Tin bar production device with defect detection

Abstract

The utility model relates to a tin bar production device with defect detection belongs to tin bar production technical field. This tin bar production device with defect detection, include: the placement board, the top of placement board is provided with two straight probes, the detection mechanism can carry out effective detection to the defect in the tin bar and sets up in the top of placement board, two straight probes in the mounting plate can carry out defect detection to the tin bar, straight probe can move from the middle to both sides through the cooperation of slider and two -way screw, carries out comprehensive detection to the tin bar, motor and two -way screw cooperate and carry out positive and negative rotation, two -way screw can drive straight probe and carry on reciprocation, support rod can position guiding to slider, improve the moving stability of straight probe, electric push rod can drive mounting plate to move in fixed plate, make straight probe and tin bar contact, control the position of straight probe, can carry out effective detection to the defect of tin bar, improve the production quality of tin bar.

Description

Technical Field

[0001] This utility model relates to the field of tin bar production technology, and in particular to a tin bar production device with defect detection. Background Technology

[0002] Solder bars are a type of soldering product, mainly used for electronic, circuit board, and metal soldering. They are divided into two categories: leaded solder bars and lead-free solder bars. Leaded solder bars use a tin-lead alloy and are suitable for wave soldering or hand dip soldering. Tin-copper or tin-silver-copper alloys are commonly used for environmentally friendly and export electronic products. Both types of products have their performance improved by adding antioxidants, resulting in good wettability, excellent fluidity, bright and full solder joints, and low dross. During the production of solder bars, defect detection is required to ensure the processing quality of the solder bars.

[0003] As shown in the reference case "A device for laser detection of solder defects" (publication number CN22079, 5059U), the clamping assembly clamps and fixes the workpiece to be inspected. Rotating the pinion causes the large gear to rotate, which in turn drives the rack to move, allowing the position of the laser detector to be adjusted. Because the number of teeth on the large gear is greater than that on the pinion, the rotation angle of the large gear is smaller than that of the pinion. Therefore, rotating the pinion only moves the laser detector a small distance, making it easier for the operator to finely adjust the position of the laser detector and improve the detection accuracy.

[0004] According to the above reference materials, in the above device, the first knob drives the pinion shaft and the large gear to rotate, the large gear drives the rack to move, and the mounting block slides along the limiting groove, making the sliding of the mounting block more stable and adjusting the position of the laser detector. However, when the device detects defects in solder bars, the laser detector is not ideal in detecting defects inside the solder bars, which leads to a reduction in the production quality of the solder bars, makes it inconvenient to effectively detect defects in the solder bars, and reduces the effectiveness of the production device. Utility Model Content

[0005] Therefore, it is necessary to provide a solder bar production device with defect detection to address the problem of inconvenience in effectively detecting solder bar defects.

[0006] The device includes a placement plate with two straight probes at its top; a detection mechanism for effectively detecting defects within solder bars, also located at the top of the placement plate; the detection mechanism includes a mounting plate at the top of the placement plate, with two sliders slidably connected to the middle of the inner wall of the mounting plate, the sliders being fixedly connected to the outer wall of the straight probes; a bidirectional screw is threaded to one side of the inner wall of the mounting plate, with both ends of the bidirectional screw threaded to one side of each of the two sliders; and a placement assembly is located at the top of the placement plate.

[0007] In one embodiment, the detection mechanism further includes a motor mounted on one side of the mounting plate, with the output shaft at one end of the motor fixedly connected to a bidirectional screw.

[0008] In one embodiment, a support rod is fixedly connected to the other side of the inner wall of the mounting plate, and the support rod is slidably connected to the other side of the slider.

[0009] In one embodiment, a fixing plate is fixedly connected to the top of the placement plate, and the mounting plate is slidably connected to the inner wall of the fixing plate.

[0010] In one embodiment, an electric push rod is installed at the top of the inner wall of the fixing plate, and one end of the electric push rod is fixedly connected to the mounting plate.

[0011] In one embodiment, the placement assembly includes a baffle fixedly connected to the top of the placement plate, and two fixing rods fixedly connected to the bottom of the baffle.

[0012] In one embodiment, the top of the placement plate has several evenly arranged fixing grooves, and the fixing rod is fitted into the fixing grooves.

[0013] In one embodiment, an anti-slip plate is fixedly connected to the top of the placement plate.

