the resistance of silver points after removing the support plate; Figure 6 yes Figure 5 A three-dimensional schematic diagram showing the removal of the resistance measurement component; Figure 7 This is a schematic diagram of the electrical connections of one embodiment of a device for measuring the resistance of a silver point. Detailed Implementation

[0025] The embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0026] It should be noted that the following description of preferred embodiments of this application does not constitute any limitation on this application. The description of preferred embodiments is merely an illustration of the general principles of this application. The embodiments described in this application are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the equipment or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and technical features numbered with Arabic numerals 1, 2, 3, etc., and designations such as "A" and "B," are used for descriptive purposes only, for ease of explanation, and do not represent a temporal or spatial order; they should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first," "second," and numbered with Arabic numerals 1, 2, 3, etc., may explicitly or implicitly include one or more of that feature. In the description of this application, "several" means two or more, unless otherwise expressly and specifically defined.

[0028] like Figures 1 to 2 A device for measuring the resistance of silver points, used to test the resistance of silver points on EPD products, includes: a resistance measuring component, a test access module A, and a test access module B; the resistance measuring component includes a port A and a port B; port A is electrically connected to the test access module A via a wire; port B is electrically connected to the test access module B via a wire; the test access module A includes an FPC connection module; the FPC connection module is used to connect to the COM electrode in the FPC of the EPD product being tested; the test access module B includes an ITO connection module; the ITO connection module includes a test probe, which is used to contact the ITO electrode of the EPD product being tested; the test probe is electrically connected to port B via a wire.

[0029] like Figures 1 to 2 The resistance measuring component is a multimeter.

[0030] like Figure 2 The ITO connection module includes a crimping device, which includes a conductive adhesive strip used to press the test probe into contact with the ITO electrode.

[0031] like Figures 3 to 5A device for measuring the resistance of silver points, used to test the resistance of silver points of EPD product 0360, includes: a resistance measuring component 0310, an A test access module 0350, and a B test access module; the resistance measuring component includes an A port 0320 and a B port 0330; the A port is electrically connected to the A test access module 0350 via a wire 0340; the B port 0330 is electrically connected to the B test access module 0370 via a wire 0390; the A test access module 0350 includes an FPC connection module; the FPC connection module is used to connect the COM electrode in the FPC of the EPD product 0360 for testing; the B test access module 0370 includes an ITO connection module; the ITO connection module includes a crimping device 0430 and a test probe 0410, the crimping device 0430 includes a conductive adhesive strip, the conductive adhesive strip is used to press the test probe 0410 into contact with the ITO electrode. The test probe 0410 is electrically connected to the B port via a wire 0390. It also includes a support plate 0380 and a guide rail 0420; the crimping device 0430 is mounted on the guide rail 0420, and the support plate 0380 is used to support the EPD product 0360 under test. The crimping device 0430 can slide on the guide rail 0420 to adapt to different product sizes.

[0032] like Figures 3 to 5 Test access module A 0350 is located above the support plate 0380; test access module B is located below the support plate 0380. Some embodiments also include a switch connected in series in the wires.

[0033] like Figures 3 to 5 The support plate 0380 is provided with a through hole 0331, and the wire 0390 passes through the through hole 0331 to connect the B port 0330 and the B test access module 0370.

[0034] like Figure 2 The connecting wire between port A and the A test access module includes a section of multi-bonded wire.

[0035] In some embodiments, a power interface is also included, which is mounted on the support plate 0380 and is electrically connected to the resistance measuring component via a power cable to supply power to the resistance measuring component.

[0036] like Figure 7In one embodiment of an apparatus for testing the resistance of silver points on an EPD product, the apparatus includes: a multimeter (1) with a built-in ohmmeter range for displaying the resistance of the silver points; multimeter connection points (2) and (3); a multi-bond wire connection point (6), a multi-bond wire (7), and an FPC COM wire base point (8) for connecting the COM wire loop; a connector (9) for leading out the COM electrode in the FPC; a product FPC (10) connected to the connector; an EPD product (11) requiring a test sample; a circuit switch (12) for controlling the test on / off; a crimper (13) for pressing the conductive adhesive strip against the ITO contact surface of the FPL, the base of which is mounted on a built-in guide rail and can be adjusted in size according to different dimensions; conductive adhesive (14) placed inside the fixture and used in conjunction with the crimper to conduct the ITO of the FPL surface into contact with the forming surface; a power plug (15) for providing power to the multimeter used; and a stage (16).

[0037] This utility model discloses a device for testing the silver point resistance of EPD (Electronic Paper Display) products, belonging to the field of EPD display technology. In this utility model, the EPD is placed on a stage, and the FPL (Film Plated Layer) is connected to a clip. By pressing down the handle, the ITO (Indium Tiny Toleranol) surface of the EPD product is brought into contact with the conductive strip below, and a circuit is formed by activating a switching switch, thus measuring the silver point resistance. When testing the silver point resistance of the EPD product connecting the TFT backplane and the FPL ITO surface, this device uses surface contact, the contact surface is movable, and there is no need to stretch the ITO film surface of the FPL during testing. It can accurately measure the silver point resistance of the EPD product and can be designed for single-unit testing or multiple-unit testing, improving testing efficiency.

[0038] As shown in the accompanying drawings, the above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made using the content of the invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A device for measuring the resistance of silver points, used to test the resistance of silver points on EPD products. Its features are, Includes: resistance measurement component, A test access module, and B test access module; The resistance measurement component includes port A and port B; Port A is electrically connected to the A test access module via a wire; Port B is electrically connected to the B test access module via a wire; Test access module A includes an FPC connection module; the FPC connection module is used to connect the COM electrode in the FPC of the test EPD product; The B test access module includes an ITO connection module; the ITO connection module includes a test probe, which is used to contact the ITO electrode of the EPD product for testing; the test probe is electrically connected to the B port via a wire.

2. The apparatus for measuring the resistance of a silver point according to claim 1, characterized in that, The resistance measurement component is a multimeter.

3. The apparatus for measuring the resistance of a silver point according to claim 1, characterized in that, The ITO connection module includes a crimping device, which includes a conductive adhesive strip used to press the test probe into contact with the ITO electrode.

4. The apparatus for measuring the resistance of a silver point according to claim 3, characterized in that, It also includes a support plate and a guide rail; the crimping device is installed on the guide rail, and the support plate is used to support the EPD product under test.

5. The apparatus for measuring the resistance of a silver point according to claim 4, characterized in that, Test access module A is located above the support plate; test access module B is located below the support plate.

6. The apparatus for measuring the resistance of a silver point according to claim 1, characterized in that, It also includes a switch connected in series in the wire.

7. The apparatus for measuring the resistance of a silver point according to claim 6, characterized in that, The support plate has a through hole, through which the wire passes to connect port B and the B test access module.

8. The apparatus for measuring the resistance of a silver point according to claim 1, characterized in that, The connecting wire between port A and the A test access module includes a section of multi-bonded wire.

9. The apparatus for measuring the resistance of a silver point according to claim 4, characterized in that, It also includes a power interface, which is mounted on the support plate and is electrically connected to the resistance measuring component via a power cable to supply power to the resistance measuring component.

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