[0014] Beneficial effects 1. The aforementioned solder bar production device with defect detection features two straight probes within the mounting plate for defect detection of the solder bars. These probes, through a slider and a bidirectional screw, can move from the center to both sides for comprehensive solder bar inspection. A motor, in conjunction with the bidirectional screw, performs forward and reverse rotation. The bidirectional screw drives the straight probes on the slider to reciprocate, improving the solder bar inspection effect. A support rod positions and guides the slider, enhancing the stability of the straight probes' movement. An electric push rod moves the mounting plate within the fixed plate, bringing the straight probes into contact with the solder bars. By controlling the position of the straight probes, defects in the solder bars can be effectively detected, improving the production quality of the solder bars. 2. When performing defect detection on solder bars, the baffle, through two fixing rods at the bottom, cooperates with the fixing slots on the placement plate, allowing one side of the solder bar to contact one side of the baffle. This adjusts and corrects the position of the solder bar, improving the detection effect of the straight probe. The multiple fixing slots allow the baffle to be installed in a suitable position, with the anti-slip plate contacting the bottom of the solder bar. This prevents the solder bar from shifting during detection, enabling defect detection and improving the detection effect of the device. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the external structure of the present utility model; Figure 2 This is a schematic diagram of the detection mechanism structure of this utility model; Figure 3 This utility model Figure 2 Enlarged view of point A in the middle; Figure 4 This is a partial structural diagram of the testing mechanism of this utility model; Figure 5 This is a schematic diagram of the placement component structure of this utility model.

[0017] Figure label: 100. Placement plate; 200. Straight probe; 300. Detection mechanism; 310. Mounting plate; 320. Slider; 330. Bidirectional screw; 340. Motor; 350. Support rod; 360. Fixing plate; 370. Electric push rod; 380. Placement assembly; 381. Baffle; 382. Fixing rod; 383. Fixing groove; 384. Anti-slip plate. Detailed Implementation

[0018] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0019] The following is combined Figure 1 - Figure 5 This invention describes a solder bar production apparatus with defect detection.

[0020] In one embodiment, a solder bar production apparatus with defect detection includes a placement plate 100, with two straight probes 200 disposed at the top of the placement plate 100; a detection mechanism 300, which can effectively detect defects in the solder bar, is disposed at the top of the placement plate 100; wherein, the detection mechanism 300 includes a mounting plate 310 disposed at the top of the placement plate 100, two sliders 320 are slidably connected to the middle of the inner wall of the mounting plate 310, the sliders 320 are fixedly connected to the outer wall of the straight probes 200, a bidirectional screw 330 is threadedly connected to one side of the inner wall of the mounting plate 310, and the two ends of the bidirectional screw 330 are respectively threadedly connected to one side of the two sliders 320; and a placement assembly 380 is disposed at the top of the placement plate 100.

[0021] It should be noted that the solder bar defect detection production device, model "USM36", consists of: Circuit module: Includes synchronization circuit, transmitting circuit, receiving circuit, horizontal scanning circuit and display interface, responsible for coordinating the timing of each module and processing signals.

[0022] Probe components: Includes a digital ultrasonic probe and a phased array ultrasonic probe, which convert electrical energy into mechanical vibration through the piezoelectric effect, emit ultrasonic waves and receive echo signals.

[0023] When inspecting solder bars for defects, the inspection mechanism 300, through the cooperation of the bidirectional screw 330 and the slider 320, can drive two straight probes 200 to run repeatedly along the upper surface of the solder bar to inspect it. The placement component 380, through the cooperation of the fixing rod 382 at the bottom of the baffle 381 and the fixing groove 383, can vertically place the solder bar. The inspection mechanism 300 and the placement component 380 can cooperate to inspect the defects of the solder bar without affecting the normal use of the device.

[0024] like Figure 2 , Figure 3 and Figure 4 As shown, the detection mechanism 300 also includes a motor 340 installed on one side of the mounting plate 310. The output shaft of one end of the motor 340 is fixedly connected to the bidirectional screw 330. A support rod 350 is fixedly connected to the other side of the inner wall of the mounting plate 310. The support rod 350 is slidably connected to the other side of the slider 320. A fixing plate 360 ​​is fixedly connected to the top of the placement plate 100. The mounting plate 310 is slidably connected to the inner wall of the fixing plate 360. An electric push rod 370 is installed at the top of the inner wall of the fixing plate 360. One end of the electric push rod 370 is fixedly connected to the mounting plate 310.

[0025] In this embodiment, when performing defect detection on the solder bar, the electric push rod 370 can drive the mounting plate 310 to slide downward along the inner wall of the fixing plate 360. The mounting plate 310 drives the two straight probes 200 to contact the upper surface of the solder bar. The motor 340 drives the two ends of the bidirectional screw 330 to be threadedly connected to the two sliders 320, which drives the straight probes 200 to move to one side. The bottom end of the straight probes 200 moves at a constant speed along the upper surface of the solder bar, which can perform comprehensive detection on the solder bar and improve the detection effect. When the sliders 320 move, the other side slides along the outer wall of the support rod 350, which can perform comprehensive and effective detection of defects in the solder bar and improve the production quality of the solder bar.

[0026] like Figure 5 As shown, the placement assembly 380 includes a baffle 381 fixedly connected to the top of the placement plate 100, two fixing rods 382 fixedly connected to the bottom of the baffle 381, several evenly arranged fixing grooves 383 opened at the top of the placement plate 100, the fixing rods 382 and the fixing grooves 383 are fitted together, and an anti-slip plate 384 is fixedly connected to the top of the placement plate 100.

[0027] In this embodiment, when the solder bar is being tested, the baffle 381 is embedded in two fixing slots 383 by two fixing rods 382 at the bottom. When the solder bar is placed, one side of the solder bar is in contact with one side of the baffle 381, which corrects the placement position of the solder bar and improves the detection effect. The anti-slip plate 384 is in contact with the bottom end of the solder bar, which can limit the solder bar to a certain extent, and can effectively detect the solder bar and improve its quality.

[0028] Working principle: The processed solder bar is placed on the anti-slip plate 384 on the placement plate 100. According to the size of the solder bar, the baffle 381 is embedded in the two fixing slots 383 by two fixing rods 382, ​​so that one side of the solder bar is aligned with one side of the baffle 381. The electric push rod 370 is driven by the control component to move the mounting plate 310 downward along the inner wall of the fixing plate 360. The bottom ends of the two straight probes 200 are in contact with the upper surface of the solder bar. The motor 340 is driven by the control component to drive the two ends of the bidirectional screw 330 to be threadedly connected to the two sliders 320. The two sliders 320 drive the straight probes 200 to move from the middle to both sides, which can perform comprehensive testing of the solder bar.

[0029] It should be noted that the motor 340 and electric actuator 370 mentioned above are all devices with relatively mature existing technology. The specific model can be selected according to actual needs. At the same time, the motor 340 and electric actuator 370 can be powered by the built-in power supply or by the mains power. The specific power supply method should be selected according to the situation, which will not be elaborated here.

[0030] The above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions will not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A solder bar production apparatus with defect detection, characterized in that, include: Placement plate (100), the top of which is provided with two straight probes (200); The detection mechanism (300), which can effectively detect defects in the solder bar, is located at the top of the placement plate (100); The detection mechanism (300) includes a mounting plate (310) disposed at the top of the placement plate (100). Two sliders (320) are slidably connected to the middle of the inner wall of the mounting plate (310). The sliders (320) are fixedly connected to the outer wall of the straight probe (200). A bidirectional screw (330) is threadedly connected to one side of the inner wall of the mounting plate (310). The two ends of the bidirectional screw (330) are respectively threadedly connected to one side of the two sliders (320). A placement assembly (380) is disposed at the top of the placement plate (100).

2. The solder bar production apparatus with defect detection according to claim 1, characterized in that, The detection mechanism (300) also includes a motor (340) installed on one side of the mounting plate (310), and the output shaft of one end of the motor (340) is fixedly connected to the bidirectional screw (330).

3. The solder bar production apparatus with defect detection according to claim 1, characterized in that, A support rod (350) is fixedly connected to the other side of the inner wall of the mounting plate (310), and the support rod (350) is slidably connected to the other side of the slider (320).

4. The solder bar production apparatus with defect detection according to claim 1, characterized in that, The top of the placement plate (100) is fixedly connected to a fixing plate (360), and the mounting plate (310) is slidably connected to the inner wall of the fixing plate (360).

5. The solder bar production apparatus with defect detection according to claim 4, characterized in that, An electric push rod (370) is installed at the top of the inner wall of the fixed plate (360), and one end of the electric push rod (370) is fixedly connected to the mounting plate (310).

6. The solder bar production apparatus with defect detection according to claim 1, characterized in that, The placement assembly (380) includes a baffle (381) fixedly connected to the top of the placement plate (100), and two fixing rods (382) fixedly connected to the bottom of the baffle (381).

7. The solder bar production apparatus with defect detection according to claim 6, characterized in that, The top of the placement plate (100) has several evenly arranged fixing grooves (383), and the fixing rod (382) is fitted into the fixing grooves (383).

8. The solder bar production apparatus with defect detection according to claim 1, characterized in that, The top of the placement plate (100) is fixedly connected to an anti-slip plate (384).

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